Heating plug hole device and circuit board production equipment

Abstract

The utility model provides a heating plug hole device and circuit board production equipment. The heating hole plugging device comprises an exchange vacuum bin, an infrared heating assembly and a temperature sensor. A heating vacuum cavity is formed in the exchange vacuum bin; the infrared heating assembly is installed and fixed in the heating vacuum cavity, and the infrared heating assembly is used for heating the circuit board; the sensing end of the temperature sensor is arranged in the heating vacuum cavity, the signal output end of the temperature sensor is electrically connected with the control end of the infrared heating assembly, and the temperature sensor is used for detecting the temperature of the circuit board. According to the heating hole plugging device, the heating effect can be improved, and meanwhile the heating accuracy can be improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit board production equipment, and in particular to a heating plugging device and circuit board production equipment. Background Art

[0002] With the continued miniaturization of electronic components, the wiring and graphic design areas of printed circuit boards (PCBs) are shrinking. To adapt to this trend, updating design concepts and manufacturing methods is essential. Resin plugging has become a key method for reducing PCB design size and accommodating component design.

[0003] In the related art process flow of resin plugging of circuit boards, first, the circuit board is placed in a hot air oven for baking operation, and then the circuit board after the baking operation is subjected to resin plugging operation. For example, the prior art patent CN115942623A discloses a process of baking the circuit board in an oven.

[0004] However, heating the PCB in a hot air oven or baking oven can easily lead to excessive board temperature, which can easily cause solder mask hole clogging. Once the board temperature drops, the plugging effect of the PCB is affected. Furthermore, the board temperature decreases over time, and the board surface temperature of the subsequent plugging production has basically dropped to room temperature, which greatly affects the fluidity and curing process of the resin, resulting in poor plugging quality, prone to problems such as holes at the hole mouth, incomplete plugging, and delamination between resin and copper. Furthermore, hot air ovens or baking ovens transfer heat to the PCB through air, which requires heating the air. This results in energy waste and significantly reduces the heating effect on the PCB. Utility Model Content

[0005] The purpose of the present disclosure is to overcome the shortcomings of the prior art and provide a heating plugging device and circuit board production equipment that can improve the heating effect and the heating accuracy.

[0006] The purpose of this disclosure is achieved through the following technical solutions:

[0007] A heating plugging device, comprising:

[0008] An exchange vacuum chamber is formed with a heating vacuum cavity;

[0009] Characterized in that, the heating plug hole device further comprises:

[0010] an infrared heating assembly, the infrared heating assembly being fixedly mounted in the heating vacuum chamber and being used to heat the circuit board; and

[0011] A temperature sensor, wherein the sensing end of the temperature sensor is arranged in the heating vacuum chamber, the signal output end of the temperature sensor is electrically connected to the control end of the infrared heating component, and the temperature sensor is used to detect the temperature of the circuit board.

[0012] In one embodiment, the exchange vacuum chamber includes a chamber body and an exchange vacuum chamber cover, the chamber body is formed with a heating groove, one end of the exchange vacuum chamber cover is rotatably connected to the chamber body, and the exchange vacuum chamber cover is used to cover the groove of the heating groove to jointly form the heating vacuum chamber.

[0013] In one embodiment, the infrared heating assembly includes a plurality of infrared heat radiation tubes, which are installed side by side and fixed on the exchange vacuum chamber cover. The heating surface of each infrared heat radiation tube is used to be set toward the circuit board in the heating tank to heat the circuit board.

[0014] In one embodiment, the heating plugging device further includes a first driving power supply, which is installed and fixed on the outside of the chamber body, and is electrically connected to the power terminal of the exchange vacuum chamber.

[0015] In one embodiment, the temperature sensor is mounted and fixed on the exchange vacuum chamber cover, and the sensing end of the temperature sensor is arranged toward the circuit board in the heating tank; and / or,

[0016] The temperature sensor is an infrared temperature measuring probe.

