Sorting mechanical grabbing device capable of stably grabbing wafers

Abstract

The utility model relates to the technical field of wafer sorting, and discloses a sorting mechanical grabbing device capable of stably grabbing wafers, which comprises a base, a first servo motor is arranged on one side of the upper end in the base, the output end of the first servo motor is fixedly connected with a supporting column, the upper end of the supporting column is fixedly connected with a rotating disc, and the rotating disc is fixedly connected with a rotating shaft. A plurality of first electric telescopic rods are evenly arranged on the outer side of the upper end of the rotating disc at intervals, and the output ends of the first electric telescopic rods extend to the lower end of the rotating disc and are fixedly connected with moving discs. According to the wafer fixing device, the first electric telescopic rod drives the moving disc to descend, the suction disc is attached to a wafer, meanwhile, the air pump sucks out air in the suction disc to firmly adsorb the wafer, then the second electric telescopic rod drives the clamping plate to further clamp the wafer, double fixing is achieved, stability is enhanced, external vibration influences are reduced, and the wafer is protected against damage.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer sorting, and in particular to a sorting mechanical grasping device capable of stably grasping wafers. Background Art

[0002] The origin of wafers is that silicon dioxide is first purified, melted, and distilled to make silicon crystal rods. The wafer factory then grinds, polishes and slices these silicon crystal rods into wafer mothers. Since round wafers themselves have no directionality and are not suitable for electron transmission, these wafers must also have an edge cut out to serve as the "base" of a triangle. Therefore, the wafer does not look like a standard circle like the DVD at home, but has one edge cut off to become a circle with a "base".

[0003] In the existing technology, most chip sorting mechanical grasping devices have the problem of insufficient stability during use. These devices usually adopt a single fixing method, such as relying solely on suction cup adsorption or simple mechanical clamping to fix the chip. However, this method has poor stability when facing external vibration or impact, which can easily cause the chip to fall off or be damaged.

[0004] Therefore, those skilled in the art provide a sorting mechanical grasping device that can stably grasp wafers to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the present utility model is to solve the shortcomings of the existing technology and propose a sorting mechanical grasping device that can stably grasp wafers. The device drives the movable plate to descend through the first electric telescopic rod, so that the suction cup fits the wafer. At the same time, the air pump sucks out the gas inside the suction cup to firmly adsorb the wafer. Subsequently, the second electric telescopic rod drives the clamping plate to further clamp the wafer, achieving double fixation, enhancing stability and reducing the impact of external vibration, protecting the wafer from damage.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A sorting mechanical grasping device capable of stably grasping wafers comprises a base, a first servo motor is provided on one side of an inner upper end of the base, an output end of the first servo motor is fixedly connected to a support column, an upper end of the support column is fixedly connected to a rotating disk, a plurality of first electric telescopic rods are evenly spaced outside the upper end of the rotating disk, output ends of the plurality of first electric telescopic rods extend to the lower end of the rotating disk and are all fixedly connected to a movable disk, a plurality of lower ends of the movable disks are each provided with a suction cup, a plurality of second electric telescopic rods are evenly spaced outside the inner side of the rotating disk, one side end surface of the plurality of second electric telescopic rods is fixedly connected to a clamping plate, and the upper ends of the plurality of clamping plates are all located inside the rotating disk and slidably connected thereto;

[0008] The cam is provided with a first spring which is threaded onto the outer side of the base and a second spring which is provided on the outer side of the base so as to enable the cam to move relative to the first spring and the second spring to move relative to the first spring.

[0009] Through the above technical solution, the device drives the movable plate down through the first electric telescopic rod, so that the suction cup fits the wafer. At the same time, the air pump sucks out the gas inside the suction cup to firmly adsorb the wafer. Subsequently, the second electric telescopic rod drives the clamping plate to further clamp the wafer, achieving double fixation, enhancing stability and reducing the impact of external vibration, protecting the wafer from damage.

[0010] Furthermore, two sliding grooves are provided on one side of the inner upper end of the base, and sliders are fixedly connected to both sides of the outer side of the sleeve, and the two sliders are located inside the sliding grooves and are slidably connected thereto;

[0011] The above technical solution helps to achieve smooth movement and precise positioning of the sleeve, thereby improving the operating accuracy and stability of the device.

