Package structure

Abstract

Some embodiments of the present application provide a package structure comprising: an upper substrate; a lower substrate; the passive device is arranged between the upper substrate and the lower substrate and is in direct contact with the upper substrate and the lower substrate; the lead is connected with the upper substrate and the lower substrate and arranged around the passive device, and the upper substrate and the lower substrate transmit different signals through the passive device and the lead. The upper substrate and the lower substrate can transmit different signals through the passive devices and the leads at the same time, vertical signal transmission of the signals in a short distance is achieved, the connection mode of vertical butt joint is increased, the assembly density is improved, and the size of the packaging structure 100 can be reduced by 15%.

Description

Technical Field

[0001] The present application relates to the technical field of power devices, and more specifically, to a packaging structure. Background Art

[0002] In the previous packaging structure, such as Figure 1A As shown, corresponding passive components 14, other electronic components 16, 18, 20, etc. (which can be arranged according to actual conditions, such as chips, etc.) are arranged side by side on the lower substrate 12, which makes the space utilization rate of the lower substrate 12 low. In the existing 3D stacked packaging structure 10, see Figure 1B The upper substrate 11 is stacked on the lower substrate 12 through the passive components 14, and other electronic components 16 are bonded to the upper substrate 11 through the bumps 17. In addition, other electronic components 18 are formed on the portion of the lower substrate 12 that extends beyond the upper substrate 11, and all are encapsulated by the encapsulation layer 15. Furthermore, an external connector 19 is formed on the side of the lower substrate 12 opposite to the upper substrate 1. Figure 1B In the illustrated package structure 10, 3D stacking technology is utilized to enable the shortest transmission distance for signal S to be transmitted directly between the upper substrate 11 and the lower substrate 12 via passive components 14. However, some signals S cannot be transmitted using passive components 14 such as RLC (reactive elements), thus requiring the design of a transmission medium without RLC functionality. Thus, in 3D stacking technology, in order to transmit some signals S between the upper substrate 11 and the lower substrate 12, passive components 14 such as RLC cannot be used for signal S transmission. Therefore, a medium without RLC functionality but capable of signal transmission between the upper and lower substrates 11 and 12 is required, such as the use of an interposer 13 for signal transmission between the upper and lower substrates 11 and 12.

[0003] Using an interposer 13 is one approach, but the volume cannot be reduced. Furthermore, other components (such as passive devices 14) between the upper substrate 11 and the lower substrate 12 must be at the same height for docking, thereby transmitting signals with the upper and lower substrates 11 and 12. Currently, the size of the interposer 13 in this approach must be similar to that of the RLC component and must be at the same height for docking and signal transmission with the upper and lower substrates 11 and 12. Therefore, this approach cannot meet requirements such as reducing the utilization and volume of substrates (such as the upper and lower substrates 11 and 12).

[0004] In summary, in the existing 3D stacking connection method, vertical connection is not possible, so other IO (input and output) routes (such as Figure 1B However, this route will require the design of multiple additional IOs for connection between the upper substrate 11 and the lower substrate 12, resulting in a waste of additional space. Utility Model Content

[0005] In order to increase the space utilization and signal transmission requirements of packaging structures such as 3D stacking, this application uses a vertical connection method to add wire bonding (without RLC function) in the upper and lower docking of components to transmit signals between the upper and lower substrates.

[0006] Some embodiments of the present application provide a packaging structure, including: an upper substrate; a lower substrate; a passive device, arranged between the upper substrate and the lower substrate and in direct contact with the upper substrate and the lower substrate; and a lead, connecting the upper substrate and the lower substrate and arranged around the passive device, wherein the upper substrate and the lower substrate transmit different signals through the passive device and the lead.

[0007] In some embodiments, the lead has two ends and a bending portion connecting the two ends.

[0008] In some embodiments, one of the two ends is connected to the upper substrate, the other of the two ends is connected to the lower substrate, and the bent portion is located in a space between the upper substrate and the lower substrate.

[0009] In some embodiments, the two end portions are located on the lower substrate, and the bent portion contacts the upper substrate.

[0010] In some embodiments, the lead contacts both the upper substrate and the lower substrate.

[0011] In some embodiments, the packaging structure further includes: a first solder pad disposed on a surface of the upper substrate facing the lower substrate; and a second solder pad disposed on a surface of the lower substrate facing the upper substrate, wherein the lead is connected to the first solder pad and the second solder pad.

[0012] In some embodiments, both ends of the lead are in contact with the first pad and the second pad, respectively.

[0013] In some embodiments, the bent portion contacts the first pad.