[0017] In one embodiment, the heating plugging device further includes a vacuum plugging hole cover and a vacuum plugging hole component, wherein the vacuum plugging hole component is provided with a plugging hole groove, one end of the vacuum plugging hole cover is rotatably connected to the vacuum plugging hole component, and the vacuum plugging hole cover is used to cover the notch of the plugging hole groove to jointly form a plugging hole vacuum chamber.

[0018] In one embodiment, the heating plugging device further includes a second driving power supply, which is mounted and fixed on the outside of the vacuum plugging component, and is electrically connected to the power connection end of the vacuum plugging component.

[0019] In one embodiment, the infrared heating component is used to stop heating when the board temperature of the circuit board reaches 40°C-50°C.

[0020] In one embodiment, the heating plugging device includes a frame, and the vacuum plugging component and the exchange vacuum chamber are both mounted and fixed on the frame.

[0021] A circuit board production device includes the heating plugging device described in any of the above embodiments.

[0022] Compared with the prior art, the present disclosure has the following advantages, including but not limited to:

[0023] 1. The above-mentioned heating plugging device has a heating vacuum chamber formed by the exchange vacuum chamber, and the infrared heating component is installed and fixed in the heating vacuum chamber. The infrared heating component is used to heat the circuit board. The heating plugging device can evacuate the heating vacuum chamber to form a vacuum environment in the heating vacuum chamber, thereby avoiding the phenomenon of heat loss caused by the circuit board contacting the air environment when the infrared heating component heats the circuit board, thereby improving the heating efficiency of the heating plugging device; at the same time, the infrared heating component can use infrared radiation heat transfer to heat the circuit board. Compared with the above-mentioned hot air oven or oven heating circuit board method, infrared has strong penetrating power, so that the infrared heating component can directly heat the inside of the circuit board, so that the inside and outside of the circuit board are heated at the same time, and the infrared heating component can heat the circuit board without any medium, reducing the heat loss in the transfer process, further improving the heating efficiency of the heating plugging device, and greatly improving the heating effect.

[0024] 2. Since the sensing end of the temperature sensor is arranged in the heating vacuum chamber, the signal output end of the temperature sensor is electrically connected to the control end of the infrared heating component. The temperature sensor is used to detect the temperature of the circuit board, so that when the sensing end of the temperature sensor detects that the board temperature of the circuit board is lower than the preset temperature range, the temperature sensor transmits a first signal to the control end of the infrared heating component, and the infrared heating component will heat the circuit board. When the sensing end of the temperature sensor detects that the board temperature of the circuit board reaches the preset temperature range, the temperature sensor transmits a second signal to the control end of the infrared heating component, and the infrared heating component will stop heating the circuit board, so that the infrared heating component can control the board temperature of the circuit board within the preset temperature range, thereby greatly improving the heating accuracy of the heating plug device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is a schematic structural diagram of a heating plugging device according to an embodiment;

[0027] Figure 2 for Figure 1 Another perspective diagram of the heating plug hole device shown;

[0028] Figure 3 for Figure 1 A schematic diagram of a partial structure of the heating plug hole device shown;

[0029] Figure 4 for Figure 3 A partial enlarged schematic diagram of the heating plug hole device shown;

[0030] Figure 5 for Figure 1 Another partial structural schematic diagram of the heating plug hole device shown;

[0031] Figure 6 for Figure 5 A partially enlarged schematic diagram of the heating plug hole device is shown. DETAILED DESCRIPTION

