Power module

Abstract

Some embodiments of the present application provide a power module comprising: a stage; a first column disposed on the stage; the mold sealing layer wraps the first columns, and the first columns protrude out of the upper surface of the mold sealing layer; and a first pin connected to the first post. According to the power module provided by the invention, the corresponding first pins are connected to the corresponding first columns, so that the performance of the power module is improved. In addition, the corresponding technological process of the power module is simplified, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of power devices, and more specifically, to a power module. Background Art

[0002] With the rapid adoption of next-generation electric vehicles (xEVs) in recent years, the need for more efficient, smaller, and lighter electric systems has emerged. This is particularly true for the core drive components—electric motor controllers. This has driven not only miniaturization and high efficiency, but also the evolution of power components. To extend EV range, battery capacity is increasing. However, miniaturization of power components, particularly power modules, is not always satisfactory.

[0003] In the current single-sided heat dissipation design of automotive power modules, reference Figure 1 As shown, Figure 1 The figure shows a schematic diagram of the structure of a current automotive power module 10 used for single-sided heat dissipation. Figure 1 In the figure, pins 15 are mounted on a carrier 20, which also carries a chip 25. Both the chip 25 and the pins 15 are mounted on the same surface of the carrier 20 and are covered by a mold layer. As can be seen, the pins 15, as external connectors, must extend beyond the surface of the mold layer to be formed, thereby serving as external connections within the power module 10. Therefore, the pins 15 have portions extending beyond the mold layer. Because the molding process for automotive power module 10 does not require housing or potting, the area and volume of power module 10 can be reduced. However, power modules 10 with pins 15 will require the pins 15 to be exposed during the molding process, which can lead to mold closing issues.

[0004] refer to Figure 2 As shown, Figure 2 A schematic diagram of the structure of a current automotive power module 10 during the manufacturing process is shown. For an automotive power module 10 having pins 15 , the pins 15 need to be placed on the same side of the carrier 20 as the chip 25 .

[0005] refer to Figure 3 As shown, Figure 3 A schematic diagram illustrates the structure of a current automotive power module 10 during the manufacturing process when the pins 15 are not present. If the automotive power module 10 does not have the pins 15, after the chip 25 is placed on the carrier 20, the carrier 20 and the mold chase 35 located above the chip 25 are pressed together to form a mold encapsulation layer (not shown).

[0006] refer to Figure 4 As shown, Figure 4The figure shows a structural diagram of a current automotive power module 10 in the process of manufacturing when the pin 15 is present. Figure 2 As can be understood from the illustrated content, since pins 15 are placed on carrier 20 before mold 35 is pressed together, and since the automotive power module 10 to be formed is designed to be compact, and pins 15 are generally tall, the presence of pins 15 during the pressing together of mold 35 can cause the automotive power module 10 with pins 15 to be unable to close the mold during the molding process. Furthermore, as external connectors, pins 15 must extend beyond the surface of the molded layer to be formed. Raising mold 35 does not effectively solve this problem and may even affect the performance of power module 10. Therefore, a power module 10 with improved performance is provided. Utility Model Content

[0007] To address the above issues, this application utilizes external connectors, such as posts, that conform to the molded thickness to produce a power module with improved performance. Furthermore, during the power module manufacturing process, the use of external connectors allows the molding process to expose the connector's contacts, which can then be used to connect pins, without requiring changes to the mold design.

[0008] Some embodiments of the present application provide a power module, including: a carrier; a first column arranged on the carrier; a molding layer covering the first column, wherein the first column protrudes from the upper surface of the molding layer; and a first pin connected to the first column.

[0009] In some embodiments, the first pin is directly bonded to the first post.

[0010] In some embodiments, the first pin is joined to the first column by solder.

[0011] In some embodiments, the solder covers a portion of a side surface of the first pin.

[0012] In some embodiments, the solder further covers side surfaces of a portion of the first pillar protruding from the molding layer.

[0013] In some embodiments, the power module further includes: a power element disposed on the carrier and around the first column, wherein the first pin provides power to the power element through the carrier.

[0014] In some embodiments, the amount of the solder covering different locations on the side of the first pillar is different.

[0015] In some embodiments, an upper surface of the molding layer adjacent to the first pillar has a curved surface.

[0016] In some embodiments, the first pins are arranged in an array.

[0017] In some embodiments, the first columns and the first pins are arranged in a one-to-one correspondence.

