Semiconductor constant humidity cabinet

By using a semiconductor movement component and an intelligent control system with one positive and one negative setting in the moisture-proof cabinet, the problem that the existing moisture-proof cabinet cannot control the humidity in both directions is solved, and automatic humidity adjustment and stabilization are achieved under unattended conditions. It is suitable for the storage of items requiring medium to high humidity.

CN223365192UActive Publication Date: 2025-09-23ZHUHAI HIGH TECH ZONE LENTHEM TECH CO LTD
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Patent Information

Application Number
CN202422506490.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-17
Publication Date
2025-09-23
Estimated Expiration
2034-10-17

AI Technical Summary

Technical Problem

Existing moisture-proof cabinets cannot achieve two-way humidity control, and semi-automatic constant humidity cabinets are difficult to maintain a constant medium-to-high humidity environment when unattended.

Method used

It adopts a semiconductor core component with one positive and one negative setting, combined with temperature and humidity sensors and an intelligent control system to achieve automatic adjustment of dehumidification and humidification, and adjust the humidity inside the cabinet through the air outside the cabinet.

Benefits of technology

It realizes automatic balance and stabilization of humidity in the cabinet when no one is on duty, provides a relatively stable medium-high humidity environment, and avoids the inconvenience of manual water addition.

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Abstract

The utility model discloses a semiconductor constant humidity cabinet, which belongs to the technical field of constant humidity cabinets and comprises a cabinet body, the cabinet body comprises two side plates, a cover plate, a back plate and a bottom plate, the two side plates are fixedly arranged on the left side and the right side of the bottom of the cover plate, and the back plate is fixedly arranged on the rear side of the bottom of the cover plate and fixedly connected with the two side plates. Two semiconductor movement mounting holes are fixedly formed in the top of the back plate, semiconductor movement assemblies are fixedly mounted in the two semiconductor movement mounting holes in a front-back mode respectively, the bottom plate is fixedly arranged at the bottoms of the two side plates and the bottom of the back plate, and the dehumidification movement is mounted in a front-back mode according to the working principle of the dehumidification movement. The constant humidity cabinet with an automatic constant humidity function is developed by adopting separate and independent control and respective program driving, the constant humidity cabinet can be used like a moisture-proof cabinet, the humidity can be increased to a relatively high humidity, manual water adding is completely not needed, and a relatively stable humidity environment can be provided.
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Description

Technical Field

[0001] The utility model relates to the technical field of constant humidity cabinets, and more specifically to a semiconductor constant humidity cabinet. Background Art

[0002] A moisture-proof cabinet is a storage cabinet that prevents moisture. It uses various dehumidification technologies to effectively reduce the humidity inside the cabinet, thereby achieving the purpose of moisture-proof, mildew-proof, oxidation-proof, rust-proof, and trace moisture absorption-proof. The main purpose of a moisture-proof cabinet is to store some items that are easily affected by moisture, such as electronic components, optical instruments, tea, etc. Its appearance has greatly improved people's home life and solved the problem of items becoming damp due to long-term storage.

[0003] At present, most of the moisture-proof cabinets for civilian use on the market are one-way dehumidification, and the humidity can only go from high to low, and it is impossible to achieve two-way humidity control. For some users who need medium to high humidity, they are not suitable. There are a small number of constant humidity cabinets launched on the market, and most of them increase the humidity inside the cabinet by adding water and then evaporating naturally or adding fans to accelerate evaporation. However, this type of constant humidity cabinet that requires manpower to add water can only be semi-automatic constant humidity. If it is unattended for a long time, it will be difficult to maintain a constant humidity after the water in the water tank in the cabinet has completely evaporated. Most constant humidity cabinets cannot store confidential documents in a relatively stable humidity environment, which is not suitable for items that need to be kept at a constant medium to high humidity. Therefore, in order to solve the above problems, a semiconductor constant humidity cabinet is very necessary. Utility Model Content

[0004] The main technical problem solved by the utility model is to provide a semiconductor constant humidity cabinet, which can solve the problems raised by the above background technology.