[0032] To facilitate understanding of the present disclosure, a more comprehensive description of the present disclosure will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. The terms used herein in the specification of this disclosure are intended only to describe specific embodiments and are not intended to limit this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0035] like Figures 1 to 6As shown, a heating plugging device 10 of an embodiment includes an exchange vacuum chamber 110, an infrared heating component 120 and a temperature sensor 130. The exchange vacuum chamber 110 forms a heating vacuum chamber, and the infrared heating component 120 is installed and fixed in the heating vacuum chamber. The infrared heating component 120 is used to heat the circuit board 20. The heating plugging device 10 can evacuate the heating vacuum chamber to form a vacuum environment in the heating vacuum chamber, thereby avoiding the phenomenon of heat loss caused by the circuit board 20 contacting the air environment when the infrared heating component 120 heats the circuit board 20, thereby improving the The heating efficiency of the heating plugging device 10; at the same time, the infrared heating component 120 can heat the circuit board 20 by using the infrared radiation heat transfer method. Compared with the above-mentioned hot air oven or oven to heat the circuit board 20, the infrared has strong penetrating power, so that the infrared heating component 120 can directly heat the inside of the circuit board 20, so that the inside and outside of the circuit board 20 are heated at the same time, and the infrared heating component 120 can heat the circuit board 20 without any medium, reducing the loss of heat during the transfer process, further improving the heating efficiency of the heating plugging device 10, and greatly improving the heating effect.

[0036] like Figures 1 to 6 As shown, further, the sensing end of the temperature sensor 130 is arranged in the heating vacuum chamber, and the signal output end of the temperature sensor 130 is electrically connected to the control end of the infrared heating component 120. The temperature sensor 130 is used to detect the temperature of the circuit board 20, so that when the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 is lower than the preset temperature range, the temperature sensor 130 transmits a first signal to the control end of the infrared heating component 120, and the infrared heating component 120 will heat the circuit board 20. When the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 reaches the preset temperature range, the temperature sensor 130 transmits a second signal to the control end of the infrared heating component 120, and the infrared heating component 120 stops heating the circuit board 20, thereby greatly improving the heating accuracy of the heating plugging device 10.

[0037] In this embodiment, first, the circuit board 20 is placed in the heating vacuum chamber of the exchange vacuum chamber 110 and the exchange vacuum chamber 110 is started; then, the heating plugging device 10 evacuates the heating vacuum chamber to form a vacuum environment in the heating vacuum chamber, and when the exchange vacuum chamber 110 evacuates the heating vacuum chamber, the infrared heating component 120 heats the circuit board 20; at the same time, during the heating process of the circuit board 20, when the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 is lower than the preset temperature range, the temperature sensor 130 transmits a first signal When the temperature sensor 130 detects that the board temperature of the circuit board 20 reaches the preset temperature range, the temperature sensor 130 transmits a second signal to the control end of the infrared heating component 120, and the infrared heating component 120 stops heating the circuit board 20, so that the exchange vacuum chamber 110 can accurately heat the circuit board 20 to the preset temperature range; finally, the heated circuit board 20 is transferred to the next process for resin plugging through the table exchange method.

[0038] It should be noted that the method in which the control end of the infrared heating component 120 controls the infrared heating component 120 to heat the circuit board 20 according to the sensing signal of the temperature sensor 130 belongs to the prior art. This application only protects the positional connection relationship between the control end of the infrared heating component 120 and the temperature sensor 130. For example, the control end of the infrared heating component 120 chooses to heat the circuit board 20 or stop heating the circuit board 20 according to the sensing signal of the temperature sensor 130. Specifically, when the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 is lower than the preset temperature range, the temperature sensor 130 transmits a first signal to the control end of the infrared heating component 120, and the infrared heating component 120 will heat the circuit board 20. When the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 reaches the preset temperature range, the temperature sensor 130 transmits a second signal to the control end of the infrared heating component 120, and the infrared heating component 120 will stop heating the circuit board 20.

