Feeding device for chemical immersion gold wire of PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of PCB (Printed Circuit Board) processing, and discloses a feeding device for a PCB chemical immersion gold wire, which comprises an electroplating box, a conveying belt located in the electroplating box and a driving piece used for driving the conveying belt to operate are installed on the electroplating box. The periphery of the conveying belt is connected with a plurality of elastic clamping assemblies arranged at intervals, and the elastic clamping assemblies are used for limiting plates. A water filtering piece is installed on the side face of the elastic clamping assembly, and an included angle exists between the water filtering piece and the elastic clamping assembly. According to the feeding device for the PCB chemical immersion gold line, the conveying belt, the elastic clamping assembly and the water filtering piece are combined, the uniformity of a gold plating layer in the PCB electroplating process can be effectively improved, when the elastic clamping assembly and the water filtering piece operate in the electroplating box, electroplating liquid can be evenly distributed on a PCB, and the electroplating quality is improved. And liquid in the electroplating box can be stirred, flowing of the liquid is accelerated, and therefore the problem that a plating layer is not uniform due to insufficient liquidity of the electroplating liquid is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, in particular to a feeding device for chemical immersion gold wire of a PCB board. Background Art

[0002] PCB, or printed circuit board, is a carrier used to connect and fix electronic components. It combines electronic components, wires, pads, etc. to form a fully functional circuit board. Electroless gold plating is a PCB surface treatment process. This process first deposits a layer of nickel of appropriate thickness on the conductor surface of the PCB board through chemical methods. Then, a layer of gold of a certain thickness is replaced on the nickel layer to protect the nickel layer on the surface of the PCB board. When gold plating a PCB board, it is generally immersed in a gold plating tank, and an electric current is applied to reduce and deposit gold ions on the PCB board surface.

[0003] During the PCB manufacturing process, the traditional loading method involves using a robotic arm to drive a suction cup to pick up the PCB and directly load it into the plating tank. However, because the liquid in the plating tank is relatively static, when the PCB comes into direct contact with the static plating solution, the lack of fluidity in the plating solution may cause uneven plating. This direct loading method affects the final gold plating quality.

[0004] In order to solve the above problems, the present application proposes a feeding device for chemically etched gold wire on a PCB board. Utility Model Content

[0005] Based on the technical problems existing in the background technology, the utility model proposes a feeding device for chemical immersion gold wire of PCB board.

[0006] The utility model provides a feeding device for chemical gold immersion wire on a PCB board, comprising an electroplating box;

[0007] The electroplating box is provided with a conveyor belt located inside the electroplating box and a driving member for driving the conveyor belt;

[0008] The outer periphery of the conveyor belt is connected to a plurality of elastic positioning components arranged at intervals, and the elastic positioning components are used to limit the position of the plate;

[0009] A water filter is installed on the side of the elastic locking component, and an angle is formed between the water filter and the elastic locking component.

[0010] Preferably, the elastic positioning assembly includes a positioning frame and an elastic limiting member. The periphery of the conveyor belt is connected to a plurality of spaced positioning frames. A limiting chamber is formed in the positioning frame, and the limiting chamber runs through both sides of the positioning frame. The positioning frame is provided with an opening that is connected to the limiting chamber and for the entry and exit of the plate. The positioning frame is installed with an elastic limiting member for limiting the plate.

[0011] Preferably, the elastic limiting member includes a spring and a limiting block, and the inner walls at both ends of the positioning frame are connected to the limiting blocks via the spring.

[0012] Preferably, the water filter element includes a water filter plate and filter holes. The water filter plate is installed on the side of the positioning frame. There is an angle between the positioning frame and the water filter plate. The water filter plate is provided with densely arranged filter holes.

[0013] Preferably, the driving member includes a motor and a roller. Two transversely arranged rollers are provided in the electroplating box. The two ends of the rollers are rotatably connected to the inner walls of the two sides of the electroplating box respectively. The motor is installed on the side of the electroplating box and is located at one end of one of the rollers. The output end of the motor is connected to the end of one of the rollers. The conveyor belt is sleeved on the two rollers and cooperates with them.

[0014] Preferably, the bottom of the electroplating box is connected to a drain pipe communicating with the interior thereof, and a valve body is installed on the drain pipe.