[0018] In some embodiments, the power module further includes: a second column disposed on the carrier and protruding from the upper surface of the encapsulation layer, wherein the first column and the second column protrude from the encapsulation layer at different heights.

[0019] In some embodiments, the carrier is a ceramic copper-clad substrate.

[0020] In some embodiments, the first pillar is electrically connected to a circuit within the carrier.

[0021] In some embodiments, the second pillar is electrically connected to a circuit within the carrier.

[0022] In some embodiments, an upper surface of the molding layer is higher than an upper surface of the power component.

[0023] In some embodiments, the first pin includes a lower portion and an upper portion located above the lower portion, wherein the lower portion extends laterally beyond a lateral extent of the upper portion.

[0024] In some embodiments, the vertical projection range of the lower portion is within the vertical projection range of the first column.

[0025] Other embodiments of the present application provide a power module, including: a carrier carrying a power element; a first column arranged on the carrier and around the power element; a molding layer covering the first column and the power element; and a first pin connected to the first column, wherein the bottom surface of the first pin is higher than the upper surface of the molding layer.

[0026] In some embodiments, the first pillar protrudes from the upper surface of the molding layer.

[0027] In some embodiments, the first pin is bonded to the first column by solder, wherein the solder further covers a side surface of a portion of the first column protruding from the molding layer.

[0028] The power module provided by the present application improves the performance of the power module, such as electrical performance and yield, by connecting corresponding first pins to corresponding first columns. In addition, the corresponding process of the power module is simplified and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figures 1 to 4 FIG. 2 shows a power module in the prior art.

[0031] Figure 5 、 Figure 5A and Figure 5B A power module according to some embodiments of the present application is shown.

[0032] Figures 6 to 9 The figure shows the process flow of the power module according to some embodiments of the present application.

[0033] Figure 10 A perspective view of a power module according to some embodiments of the present application is shown. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field fall within the scope of protection of this application. In addition, when "approximately", "about", "substantial", "basic" and the like are used to describe a numerical value or a numerical range, unless otherwise specified, the term is intended to cover a numerical value within ±10% of the described numerical value. For example, the term "about 5nm" covers a size range from 4.5nm to 5.5nm.

[0035] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which an additional component is formed between the first component and the second component so that the first component and the second component may not be in direct contact. Moreover, the present invention may repeatedly refer to numbers and / or letters in various examples. This repetition is merely for simplicity and clarity and does not in itself represent a relationship between the various embodiments and / or configurations discussed.

[0036] The corresponding pins of the power module provided in this application are connected to the external connector by solder connection. Figure 5The present application provides a power module 100, which includes: a carrier 101; a first column 102 disposed on the carrier 101; and a mold sealing layer 103 covering the first column 102. Figures 5A to 5B , Figures 5A to 5B Shown Figure 5 An enlarged view of region A of the power module 100, from Figures 5A to 5B As can be seen from FIG, the first column 102 protrudes from the upper surface 103t of the mold encapsulation layer 103. Figures 5 to 5B It can also be seen that the power module 100 further includes a first pin 104 electrically or physically connected to the first column 102. Specifically, the first pin 104 includes a lower portion 104B and an upper portion 104A located above the lower portion, and the vertical projection of the upper portion 104A is within the vertical projection range of the lower portion 104B. Specifically, as Figure 5 As shown, the width of the upper portion 104A in the x-direction is smaller than the width of the lower portion 104B in the x-direction, or the lower portion 104B extends laterally beyond the lateral extent of the upper portion 104A. In further embodiments, the first pins 104 are arranged in an array. In addition, the first columns 102 are arranged in a one-to-one correspondence with the first pins 104. In some embodiments, the vertical projection range of the lower portion 104B of the first pin 104 is within the vertical projection range of the first column 102. That is, Figure 5 In the cross-sectional view shown, the width of the lower portion 104B of the first pin 104 in the x-direction is smaller than the width of the first column 102 in the x-direction. In other embodiments, the width of the lower portion 104B of the first pin 104 in the x-direction may also be greater than or equal to the width of the first column 102 in the x-direction.