[0005] In order to solve the above technical problems, according to one aspect of the utility model, more specifically, a semiconductor constant humidity cabinet includes a cabinet body, which includes two side panels, a cover plate, a back plate and a bottom plate. The two side panels are fixedly arranged on the left and right sides of the bottom of the cover plate, and the back plate is fixedly arranged on the rear side of the bottom of the cover plate and is fixedly connected to the two side panels. Two semiconductor core mounting holes are fixedly opened on the top of the back plate, and semiconductor core components are fixedly installed in the two semiconductor core mounting holes, one positive and one negative, respectively. The bottom plate is fixedly arranged on the two side panels and the bottom of the back plate. The front side of the cabinet is rotatably connected to an aluminum door frame, and a piano frame component is fixedly arranged in the middle section of the interior of the cabinet.

[0006] Furthermore, the semiconductor core assembly includes a heat dissipation aluminum fixedly arranged inside the semiconductor core mounting hole, a placement groove is provided on the rear side of the heat dissipation aluminum, and wood pulp cotton and a moisture-removing sheet are connected by the placement groove, and seals are connected on both sides of the side glass, and the front side of the heat dissipation aluminum is fixedly connected to the condensation box by screws, and the front side of the heat dissipation aluminum is tightly fitted with the semiconductor condensation sheet, and the front and back sides of the semiconductor condensation sheet are coated with thermal conductive silicone grease, and the front side of the semiconductor condensation sheet is tightly fitted with a small semiconductor aluminum sheet, and the rear side of the semiconductor condensation sheet is tightly fitted to the heat dissipation aluminum, and the front side of the small semiconductor aluminum sheet is tightly fitted with a transistor gasket, and the transistor gasket is used to cooperate with the screws to press the small semiconductor aluminum sheet, and a driving board is fixedly arranged on the front side of the heat dissipation aluminum, and a wire is fixedly connected between the DC socket and the semiconductor condensation sheet, and the front side of the heat dissipation aluminum is fixedly connected to a circuit cover plate, and a plate cover sealing strip is fixedly provided on the outer edge of the circuit cover plate.

[0007] Furthermore, a touch panel is fixedly provided on one side of the top of the cover plate, and a main control circuit, a liquid crystal display, touch buttons, a temperature and humidity sensor and a signal control line connected to the DC socket and the semiconductor condenser are fixedly provided on one side of the touch panel. The bottom of the cover plate is fixedly connected to a front cover sealing plate, and the bottom of the front cover sealing plate is fixedly provided with an LED light strip.

[0008] Furthermore, a PVC mounting plate is fixedly provided on the inner side of the two side panels, and a side glass is fixedly provided on the inner side of the two PVC mounting plates. The two PVC mounting plates have a row of holes opened and closed from top to bottom and are fixedly connected to the piano frame assembly by screws on both sides.

[0009] Furthermore, the cover plate and the bottom plate are respectively fixedly provided with upper door hinges and lower door hinges at the connection with the aluminum door frame, the aluminum door frame is fixedly provided with silk-screened glass, the front side of the aluminum door frame is fixedly provided with a fingerprint lock, the aluminum door frame and the cabinet body are both powder-coated with rust-proof electrolytic plates, and magnetic strips are embedded around the aluminum door frame.

[0010] Furthermore, the music frame assembly includes a rear music frame mounting plate fixedly connected between two PVC mounting plates, a front music frame mounting plate fixedly connected to the bottom of the rear music frame mounting plate, and a plurality of music frames fixedly arranged on one side of the front music frame mounting plate.

[0011] Furthermore, a glass partition is fixedly provided inside the cover below the piano frame assembly, a sponge is fixedly provided on the top of the glass partition, a pulley mounting plate is fixedly connected to the bottom of the base plate, and a pulley assembly is fixedly connected to the bottom of the pulley mounting plate.