[0012] Furthermore, an air pump is provided in the middle of the upper end of the rotating disk, one end of the air pump is connected to a plurality of hoses, and the plurality of hoses extend to the interior of the movable disk and are fixedly connected to the suction cup;

[0013] Through the above technical solution, it can be ensured that the suction cup can firmly adsorb the wafer. At the same time, through the control of the air pump, the adsorption force can be accurately adjusted to improve operational efficiency and safety.

[0014] Furthermore, a solenoid valve is provided at the middle portion of the exterior of each of the plurality of hoses;

[0015] Through the above technical solution, the on / off of the airflow can be controlled by controlling the switch of the solenoid valve, thereby achieving rapid response and precise control of the suction cup adsorption force, which helps to improve the degree of automation and operational convenience of the device.

[0016] Furthermore, a conveyor belt is provided on one side of the upper end of the base, a frame is fixedly connected to a corner of the upper end of the base, and a wafer detector is provided on the inner upper end of the frame;

[0017] Through the above technical solution, automatic transportation and detection of wafers can be achieved, thereby improving production efficiency and product quality.

[0018] Furthermore, the lower end of the support column extends into the interior of the base and is slidably connected thereto;

[0019] Through the above technical solution, the stable support of the support column on the base can be ensured, and at the same time, the position of each movable disk at the upper end of the support column can be easily adjusted to meet work requirements.

[0020] Furthermore, one end of the first spring is fixedly connected to the bearing plate, and the other end of the first spring is fixedly connected to the external protrusion of the limiting rod;

[0021] Through the above technical solution, the stability of the spring is ensured by the fixed connection at both ends, so that it can stably control the limiting rod to limit its limiting ring.

[0022] Furthermore, one end surface of each of the plurality of limit rods is fixedly connected to a handle;

[0023] The above technical solution makes it easier for operators to manually adjust the position of the limit rod, thereby improving the operational convenience of the device.

[0024] The utility model has the following beneficial effects:

[0025] 1. The utility model proposes a sorting mechanical grasping device that can stably grasp wafers. When the device is in use, the first electric telescopic rod is used to drive the movable plate to descend, and the suction cup is attached to the wafer. At the same time, the air pump sucks out the gas inside the suction cup, so that the suction cup can firmly adsorb the wafer. Subsequently, the second electric telescopic rod drives the clamping plate to further clamp the adsorbed wafer, thereby achieving double fixation. This design greatly enhances the stability of the wafer during transportation and sorting, effectively reduces the impact of external vibration on the wafer, and protects the wafer from damage.

[0026] 2. The utility model proposes a sorting mechanical gripping device that can stably grip wafers. When the device is in use, after the wafer is clamped, the first servo motor is used to drive the rotating disk to rotate, and the second servo motor drives the threaded rod to rotate, so that the wafers detected by the wafer detector can be clamped and entered into the collection box of the corresponding size for sorting. While one suction cup adsorbs the wafer and puts it into the collection box, the other suction cup can perform adsorption and gripping operations at the same time, realizing parallel operation, thereby significantly improving the sorting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is an axonometric diagram of a sorting mechanical gripping device proposed in the present invention that can stably grip wafers;

[0028] Figure 2 This is a diagram of a rotating disk of a sorting mechanical grasping device that can stably grasp wafers proposed by the present invention;

[0029] Figure 3 This is an axonometric diagram of a collection box of a sorting mechanical grasping device that can stably grasp wafers proposed in the present invention;

[0030] Figure 4 This is an axonometric diagram of the moving plate of a sorting mechanical gripping device that can stably grip wafers proposed in the utility model;

[0031] Figure 5 This is an axonometric diagram of the framework of a sorting mechanical grasping device that can stably grasp wafers proposed in the present invention;

[0032] Figure 6 This is a schematic diagram of the internal structure of a collection box of a sorting mechanical grasping device that can stably grasp wafers proposed in the utility model.