[0039] The above-mentioned heating hole plugging device 10, since the exchange vacuum chamber 110 forms a heating vacuum chamber, the infrared heating component 120 is installed and fixed in the heating vacuum chamber, and the infrared heating component 120 is used to heat the circuit board 20. The heating hole plugging device 10 can evacuate the heating vacuum chamber to form a vacuum environment in the heating vacuum chamber, thereby avoiding the phenomenon of heat loss caused by the circuit board 20 contacting the air environment when the infrared heating component 120 heats the circuit board 20, thereby improving the heating efficiency of the heating hole plugging device 10; at the same time, the infrared heating component 120 can heat the circuit board 20 by infrared radiation heat transfer. Compared with the above-mentioned hot air oven or oven heating circuit board 20, infrared rays have strong penetrating power, so that the infrared heating component 120 can directly heat the inside of the circuit board 20, so that the inside and outside of the circuit board 20 are heated simultaneously. Moreover, the infrared heating component 120 can heat the circuit board 20 without any medium, reducing heat loss during the transfer process, further improving the heating efficiency of the heating hole plugging device 10, and greatly improving the heating effect.

[0040] Since the sensing end of the temperature sensor 130 is arranged in the heating vacuum chamber, the signal output end of the temperature sensor 130 is electrically connected to the control end of the infrared heating component 120. The temperature sensor 130 is used to detect the temperature of the circuit board 20, so that when the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 is lower than the preset temperature range, the temperature sensor 130 transmits a first signal to the control end of the infrared heating component 120, and the infrared heating component 120 will heat the circuit board 20. When the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 reaches the preset temperature range, the temperature sensor 130 transmits a second signal to the control end of the infrared heating component 120, and the infrared heating component 120 stops heating the circuit board 20, thereby greatly improving the heating accuracy of the heating plugging device 10.

[0041] like Figures 3 and 4 As shown, in one embodiment, the exchange vacuum chamber 110 includes a chamber body 112 and an exchange vacuum chamber cover 113, the chamber body 112 is formed with a heating groove, one end of the exchange vacuum chamber cover 113 is rotatably connected to the chamber body 112, and the exchange vacuum chamber cover 113 is covered at the notch of the heating groove to jointly form a heating vacuum chamber, so that when the circuit board 20 needs to be placed in the heating vacuum chamber, the exchange vacuum chamber 110 can open the heating vacuum chamber by rotating the exchange vacuum chamber cover 113, and when the heating vacuum chamber needs to be evacuated, the exchange vacuum chamber 110 can also close the heating vacuum chamber by rotating the exchange vacuum chamber cover 113.

[0042] like Figures 3 to 6As shown, in one embodiment, the infrared heating assembly 120 includes a plurality of infrared heat radiation tubes 121, and the plurality of infrared heat radiation tubes 121 are installed side by side and fixed on the exchange vacuum chamber cover 113. The heating surface of each infrared heat radiation tube 121 is used to be set toward the circuit board 20 in the heating tank to heat the circuit board 20, so that the infrared heat radiation tube 121 can use infrared rays to heat the circuit board 20, thereby improving the heating efficiency of the heating plugging device 10.

[0043] like Figures 1 to 6 As shown, in one embodiment, the heating plugging device 10 also includes a first driving power supply 140, which is installed and fixed on the outside of the chamber body 112. The first driving power supply 140 is electrically connected to the power terminal of the exchange vacuum chamber 110, so that the first driving power supply 140 can transmit electricity to the infrared heating component 120, so that the infrared heating component 120 can convert electrical energy into infrared light and radiate it onto the circuit board 20, thereby heating the circuit board 20.

[0044] like Figures 3 to 6 As shown, in one embodiment, the temperature sensor 130 is installed and fixed on the exchange vacuum chamber cover 113, and the sensing end of the temperature sensor 130 is used to be set toward the circuit board 20 in the heating tank, so that when the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 in the heating tank is lower than the preset temperature range, the temperature sensor 130 transmits a first signal to the control end of the infrared heating component 120, and the infrared heating component 120 will heat the circuit board 20. When the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 in the heating tank reaches the preset temperature range, the temperature sensor 130 transmits a second signal to the control end of the infrared heating component 120, and the infrared heating component 120 stops heating the circuit board 20.

[0045] like Figures 5 and 6 As shown, in one embodiment, the temperature sensor 130 is an infrared temperature measuring probe, so that the temperature sensor 130 can accurately detect the board temperature of the circuit board 20.