[0012] The beneficial effects of the semiconductor constant humidity cabinet of the utility model are:

[0013] By setting two semiconductor core components, one in front and one in the back, to achieve dehumidification and humidification respectively, it can efficiently absorb moisture inside the cabinet or increase the humidity inside the cabinet to maintain a constant humidity inside the cabinet. Even if personnel are not around, it can automatically draw water from the air outside the cabinet to adjust the humidity environment inside the cabinet to achieve humidity balance and keep the air moisture inside the cabinet within the set control range.

[0014] The touch control panel is equipped with a main control circuit, liquid crystal display, touch buttons, temperature and humidity sensors and signal control lines to connect the semiconductor core components. The LED light strip is controlled by the touch control panel to control whether the power is supplied to the LED light strip. After the humidity is set, the temperature and humidity sensor detects the humidity, and after comparison, the signal line controls the two semiconductor cores to dehumidify or humidify and cut off the power supply, thereby realizing the intelligent humidity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0016] Figure 1 This is a schematic diagram of the cabinet structure of a semiconductor constant humidity cabinet of the present utility model;

[0017] Figure 2 This is an exploded schematic diagram of the cabinet structure of a semiconductor constant humidity cabinet of the present utility model;

[0018] Figure 3 This is a schematic diagram of the explosion of the semiconductor core component structure of a semiconductor constant humidity cabinet of the present invention.

[0019] In the figure: 1. Cover plate; 2. Upper door hinge; 3. Cabinet; 4. Side panel; 5. Rear piano frame mounting plate; 6. Front piano frame mounting plate; 7. Piano frame; 8. Sponge; 9. Glass partition; 10. Lower door hinge; 11. Bottom plate; 12. Back panel; 13. Fingerprint lock; 14. Silk-screen glass; 15. Aluminum door frame; 16. Touch panel; 17. Front cover sealing plate; 18. LED light strip; 19. PVC mounting plate; 20. Side glass; 21. Semiconductor movement mounting hole; 22. Pulley mounting plate; 23. Pulley assembly; 24. Circuit cover plate; 25. Semiconductor small aluminum sheet; 26. Transistor gasket; 28. Heat dissipation aluminum; 29. ​​Wood pulp cotton; 30. Dehumidification sheet; 31. DC socket; 32. Seal; 33. Condensation box; 34. Semiconductor condensation sheet; 36. Board cover sealing strip; 37. Driver board. DETAILED DESCRIPTION

[0020] In order to make the technical solution of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] Example 1

[0022] like Figure 1-3 As shown, according to one aspect of the present invention, a semiconductor constant humidity cabinet is provided.

[0023] In this embodiment, the cabinet body 3 includes two side panels 4, a cover plate 1, a back panel 12 and a bottom panel 11. The two side panels 4 are fixedly arranged on the left and right sides of the bottom of the cover plate 1. The back panel 12 is fixedly arranged on the rear side of the bottom of the cover plate 1 and is fixedly connected to the two side panels 4. Two semiconductor core mounting holes 21 are fixedly provided on the top of the back panel 12. Semiconductor core components are fixedly installed inside the two semiconductor core mounting holes 21, one positive and one negative. The bottom panel 11 is fixedly arranged on the two side panels 4 and the bottom of the back panel 12. The front side of the cabinet body 3 is rotatably connected to the aluminum door frame 15. A piano frame component is fixedly arranged in the middle section of the interior of the cabinet body 3. Dehumidification and humidification are respectively achieved by arranging two semiconductor core components, one positive and one negative, which can effectively absorb moisture in the cabinet or increase the humidity in the cabinet to maintain a constant humidity in the cabinet. Even if personnel are not around, they can automatically take water from the air outside the cabinet to adjust the humidity environment in the cabinet to achieve humidity balance and keep the air moisture in the cabinet within the set control range.

