Shield and electronic device

Abstract

The utility model relates to the technical field of electronic equipment, and discloses a shielding piece and electronic equipment. Wherein the shielding piece comprises a conducting layer and a magnetic shielding layer, the conducting layer comprises a first section, a second section and a third section, the two ends of the second section are connected with the first section and the third section respectively, the first section and the third section are located on the two opposite sides of the magnetic shielding layer in the first direction respectively, and the first direction is the thickness direction of the magnetic shielding layer. The shielding piece can solve the problems of radiation stray and low-frequency magnetic interference at the same time.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a shielding component and an electronic device. Background Art

[0002] Electronic devices are becoming increasingly smaller and more compact. Consequently, components in these devices are placed closer together, which can lead to radiated spurious emission (RSE) and low-frequency magnetic interference between the components, affecting their proper operation.

[0003] For example, antenna energy placed near a camera can couple to the camera, causing it to radiate unwanted electromagnetic waves (e.g., harmonics), leading to spurious emissions. Another example is a motherboard placed near a camera, which can generate low-frequency magnetic fields (e.g., less than 100kHz) during operation, potentially interfering with the camera's operation.

[0004] Therefore, the camera needs to avoid both radiated stray radiation and low-frequency magnetic interference, but current electronic devices cannot solve the problems of radiated stray radiation and low-frequency magnetic interference at the same time. Utility Model Content

[0005] The embodiments of the present application provide a shielding component and an electronic device to achieve the purpose of simultaneously solving the problems of radiation stray and low-frequency magnetic interference.

[0006] In the first aspect, an embodiment of the present application provides a shielding component, which includes a conductive layer and a magnetic shielding layer, the conductive layer includes a first segment, a second segment and a third segment, the two ends of the second segment are respectively connected to the first segment and the third segment, the first segment and the third segment are respectively located on opposite sides of the magnetic shielding layer along a first direction, and the first direction is the thickness direction of the magnetic shielding layer.

[0007] According to the embodiment of the present application, the conductive layer of the shielding member is used to form a low-impedance path to solve the problem of radiation stray, and the magnetic shielding layer of the shielding member is used to solve the problem of low-frequency magnetic interference. The shielding member has a simple structure and good shielding effect.

[0008] In a possible implementation of the first aspect above, the conductive layer includes a fourth segment, the fourth segment and the second segment are located on opposite sides of the magnetic shielding layer along a second direction, the second direction is perpendicular to the first direction, and the two ends of the fourth segment are respectively connected to the first segment and the third segment.

[0009] The conductive layer of this structure is larger, thus more effectively forming a low-impedance path, thereby solving the problem of stray radiation. At the same time, the U-shaped structure can also make the force on the left and right sides of the shield more uniform, thus improving the structural stability of the shield.

[0010] In a possible implementation of the first aspect, the conductive layer includes a fifth segment, and along the first direction, the fifth segment and the first segment are arranged opposite to each other, and the fifth segment is connected to the fourth segment.

[0011] The conductive layer of the above structure has a larger area, which can more effectively form a low-impedance path, thereby solving the problem of radiation stray. At the same time, it also helps to improve the strength of the shielding component.

[0012] In a possible implementation of the first aspect, the shielding element includes a conductive flange connected to the conductive layer, extending along a first direction and including a protrusion located on a side of the conductive layer facing away from the magnetic shielding layer.

[0013] In this way, the conductive layer can be connected to different areas of other devices through the conductive flange, so as to effectively form a low-impedance path according to different usage scenarios, thereby further avoiding radiation stray problems.

[0014] In a possible implementation of the first aspect, along the first direction, the protrusion includes a first end and a second end, the first end is farther away from the conductive layer than the second end, and an area of ​​the first end of the protrusion is larger than an area of ​​the second end of the protrusion.

[0015] In this way, the connection between the protrusion and other devices can be made more secure, and the protrusion can be prevented from warping.

[0016] In a possible implementation of the first aspect, the shape of the protrusion includes a rectangle, a T-shape, or a trapezoid.

[0017] In a possible implementation of the first aspect, the shielding element includes an elastic layer, which is elastically expandable and contractible along a first direction, and the elastic layer is disposed opposite to the magnetic shielding layer along the first direction.

[0018] Since the elastic layer can elastically expand and contract along the first direction, the elastic layer can absorb assembly tolerances, thereby effectively reducing the difficulty of assembling the shielding component and the requirements for the manufacturing accuracy of the shielding component.

[0019] In a possible implementation of the first aspect above, the elastic layer is provided between the first section and the third section.

[0020] In a possible implementation of the first aspect, the elastic layer is detachably provided on one side of the magnetic shielding layer along the first direction.

[0021] In one possible implementation of the first aspect, the conductive layer includes a sixth segment, a seventh segment, and an eighth segment. Along the first direction, the sixth segment and the eighth segment are located on opposite sides of the elastic layer, respectively. Both ends of the seventh segment are connected to the sixth segment and the eighth segment, respectively. The sixth segment is located on a side of the third segment facing away from the magnetic shielding layer and is detachably connected to the third segment.

[0022] In a possible implementation of the first aspect above, the magnetic shielding layer includes a heat-conducting layer to meet heat dissipation requirements.

[0023] In a possible implementation of the first aspect above, the conductive flange is made of nickel or copper to achieve good conductive effect and meet actual usage requirements.

[0024] In a possible implementation of the first aspect above, the conductive layer is made of nickel or copper, so as to form a low-impedance path to solve the problem of stray radiation.

[0025] In a possible implementation of the first aspect above, the material of the magnetic shielding layer is iron-based nanocrystals or magnetic rubber, thereby solving the magnetic interference problem.

[0026] In a second aspect, an embodiment of the present application provides an electronic device, which includes an electronic device and a shielding member that can be provided by any one of the possible implementations of the first aspect, wherein the shielding member is provided on the electronic device.

[0027] The beneficial effects that can be achieved in the second aspect can refer to the beneficial effects of the method provided in any embodiment of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1A shows an exemplary structure of a mobile phone in an embodiment of the present application;

[0029] Figure 1B according to Figure 1A A partial enlarged view of the area where the camera is located in the mobile phone in an embodiment of the present application is shown;

[0030] Figure 2 Shows exemplary arrangements of conductive elements in some technical solutions;

[0031] Figure 3A An exemplary arrangement of a magnetic shielding member in an embodiment of the present application is shown;

[0032] Figure 3B A schematic diagram showing a high permeability magnetic shielding member for achieving magnetic field shielding in an embodiment of the present application is shown;

[0033] Figure 4 The principle of high conductivity materials achieving magnetic field shielding in the embodiment of the present application is shown;

[0034] Figure 5A A three-dimensional diagram of a shielding member, a camera, and a circuit board in an embodiment of the present application is shown;

[0035] Figure 5B A split diagram of a shielding member, a camera, and a circuit board in an embodiment of the present application is shown;

[0036] Figure 6A shows a top view of a shielding member in an embodiment of the present application;

[0037] Figure 6B shows an expanded view of the shielding member in an embodiment of the present application;

[0038] Figure 6C It shows the structure of part of the shielding member in the embodiment of the present application. Figure 6A Sectional view 1 at AA in FIG;

[0039] Figure 6D It shows the structure of part of the shielding member in the embodiment of the present application. Figure 6A Section view at AA Figure 2 ;

[0040] Figure 7A An exemplary structure of a conductive layer in an embodiment of the present application is shown;

[0041] Figure 7B according to Figure 7A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0042] Figure 8A shows an exemplary structure of another conductive layer in an embodiment of the present application;

[0043] Figure 8B according to Figure 8A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0044] Figure 9A An exemplary arrangement of the conductive adhesive in the embodiment of the present application is shown;

[0045] Figure 9B according to Figure 9A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0046] Figure 10A Another exemplary arrangement of the conductive adhesive in the embodiment of the present application is shown;

[0047] Figure 10B according to Figure 10A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0048] Figure 11A Another exemplary arrangement of the conductive adhesive in the embodiment of the present application is shown;

[0049] Figure 11B according to Figure 11A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0050] Figure 12A An exemplary arrangement of the conductive flange in an embodiment of the present application is shown;

[0051] Figure 12B according to Figure 12A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0052] Figure 13A Another exemplary arrangement of the conductive flange in the embodiment of the present application is shown;

[0053] Figure 13B according to Figure 13A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0054] Figure 14A Another exemplary arrangement of the conductive flange in the embodiment of the present application is shown;