[0046] like Figure 1As shown, in one embodiment, the heating plugging device 10 further includes a vacuum plugging cover 150 and a vacuum plugging member 160. The vacuum plugging member 160 is provided with a plugging slot. One end of the vacuum plugging cover 150 is rotatably connected to the vacuum plugging member 160, and the vacuum plugging cover 150 is arranged at the notch of the plugging slot to jointly form a plugging vacuum chamber. When the circuit board 20 needs to be placed in the plugging vacuum chamber, the vacuum plugging member 160 can open the plugging vacuum chamber by rotating the vacuum plugging cover 150, and when the plugging vacuum chamber needs to be evacuated, the vacuum plugging member 160 can also close the plugging vacuum chamber by rotating the vacuum plugging cover 150. At the same time, the heating plugging device 10 can evacuate the plugging vacuum chamber to form a vacuum environment in the plugging vacuum chamber, and the heating plugging device 10 can also vent the plugging vacuum chamber and the heating vacuum chamber.

[0047] like Figure 1 As shown, in one embodiment, the heating plugging device 10 further includes a second driving power supply 170, which is installed and fixed on the outside of the vacuum plugging component 160, and the second driving power supply 170 is connected to the power input end of the vacuum plugging component 160, so that the second driving power supply 170 can transmit power to the vacuum plugging component 160, so that the vacuum plugging component 160 can start and perform vacuum resin plugging on the heated circuit board 20.

[0048] like Figure 1 As shown, in one embodiment, the heating plugging device 10 has a double table, so that the exchange vacuum chamber 110 and the vacuum plugging component 160 can operate simultaneously, thereby improving the production efficiency of the heating plugging device 10, and the exchange vacuum chamber 110 can also enter the vacuum plugging component 160 through table exchange to perform resin plugging operations.

[0049] It should be noted that the double-table structure of the heating plugging device 10 and the method of exchanging the tables through the double-table structure, the method of evacuating the vacuum of the heating vacuum chamber and the plugging vacuum chamber by the heating plugging device 10, the structure of the vacuum plugging part 160 and the method of performing resin plugging on the circuit board 20 are all existing technologies and will not be elaborated here.

[0050] like Figures 1 to 6 As shown, in one embodiment, the infrared heating component 120 is used to stop heating when the board temperature of the circuit board 20 reaches 40°C-50°C, so as to reduce the viscosity of the resin and improve the rheological properties of the resin, thereby achieving the purpose of quickly filling the plug hole.

[0051] like Figure 1As shown, in one embodiment, the heating plugging device 10 includes a frame 180, and the vacuum plugging component 160 and the exchange vacuum chamber 110 are both installed and fixed on the frame 180 to protect the vacuum plugging component 160 and the exchange vacuum chamber 110 from being affected by ground moisture.

[0052] The present disclosure also provides a circuit board production device, including the heating plugging device 10 described in any of the above embodiments.

[0053] Compared with the prior art, the present disclosure has the following advantages, including but not limited to:

[0054] 1. In the above-mentioned circuit board production equipment, since the exchange vacuum chamber 110 forms a heating vacuum chamber, the infrared heating component 120 is installed and fixed in the heating vacuum chamber. The infrared heating component 120 is used to heat the circuit board 20. The heating plugging device 10 can evacuate the heating vacuum chamber to form a vacuum environment in the heating vacuum chamber, thereby avoiding the phenomenon of heat loss caused by the circuit board 20 contacting the air environment when the infrared heating component 120 heats the circuit board 20, thereby improving the heating efficiency of the heating plugging device 10; at the same time, the infrared heating component 120 can heat the circuit board 20 by infrared radiation heat transfer. Compared with the above-mentioned method of heating the circuit board 20 in a hot air oven or a baking oven, infrared rays have strong penetrating power, so that the infrared heating component 120 can directly heat the inside of the circuit board 20, so that the inside and outside of the circuit board 20 are heated simultaneously. Moreover, the infrared heating component 120 can heat the circuit board 20 without any medium, thereby reducing heat loss during the transfer process, further improving the heating efficiency of the heating plugging device 10, and greatly improving the heating effect.