[0037] In some embodiments, the first pin 104 is directly bonded to the first post 102 (eg, Figure 5A In some other embodiments, as shown in Figure 5B As shown, the first pin 104 is bonded to the first column 102 by solder 106. Further, the solder 106 covers a portion of the side surface of the first pin 104, specifically, covers a portion of the side surface 104Bs of the lower portion 104B of the first pin 104. Figure 5B The solder 106 further covers the side surface 102As of the first pillar 102 that protrudes from the molding layer 103. In some embodiments, the amount of solder 106 covering different positions of the side surface 102As of the first pillar 102 is different. Figure 5BIn the embodiment shown, the amount of solder on the side surface 102As on the left side of the first column 102 is different from the amount of solder on the side surface 102As on the right side. In this embodiment, the first column 102 protrudes from the upper surface 103t of the molding layer 103 to increase the joint surface between the solder 106 and the first column 102, thereby improving the connection strength between the first pin 104 and the first column 102. In some embodiments, the height of the portion 102A of the first column 102 protruding from the molding layer 103 in the z direction is generally less than 200 microns, and further, in the range of several microns to 200 microns. In some embodiments, the first pin 104 can be a pin commonly used in the art. In some embodiments, the first pin 104 includes but is not limited to metal.

[0038] In addition, if Figure 5B As shown, the upper surface 103t of the encapsulation layer 103 near the first pillar 102 has a curved surface 103c. In some embodiments, the curved surface 103c protrudes toward the first pillar 102. In further embodiments, a portion of the curved surface 103c is covered by solder 106. In some embodiments, the encapsulation layer 103 includes, but is not limited to, molding compound, underfill, etc.

[0039] Back reference Figure 5 The power module 100 further includes a power element 105 disposed on the carrier 101 and around the first column 102. Figure 5 In the cross-sectional view shown, the first column 102 is arranged on the side of the power element 105. In some embodiments, the power element 105 is covered by the molding layer 103, and the upper surface 103t of the molding layer 103 is higher than the upper surface 105t of the power element 105. Further, in the power module 100, the first pin 104 provides power to the power element 105 through the carrier 101. This is because the first pin 104 is connected to the first column 102, and the first column 102 is further electrically connected to the circuit 101m within the carrier 101. In addition, the power element 105 is bonded to the surface of the carrier 101 through the bonding layer 105b, which can be a dielectric layer formed with a bonding pad (such as a metal pad), or any suitable bonding layer. In the above embodiment, the circuit 101m and the bonding pad can be made of a metal such as copper. In a specific embodiment, the carrier 101 can be a ceramic copper-clad substrate. In some embodiments, the power element 105 can include but is not limited to a chip.

[0040] In some other embodiments, further Figure 5As shown, the power module 100 also includes: a second column 107, which is arranged on the carrier 101 and protrudes from the upper surface 103t of the encapsulation layer 103. In some embodiments, the first column 102 and the second column 107 protrude from the encapsulation layer 103 at different heights. That is, the first column 102 and the second column 107 can have different heights above the encapsulation layer 103. In addition, the second column 107 is electrically connected to the circuit 101m in the carrier 101. Further, the second pin 108 is joined to the corresponding second column 107. In some embodiments, the second column 107 and the second pin 108 are similar to the first column 102 and the first pin 104 and are not described in detail here.

[0041] Continue to refer to Figures 5 to 5B Some other embodiments of the present application further provide a power module 100, comprising: a carrier 101 carrying a power element 105; a first column 102 disposed on the carrier 101 and around the power element 105; a mold layer 103 covering the first column 102 and the power element 105; and a first pin 104 connected to the first column 102, wherein the bottom surface 104d of the first pin 104 is higher than the upper surface 103t of the mold layer 103. In some embodiments, as Figure 5A and Figure 5B As shown, the first pillar 102 protrudes from the upper surface 103t of the encapsulation layer 103. In some embodiments, as shown in FIG. Figure 5B As shown, the first pin 104 is bonded to the first pillar 102 via solder 106 , wherein the solder 106 further covers a side surface 102As of a portion 102A of the first pillar 102 protruding from the molding layer 103 .

[0042] In the present application, by joining the first pin 104 to the first column 102 and joining the second pin 108 to the second column 107 , the problem in the prior art that the corresponding pins affect the performance of the packaging module is overcome, and the performance of the corresponding packaging module 100 is improved.