[0055] Figure 14B according to Figure 14A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application; Figure 15A Another exemplary arrangement of the conductive flange in the embodiment of the present application is shown;

[0056] Figure 15B according to Figure 15A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0057] Figure 16A 1 shows an exemplary shape of the protrusion in an embodiment of the present application;

[0058] Figure 16B Schematic diagram showing a second exemplary shape of the protrusion in an embodiment of the present application;

[0059] Figure 17 An exemplary arrangement of the insulating layer in an embodiment of the present application is shown;

[0060] Figure 18A An exemplary configuration of the elastic layer in an embodiment of the present application is shown;

[0061] Figure 18B according to Figure 18A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0062] Figure 19A Another exemplary arrangement of the elastic layer in the embodiment of the present application is shown;

[0063] Figure 19B according to Figure 19A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0064] Figure 20A Another exemplary arrangement of the elastic layer in the embodiment of the present application is shown;

[0065] Figure 20B according to Figure 20A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0066] Figure 21A Another exemplary arrangement of the elastic layer in the embodiment of the present application is shown;

[0067] Figure 21B according to Figure 21A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0068] Figure 22A Another exemplary arrangement of the elastic layer in the embodiment of the present application is shown;

[0069] Figure 22B according to Figure 22A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0070] Figure 23A Another exemplary arrangement of the elastic layer in the embodiment of the present application is shown;

[0071] Figure 23B according to Figure 23A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0072] Figure 24A Another exemplary arrangement of the elastic layer in the embodiment of the present application is shown;

[0073] Figure 24B according to Figure 24A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0074] Figure 25A Another exemplary arrangement of the elastic layer in the embodiment of the present application is shown;

[0075] Figure 25B according to Figure 25A The figure shows an exemplary arrangement of the shielding member, the camera and the copper leakage area in the embodiment of the present application;

[0076] Figure 26 Shows exemplary structures of conductive fabrics in some technical solutions;

[0077] Figure 27 Shows exemplary structures of electromagnetic shielding sheets in other technical solutions;

[0078] Figure 28 Shows exemplary structures of electromagnetic shielding sheets in some other technical solutions;

[0079] Figure 29 Shows exemplary structures of electromagnetic shielding sheets in some other technical solutions;

[0080] Figure 30 The exemplary structures of electromagnetic shielding sheets in some further technical solutions are shown. DETAILED DESCRIPTION

[0081] The embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

[0082] The embodiments of the present application are used to provide a shielding component and an electronic device, wherein the shielding component can simultaneously solve the problems of radiation stray and low-frequency magnetic interference, thereby ensuring that the components in the electronic device can operate normally.

[0083] The electronic devices may include, for example, tablets, mobile phones, laptops, cameras, ultra-mobile personal computers (UMPCs), handheld computers, touch-screen televisions, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, smart vehicles, smart robots, or industrial equipment, and this application does not impose specific restrictions on these devices. Furthermore, electronic components in electronic devices that need to avoid both radiated stray radiation and low-frequency magnetic interference may include, for example, nonlinear devices such as cameras, compasses, or microphones (MICs), and this application does not impose specific restrictions on these devices.

[0084] For ease of description, the following is an example in which the electronic device is a mobile phone, and the electronic component that needs to avoid both radiated stray radiation and low-frequency magnetic interference is the rear camera in the mobile phone.

[0085] Figure 1A The figure shows an exemplary structure of the mobile phone 1 in the embodiment of the present application. Figure 1B according to Figure 1A A partial enlarged view of the area where the camera 30 is located in the mobile phone 1 in the embodiment of the present application is shown, wherein, in order to facilitate observation of the components inside the mobile phone 1, Figure 1B Some structural features of the housing 10 are shown in dashed lines. Figure 1A and Figure 1B The mobile phone 1 includes a housing 10 , a display screen 20 , a camera 30 , an antenna 40 and a mainboard 50 .

[0086] The housing 10 may include a middle frame 11, a back cover 12, and a camera deco 13 (deco). The middle frame 11, back cover 12, and camera deco 13 may be an integrally formed structure, or may be assembled to form an integral structure. The display screen 20 and back cover 12 are respectively mounted on opposite sides of the middle frame 11, and the camera deco 13 is disposed on the side of the back cover 12 facing away from the middle frame 11. Thus, the middle frame 11, back cover 12, camera deco 13, and display screen 20 together form a housing cavity 14. The camera 30 and the mainboard 50 are disposed in the housing cavity 14, and the mainboard 50 is located at the bottom of the camera 30. The antenna 40 is disposed on the housing 10.

[0087] The camera 30 includes a housing 31 and a lens 32 enclosed by the housing 31. The portion of the housing 31 located below the lens 32 is made of metal (e.g., a first metal portion S1) to provide sufficient support strength. The lens 32 receives light from outside the phone 1 to capture scenes outside the phone 1.

[0088] The antenna 40 is used to receive or radiate electromagnetic waves to implement the wireless communication function of the mobile phone 1 .

[0089] The motherboard 50 may be integrated with components such as a processor, memory, and a communication module. The memory and communication module are electrically connected to the processor, respectively. The memory is used to store instructions and data, and the communication module can implement 3G / 4G / 5G wireless communications of the mobile phone 1, as well as wireless local area networks (WLAN), Bluetooth (BT), and near field communication (NFC) of the mobile phone 1. It is understood that the components on the motherboard 50 are not limited to those described above, and electronic components that can realize other performance of the mobile phone 1 are also provided, which are not listed here. By way of example, the motherboard 50 may be, for example, a system on chip (SOC).

[0090] It is worth noting that in order to meet the design requirements of miniaturization and compactness of the mobile phone 1, the camera 30, antenna 40 and mainboard 50 are arranged relatively close to each other, which may cause radiation stray and low-frequency magnetic interference problems.

[0091] Specifically, refer to Figure 1B When the antenna 40 is operating, it generates electromagnetic waves. These waves are reflected by the camera trim 13 and reach the housing 31 of the camera 30, thereby exciting the first metal portion S1 of the housing 31 to radiate undesirable electromagnetic waves (e.g., harmonics) into free space, leading to spurious radiation. Therefore, a high-conductivity conductive member is required to ground the camera 30, providing a low-impedance path to guide the undesirable electromagnetic waves radiated by the first metal portion S1 of the housing 31 to the ground, thereby avoiding spurious radiation.

[0092] Figure 2 FIG. 4 shows an exemplary arrangement of the conductive member 60 in some technical solutions. Figure 2 The conductive member 60 can be, for example, a nickel-plated conductive cloth or a high conductivity material such as copper foil to meet the high conductivity requirement and ensure that the housing 31 of the camera 30 is well grounded.

[0093] The conductive member 60 can be attached to the surface of the first metal portion S1 of the housing 31 facing away from the lens 32 to be electrically connected to the first metal portion S1 of the housing 31. Figure 2 The pasting direction is shown by the dotted arrow in the figure. The surface of the conductive member 60 facing away from the first metal part S1 of the outer shell 31 is used to conduct with the copper leakage area G (as an example of a metal ground) on the main board 50. In this way, the grounding of the first metal part S1 of the outer shell 31 can be achieved, thereby forming a low-impedance path: first metal part S1→conductive member 60→copper leakage area G, thereby guiding the unwanted electromagnetic waves radiated by the first metal part S1 of the outer shell 31 to the ground, avoiding the problem of radiation stray. In other embodiments, the metal ground can also be other structures, such as a metal middle plate in the middle frame provided between the camera 30 and the main board 50, and the metal middle plate is used to support the camera 30 and the main board 50. This application does not impose any specific restrictions on this.

[0094] Continue to refer Figure 1B During operation, a large current flows through the motherboard 50. Furthermore, the buck inductor and some power supply components (not shown) on the motherboard 50 generate ripple, i.e., small fluctuations in the output voltage or current, ultimately forming a low-frequency magnetic field. This low-frequency magnetic field can interfere with the normal operation of the camera 30, for example, affecting the loop between the analog voltage positive power supply (AVP) and the analog ground (AGND) of the image sensor in the camera 30, thereby causing camera streaks. Therefore, it is necessary to shield against interference from low-frequency magnetic fields.

[0095] In some technical solutions, the flux-dividing properties of high-permeability materials (e.g., iron-based nanocrystals) can be utilized to shield against low-frequency magnetic fields. However, the high-conductivity conductive fabric 60 (e.g., nickel-plated conductive fabric or copper foil) has a relatively low magnetic permeability. For example, as shown in Table 1 below, the relative magnetic permeability of nickel is 350, and the relative magnetic permeability of copper is 1, which is far lower than the relative magnetic permeability of iron-based nanocrystals, which ranges from 80,000 to 400,000. Therefore, an additional high-permeability shielding member is required at the bottom of the camera 30.