[0014] In some embodiments, the packaging structure further includes: a first electronic component disposed above the upper substrate.

[0015] In some embodiments, the packaging structure further includes: a packaging layer, packaging the upper substrate, the lower substrate, the passive components, and the leads.

[0016] In some embodiments, an outermost edge of the encapsulation layer extends beyond an edge of the upper substrate.

[0017] In some embodiments, an outermost edge of the encapsulation layer is aligned with an edge of the lower substrate.

[0018] In some embodiments, a first metal line is disposed in the upper substrate, and a second metal line is disposed in the lower substrate, wherein the first metal line is electrically connected to the second metal line through the lead.

[0019] In some embodiments, there are a plurality of leads, and lengths of the plurality of leads from one end to the other end of the respective leads are different from each other.

[0020] In some embodiments, the lower substrate extends beyond the lateral extent of the upper substrate.

[0021] In some embodiments, the packaging structure further includes: a second electronic component disposed at a position of the lower substrate extending beyond the upper substrate, wherein a top surface of the second electronic component is higher than a top surface of the upper substrate.

[0022] In some embodiments, the package structure further includes: an external connector disposed at a side of the lower substrate opposite to the upper substrate.

[0023] Other embodiments of the present application provide a packaging structure, comprising: an upper substrate; a lower substrate; and a plurality of leads connecting the upper substrate and the lower substrate, wherein each of the plurality of leads has two ends and a bending portion connecting the two ends, and wherein, for some of the plurality of leads, the two ends are located on the lower substrate, and the bending portion contacts the upper substrate.

[0024] In some embodiments, the packaging structure further includes: a passive device disposed between the upper substrate and the lower substrate and around the plurality of leads, wherein the upper substrate and the lower substrate transmit different signals through the passive device and the leads.

[0025] In some embodiments, the plurality of leads are in contact with both the upper substrate and the lower substrate.

[0026] The present application utilizes wire bonding (not limited to any form) to transmit signals between the upper and lower substrates. When the upper and lower substrates are docked, as long as the wires touch the corresponding pads on the upper and lower substrates, signal transmission can be performed. Even if the wires are deformed, the wires are higher than the docking components, ensuring that they can definitely touch the corresponding pads to achieve the purpose of signal transmission. Therefore, there is a certain tolerance, and the position of the wires can be designed according to actual needs without any special position restrictions. Therefore, the wires can use this characteristic to achieve bilateral docking and signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1A and Figure 1B The figure shows a packaging structure in the prior art.

[0029] Figure 2 and Figure 3 The package structures of some embodiments of the present application are shown.

[0030] Figures 4 to 15 The process flow of forming the packaging structure of some embodiments of the present application is shown. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field fall within the scope of protection of this application. In addition, when "approximately", "about", "substantial", "basic" and the like are used to describe a numerical value or a numerical range, unless otherwise specified, the term is intended to cover a numerical value within ±10% of the described numerical value. For example, the term "about 5nm" covers a size range from 4.5nm to 5.5nm.

[0032] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which an additional component is formed between the first component and the second component so that the first component and the second component may not be in direct contact. Moreover, the present invention may repeatedly refer to numbers and / or letters in various examples. This repetition is merely for simplicity and clarity and does not in itself represent a relationship between the various embodiments and / or configurations discussed.

[0033] Currently, some double-sided docking packages only allow for the docking of components of the same size. Shorter passive components require longer, planar signal transmission paths to connect to the upper substrate. However, in this application, wire bonding allows for shorter signal transmission distances and increases signal connectivity for shorter components, thereby achieving greater component density.

[0034] Specifically, the present application solves the problem that signals in existing 3D stacked packaging structures cannot be directly transmitted through passive components by using a medium that does not contain RLC functions. Specifically, the present application uses wire bonding (not limited to any form) to transmit signals between the upper and lower substrates. When the upper and lower substrates are docked, as long as the wires touch the pads on the corresponding upper and lower substrates, signal transmission can be performed. Even if the wires are deformed, the height of the wires is higher than that of the docking components, thereby ensuring that they can definitely touch the corresponding pads to achieve the purpose of signal transmission. Therefore, there is a certain tolerance, and the position of the wires can be designed according to actual needs without any special position restrictions. Therefore, the wires can be used for bilateral docking and signal transmission with this characteristic.

