Flexible separating device for LED pre-cutting substrate

Abstract

The flexible separating device for the LED pre-cutting substrate comprises a first air bag and a second air bag which are longitudinally arranged in parallel, and a substrate placing position is reserved between the first air bag and the second air bag. And the first air bag and / or the second air bag are / is inflated and expanded to longitudinally extrude the LED pre-cutting substrate placed in the substrate placing position, so that each chip packaging area in the substrate deforms towards multiple directions, and the pre-cutting lines of the substrate are extruded to be broken, so that the substrate is divided into multiple LED units. When in use, an LED pre-cutting substrate on which a plurality of transversely parallel LED chips are packaged is placed in the substrate placing position; and then the first air bag and the second air bag are inflated and expanded to longitudinally extrude the LED pre-cutting substrate, so that each chip packaging area in the substrate deforms towards multiple directions, the pre-cutting lines of the substrate are forced to be brittle-broken, and the LED pre-cutting substrate is divided into multiple LED units. According to the separating device, the flexible air bag is adopted to carry out flexible separation on the LED pre-cut substrate, and packaging materials on the substrate are not prone to being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED pre-cut substrate separation, in particular to a flexible separation device for LED pre-cut substrates. Background Art

[0002] The LED unit production process is as follows: a pre-cut substrate with multiple parallel chip packaging areas is taken, and an LED chip is placed on each chip packaging area to form the LED pre-cut substrate. This substrate is then encapsulated using an encapsulation material such as glass or plastic. After encapsulation, the pre-cut LED substrate is manually broken along the pre-cut lines between each adjacent chip packaging area to form multiple LED units. When manually breaking the pre-cut LED substrate, excessive or uneven force can easily damage the encapsulation material on the pre-cut LED substrate, affecting the LED unit's luminous effect. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a flexible separation device for LED pre-cut substrates, which is used to separate LED pre-cut substrates without easily damaging the packaging materials on the substrates.

[0004] In order to solve the above technical problems, the utility model provides a flexible separation device for LED pre-cut substrates, comprising a first airbag and a second airbag arranged in parallel longitudinally, wherein a substrate placement position is reserved between the first airbag and the second airbag for placing the LED pre-cut substrate encapsulated with multiple LED chips arranged in parallel laterally. The first airbag and / or the second airbag are inflated to longitudinally squeeze the LED pre-cut substrate placed in the substrate placement position, causing each chip packaging area in the substrate to deform in multiple directions, thereby breaking the pre-cutting line of the substrate and dividing the substrate into multiple LED units.

[0005] Furthermore, the first airbag and / or the second airbag are inflated to compress the substrate placement position into an arc shape so that each chip packaging area in the substrate is deformed along a tangent line of the substrate placement position.

[0006] Furthermore, the first airbag and / or the second airbag are inflated to compress the substrate into an arc shape bent toward one side.

[0007] Furthermore, the substrate placement position is specifically a substrate placement position for vertically placing an LED pre-cut substrate encapsulating a plurality of LED chips arranged in parallel laterally.

[0008] Furthermore, the first airbag and / or the second airbag are inflated to compress the substrate to a longitudinal width of 1.5 mm to 2.5 mm.

[0009] Furthermore, a collection box with an upward opening is provided below the substrate placement position, and when the first airbag and / or the second airbag is deflated, the LED unit falls into the collection box from the box opening.

[0010] Furthermore, a support plate is provided at the box opening of the collection box to support the substrate placed in the substrate placement position, and the support plate can be removed from the box opening of the collection box.

[0011] Furthermore, the driving mechanism drives the support plate to move away from the box opening of the supporting box.

[0012] During use, a pre-cut LED substrate encapsulating multiple horizontally aligned LED chips is placed in a substrate placement position. The first and / or second airbags are then inflated to longitudinally compress the pre-cut LED substrate, deforming the chip encapsulation areas in multiple directions and forcing the pre-cut lines of the substrate to break, thereby separating the pre-cut LED substrate into multiple LED units. This separation device utilizes flexible airbags to flexibly separate the pre-cut LED substrates, minimizing damage to the encapsulation material on the substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the flexible separation device for LED pre-cut substrates, in which the two airbags have not yet been inflated.

[0014] Figure 2 This is a schematic diagram of a flexible separation device for LED pre-cut substrates, in which two airbags are inflated to squeeze the LED pre-cut substrates.

[0015] Figure 3 This is a schematic diagram of a flexible separation device for LED pre-cut substrates, in which the rod body of the electric push rod extends forward to connect the support plate.

[0016] Figure 4 This is a schematic diagram of a flexible separation device for LED pre-cut substrates. In the figure, the rod body of the electric push rod retracts backward to drive the support plate away from the box opening of the collection box. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below in conjunction with specific embodiments.