[0096] Figure 3A FIG. 4 shows an exemplary arrangement of a magnetic shielding member 70 a in an embodiment of the present application. Figure 3B FIG2 shows a schematic diagram of a magnetic shielding member 70a with high magnetic permeability to achieve magnetic field shielding in an embodiment of the present application. Figure 3A Combined with Figure 3B The magnetic shielding member 70a can be attached to the surface of the first metal portion S1 of the housing 31 of the camera 30 facing away from the lens 32, wherein: Figure 2 The dotted arrow in the figure indicates the direction of attachment. This shields low-frequency magnetic interference from the mainboard 50. Specifically, the magnetic shield 70a is made of a high-permeability material with low magnetic resistance. When a low-frequency magnetic field is incident on the magnetic shield 70a, the magnetic resistance of the magnetic shield 70a is lower than that of air. Therefore, most of the low-frequency magnetic field is diverted to other locations through the magnetic shield 70a, with very little passing through the magnetic shield 70a to propagate in the air. This effectively shields the low-frequency magnetic field.

[0097] However, the electrical conductivity of high permeability materials is low. For example, as shown in Table 1 below, the electrical conductivity of iron-based nanocrystals is 8.7×10 5 S / m, which is much lower than the conductivity of nickel, 1.56×10 7 S / m and the electrical conductivity of copper is 5.7×10 7 S / m, therefore, installing a high-permeability magnetic shield 70a will hinder effective grounding of the camera 30, making it difficult to avoid radiated stray interference. For example, if the magnetic shield 70a is installed between the camera 30 and the conductive fabric 60, it will hinder electrical conduction between the camera 30 and the conductive fabric 60, making it difficult to form a low-impedance path. If the magnetic shield 70a is installed on the side of the conductive fabric 60 facing away from the camera 30, it will hinder electrical conduction between the conductive fabric 60 and the copper leakage area G of the motherboard 50, making it difficult to form a low-impedance path. Therefore, installing both the conductive member 60 and the magnetic shield 70a cannot simultaneously solve the problems of radiated stray interference and low-frequency magnetic interference.

[0098] In other technical solutions, the eddy current elimination property of high-conductivity materials can also be used to achieve shielding of low-frequency magnetic fields.

[0099] Figure 4The principle of high conductivity material 70b to achieve magnetic field shielding in the embodiment of the present application is shown. Figure 4 High-conductivity material 70b (e.g., nickel, copper, etc.) has low resistance. When a low-frequency magnetic field is incident on high-conductivity material 70b, eddy currents form on its surface, generating an opposing magnetic field that counteracts or suppresses the incident low-frequency magnetic field, thereby shielding it.

[0100] However, the shielding effectiveness of the high conductivity material 70b is related to its corresponding skin depth. For low-frequency magnetic fields, the high conductivity material 70b needs to be thick enough. For example, the thickness of the high conductivity material 70b is greater than 1 / 10 of the corresponding skin depth of the high conductivity material 70b.

[0101] The skin depth refers to the effective thickness of the material transmission path in the skin effect. The skin depth can be calculated according to the following formula (1):

[0102]

[0103] In formula (1), δ is the skin depth; μ is the magnetic permeability of the material, μ = μ0 × μ r , μ0 is the vacuum permeability, μ0=4π×10 -7 H·m -1 , μ r is the relative magnetic permeability of the material; σ is the electrical conductivity of the material; f is the frequency of the electromagnetic wave that needs to be shielded.

[0104] According to the above formula (1), Table 1 shows the electrical conductivity, relative magnetic permeability and skin depth of several materials at 20° C. and an electromagnetic wave frequency of 100 kHz.

[0105] Table 1

[0106] Material Conductivity (S / m) Relative magnetic permeability Skin depth (μm) nickel <![CDATA[1.56×10 7 ]]> 350 17 copper <![CDATA[5.7×10 7 ]]> 1 206 Iron-based nanocrystals <![CDATA[8.7×10 5 ]]> 80000-400000 /

[0107] As can be seen from Table 1 above, high-conductivity materials such as nickel and copper need to be sufficiently thick to effectively shield low-frequency magnetic fields. However, current conductive members 60 (e.g., nickel-plated conductive fabric or copper foil) are difficult to provide with sufficient thickness, and the conductive member 60 is often provided with openings (e.g., grounding holes), making it difficult to completely cover the first metal portion S1 of the housing 31. Therefore, current conductive members 60 do not provide a good shielding effect against low-frequency magnetic fields.

[0108] In view of this, the present application provides a shielding component to simultaneously solve the problems of radiated stray radiation and low-frequency magnetic interference, thereby ensuring that the device can operate normally. A detailed description is given below with reference to the accompanying drawings.

[0109] Figure 5A and Figure 5BFIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the circuit board 50 in an embodiment of the present application, wherein: Figure 5A is a three-dimensional diagram of the shielding member 100, the camera 30 and the circuit board 50, Figure 5B 1 is a separate diagram of the shielding member 100 , the camera 30 and the circuit board 50 . 6A to 6D FIG. 1 shows an exemplary structure of a shielding member 100 in an embodiment of the present application, wherein: Figure 6A is a top view of the shielding element 100, Figure 6B is an expanded view of the shielding member 100, Figure 6C Part of the structure of the shielding member 100 is Figure 6A The cross-sectional view at AA in Figure 1, Figure 6D The shielding element 100 is shown as a partial structure. Figure 6A Section view at AA Figure 2 , where, for ease of observation, Figure 6A and Figure 6B The colloid 130 and the conductive glue 140 are not shown. Figure 6D Also shown are the copper leakage areas G of the camera 30 and the main board 50. 6A to 6D , the shielding element 100 includes a conductive layer 110 and a magnetic shielding layer 120 .

[0110] Wherein, the conductive layer 110 includes a first section 111, a second section 112 and a third section 113. Along the thickness direction of the shielding member 100 (as an example of the first direction, for example, the Z direction), the first section 111 and the third section 113 are respectively located on opposite sides of the magnetic shielding layer 120. That is, the first section 111 and the third section 113 are arranged opposite to each other along the Z direction. The two ends of the second section 112 are respectively connected to one end 111A of the first section 111 along the X direction and one end 113A of the third section 113 along the X direction. In this way, the first section 111, the second section 112 and the third section 113 can together form a U-shaped structure. The opening of the U-shaped structure faces the X direction, and the X direction is perpendicular to the Z direction. The magnetic shielding layer 120 is located in the inner cavity of the U-shaped structure.

[0111] The conductive layer 110 is used to form a low impedance path to solve the above-mentioned radiation stray problem. The magnetic shielding layer 120 is used to solve the above-mentioned low-frequency magnetic interference problem.

[0112] To facilitate understanding of the working principle of the shielding member 100 provided in the present application, a description is given below in conjunction with the camera 30 and the circuit board 50 .

[0113] Continue to refer to 5A and Figure 5B , and combined with 6A to 6DThe first section 111, the third section 113, and the magnetic shielding layer 120 of the shield 100 are all arranged on the side of the first metal part S1 of the housing 31 of the camera 30 that faces away from the lens 32. The first section 111 of the conductive layer 110 in the shield 100 faces the first metal part S1 of the housing 31 and is electrically connected to the first metal part S1 of the housing 31. The third section 113 faces away from the first metal part S1 of the housing 31 and is electrically connected to the copper leakage area G on the mainboard 50. In this way, the first metal part S1 of the housing 31 can be grounded, thereby forming a low-impedance path: first metal part S1 → first section 111 → second section 112 → third section 113 → copper leakage area G, thereby guiding the undesired electromagnetic waves radiated by the first metal part S1 of the housing 31 to the ground, thereby avoiding the problem of stray radiation.

[0114] The magnetic shielding layer 120 is located between the camera 30 and the mainboard 50. The low-frequency magnetic field generated by the mainboard 50 can pass through the third section 113 of the conductive layer 110 to reach the magnetic shielding layer 120. The magnetic shielding layer 120 can shield the interference of the low-frequency magnetic field from the mainboard 50.

[0115] In summary, compared with the above Figures 2 to 4 As shown in the solution, the shielding member 100 provided in the present application can solve the problems of radiation stray and low-frequency magnetic interference at the same time, thereby ensuring that the camera 30 can work normally. The shielding member 100 has a simple structure and good shielding effect.