[0035] Some embodiments of the present application provide a packaging structure 100, see Figure 2 The package structure 100 includes: an upper substrate 110; a lower substrate 120; a passive device 140 disposed between and in direct contact with the upper and lower substrates 110, 120. In this application, the passive device 140 may be used to support the upper substrate 110; and leads 130 connecting the upper and lower substrates 110, 120 and disposed around the passive device 140. In some embodiments of the present application, the upper and lower substrates 110, 120 transmit different signals via the passive device 140 and the leads 130. In some embodiments, the upper and lower substrates 110, 120 may be any suitable substrates, including but not limited to printed circuit boards. In some embodiments, the leads 130 may include a metal or metal alloy such as copper, gold, or silver. In some embodiments, the passive device 140 may include but not limited to capacitors, inductors, and the like. In some embodiments, the passive device 140 is attached to the upper substrate 110 via microbumps 111 and to the lower substrate 120 via microbumps 112. In some embodiments, microbumps 111 and 112 may include, but are not limited to, solder.

[0036] In some embodiments, the lead 130 contacts both the upper substrate 110 and the lower substrate 120. Figure 2 As can be seen in FIG, each of the leads 130 has two ends 130e and a bent portion 130w connecting the two ends 130e. Figure 2In some specific embodiments shown, one of the two ends 130e of the lead 130 is connected to the upper substrate 110, the other of the two ends 130e is connected to the lower substrate 120, and the bent portion 130w is located in the space between the upper substrate 110 and the lower substrate 120. Figure 2 In some other specific embodiments shown, the two end portions 130e are located on the lower substrate 110, and the bent portion 130w contacts the upper substrate 110. In the embodiment, the package structure 100 further includes: a first solder pad 110p, disposed on a surface 110s of the upper substrate 110 facing the lower substrate 120; and a second solder pad 120p, disposed on a surface 120s of the lower substrate 120 facing the upper substrate 110. Figure 2 It can be seen in the figure that the lead 130 is connected to the first pad 110p and the second pad 120p, and further, the lead 130 is in physical contact with both the first pad 110p and the second pad 120p. Specifically, in some embodiments, the two end portions 130e of the lead 130 are in contact with the first pad 110p and the second pad 120p, respectively, and the bent portion 130w of the lead 130 is disposed between the upper substrate 110 and the lower substrate 120 and is spaced apart from the corresponding first pad 110p and the second pad 120p. In some other embodiments, the two end portions 130e of the lead 130 are in contact with the second pad 120P on the lower substrate 120, and the bent portion 130w is in contact with the first pad 110p. Figure 2 In the illustrated embodiment, the number of the lead wires 130 is plural, and the lengths of the plurality of lead wires 130 from one end 130e to the other end 130e of the corresponding lead wires are different from each other. Figure 2 In the cross-sectional view shown, the width of the two end portions 130 e may be wider than the width of the other portions of the lead 130 , or may be the same as the width of the other portions of the lead 130 .

[0037] In addition, further reference Figure 2 , the package structure 100 further includes: a first electronic component 160 disposed above the upper substrate 110, the first electronic component 160 being connected to the upper substrate 110 via a bump 170. In some embodiments, the first electronic component 160 includes a power management integrated circuit (PMIC). Figure 2 In the embodiment shown, the package structure 100 further includes a package layer 150 that packages the upper substrate 110, the lower substrate 120, the passive components 140, and the leads 130. Figure 2As can be seen in FIG, the outermost edge 150o of the encapsulation layer 150 extends beyond the edge 110o of the upper substrate 110, and the outermost edge 150o of the encapsulation layer 150 is aligned with the edge 120o of the lower substrate 120. Further, the lower substrate 120 extends beyond the lateral extent of the upper substrate 110, and the encapsulation structure 100 further includes: a second electronic component 180 disposed at a position of the lower substrate 120 extending beyond the upper substrate 110, such as Figure 2 As shown, the top surface 180t of the second electronic component 180 can be higher than the top surface 110t of the upper substrate 110, and in other embodiments, the top surface 180t of the second electronic component 180 can be lower than the top surface 110t of the upper substrate 110 or flush with the top surface 110t of the upper substrate 110. In some embodiments, the package structure 100 also includes other electronic components 141, such as active devices or passive devices, disposed on the upper substrate 110 or on the lower substrate 120. In some embodiments, the package structure 100 also includes external connectors 190 disposed on the side of the lower substrate 120 opposite to the upper substrate 110. In some embodiments, the external connectors 190 can be solder connectors for making external connections. In some embodiments, the encapsulation layer 150 includes, but is not limited to, molding compound, molding material, underfill, etc. In some embodiments, the bumps 170 can include, but are not limited to, solder bumps. In some embodiments, the second electronic component 180 can be any suitable electronic component, such as an integrated circuit device, a chip, etc.