[0024] In this embodiment, the semiconductor core assembly includes a heat dissipation aluminum 28 fixedly arranged inside the semiconductor core mounting hole 21, a placement groove is provided on the rear side of the heat dissipation aluminum 28, and wood pulp cotton 29 and a moisture-removing sheet 30 are connected by the placement groove, and sealing members 32 are connected by the left and right sides of the side glass 20, and a condensation box 33 is fixedly connected to the front side of the heat dissipation aluminum 28 by screws, and a semiconductor condensation sheet 34 is tightly attached to the front side of the heat dissipation aluminum 28, and the front and rear sides of the semiconductor condensation sheet 34 are coated with thermal grease, and the front of the semiconductor condensation sheet 34 is tightly attached to the semiconductor The small aluminum sheet 25, the rear side of the semiconductor condensing sheet 34 is tightly fitted with the heat dissipation aluminum 28, the front side of the semiconductor small aluminum sheet 25 is tightly fitted with a transistor gasket 26, the transistor gasket 26 is used to cooperate with the screw to press the semiconductor small aluminum sheet 25, the front side of the heat dissipation aluminum 28 is fixed with a driving board 37, the DC socket 31 and the semiconductor condensing sheet 34 are fixedly connected with a wire, the front side of the heat dissipation aluminum 28 is fixedly connected with a circuit cover 24, and the outer edge of the circuit cover 24 is fixedly provided with a plate cover sealing strip 36. Through the above arrangement, when in use, first put the DC socket 31 in the power supply, then the DC socket 31 is fixed with the power supply, and ... The seat 31 is embedded in the mounting hole of the heat dissipation aluminum 28 and fixed. Then the wood pulp cotton 29 is pushed into the placement groove from the side of the heat dissipation aluminum 28. Then the moisture removal sheet 30 is also pushed into the placement groove. Then the left and right seals 32 are clamped on both sides of the heat dissipation aluminum 28. The condensation box 33 is fixed to the installation position on the front of the heat dissipation aluminum 28 with M3 screws. The front and back sides of the semiconductor condensation sheet 34 are respectively coated with thermal conductive silicone grease. Then the semiconductor small aluminum sheet 25 is attached to the front of the semiconductor condensation sheet 34, and the back of the semiconductor condensation sheet 34 is attached to the front of the heat dissipation aluminum 28. Then use M3*10m m screws and transistor gaskets 26 press the semiconductor aluminum sheet 25, fix the driver board 37 to the installation position of the heat dissipation aluminum 28 with M3 screws, connect it with the DC socket 31 and the semiconductor condenser sheet 34 with wires, and connect it with the touch panel 16 with a signal control line. Finally, cover the circuit cover 24 on the front installation position of the heat dissipation aluminum 28, fix it with M3*10mm screws, and then put the board cover sealing strip 36 on the outer edge of the circuit cover 24, which effectively improves the sealing of the semiconductor core assembly and the safety during use.

[0025] In this embodiment, a touch panel 16 is fixedly provided on one side of the top of the cover 1, and a main control circuit, a liquid crystal display, touch buttons, a temperature and humidity sensor and a signal control line are fixedly provided on one side of the touch panel 16, which are connected to the DC socket 31 and the semiconductor condenser sheet 34. A front cover sealing plate 17 is fixedly connected to the bottom of the cover 1, and an LED light strip 18 is fixedly provided on the bottom of the front cover sealing plate 17. Through the above settings, when the humidity is set, the temperature and humidity sensor detects the humidity, and after comparison, the signal line is used to control whether the two semiconductor cores are to dehumidify or humidify and cut off the power supply, thereby realizing the intelligence of the humidity.

[0026] In this embodiment, a PVC mounting plate 19 is fixedly provided on the inner side of each of the two side panels 4, and a side glass 20 is fixedly provided on the inner side of each of the two PVC mounting plates 19. The two PVC mounting plates 19 have a row of holes opened and closed from top to bottom and are fixedly connected to the piano frame assembly by screws on both sides.