[0055] 2. Since the sensing end of the temperature sensor 130 is arranged in the heating vacuum chamber, the signal output end of the temperature sensor 130 is electrically connected to the control end of the infrared heating component 120. The temperature sensor 130 is used to detect the temperature of the circuit board 20, so that when the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 is lower than the preset temperature range, the temperature sensor 130 transmits a first signal to the control end of the infrared heating component 120, and the infrared heating component 120 will heat the circuit board 20. When the sensing end of the temperature sensor 130 detects that the board temperature of the circuit board 20 reaches the preset temperature range, the temperature sensor 130 transmits a second signal to the control end of the infrared heating component 120, and the infrared heating component 120 stops heating the circuit board 20, thereby greatly improving the heating accuracy of the heating plugging device 10.

[0056] The above-described embodiments merely represent several implementation methods of the present disclosure. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the scope of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the disclosed patent shall be determined by the appended claims.

Claims

1. A heating plugging device, comprising: An exchange vacuum chamber is formed with a heating vacuum cavity; Characterized in that, the heating plug hole device further comprises: an infrared heating assembly, the infrared heating assembly being fixedly mounted in the heating vacuum chamber and being used to heat the circuit board; and A temperature sensor, wherein the sensing end of the temperature sensor is arranged in the heating vacuum chamber, the signal output end of the temperature sensor is electrically connected to the control end of the infrared heating component, and the temperature sensor is used to detect the temperature of the circuit board.

2. The heating plug hole device according to claim 1, characterized in that: The exchange vacuum chamber includes a chamber body and an exchange vacuum chamber cover. The chamber body is formed with a heating groove. One end of the exchange vacuum chamber cover is rotatably connected to the chamber body, and the exchange vacuum chamber cover is used to cover the notch of the heating groove to jointly form the heating vacuum chamber.

3. The heating plug hole device according to claim 2, characterized in that: The infrared heating assembly includes a plurality of infrared heat radiation tubes, which are installed side by side and fixed on the exchange vacuum chamber cover. The heating surface of each infrared heat radiation tube is used to be set toward the circuit board in the heating tank to heat the circuit board.

4. The heating plug hole device according to claim 2, characterized in that: The heating plug hole device also includes a first driving power supply, which is installed and fixed on the outside of the chamber body, and is electrically connected to the power terminal of the exchange vacuum chamber.

5. The heating plug hole device according to claim 2, characterized in that: The temperature sensor is mounted and fixed on the exchange vacuum chamber cover, and the sensing end of the temperature sensor is used to be arranged toward the circuit board in the heating tank; and / or, The temperature sensor is an infrared temperature measuring probe.

6. The heating plugging device according to claim 1, characterized in that: The heating plugging device also includes a vacuum plugging hole cover and a vacuum plugging hole component. The vacuum plugging hole component is provided with a plugging hole groove. One end of the vacuum plugging hole cover is rotatably connected to the vacuum plugging hole component, and the vacuum plugging hole cover is used to cover the notch of the plugging hole groove to jointly form a plugging hole vacuum chamber.

7. The heating plug hole device according to claim 6, characterized in that: The heating hole plugging device also includes a second driving power supply, which is installed and fixed on the outside of the vacuum hole plugging component, and the second driving power supply is electrically connected to the power connection end of the vacuum hole plugging component.

8. The heating plug hole device according to claim 1, characterized in that: The infrared heating assembly is used to stop heating when the board temperature of the circuit board reaches 40°C-50°C.

9. The heating plug hole device according to claim 6, characterized in that: The heating plugging device comprises a frame, and the vacuum plugging component and the exchange vacuum chamber are both mounted and fixed on the frame.

10. A circuit board production equipment, characterized in that, A heating plug hole device comprising the heating plug hole device according to any one of claims 1 to 9.

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