[0038] Next, see Figure 3 , Figure 3 Shown Figure 2 A detailed view of the package structure 100 is shown, from Figure 3 As can be seen in the figure, a first metal line 110m is provided in the upper substrate 110, and a first through-hole 110v is provided to connect the first metal line 110m. In addition, a second metal line 120m is provided in the lower substrate 120, and a second through-hole 120v is provided to connect the second metal line 120m. In the package structure 100, the first metal line 110m is electrically connected to the second metal line 120m through the lead 130. Furthermore, the first metal line 110m and the first through-hole 110v are embedded in the dielectric material 110l, and the second metal line 120m and the second through-hole 120v are also embedded in the dielectric material 120l. In some embodiments, the dielectric materials 110l and 120l may include materials such as polyimide, polyamide, etc. In some embodiments, the first metal line 110m and the first through-hole 110v, as well as the second metal line 120m and the second through-hole 120v, may be made of a metal or metal alloy such as copper, gold, silver, etc.

[0039] Return to reference Figure 2Some other embodiments of the present application provide a packaging structure 100, which includes an upper substrate 110, a lower substrate 120, and a plurality of leads 130 connecting the upper substrate 110 and the lower substrate 120, such as Figure 2 As shown, each of the multiple leads 130 has two ends 130e and a bending portion 130w connecting the two ends 130e, and wherein, for some of the multiple leads 130, the two ends 130e are located on the lower substrate 120, and the bending portion 130w contacts the upper substrate 110. For other leads of the multiple leads 130, the two ends 130e may be located on the upper substrate 110 and the lower substrate 120, respectively, which can be set according to actual conditions. In some embodiments, the packaging structure 100 also includes: a passive device 140, which is arranged between the upper substrate 110 and the lower substrate 120 and is arranged around the multiple leads 130, wherein the upper substrate 110 and the lower substrate 120 transmit different signals through the passive device 140 and the leads 130. Figure 2 In the illustrated embodiment, the plurality of leads 130 are in contact with both the upper substrate 110 and the lower substrate 120 .

[0040] Refer to the following Figures 4 to 15 To introduce Figure 2 and Figure 3 The process flow of forming the package structure 100 is shown.

[0041] First, refer to Figures 4 to 7 The formation of the relevant components on the upper substrate 110 is described below. Figure 4 As shown, an upper substrate 110 is provided, which has a dielectric layer 1101 and a first metal line 110m and a first via 110v embedded in the dielectric layer 1101. In addition, the upper substrate 110 has a top surface 110t, a surface 110s opposite to the top surface, and an edge 110o. Furthermore, the upper substrate 110 has a first pad 110p on the surface 110s.

[0042] Reference Figure 5 Microbumps 111 are formed on the top surface 110t of the upper substrate 110 for attaching passive devices 140 and other electronic components 141. In some embodiments, the microbumps 111 are formed using a solder printing process and are made of solder.

[0043] Next, refer to Figure 6 , the passive components 140 and other electronic components 141 (set according to actual conditions) are attached to the upper substrate 110 through the micro bumps 111 through the chip mounting process. Figure 7 , sawing by sawing process S1 Figure 6The resulting structure forms a separate upper substrate 110 with passive devices 140 and other electronic components 141 attached.

[0044] Afterwards, refer to Figures 8 to 15 The following describes the relevant components on the substrate 120 and the corresponding process of forming the packaging structure 100. Figure 8 A lower substrate 120 is provided. The lower substrate 120 has a dielectric layer 1201 and a second metal line 120m and a second via 120v embedded in the dielectric layer 1201. In addition, the lower substrate 120 has a surface 120s and an edge 120o. Further, the lower substrate 120 has a second pad 120p on the surface 120s.

[0045] Reference Figure 9 , forming micro bumps 112 on the surface 120s of the lower substrate 120 for attaching the passive device 140, and as Figure 9 As shown, other electronic components 141 are attached to the microbumps 112 that are not used to attach the passive device 140. In some embodiments, the microbumps 112 are formed using a solder printing process and are made of solder. In some embodiments, the microbumps 112 can be formed into different shapes according to actual conditions. Figure 10 The passive device 140 and the second electronic component 180 are attached to the lower substrate 120 through the micro bumps 112 through a chip mounting process.

[0046] See also Figure 11 , bonding the lead 130 to the second pad 120p of the lower substrate 120, specifically, bonding one or both ends 130e of the lead 130 to the second pad 120p of the lower substrate 120. In some embodiments, the lead 130 is formed by a wire bonding process commonly used in the art.