[0015] The above technical solution of the utility model has the following beneficial technical effects:

[0016] By providing a conveyor belt, an elastic clamping component and a water filter, several PCB boards can be fixed respectively by means of several elastic clamping components on the conveyor belt, and then the conveyor belt is driven to operate by a driving component, so that the PCB boards fixed on the elastic clamping component come into contact with the liquid in the electroplating box in turn. When the elastic clamping component operates in the electroplating box, the liquid can be filtered through the water filter on the side of the elastic clamping component and evenly distributed on the PCB boards. When the elastic clamping component and the water filter operate in the electroplating box, the liquid in the electroplating box can be stirred, thereby accelerating the flow of the liquid and improving the quality of the gold plating of the PCB boards. This structure can effectively improve the uniformity of the gold plating layer during the electroplating process of the PCB boards by using the combination of the conveyor belt, the elastic clamping component and the water filter. When the elastic clamping component and the water filter operate in the electroplating box, not only can the electroplating liquid be evenly distributed on the PCB boards, but the liquid in the electroplating box can also be stirred and accelerated its flow, thereby reducing the problem of uneven plating caused by insufficient fluidity of the electroplating liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a feeding device for chemical gold immersion wire on a PCB board proposed by the present invention.

[0018] Figure 2 It is a structural diagram of the elastic locking component and the water filter of the utility model.

[0019] Figure numerals: 1. electroplating box; 2. conveyor belt; 3. driving part; 31. motor; 32. roller; 4. elastic locking assembly; 41. locking frame; 42. elastic limiting part; 421. spring; 422. limiting block; 5. water filter; 51. water filter plate; 52. filter hole; 6. drain pipe; 7. valve body. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely illustrative and are not intended to limit the scope of the present invention. Furthermore, descriptions of known structures and technologies are omitted in the following description to avoid unnecessary confusion regarding the concepts of the present invention.

[0021] like Figure 1 and Figure 2 As shown, the present invention provides a feeding device for chemical gold immersion lines on PCB boards, comprising an electroplating box 1;

[0022] In this embodiment, the electroplating box 1 is equipped with a conveyor belt 2 located inside it and a driving member 3 for driving the conveyor belt 2 to operate. The driving member 3 includes a motor 31 and a roller 32. Two transversely arranged rollers 32 are provided in the electroplating box 1. The two ends of the roller 32 are rotatably connected to the inner walls of the two sides of the electroplating box 1 respectively. The motor 31 is installed on the side of the electroplating box 1 and is located at one end of a roller 32. The output end of the motor 31 is connected to the end of a roller 32. The conveyor belt 2 is sleeved on the two rollers 32 and cooperates with them.

[0023] In this embodiment, the periphery of the conveyor belt 2 is connected to a plurality of elastic locking components 4 arranged at intervals, and the elastic locking components 4 are used to limit the plate. The elastic locking components 4 include a locking frame 41 and an elastic limiting member 42. The periphery of the conveyor belt 2 is connected to a plurality of locking frames 41 arranged at intervals. A limiting chamber is formed in the locking frame 41, and the limiting chamber runs through both sides of the locking frame 41. An opening is provided on the locking frame 41 that is connected to the limiting chamber and for the plate to enter and exit. An elastic limiting member 42 for limiting the plate is installed in the locking frame 41. The elastic limiting member 42 includes a spring 421 and a limiting block 422. The inner walls at both ends of the locking frame 41 are connected to the limiting block 422 through the spring 421.

[0024] In this embodiment, a water filter component 5 is installed on the side of the elastic locking component 4, and there is an angle between the water filter component 5 and the elastic locking component 4. The water filter component 5 includes a water filter plate 51 and filter holes 52. The water filter plate 51 is installed on the side of the locking frame 41, and there is an angle between the locking frame 41 and the water filter plate 51. The water filter plate 51 is provided with densely arranged filter holes 52.