[0027] In this embodiment, the cover plate 1 and the bottom plate 11 are respectively fixed with an upper door hinge 2 and a lower door hinge 10 at the connection with the aluminum door frame 15, a silk-screened glass 14 is fixedly provided inside the aluminum door frame 15, a fingerprint lock 13 is fixedly provided on the front side of the aluminum door frame 15, the aluminum door frame 15 and the cabinet body 3 are both powder-coated with rust-proof electrolytic plates, and magnetic strips are embedded around the aluminum door frame 15.

[0028] In this embodiment, the music frame assembly includes a rear music frame mounting plate 5 fixedly connected between two PVC mounting plates 19, a front music frame mounting plate 6 fixedly connected to the bottom of the rear music frame mounting plate 5, and a plurality of music frames 7 fixedly arranged on one side of the front music frame mounting plate 6.

[0029] In this embodiment, a glass partition 9 is fixedly provided inside the cover plate 1 below the piano frame assembly, a sponge 8 is fixedly provided on the top of the glass partition 9, a pulley mounting plate 22 is fixedly connected to the bottom of the bottom plate 11, and a pulley assembly 23 is fixedly connected to the bottom of the pulley mounting plate 22. The cover plate 1, side panels 4, back panel 12 and bottom plate 11 form a cabinet body 3, the upper door hinge 2 is installed on the cover plate 1, and the door hole of the glass door composed of the silk-screen glass 14, aluminum door frame 15, fingerprint lock 13 and other door components is inserted into the door axis of the upper door hinge 2, and the door axis of the lower door hinge 10 is inserted into the lower door axis hole of the glass door, and the lower door hinge 10 is fixed to the bottom plate 11 with screws. In addition, the side glass 20 is fixed on the PVC mounting plate 19 to form a side mounting plate assembly, and the mounting plate assembly is fixed to the left and right side panels 4. The rear piano frame mounting plate 5, the front piano frame mounting plate 6 and the piano frame 7 form a piano frame assembly, which is fixed to the mounting plate assembly with screws, and the other 4 glass layer buckles are inserted In the mounting hole of the PVC mounting plate 19, place the glass partition 9 on the glass layer buckle, and then place the sponge 8 on the glass partition 9, the pulley mounting plate 22 is welded to the bottom of the base plate 11, and the pulley assembly 23 is fixed to the pulley mounting plate 22 with screws. The semiconductor core mounting hole 21 is installed in the semiconductor core mounting hole 21 on the back plate 12, one positive and one negative. The touch panel 16 is installed in its mounting hole, and the LED light strip 18 is embedded in the mounting hole of the front cover sealing plate 17 and connected to the semiconductor core assembly. The front cover sealing plate 17 with the LED light strip 18 installed is fixed to the top of the cover plate 1 with screws. According to the working principle of the dehumidification core, the dehumidification core is installed one positive and one negative, and is controlled separately and driven by the program separately. A constant humidity cabinet with automatic constant humidity function has been developed, which can be used like a moisture-proof cabinet, and can also humidify to a relatively high humidity, and no manual water addition is required, which can provide a more stable humidity environment.

[0030] The above embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A semiconductor constant humidity cabinet, comprising a cabinet body (3), characterized in that: The cabinet (3) comprises two side panels (4), a cover (1), a back panel (12) and a bottom panel (11), wherein the two side panels (4) are fixedly arranged on the left and right sides of the bottom of the cover (1), the back panel (12) is fixedly arranged on the rear side of the bottom of the cover (1) and is fixedly connected to the two side panels (4), the top of the back panel (12) is fixedly provided with two semiconductor core mounting holes (21), and semiconductor core components are fixedly installed inside the two semiconductor core mounting holes (21), one in front and one in back, respectively. The bottom panel (11) is fixedly arranged on the bottom of the two side panels (4) and the back panel (12), the front side of the cabinet (3) is rotatably connected to an aluminum door frame (15), and a piano frame component is fixedly arranged in the middle section of the interior of the cabinet (3).