[0116] In some embodiments of the present application, the material of the conductive layer 110 may be a high conductivity material. For example, the conductivity of the material of the conductive layer 110 may be greater than or equal to 10 6 S / m, thereby forming a low impedance path to solve the above-mentioned radiation spurious problem.

[0117] In some implementations, the conductive layer 110 may be made of a material with high electrical conductivity, such as nickel or copper.

[0118] In some embodiments of the present application, the material of the magnetic shielding layer 120 can be a high magnetic permeability material. For example, the relative magnetic permeability of the material of the magnetic shielding layer 120 can be greater than or equal to 1000. In this way, the magnetic shielding layer 120 can solve the above-mentioned low-frequency magnetic interference problem through the flux diversion characteristics.

[0119] In some implementations, the material of the magnetic shielding layer 120 may be a high magnetic permeability material such as iron-based nanocrystals and magnetic rubber.

[0120] In some embodiments of the present application, the magnetic shielding layer 120 may further include a thermal conductive layer, such as graphite, to meet both grounding and heat dissipation requirements.

[0121] above Figure 6C and Figure 6D In the embodiment shown, the conductive layer 110 is at AA (for example, see Figure 6A The cross-sectional shape of the conductive layer 110 at AA shown in FIG. 1 is U-shaped, but the present application is not limited thereto. In other embodiments, the conductive layer 110 may further include more segments to form other structural forms besides the above-mentioned U-shape, which will be exemplarily described below.

[0122] Figure 7A An exemplary structure of a conductive layer 110 in an embodiment of the present application is shown. Figure 7B according to Figure 7A An exemplary arrangement of the shielding member 100 , the camera 30 , and the copper leakage area G in an embodiment of the present application is shown.

[0123] refer to Figure 7A Combined with Figure 7B The conductive layer 110 includes a first section 111, a second section 112, a third section 113 and a fourth section 114. The first section 111, the second section 112 and the third section 113 can refer to the above Figure 6C and Figure 6D Related description of the illustrated embodiment. The fourth segment 114 and the second segment 112 are located on opposite sides of the magnetic shielding layer 120 along the X direction (as an example of the second direction). That is, the fourth segment 114 is arranged opposite to the second segment 112 along the X direction. The two ends of the fourth segment 114 are respectively connected to the other end 111B of the first segment 111 along the X direction (that is, the end of the first segment 111 away from the second segment 112 along the X direction) and the other end 113B of the third segment 113 along the X direction (that is, the end of the third segment 113 away from the second segment 112 along the X direction). Alternatively, it can also be understood that the first segment 111, the second segment 112, the third segment 113 and the fourth segment 114 are connected end to end in sequence. Thus, the first segment 111, the second segment 112, the third segment 113 and the fourth segment 114 together constitute a U-shaped structure, that is, the conductive layer 110 is at AA (for example, refer to Figure 6A The cross-section shape of the magnetic shielding layer 120 is located in the inner cavity of the U-shaped structure.

[0124] The conductive layer 110 of the U-shaped structure has a larger area, thereby more effectively forming a low-impedance path. At the same time, the U-shaped structure can also make the force on the left and right sides of the shielding element 100 more uniform, thereby improving the structural stability of the shielding element 100.

[0125] Figure 8A FIG. 1 shows another exemplary structure of the conductive layer 110 in an embodiment of the present application. Figure 8B according to Figure 8AAn exemplary arrangement of the shielding member 100 , the camera 30 and the copper leakage area G in an embodiment of the present application is shown.

[0126] refer to Figure 8A Combined with Figure 8B The conductive layer 110 includes a first section 111, a second section 112, a third section 113, a fourth section 114 and a fifth section 115. The first section 111, the second section 112, the third section 113 and the fourth section 114 can refer to the above Figure 7A and Figure 7B The fifth segment 115 and the first segment 111 are arranged opposite to each other along the Z direction and are located on the side of the first segment 111 facing away from the magnetic shielding layer 120. One end 115A of the fifth segment 115 along the X direction is connected to the fourth segment 114. Thus, the first segment 111, the second segment 112, the third segment 113, the fourth segment 114 and the fifth segment 115 together form a 6-shaped structure, that is, the conductive layer 110 is at AA (for example, refer to Figure 6A The cross-section shape of the magnetic shielding layer 120 is in the inner cavity of the 6-shaped structure.

[0127] The conductive layer 110 of the 6-shaped structure has a larger area, thereby more effectively forming a low-impedance path. At the same time, the 6-shaped structure also helps to improve the strength of the shielding element 100.

[0128] It is understandable that the above Figures 6C to 8B The conductive layer 110 is only schematically shown as a part of the form, and does not constitute a limitation to the present application. For example, the fifth segment 115 can also be located on the side of the third segment 113 facing away from the magnetic shielding layer 120, so that the conductive layer 110 is at AA (for example, refer to Figure 6A The cross-sectional shape at AA shown is an inverted 6 shape.

[0129] After introducing several exemplary forms of the conductive layer 110 of the magnetic shielding component 100, the following will continue to introduce exemplary connection methods between the layers of the magnetic shielding component 100, as well as exemplary connection methods between the magnetic shielding component 100 and other structures (for example, the first metal part S1 of the housing 31 of the camera 30 and the copper leakage area G).

[0130] Continue to refer Figures 6C to 8B In some embodiments of the present application, a colloid 130 may be provided between the conductive layer 110 and the magnetic shielding layer 120. In this way, the conductive layer 110 can be bonded to the magnetic shielding layer 120 through the colloid 130, thereby achieving a fixed connection between the conductive layer 110 and the magnetic shielding layer 120, preventing the conductive layer 110 and the magnetic shielding layer 120 from separating from each other, and ensuring the structural stability of the shielding component 100.

[0131] In some implementations, the colloid 130 may cover the entire surface of the conductive layer 110 facing the magnetic shielding layer 120, so as to ensure the bonding strength between the conductive layer 110 and the magnetic shielding layer 120. For example, Figure 6C and Figure 6D In the embodiment shown, the colloid 130 may cover the surface of the first section 111 of the conductive layer 110 facing the magnetic shielding layer 120, the surface of the second section 112 facing the magnetic shielding layer 120, and the surface of the third section 113 facing the magnetic shielding layer 120. Figures 7A to 8B In the illustrated embodiment, the colloid 130 can cover the surface of the first section 111 of the conductive layer 110 facing the magnetic shielding layer 120, the surface of the second section 112 facing the magnetic shielding layer 120, the surface of the third section 113 facing the magnetic shielding layer 120, and the surface of the fourth section 114 facing the magnetic shielding layer 120.

[0132] In some other implementations, the colloid 130 may only cover a portion of the surface of the conductive layer 110 facing the magnetic shielding layer 120. For example, the colloid 130 may cover the surface of the first section 111 of the conductive layer 110 facing the magnetic shielding layer 120 and the surface of the third section 113 facing the magnetic shielding layer 120, but not cover the surface of the second section 112 facing the magnetic shielding layer 120.

[0133] In some implementations, the colloid 130 may be, for example, a conductive adhesive (eg, the conductive adhesive 140 described below), an insulating adhesive, a pressure-sensitive adhesive, or a thermosetting adhesive, etc., and this application does not impose any specific limitation on this.

[0134] It is understandable that the present application does not impose any specific restrictions on the distribution method and type of the colloid 130, as long as the above-mentioned bonding effect can be achieved.

[0135] In other embodiments of the present application, the fixed connection between the conductive layer 110 and the magnetic shielding layer 120 can be achieved by other means. For example, the conductive layer 110 and the magnetic shielding layer 120 can be pressurized so that the contact surface between the conductive layer 110 and the magnetic shielding layer 120 is pressed together. For another example, the conductive layer 110 and the magnetic shielding layer 120 can be heated so that the contact surface between the conductive layer 110 and the magnetic shielding layer 120 is melted and fused together. For another example, the conductive layer 110 and the magnetic shielding layer 120 can also be connected together by snaps, hooks and loops, and the present application does not impose any specific restrictions on this.

[0136] Continue reading Figure 8A and Figure 8BIn some embodiments of the present application, the first section 111 and the fifth section 115 may also be fixedly connected to prevent the first section 111 and the fifth section 115 from separating from each other, thereby ensuring the structural stability of the shielding element 100. The first section 111 and the fifth section 115 may be fixedly connected by bonding, pressurizing, melting, or connecting with a connector. For details, please refer to the above description of the fixed connection between the conductive layer 110 and the magnetic shielding layer 120, which will not be repeated here.