[0025] It should be noted that: a plurality of PCB boards can be fixed respectively by a plurality of elastic positioning components 4 on the conveyor belt 2. Specifically, the PCB board can be inserted into the positioning frame 41 so as to be placed between the two limit blocks 422. Under the elastic action of the spring 421, the PCB board can be clamped between the two limit blocks 422. Then, the roller 32 is driven by the motor 31 to drive the conveyor belt 2 to operate, so that the PCB boards fixed on the positioning frame 41 are in contact with the liquid in the electroplating box 1 in turn. When the positioning frame 41 operates in the electroplating box 1, the liquid can be filtered evenly through the filter holes 52 on the water filter plate 51 on the side of the positioning frame 41. Distributed on the PCB board, the positioning frame 41 and the water filter plate 51 can stir the liquid in the electroplating box 1 when they are running in the electroplating box 1, accelerate the flow of the liquid, and improve the quality of the gold plating of the PCB board. This structure can effectively improve the uniformity of the gold plating layer during the electroplating process of the PCB board by using a combination of the conveyor belt 2, the elastic positioning component 4 and the water filter 5. When the elastic positioning component 4 and the water filter 5 are running in the electroplating box 1, they can not only make the plating liquid evenly distributed on the PCB board, but also stir the liquid in the electroplating box 1 and accelerate its flow, thereby reducing the problem of uneven plating caused by insufficient fluidity of the plating liquid.

[0026] In a specific embodiment, the bottom of the electroplating box 1 is connected to a drain pipe 6 communicating with the interior thereof, and a valve body 7 is installed on the drain pipe 6 .

[0027] After the gold plating of the PCB is completed, the valve body 7 on the drain pipe 6 can be opened to allow the liquid in the electroplating box 1 to be discharged through the drain pipe 6.

[0028] It should be understood that the above-described specific embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the scope of protection of the present invention. In addition, the appended claims of the present invention are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents thereof.

Claims

1. A feeding device for chemical gold deposition lines on PCB boards, comprising an electroplating box (1), characterized in that: The electroplating box (1) is provided with a conveyor belt (2) located inside the electroplating box and a driving member (3) for driving the conveyor belt (2). The outer periphery of the conveyor belt (2) is connected to a plurality of elastic positioning components (4) arranged at intervals, and the elastic positioning components (4) are used to limit the position of the plate; A water filter (5) is installed on the side of the elastic locking component (4), and an angle exists between the water filter (5) and the elastic locking component (4).

2. A feeding device for chemically etched gold wire on a PCB according to claim 1, characterized in that: The elastic positioning assembly (4) includes a positioning frame (41) and an elastic limiting member (42). The outer periphery of the conveyor belt (2) is connected to a plurality of spacingly arranged positioning frames (41). A limiting cavity is formed in the positioning frame (41), and the limiting cavity passes through both sides of the positioning frame (41). The positioning frame (41) is provided with an opening that is connected to the limiting cavity and is used for the entry and exit of a plate. The positioning frame (41) is installed with an elastic limiting member (42) for limiting the position of the plate.

3. A feeding device for chemically etched gold wire on a PCB according to claim 2, characterized in that: The elastic limiting member (42) comprises a spring (421) and a limiting block (422), and the inner walls at both ends of the positioning frame (41) are connected to the limiting block (422) via the spring (421).

4. A feeding device for chemically etched gold wire on a PCB according to claim 2, characterized in that: The water filter element (5) comprises a water filter plate (51) and filter holes (52); the water filter plate (51) is mounted on a side of the positioning frame (41); an angle is formed between the positioning frame (41) and the water filter plate (51); and the water filter plate (51) is provided with densely arranged filter holes (52).

5. A feeding device for chemically etched gold wire on a PCB according to claim 1, characterized in that: The driving member (3) includes a motor (31) and a roller (32). Two horizontally arranged rollers (32) are provided in the electroplating box (1). The two ends of the rollers (32) are rotatably connected to the inner walls of the electroplating box (1) on both sides. The motor (31) is installed on the side of the electroplating box (1) and is located at one end of one of the rollers (32). The output end of the motor (31) is connected to the end of one of the rollers (32). The conveyor belt (2) is sleeved on the two rollers (32) and cooperates with them.

6. A feeding device for chemically etched gold wire on a PCB according to claim 1, characterized in that: The bottom of the electroplating box (1) is connected to a drainage pipe (6) communicating with the interior thereof, and a valve body (7) is installed on the drainage pipe (6).

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