2. A semiconductor constant humidity cabinet according to claim 1, characterized in that: A PVC mounting plate (19) is fixedly provided on the inner side of the two side panels (4), and a side glass (20) is fixedly provided on the inner side of the two PVC mounting plates (19). The two PVC mounting plates (19) have a row of holes opened and closed from top to bottom and are fixedly connected to the piano frame assembly by screws on both sides.

3. A semiconductor constant humidity cabinet according to claim 2, characterized in that: The semiconductor core assembly includes a heat dissipation aluminum (28) fixedly arranged inside the semiconductor core mounting hole (21), a placement groove is provided on the rear side of the heat dissipation aluminum (28) and wood pulp cotton (29) and a moisture-removing sheet (30) are connected by snapping through the placement groove, the left and right sides of the side glass (20) are snapped and connected with sealing members (32), the front side of the heat dissipation aluminum (28) is fixedly connected with a condensation box (33) by screws, the front side of the heat dissipation aluminum (28) is tightly fitted with a semiconductor condensation sheet (34), the front and rear sides of the semiconductor condensation sheet (34) are coated with thermal grease, the front side of the semiconductor condensation sheet (34) is tightly fitted with a semiconductor small aluminum sheet (25), the The rear side of the semiconductor condensing sheet (34) is tightly fitted to the heat dissipation aluminum (28), and the front side of the semiconductor small aluminum sheet (25) is tightly fitted with a transistor gasket (26), and the transistor gasket (26) is used to cooperate with a screw to press the semiconductor small aluminum sheet (25). A driving plate (37) is fixedly provided on the front side of the heat dissipation aluminum (28), and a DC socket (31) is fixed in the mounting hole of the heat dissipation aluminum (28). A wire is fixedly connected between the DC socket (31) and the semiconductor condensing sheet (34). The front side of the heat dissipation aluminum (28) is fixedly connected to a circuit cover (24), and a plate cover sealing strip (36) is fixedly provided on the outer edge of the circuit cover (24).

4. A semiconductor constant humidity cabinet according to claim 3, characterized in that: A touch panel (16) is fixedly provided on one side of the top of the cover plate (1), a main control circuit, a liquid crystal display, touch buttons, a temperature and humidity sensor, and a signal control line connected to a DC socket (31) and a semiconductor condensing sheet (34) are fixedly provided on one side of the touch panel (16), and a front cover sealing plate (17) is fixedly provided on the bottom of the cover plate (1), and an LED light bar (18) is fixedly provided on the bottom of the front cover sealing plate (17).

5. The semiconductor constant humidity cabinet according to claim 1, characterized in that: The cover plate (1) and the bottom plate (11) are respectively fixedly provided with an upper door hinge (2) and a lower door hinge (10) at the connection with the aluminum door frame (15); a silk-screened glass (14) is fixedly provided inside the aluminum door frame (15); a fingerprint lock (13) is fixedly provided on the front side of the aluminum door frame (15); the aluminum door frame (15) and the cabinet body (3) are both powder-coated with rust-proof electrolytic plates; and magnetic strips are embedded around the aluminum door frame (15).

6. A semiconductor constant humidity cabinet according to claim 2, characterized in that: The music frame assembly comprises a rear music frame mounting plate (5) fixedly connected between two PVC mounting plates (19); a front music frame mounting plate (6) is fixedly connected to the bottom of the rear music frame mounting plate (5); and a plurality of music frames (7) are fixedly arranged on one side of the front music frame mounting plate (6).

7. The semiconductor constant humidity cabinet according to claim 1, characterized in that: A glass partition (9) is fixedly arranged inside the cover (1) below the piano frame assembly, a sponge (8) is fixedly arranged on the top of the glass partition (9), a pulley mounting plate (22) is fixedly connected to the bottom of the bottom plate (11), and a pulley assembly (23) is fixedly connected to the bottom of the pulley mounting plate (22).