[0043] Reference below Figures 6 to 9 Now, let’s introduce the process of the corresponding power module 100. Figure 6 As shown, a power element 105 such as a chip and a first pillar 102 and a second pillar 107 such as copper are arranged on the same side of the carrier, and the first pillar 102 and the second pillar 107 are electrically connected to a line 101m in the carrier 101. Figure 7 , press the carrier 101 and the mold 1001 located above the power element 105, and encapsulate the molding compound, and grind the surface of the encapsulated molding compound to form a molding layer 103 (in Figure 8), when performing this step of the molding process, a first column 102 and a second column 107 such as a copper column are added below the mold 1001 such as a frame. After the first column 102 and the second column 107 such as a copper column are extended in the z direction, the first pin 104 and the second pin 108 are used to connect with them respectively. This can avoid the problem of being unable to close the mold during the subsequent pressing molding process caused by directly setting the pins on the carrier 101. In the present application, the molding process can be an exposed molding operation, and the external connectors such as the first column 102 and the second column 107 can be embedded in a release film (not shown) to prevent the molding material from flowing out. Therefore, the final external connectors such as the first column 102 and the second column 107 will protrude from the upper surface 103t of the molding layer 103. That is, the top surface 102t of the first column 102 and the top surface 107t of the second column 107 are higher than the upper surface 103t of the molding layer 103.

[0044] Next, refer to Figure 8 , the mold encapsulation layer 103 is formed and covers the power element 105. Figure 9 After removing the mold 1001, the top surface 103t of the encapsulation layer 103 is higher than the top surface 105t of the power element 105, and the top surface 102t of the first pillar 102 and the top surface 107t of the second pillar 107 are exposed from the encapsulation layer 103, that is, higher than the top surface 103t of the encapsulation layer 103. The top surface 102t of the first pillar 102 and the top surface 107t of the second pillar 107 can be at different heights. Finally, the first pin 104 and the second pin 108 are bonded to the first pillar 102 and the second pillar 107, respectively, to form the following. Figure 9 The power module 100 shown in FIG. The power module 100 manufactured using the method of the present application has a higher yield than conventional power modules, particularly in the molding process. Furthermore, the manufacturing process of the power module 100 of the present application eliminates the need for housing and potting processes, thereby reducing the product design area of ​​the power module 100 and lowering costs.

[0045] In summary, the present application utilizes first and second pillars 102 and 107 (external connectors) that conform to the thickness of the molded encapsulation layer 103, such that the joints of the first and second pillars 102 and 107 (i.e., the junction of the top surface 102t of the first pillar 102 and the top surface 107t of the second pillar 107) are exposed after molding. The corresponding first and second pins 104 and 108 can then be connected through these joints without changing the design of the mold 1001. In the present application, the first and second pins 104 and 108 can be connected to external connectors such as the first and second pillars 102 and 107 via solder 106 (solder joints). In addition, the above-mentioned molding process can be an exposed molding operation, and the external connectors such as the first column 102 and the second column 107 can be embedded in a release film to prevent the molding material from flowing out. Therefore, the final external connectors such as the first column 102 and the second column 107 will protrude from the upper surface 103t of the molding layer 103, thereby increasing the joint surface between the solder 106 and the external connectors such as the first column 102 and the second column 107, thereby improving the connection strength.

[0046] also, Figure 10 The three-dimensional diagram of the power module 100 provided in this application is shown. Figure 10 As can be seen in the figure, a first pillar 102 such as a copper pillar is provided on the carrier 101, and the first pin 104 is bonded to the first pillar 102. In this way, only the first pillar 102 is used without using other frames or changing the design of the mold 1001. Therefore, the design is simpler and more feasible for the molding process.

[0047] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A power module, comprising: carrier; A first column is provided on the carrier; a mold sealing layer covering the first pillar, wherein the first pillar protrudes from an upper surface of the mold sealing layer; as well as A first pin is connected to the first column.

2. The power module according to claim 1, wherein: The first pin is joined to the first column by solder.

3. The power module according to claim 2, wherein: The solder covers a portion of the side surface of the first pin.

4. The power module according to claim 3, wherein: The solder further covers a side surface of a portion of the first pillar protruding from the molding layer.

5. The power module according to claim 1, further comprising: A power element is arranged on the carrier and around the first column, wherein the first pin provides power to the power element through the carrier.

6. The power module according to claim 2, wherein: The amount of the solder covering different positions of the side surface of the first pillar is different.

7. The power module according to claim 1, wherein: An upper surface of the molding layer close to the first pillar has a curved surface.

8. The power module according to claim 1, wherein: The first pins are arranged in an array.

9. The power module according to claim 1, wherein: The first columns and the first pins are arranged in a one-to-one correspondence.

10. The power module according to claim 1, further comprising: A second column is provided on the carrier and protrudes from the upper surface of the mold sealing layer. The first column and the second column protrude from the molding layer at different heights.

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