[0137] Continue to refer Figures 6C to 8B In some embodiments of the present application, conductive adhesive 140 is applied to at least one of the upper and lower surfaces of the conductive layer 110, where the upper and lower surfaces of the conductive layer 110 are disposed opposite each other along the Z direction. The conductive adhesive 140 can provide electrical continuity and a fixed connection between the conductive layer 110 and other structures (e.g., the first metal portion S1 of the housing 31 of the camera 30 and the copper leakage area G), thereby forming a low-impedance path, addressing the aforementioned stray radiation issue, and enabling installation of the shielding element 100.

[0138] In some implementations, a conductive adhesive 140 may be provided on the upper surface of the conductive layer 110 .

[0139] For example, Figures 6C to 7B In the illustrated embodiment, the upper surface of the conductive layer 110 includes an upper surface 1111 of a first segment 111, which faces away from the magnetic shielding layer 120. A conductive adhesive 140 is applied to the upper surface 1111 of the first segment 111. This allows the first segment 111 to be bonded to the first metal portion S1 of the housing 31 of the camera 30 via the conductive adhesive 140, thereby attaching the shield 100 to the camera 30. Furthermore, the first segment 111 is electrically connected to the first metal portion S1 via the conductive adhesive 140, thereby forming a low-impedance path and addressing the aforementioned stray radiation issue.

[0140] For example, Figure 8A and Figure 8B In the illustrated embodiment, the upper surface of the conductive layer 110 includes an upper surface 1151 of the fifth segment 115. The upper surface 1151 of the fifth segment 115 faces away from the magnetic shielding layer 120. Conductive adhesive 140 is applied to the upper surface 1151 of the fifth segment 115. Thus, the fifth segment 115 is electrically connected to and bonded to the first metal portion S1 of the housing 31 of the camera 30 via the conductive adhesive 140.

[0141] It can be understood that the present application does not specifically limit the distribution method of the conductive adhesive 140 on the upper surface of the conductive layer 110, as long as it can achieve the above-mentioned conductive and adhesive effects. In some embodiments, the conductive adhesive 140 can cover at least a portion of the upper surface 1111 of the first section 111. For example, the conductive adhesive 140 can cover the entire area of ​​the upper surface 1111 of the first section 111; for another example, the conductive adhesive 140 can also cover the central area of ​​the upper surface 1111 of the first section 111; for another example, the conductive adhesive 140 can also cover the surrounding edge areas of the upper surface 1111 of the first section 111. In other embodiments, the upper surface 1111 of the first section 111 can be provided with a groove, and the conductive adhesive 140 is filled in the groove, that is, the conductive adhesive 140 is embedded in the first section 111 and is at least partially exposed to the outside world. In this way, the layout space in the Z direction can be saved, making the size of the shielding component 100 along the Z direction smaller.

[0142] In some other implementations, conductive adhesive 140 may be provided on both the upper surface and the lower surface of the conductive layer 110 .

[0143] For example, based on the above Figure 6C and Figure 6D The U-shaped conductive layer 110 shown, Figure 9A FIG. 1 shows an exemplary configuration of the conductive adhesive 140 in an embodiment of the present application. Figure 9B according to Figure 9A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 9A Combined with Figure 9B , the conductive layer 110 is at AA (for example, refer to Figure 6A The cross-section (at AA shown) is U-shaped, with the opening of the U facing the X direction. The upper surface of the conductive layer 110 includes the upper surface 1111 of the first segment 111. The lower surface of the conductive layer 110 includes the lower surface 1131 of the third segment 113. Conductive adhesive 140 is applied to both the upper surface 1111 of the first segment 111 and the lower surface 1131 of the third segment 113.

[0144] In this way, on the one hand, the first section 111 can be bonded to the first metal portion S1 via the conductive adhesive 140, and the third section 113 can be bonded to the copper leakage area G via the conductive adhesive 140, thereby integrally connecting the camera 30, the shield 100, and the mainboard 50. On the other hand, the first section 111 can be electrically connected to the first metal portion S1 via the conductive adhesive 140, and the third section 113 can be electrically connected to the copper leakage area G via the conductive adhesive 140, thereby forming a low-impedance path and resolving the aforementioned radiated emissions issue.

[0145] For example, based on the above Figure 7A and Figure 7B The U-shaped conductive layer 110 shown, Figure 10A FIG. 1 shows another exemplary arrangement of the conductive adhesive 140 in an embodiment of the present application. Figure 10B according to Figure 10A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 10A Combined with Figure 10B , the conductive layer 110 is at AA (for example, refer to Figure 6A The cross-section (at point AA) is a square. The upper surface of the conductive layer 110 includes the upper surface 1111 of the first segment 111. The lower surface of the conductive layer 110 includes the lower surface 1131 of the third segment 113. Conductive adhesive 140 is applied to both the upper surface 1111 of the first segment 111 and the lower surface 1131 of the third segment 113.

[0146] For example, based on the above Figure 8A and Figure 8B The 6-shaped conductive layer 110 shown, Figure 11A FIG. 1 shows another exemplary arrangement of the conductive adhesive 140 in an embodiment of the present application. Figure 11B according to Figure 11A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 11A Combined with Figure 11B The conductive layer 110 has an upper surface 1151 of the fifth segment 115. The lower surface 1131 of the third segment 113 is provided with conductive adhesive 140.

[0147] In some other implementations, the lower surface of the conductive layer 110 may be provided with a conductive adhesive 140 , and this application does not impose any specific limitation on this.

[0148] In some embodiments of the present application, the shielding member 100 may further include a conductive flange connected to the conductive layer 110, the conductive flange extending along the Z direction, and including a protrusion located on the side of the conductive layer 110 facing away from the magnetic shielding layer 120. The protrusion is used to conduct with at least part of the side of the housing 31 of the camera 30. The side of the housing 31 refers to the physical part of the housing 31 that is arranged around the side of the lens 32, or in other words, the physical part of the housing 31 that is arranged parallel to the Z direction. In this way, when the side of the housing 31 is metal, the metal side of the housing 31 can be conducted to the conductive layer 110 through the conductive flange, and then grounded through the conductive layer 110, thereby forming a low-impedance path, thereby further avoiding the problem of radiation stray.

[0149] It can be understood that the conductive flange can be connected to different ends of different sections of the conductive layer 110 according to actual needs, so that the protrusion of the conductive flange can be connected to different metal sides of the housing 31 of the camera 30. An exemplary introduction is given below.

[0150] Based on the above Figure 6C and Figure 6D The U-shaped conductive layer 110 shown, Figure 12A An exemplary configuration of the conductive flange 150 in an embodiment of the present application is shown. Figure 12B according to Figure 12A An exemplary arrangement of the shielding member 100 , the camera 30 and the copper leakage area G in an embodiment of the present application is shown.

[0151] refer to Figure 12A Combined with Figure 12B The conductive flange 150 is connected to the other end 113B of the third segment 113 of the conductive layer 110 along the X direction (i.e., the end of the third segment 113 away from the second segment 112). Furthermore, the conductive flange 150 is foldable. After being folded toward the Z direction, the conductive flange 150 extends in the Z direction. The conductive flange 150 extending in the Z direction includes a protrusion 151. The protrusion 151 is located on the side of the first segment 111 of the conductive layer 110 that faces away from the magnetic shielding layer 120 and is located near one end of the conductive layer 110 along the X direction.

[0152] The housing 31 of the camera 30 includes a second metal portion S2. The second metal portion S2 is a side portion of the housing 31 along the X-direction. When the shield 100 is mounted on the camera 30, the protrusion 151 formed by the folded conductive flange 150 can be electrically connected to the second metal portion S2. This allows the second metal portion S2 to be electrically connected to the conductive layer 110 through the conductive flange 150, and then to ground through the conductive layer 110, forming a low-impedance path. This ultimately guides unwanted electromagnetic waves radiated by the second metal portion S2 to the ground, preventing stray radiation.

[0153] In some embodiments of the present application, the protrusion 151 of the conductive flange 150 can be electrically conductively bonded to and adhered to the second metal portion S2 via the conductive adhesive 140. Specifically, the conductive adhesive 140 is provided on the upper surface 152 of the conductive flange 150. After the conductive flange 150 is folded to form the protrusion 151, the upper surface 152 of the conductive flange 150 can form the surface of the protrusion 151 facing the second metal portion S2, thereby electrically conductively bonding the protrusion 151 to and adhered to the second metal portion S2 via the conductive adhesive 140.