[0047] Afterwards, see Figure 12 ,Will Figure 7 The resulting structure is flipped and joined Figure 11 The resulting structure is Figure 12It should be noted that the passive device 140 on the upper substrate 110 is aligned with the microbumps 112 and attached to the lower substrate 120 via the microbumps 112, and the bent portion 130w or the end 130e of the lead 130 is aligned with the first pad 110p on the surface 110s of the upper substrate 110 and bonded to the first pad 110p. In this application, when the upper substrate 110 and the lower substrate 120 are docked, signal transmission can be achieved as long as the lead 130 contacts the corresponding first pad 110p of the upper substrate 110 and the second pad 120p of the lower substrate 120. Furthermore, the lead 130 is deformable. Even if the lead 130 deforms, it is still higher than the docking component (such as the passive device 140), ensuring that it will contact the corresponding first pad 110p and second pad 120p, thereby achieving the purpose of signal transmission. This has a certain tolerance and a relatively simple manufacturing process. Furthermore, the position of the lead 130 can be freely designed according to actual needs without any specific position restrictions. Therefore, the lead 130 can achieve bilateral docking and signal transmission with this characteristic.

[0048] See also Figure 13 , the first electronic component 160 is attached to the top surface 110t of the upper substrate 110 via the bumps 170. In some embodiments, the first electronic component 160 is attached via a chip mounting process. Figure 14 The encapsulation layer 150 is formed by a molding process, thereby encapsulating (sealing) the upper substrate 110, the lower substrate 120, the passive components 140, the leads 130, the first electronic component 160, and the second electronic component 180. In some embodiments, the encapsulation layer 150 can be polished to expose the first electronic component 160 from the encapsulation layer 150.

[0049] Finally, see Figure 15 , sawing by sawing process S2 Figure 14 The structure is formed to form a single package structure, and then the external connection member 190 is formed on the side of the lower substrate 120 opposite to the upper substrate 110, thereby obtaining Figure 2 and Figure 3 The package structure 100 is shown.

[0050] In the application, when the upper and lower substrates 110 and 120 are mated, signal transmission is achieved as long as the leads 130 contact the corresponding first pads 110p on the upper substrate 110 and the second pads 120p on the lower substrate 120. Furthermore, the leads 130 are deformable. Even if they deform, their height is higher than the mating components (such as the passive device 140), ensuring they will contact the corresponding first and second pads 110p and 120p, thus achieving signal transmission. This provides a certain tolerance and simplifies the manufacturing process. Furthermore, the upper and lower substrates 110 and 120 can simultaneously transmit different signals through the passive devices 140 and leads 130, allowing for shorter vertical signal transmission distances. This increases the number of vertical mating connection options, thereby improving component density and reducing the size of the package structure 100 by 15%.

[0051] Furthermore, the packaging structure provided by the present application does not require special design or specific position restrictions, and can achieve the shortest distance signal transmission. Except for the highest plane that needs to be connected to the passive device 104, the shorter passive devices 104 can be connected by leads 130 for vertical signal transmission.

[0052] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A packaging structure, characterized in that: include: upper base plate; lower base plate; a passive component disposed between the upper substrate and the lower substrate and in direct contact with the upper substrate and the lower substrate; and a lead connecting the upper substrate and the lower substrate and arranged around the passive device, The upper substrate and the lower substrate transmit different signals through the passive components and the leads.

2. The packaging structure according to claim 1, wherein: The lead wire has two ends and a bending portion connecting the two ends.

3. The packaging structure according to claim 2, wherein: One of the two end portions is connected to the upper substrate, the other of the two end portions is connected to the lower substrate, and the bent portion is located in a space between the upper substrate and the lower substrate.

4. The packaging structure according to claim 2, wherein: The two end portions are located on the lower substrate, and the bent portion contacts the upper substrate.

5. The packaging structure according to claim 1, wherein: Also includes: The packaging layer packages the upper substrate, the lower substrate, the passive components and the leads.

6. The packaging structure according to claim 5, wherein: An outermost edge of the encapsulation layer extends beyond an edge of the upper substrate.

7. The packaging structure according to claim 5, wherein: An outermost edge of the encapsulation layer is aligned with an edge of the lower substrate.

8. The packaging structure according to claim 1, wherein: The number of the lead wires is plural, and the lengths of the plurality of lead wires from one end to the other end are different from each other.

9. The packaging structure according to claim 1, wherein: The lower substrate extends beyond the lateral extent of the upper substrate.

10. The packaging structure according to claim 9, wherein: Also includes: a second electronic component disposed at a position of the lower substrate extending beyond the upper substrate; Wherein, the top surface of the second electronic component is higher than the top surface of the upper substrate.

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