[0018] LED pre-cut substrate flexible separation device Figure 1 , including a mounting frame 9, on which are mounted two air bags 1 and 2 arranged longitudinally in parallel, one behind the other, with a horizontal substrate placement position 3 left between the front and rear air bags 1 and 2. The mounting frame 9 is also equipped with an air pump 30, which is connected to the front and rear air bags 1 and 2 through an air pipe 31. A collection box 6 is provided below the two air bags 1 and 2, such as Figure 3The collection box 6 has its opening 60 facing upwards and aligned with the substrate placement position 3. A support plate 7 is provided at the box opening 60. An electric push rod 8 is installed on the mounting frame 9, and its rod body 81 extends forward to connect the support plate 7. Figure 1 and Figure 3 When in use, first place the LED pre-cut substrate 4 encapsulating 6 LED chips 40 arranged side by side in a vertical position in the substrate placement position 3 and support it on the support plate 7, then start the air pump 30 to inflate the front and rear air bags 1, 2 so that the front and rear air bags 1, 2 are expanded respectively, thereby compressing the substrate placement position 3 into an arc shape that is curved toward the rear and has a longitudinal width of 1.5mm to 2.5mm (preferably 2mm), as shown in FIG. Figure 2 See Figure 1 、 Figure 2 During expansion, the front and rear airbags 1 and 2 longitudinally squeeze the pre-cut LED substrate 4, causing the chip packaging areas 42 within the substrate 4 to deform in multiple directions along the tangent line of the substrate placement position 3. This severing the pre-cut lines 41 of the substrate 4, thus separating the substrate 4 into six LED units 5. The inflated airbags 1 and 2 jointly clamp the six LED units 5. Because this separation device utilizes soft airbags 1 and 2 to flexibly separate the pre-cut LED substrate 4, it is less likely to damage the packaging material on the substrate 4. After flexible separation, the six LED units 5 are collected: see [see figure]. Figure 4 First, the electric push rod 8 is controlled to retract the rod body 81 backward, thereby driving the support plate 7 to move backward and away from the box opening 60 of the collection box 6, and then the air pump 30 is turned off, allowing the air bags 1 and 2 to automatically discharge the gas and deflate so that the two air bags 1 and 2 no longer clamp the 6 LED units 5, and the 6 LED units 5 fall into the collection box 6 from the box opening 60 of the collection box 6.

[0019] This embodiment sees Figure 1 、 Figure 2 The air pump 30 inflates the two airbags 1 and 2 through a single air tube 31, causing the two airbags 1 and 2 to expand and squeeze the pre-cut LED substrate 4. In other embodiments, the air pump 30 can be connected to the two airbags 1 and 2 through two air tubes. During use, the air pump 30 first inflates the rear airbag 2 through the first air tube, then disconnects the air pump 30 from the first air tube and ties the first air tube with a rope to keep the rear airbag 2 inflated. The pre-cut LED substrate 4 is placed in the substrate placement position 3, and then the air pump 30 inflates the front airbag 1 through the second air tube, causing the front airbag 1 to inflate and squeeze the pre-cut LED substrate 4.

[0020] This embodiment sees Figure 2The two airbags 1 and 2 are inflated to compress the substrate placement position 3 into an arc shape that bends toward the rear side, thereby deforming the various chip packaging areas 42 in the LED pre-cut substrate 4 in multiple different directions. In other embodiments, the arc shape that bends toward the rear side can be changed to other shapes, such as a wave shape or a sawtooth shape.

[0021] This embodiment sees Figure 4 , the electric push rod 8 is used as a driving mechanism to drive the support plate 7 to move away from the box opening 60 of the support box 6. Other embodiments can use other driving mechanisms such as cylinders to drive the support plate.

[0022] The above is only an embodiment of the present invention and does not limit the scope of patent protection. Those skilled in the art can make non-substantial changes or substitutions based on the present invention and still fall within the scope of patent protection.

Claims

1. LED pre-cut substrate flexible separation device, characterized by: The system comprises a first airbag and a second airbag arranged in parallel longitudinally, wherein a substrate placement position for placing a pre-cut LED substrate encapsulating a plurality of LED chips arranged in parallel transversely is reserved between the first airbag and the second airbag. The first airbag and / or the second airbag are inflated to longitudinally squeeze the pre-cut LED substrate placed in the substrate placement position, causing each chip encapsulation area in the substrate to deform in multiple directions, thereby breaking the pre-cutting line of the substrate and dividing the substrate into a plurality of LED units.

2. The flexible separation device for pre-cut LED substrates according to claim 1, characterized in that: The first airbag and / or the second airbag are inflated to compress the substrate placement position into an arc shape so that each chip packaging area in the substrate is deformed along the tangent line of the substrate placement position.

3. The flexible separation device for pre-cut LED substrates according to claim 2, characterized in that: The first airbag and / or the second airbag are inflated to compress the substrate into an arc shape bent toward one side.

4. The flexible separation device for pre-cut LED substrates according to claim 1, characterized in that: The substrate placement position is specifically a substrate placement position for vertically placing an LED pre-cut substrate encapsulating a plurality of LED chips arranged in parallel laterally.

5. The flexible separation device for pre-cut LED substrates according to claim 4, characterized in that: The first airbag and / or the second airbag are inflated to compress the substrate to a longitudinal width of 1.5 mm to 2.5 mm.

6. The flexible separation device for pre-cut LED substrates according to claim 1, characterized in that: A collection box with an upward opening is provided below the substrate placement position. When the first airbag and / or the second airbag is deflated, the LED unit falls into the collection box from the box opening.

7. The flexible separation device for pre-cut LED substrates according to claim 6, characterized in that: A support plate is provided at the box opening of the collection box to support the substrate placed in the substrate placement position, and the support plate can be removed from the box opening of the collection box.

8. The flexible separation device for pre-cut LED substrates according to claim 7, characterized in that: The driving mechanism drives the support plate to move away from the box opening of the supporting box.

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