[0154] It should be noted that Figure 12A and Figure 12B In the illustrated embodiment, the colloid 130 disposed between the conductive layer 110 and the magnetic shielding layer 120 is a conductive adhesive 140 .

[0155] Based on the above Figure 7A and Figure 7B The U-shaped conductive layer 110 shown, Figure 13A Another exemplary arrangement of the conductive flange 150 in an embodiment of the present application is shown. Figure 13B according to Figure 13A An exemplary arrangement of the shielding member 100 , the camera 30 , and the copper leakage area G in an embodiment of the present application is shown.

[0156] refer to Figure 13A Combined with Figure 13B The conductive flange 150 is connected to one end 111A of the first section 111 of the conductive layer 110 along the X direction. In addition, the conductive flange 150 can be folded. After the conductive flange 150 is folded toward the Z direction, its extension direction is the Z direction. The conductive flange 150 extending along the Z direction includes a protrusion 151. The protrusion 151 is located on the side of the first section 111 of the conductive layer 110 that is away from the magnetic shielding layer 120 and is arranged near the other end of the conductive layer 110 along the X direction. It can be understood that Figure 13A and Figure 13B The protrusion 151 in the embodiment shown is similar to the above Figure 12A and Figure 12B The protrusions 151 in the illustrated embodiment are arranged opposite to each other along the X direction.

[0157] The housing 31 of the camera 30 includes a third metal portion S3. The third metal portion S3 is another side portion of the housing 31 along the X direction. It can be understood that Figure 13A and Figure 13B The third metal portion S3 in the embodiment shown is the same as the above Figure 12A and Figure 12B In the illustrated embodiment, the second metal portions S2 are disposed opposite each other along the X-direction. When the shield 100 is mounted on the camera 30, the protrusion 151 of the conductive flange 150 can be electrically connected to the third metal portion S3. Thus, the third metal portion S3 can be electrically connected to the conductive layer 110 via the conductive flange 150, and further connected to the ground via the conductive layer 110, forming a low-impedance path. This ultimately guides unwanted electromagnetic waves radiated by the third metal portion S3 to the ground, preventing stray radiation.

[0158] Figure 14A Another exemplary arrangement of the conductive flange 150 in the embodiment of the present application is shown. Figure 14B according to Figure 14A An exemplary arrangement of the shielding member 100 , the camera 30 , and the copper leakage area G in an embodiment of the present application is shown.

[0159] refer to Figure 14A Combined with Figure 14BThe conductive layer 110 includes a first segment 111 , a second segment 112 , a third segment 113 , a fourth segment 114 and a fifth segment 115 . Figure 8A and Figure 8B Compared to the conductive layer 110 shown, Figure 14A and Figure 14B The conductive layer 110 shown differs in that Figure 14A and Figure 14B The conductive layer 110 shown has a colloid 130 disposed between the first section 111 and the fourth section 114. Figure 14A and Figure 14B The first section 111, the second section 112, the third section 113, the fourth section 114 and the fifth section 115 of the conductive layer 110 shown can be referred to as Figure 8A and Figure 8B Description of the illustrated embodiment.

[0160] Continue reading Figure 14A Combined with Figure 14B The conductive flange 150 is connected to the other end 115B of the fifth section 115 of the conductive layer 110 along the X direction. In addition, the conductive flange 150 can be folded. After the conductive flange 150 is folded toward the Z direction, its extension direction is the Z direction. The conductive flange 150 extending along the Z direction includes a protrusion 151. The protrusion 151 is located on the side of the fifth section 115 of the conductive layer 110 that is away from the magnetic shielding layer 120 and is arranged near the other end of the conductive layer 110 along the X direction. It can be understood that Figure 14A and Figure 14B The protrusion 151 in the embodiment shown is similar to the above Figure 12A and Figure 12B The protrusions 151 in the illustrated embodiment are arranged opposite to each other along the X direction.

[0161] When the shielding member 100 is installed on the camera 30, the protrusion 151 of the conductive flange 150 can be connected to the third metal part S3, so that the third metal part S3 can be connected to the conductive layer 110 through the conductive flange 150, and then grounded through the conductive layer 110, forming a low-impedance path, and finally guiding the unwanted electromagnetic waves radiated by the third metal part S3 to the ground, avoiding the problem of radiation stray.

[0162] Figure 15A Another exemplary arrangement of the conductive flange 150 in the embodiment of the present application is shown. Figure 15B according to Figure 15A The figure shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in the embodiment of the present application. Figure 15A and Figure 15B Each structure is Figure 5A A cross-sectional view at BB is shown.

[0163] refer to Figure 15A Combined with Figure 15B The number of conductive flanges 150 can be two, and the two conductive flanges 150 are respectively connected to the two ends 113C and 113D of the third segment 113 along the Y direction. It can be understood that the protrusions 151 of the two conductive flanges 150 are arranged opposite each other along the Y direction. The Y direction is perpendicular to the X direction and the Z direction.

[0164] The housing 31 of the camera 30 includes a fourth metal portion S4 and a fifth metal portion S5. The fourth metal portion S4 and the fifth metal portion S5 are two oppositely disposed side portions of the housing 31 along the Y direction. When the shield 100 is mounted on the camera 30, the protrusions 151 of the two conductive flanges 150 are electrically connected to the fourth metal portion S4 and the fifth metal portion S5, respectively. As a result, the fourth metal portion S4 and the fifth metal portion S5 are electrically connected to the conductive layer 110 through the two conductive flanges 150, thereby achieving grounding and forming a low-impedance path. This ultimately guides unwanted electromagnetic waves radiated by the fourth metal portion S4 and the fifth metal portion S5 to the ground, preventing stray radiation.

[0165] It is understandable that the above Figures 12A to 15B It only schematically illustrates a portion of the configuration of the conductive flange 150 and does not constitute a limitation to the present application.

[0166] It is also understandable that the above Figures 12A to 15B The conductive flanges 150 shown can be folded to extend along the Z direction, but the present application is not limited thereto. In other embodiments, the conductive flanges 150 can also extend along the Z direction and include protrusions 151 instead of folding the conductive flanges 150 to extend along the Z direction.

[0167] This application does not impose any specific restrictions on the shape of the protrusion 151 of the conductive flange 150, as long as it can be conductive with the metal side of the housing 31 of the camera 30 (such as the above-mentioned second metal part S2, third metal part S3, fourth metal part S4 and fifth metal part S5). Figure 16A and Figure 16B Several exemplary shapes of the protrusions 151 in the embodiments of the present application are shown, wherein: Figure 16A and Figure 16B for Figure 12B 15 is a side view of the second metal portion S2 and the protrusion 151 along the X direction.

[0168] refer to Figure 16A Combined with Figure 12B In some implementations, the protrusion 151 may be rectangular. The protrusion 151 covers the lower half of the second metal portion S2 to facilitate grounding of the second metal portion S2.

[0169] refer to Figure 16B Combined with Figure 12A and Figure 12B In some other implementations, the area of ​​the first end 151A of the protrusion 151 is larger than the area of ​​the second end 151B of the protrusion 151. In the protruding direction of the protrusion 151 (e.g., the Z direction), the first end 151A is farther away from the conductive layer 110 than the second end 151B.

[0170] In this way, the contact area between the first end 151A of the protrusion 151 and the second metal part S2 is larger than the contact area between the second end 151B of the protrusion 151 and the second metal part S2, thereby making the connection between the protrusion 151 and the second metal part S2 more secure and preventing the protrusion 151 from warping.

[0171] For example, the protrusion 151 may be Figure 10B Alternatively, the protrusion 151 may be in other shapes, such as a trapezoid or other irregular shapes, and the present application does not impose any specific restrictions thereto, as long as the area of ​​the first end 151A of the protrusion 151 is larger than the area of ​​the second end 151B of the protrusion 151 to achieve the above-mentioned anti-warping effect.

[0172] In some embodiments of the present application, an insulating layer may be further provided on the protrusion 151. Specifically, Figure 17 FIG. 1 shows an exemplary configuration of the insulating layer 153 in an embodiment of the present application. Figure 17 The surface of the protrusion 151 facing away from the second metal portion S2 is provided with an insulating layer 153 (e.g., Mylar). This insulates the protrusion 151 from other components (e.g., other circuit boards, metal plates, etc.), preventing interference between the protrusion 151 and other components.

[0173] Among them, the insulating layer 153 can completely cover the surface of the protrusion 151 facing away from the second metal part S2, or it can only cover a part of the surface of the protrusion 151 facing away from the second metal part S2. This application does not impose any specific restrictions on this, as long as it can meet actual usage requirements.

[0174] In some embodiments of the present application, the material of the conductive flange 150 may be a high conductivity material. For example, the conductivity of the material of the conductive flange 150 may be greater than or equal to 10 6 S / m, thus helping to form a low impedance path to solve the above-mentioned radiated spurious problem.

[0175] In some implementations, the conductive flange 150 may be made of a material with high electrical conductivity, such as nickel or copper.

[0176] In some embodiments of the present application, the shielding member 100 may further include an elastic layer, which is arranged relative to the magnetic shielding layer 120 along the Z direction and can elastically expand and contract along the Z direction to absorb assembly tolerances, thereby effectively reducing the assembly difficulty of the shielding member 100 and the requirements for the manufacturing accuracy of the shielding member 100.

[0177] In some embodiments of the present application, the elastic layer and the magnetic shield 120 are wrapped together by the first segment 111, the second segment 112 and the third segment 113 of the conductive layer 110, that is, the elastic layer is arranged between the first segment 111 and the third segment 113, which is exemplarily introduced below.

[0178] Based on the above Figure 6C and Figure 6D The U-shaped conductive layer 110 shown, Figure 18A FIG. 1 shows an exemplary configuration of the elastic layer 160 in an embodiment of the present application. Figure 18B according to Figure 18A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 18A Combined with Figure 18B The elastic layer 160 may be located in the inner cavity of the U-shaped conductive layer 110 and disposed between the magnetic shielding layer 120 and the third section 113 .

[0179] Based on the above Figure 7A and Figure 7B The U-shaped conductive layer 110 shown, Figure 19A FIG. 1 shows another exemplary arrangement of the elastic layer 160 in an embodiment of the present application. Figure 19B according to Figure 19A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 19A Combined with Figure 19B The elastic layer 160 may be located in the inner cavity of the U-shaped conductive layer 110 and disposed between the magnetic shielding layer 120 and the third section 113 .

[0180] Based on the above Figure 13A and Figure 13B The shield 100 shown has a conductive cuff 150, Figure 20A FIG. 1 shows another exemplary arrangement of the elastic layer 160 in an embodiment of the present application. Figure 20B according to Figure 20A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 20A Combined with Figure 20B The shielding member 100 may include a conductive flange 150 and an elastic layer 160. The configuration of the conductive flange 150 may be specifically described in the above description. Figure 13A and Figure 13B The relevant description of the embodiment shown in the figure, the configuration of the elastic layer 160 can be specifically referred to the above Figure 19A and Figure 19B The relevant descriptions in the illustrated embodiments will not be repeated here.

[0181] Figure 21A FIG. 1 shows another exemplary configuration of the elastic layer 160 in an embodiment of the present application. Figure 21B according to Figure 21A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 21A Combined with Figure 21B Conductive adhesive 140 is embedded in the third section 113. The elastic layer 160 is located between the magnetic shielding layer 120 and the third section 113 and contacts the conductive adhesive 140. Thus, the elastic layer 160 can be bonded to the third section 113 via the conductive adhesive 140. Furthermore, the third section 113 can also be electrically connected to and bonded to the copper leakage region G via the conductive adhesive 140.

[0182] It is understandable that the above Figures 18A to 21B It only schematically illustrates a portion of the configuration of the elastic layer 160 and does not constitute a limitation to the present application.

[0183] In some other embodiments of the present application, the elastic layer 160 can also be detachably provided on one side of the magnetic shielding layer 120 along the Z direction, instead of being wrapped by the first segment 111, the second segment 112 and the third segment 113 of the conductive layer 110 together with the magnetic shielding layer 120. An exemplary introduction is given below.

[0184] Based on the above Figure 6C and Figure 6D The U-shaped conductive layer 110 shown, Figure 22A FIG. 1 shows another exemplary configuration of the elastic layer 160 in an embodiment of the present application. Figure 22B according to Figure 22A An exemplary arrangement of the shielding member 100 , the camera 30 , and the copper leakage area G in an embodiment of the present application is shown.

[0185] refer to Figure 22A Combined with Figure 22B, the conductive layer 110 includes a sixth segment 116, a seventh segment 117, and an eighth segment 118. Along the Z direction, the sixth segment 116 and the eighth segment 118 are located on opposite sides of the elastic layer 160. That is, the sixth segment 116 and the eighth segment 118 are disposed opposite each other along the Z direction. The ends of the seventh segment 117 are connected to one end of the sixth segment 116 along the X direction and one end of the eighth segment 118 along the X direction, respectively. In other words, the elastic layer 160 is surrounded by the sixth segment 116, the seventh segment 117, and the eighth segment 118. This prevents the elastic layer 160 from obstructing electrical conduction between the conductive layer 160 and other structures (e.g., the first metal portion S1 and the copper leakage area G).

[0186] The sixth section 116 faces the third section 113 and is detachably connected to the third section 113, thereby achieving a detachable connection of the conductive layer 160. Specifically, the shield 100 comprises two separable portions: an upper portion D1 and a lower portion D2. The upper portion D1 comprises the first, second, and third sections 111, 112, and 113 of the conductive layer 110, as well as the magnetic shielding layer 120. The lower portion D2 comprises the sixth, seventh, and eighth sections 116, 117, and 118 of the conductive layer 110, as well as the elastic layer 160. During assembly, the upper portion D1 can be first mounted on the camera 30, followed by the lower portion D2 mounted on the mainboard 50. Finally, the camera 30 and mainboard 50 are aligned and assembled, so that the upper and lower portions D1 and D2 are integrated, thus forming the shield 100. During this process, the elastic layer 160 can be compressed in the Z direction, thereby absorbing assembly tolerances.

[0187] It is understandable that the above Figure 22A and Figure 22B The sixth segment 116, the seventh segment 117 and the eighth segment 118 in the embodiment shown together form a U-shaped structure. Figure 6C and Figure 6D In the illustrated embodiment, the U-shaped structures formed by the first section 111 , the second section 112 and the third section 113 are substantially the same.

[0188] However, the present application is not limited to this. In other embodiments, the portion of the conductive layer 110 used to wrap the elastic layer 160 may also include more segments to form other structural forms besides the above-mentioned U-shape (for example, a U-shape, a 6-shape, etc.), which is exemplified below.

[0189] Figure 23A FIG. 1 shows another exemplary configuration of the elastic layer 160 in an embodiment of the present application. Figure 23B according to Figure 23A An exemplary arrangement of the shielding member 100 , the camera 30 , and the copper leakage area G in an embodiment of the present application is shown.

[0190] refer to Figure 23A Combined with Figure 23B , the conductive layer 110 may include a sixth segment 116, a seventh segment 117, an eighth segment 118 and a ninth segment 119. The sixth segment 116, the seventh segment 117 and the eighth segment 118 may refer to the above Figure 22A and Figure 22B The sixth segment 116, the seventh segment 117, the eighth segment 118 and the ninth segment 119 are sequentially connected end to end, thereby forming a U-shaped structure, that is, the portion of the conductive layer 110 used to wrap the elastic layer 160 is at AA (for example, refer to Figure 6A The cross-sectional shape of the AA shown in FIG. 1 is a square. The elastic layer 160 is located in the inner cavity of the square structure. It can be understood that the square structure composed of the sixth section 116, the seventh section 117, the eighth section 118 and the ninth section 119 is the same as the above-mentioned square structure. Figure 7A and Figure 7B In the illustrated embodiment, the U-shaped structures formed by the first section 111 , the second section 112 , the third section 113 and the fourth section 114 are substantially the same.

[0191] In some other alternative implementations, the portion of the conductive layer 110 used to wrap the elastic layer 160 is at AA (for example, see Figure 6A The cross-sectional shape at AA shown in FIG. 1 may also be other shapes, for example, a 6-shaped structure. Figure 8A and Figure 8B In the embodiment shown, the first section 111, the second section 112, the third section 113, the fourth section 114 and the fifth section 115 together form a 6-shaped structure that is substantially the same. Therefore, reference can be made to the above Figure 8A and Figure 8B The relevant descriptions in the illustrated embodiments are omitted here for brevity.

[0192] Based on the above Figure 13A and Figure 13B The conductive layer 110 shown, Figure 24A FIG. 1 shows another exemplary arrangement of the elastic layer 160 in an embodiment of the present application. Figure 24B according to Figure 24A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 24A Combined with Figure 24B The conductive layer 110 may include a conductive flange 150 and an elastic layer 160. The structure and formation of the conductive flange 150 may be specifically referred to above. Figure 13A and Figure 13B The configuration of the elastic layer 160 can be specifically referred to above. Figure 23A and Figure 23B The relevant descriptions in the illustrated embodiments will not be repeated here.

[0193] Figure 25A FIG. 1 shows another exemplary configuration of the elastic layer 160 in an embodiment of the present application. Figure 25B according to Figure 25A FIG. 1 shows an exemplary arrangement of the shielding member 100, the camera 30 and the copper leakage area G in an embodiment of the present application. Figure 25A Combined with Figure 25B Conductive adhesive 140 is embedded in the eighth section 118. The elastic layer 160 is located between the magnetic shielding layer 120 and the conductive adhesive 140, so that the elastic layer 160 can be bonded to the eighth section 118 via the conductive adhesive 140. Furthermore, the eighth section 118 can also be electrically connected and bonded to the copper leakage region G via the conductive adhesive 140.

[0194] The following describes a comparison between the shielding member provided in the embodiment of the present application and devices used to avoid interference problems in some other technical solutions.

[0195] Figure 26 FIG. 1 shows an exemplary structure of a conductive cloth 100a in some technical solutions. Figure 26 The conductive cloth 100a is used to be arranged on the outside of the metal shell of the device to play an electrostatic shielding role.

[0196] Figure 27 FIG. 1 shows exemplary structures of electromagnetic shielding sheets 100b in other technical solutions. Figure 27 The electromagnetic shielding sheet 100b includes a magnetic shielding layer 110b, an isolation layer 120b, and an absorption layer 130b stacked along the Z direction. The magnetic shielding layer 110b is used to shield electromagnetic waves, the isolation layer 120b is used to isolate electromagnetic waves, and the absorption layer 130b is used to absorb electromagnetic waves, thereby achieving multi-level electromagnetic wave isolation.

[0197] Figure 28 FIG. 1 shows an exemplary structure of an electromagnetic shielding sheet 100c in some other technical solutions. Figure 28 The electromagnetic shielding sheet 100c includes a first flame-retardant layer 110c, a magnetic shielding layer 120c, and a second flame-retardant layer 130c stacked along the Z direction. The magnetic shielding layer 120c is used to achieve electromagnetic shielding. The first flame-retardant layer 110c and the second flame-retardant layer 130c can also provide flame retardancy and explosion-proof functions.

[0198] Figure 29 FIG. 1 shows an exemplary structure of an electromagnetic shielding sheet 100d in some other technical solutions. Figure 29The electromagnetic shielding sheet 100d includes a first thermally conductive layer 110d, a magnetic shielding layer 120d, and a second thermally conductive layer 130d stacked along the Z direction. The magnetic shielding layer 120d is used to provide electromagnetic shielding. The first thermally conductive layer 110d and the second thermally conductive layer 130d provide heat dissipation and uniform heat distribution.

[0199] Figure 30 FIG. 1 shows an exemplary structure of an electromagnetic shielding sheet 100e in some other technical solutions. Figure 30 The electromagnetic shielding sheet 100e includes a first protective layer 110e, a first conductive layer 120e, a first magnetic conductive layer 130e, a second conductive layer 140e, a polymer layer 150e, a second magnetic conductive layer 160e, a porous metal layer 170e, a third conductive layer 180e and a second protective layer 190e stacked along the Z direction.

[0200] By alternating the stacking of conductive layers (e.g., first conductive layer 120e, second conductive layer 140e, and third conductive layer 180e) and magnetic conductive layers (e.g., first magnetic conductive layer 130e and second magnetic conductive layer 160e), the eddy current elimination characteristics of each conductive layer can be enhanced. This enhances the reverse magnetic field generated by the induced eddy currents within each conductive layer, thereby improving the conductive layer's ability to shield against magnetic fields. The first protective layer 110e and the second protective layer 190e are used to provide water and dust resistance. The polymer layer 150e and the porous metal layer 170e are used to further enhance the magnetic shielding capabilities of each conductive layer.

[0201] In summary, the above Figures 26 to 30 The devices in the solutions shown cannot solve the problems of both radiated stray and low-frequency magnetic interference at the same time. However, in this application, by designing the stacked structure of the conductive layer 110 and the magnetic shielding layer 120, both the radiated stray and low-frequency magnetic interference problems can be solved at the same time, with a simple structure and good shielding effect.

[0202] The above describes the implementation methods of the present application by means of specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation methods. On the contrary, the purpose of introducing the application in conjunction with the implementation methods is to cover other options or modifications that may be extended based on the claims of the present application. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details are omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.

[0203] In the description of this application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "outside", "inside", "circumferential", "radial", "axial", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0204] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "dispose," "install," "connect," and "fit" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0205] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A shielding member (100), characterized in that: It comprises a conductive layer (110) and a magnetic shielding layer (120), wherein: The conductive layer (110) comprises a first section (111), a second section (112) and a third section (113); two ends of the second section (112) are respectively connected to the first section (111) and the third section (113); the first section (111) and the third section (113) are respectively located on opposite sides of the magnetic shielding layer (120) along a first direction; the first direction is the thickness direction of the magnetic shielding layer (120).

2. The shielding element (100) according to claim 1, characterized in that The conductive layer (110) includes a fourth segment (114), the fourth segment (114) and the second segment (112) are located on opposite sides of the magnetic shielding layer (120) along a second direction, the second direction is perpendicular to the first direction, and two ends of the fourth segment (114) are respectively connected to the first segment (111) and the third segment (113).

3. The shielding element (100) according to claim 2, characterized in that The conductive layer (110) includes a fifth segment (115). Along the first direction, the fifth segment (115) and the first segment (111) are arranged opposite to each other, and the fifth segment (115) is connected to the fourth segment (114).

4. The shielding element (100) according to any one of claims 1 to 3, characterized in that The shielding member (100) comprises a conductive flange (150), the conductive flange (150) being connected to the conductive layer (110), the conductive flange (150) extending along the first direction, and comprising a protrusion (151) located on a side of the conductive layer (110) facing away from the magnetic shielding layer (120).

5. The shielding element (100) according to claim 4, characterized in that Along the first direction, the protrusion (151) includes a first end (151A) and a second end (151B), the first end (151A) is farther away from the conductive layer (110) than the second end (151B), and the area of ​​the first end (151A) of the protrusion (151) is greater than the area of ​​the second end (151B) of the protrusion (151).

6. The shielding element (100) according to claim 4, characterized in that The shape of the protrusion (151) includes a rectangle, a T-shape or a trapezoid.

7. The shielding element (100) according to claim 1, characterized in that The shielding member (100) comprises an elastic layer (160), the elastic layer (160) being elastically expandable and contractible along the first direction, and the elastic layer (160) and the magnetic shielding layer (120) being arranged opposite to each other along the first direction.

8. The shielding element (100) according to claim 7, characterized in that The elastic layer (160) is provided between the first section (111) and the third section (113).

9. The shielding element (100) according to claim 7, characterized in that Along the first direction, the elastic layer (160) is detachably arranged on one side of the magnetic shielding layer (120).

10. The shielding element (100) according to claim 9, characterized in that The conductive layer (110) comprises a sixth segment (116), a seventh segment (117) and an eighth segment (118); along the first direction, the sixth segment (116) and the eighth segment (118) are respectively located on opposite sides of the elastic layer (160); and two ends of the seventh segment (117) are respectively connected to the sixth segment (116) and the eighth segment (118); The sixth section (116) is located on a side of the third section (113) facing away from the magnetic shielding layer (120) and is detachably connected to the third section (113).

11. The shielding element (100) according to claim 1, characterized in that The magnetic shielding layer (120) includes a heat conductive layer.

12. The shielding element (100) according to claim 4, characterized in that The conductive flange (150) is made of nickel or copper.

13. The shielding element (100) according to claim 1, characterized in that The conductive layer (110) is made of nickel or copper.

14. The shielding element (100) according to claim 1, characterized in that The material of the magnetic shielding layer (120) is iron-based nanocrystals or magnetic rubber.

15. An electronic device, characterized in that: The electronic equipment comprises an electronic device and the shielding element (100) according to any one of claims 1 to 14, wherein the shielding element (100) is provided on the electronic device.

Images