[0033] Legend:

[0034] 1. Base; 2. First servo motor; 3. Support column; 4. Rotating disk; 5. First electric telescopic rod; 6. Moving disk; 7. Suction cup; 8. Air pump; 9. Hose; 10. Solenoid valve; 11. Second electric telescopic rod; 12. Clamp; 13. Second servo motor; 14. Threaded rod; 15. Sleeve; 16. Loading plate; 17. Limit rod; 18. First spring; 19. Handle; 20. Limit ring; 21. Collection box; 22. Slide rod; 23. Second spring; 24. Support plate; 25. Rubber pad; 26. Conveyor belt; 27. Frame; 28. Wafer detector; 29. ​​Slider; 30. Slide chute. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the specific embodiments of the present invention to clearly and completely describe the technical solutions in the specific embodiments of the present invention. Obviously, the specific embodiments described are only part of the specific embodiments of the present invention, not all of the specific embodiments. Based on the specific embodiments of the present invention, all other specific embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] Reference Figure 1-6The utility model provides a specific embodiment: a sorting mechanical grasping device that can stably grasp wafers, including a base 1, a first servo motor 2 is provided on one side of the inner upper end of the base 1, the output end of the first servo motor 2 is fixedly connected to a support column 3, the upper end of the support column 3 is fixedly connected to a rotating disk 4, a plurality of first electric telescopic rods 5 are evenly spaced outside the upper end of the rotating disk 4, the output ends of the plurality of first electric telescopic rods 5 extend to the lower end of the rotating disk 4 and are fixedly connected to a movable disk 6, the lower ends of the plurality of movable disks 6 are each provided with a suction cup 7, a plurality of second electric telescopic rods 11 are evenly spaced outside the inner and outer sides of the rotating disk 4, one side end surfaces of the plurality of second electric telescopic rods 11 are fixedly connected to a clamping plate 12, and the upper ends of the plurality of clamping plates 12 are all inside the rotating disk 4 and slidably connected thereto;

[0037] A second servo motor 13 is provided at a corner of the upper end of the interior of the base 1, and the output end of the second servo motor 13 is fixedly connected to a threaded rod 14, and a sleeve 15 is threaded on one side of the outer side of the threaded rod 14, and the upper end of the sleeve 15 is fixedly connected to a carrying plate 16, and the inner middle part of the carrying plate 16 is slidably connected to a limit rod 17, and a first spring 18 is sleeved on one side of the outer side of multiple limit rods 17, and a limit ring 20 is sleeved on the other side of the outer side of multiple limit rods 17, and a collection box 21 is fixedly connected to the upper ends of multiple limit rings 20, and the inner two sides of multiple collection boxes 21 are fixedly connected to sliding rods 22, and the outer sides of multiple sliding rods 22 are sleeved with second springs 23, and the upper ends of multiple second springs 23 are fixedly connected to support plates 24, and the upper ends of multiple support plates 24 are provided with rubber pads 25, and both ends of multiple support plates 24 are slidably connected to the sliding rods 22;

[0038] The device uses the first electric telescopic rod 5 to drive the movable plate 6 to descend, so that the suction cup 7 fits the wafer. At the same time, the air pump 8 sucks out the gas inside the suction cup 7 to firmly adsorb the wafer. Subsequently, the second electric telescopic rod 11 drives the clamping plate 12 to further clamp the wafer, achieving double fixation, enhancing stability and reducing the impact of external vibration, protecting the wafer from damage.

[0039] Two slide grooves 30 are provided on one side of the upper end of the interior of the base 1, and sliders 29 are fixedly connected to the outside of the sleeve 15 on both sides. The two sliders 29 are both in the inside of the slide grooves 30 and are slidably connected thereto, which helps to achieve smooth movement and precise positioning of the sleeve 15, thereby improving the operating accuracy and stability of the device. An air pump 8 is provided in the middle of the upper end of the rotating disk 4, and one end of the air pump 8 is connected to multiple hoses 9. Multiple hoses 9 all extend to the inside of the movable disk 6 and are fixedly connected to the suction cup 7, which can ensure that the suction cup 7 can firmly adsorb the wafer. At the same time, through the control of the air pump 8, the adsorption force can be accurately adjusted, thereby improving operational efficiency and safety. Electromagnetic valves 10 are provided in the middle of the outside of the multiple hoses 9, and the on and off of the airflow can be controlled by controlling the switch of the electromagnetic valve 10, thereby achieving rapid response and precise control of the adsorption force of the suction cup 7, thereby helping to improve the degree of automation and operational convenience of the device. A conveyor belt 26 is provided on one side of the upper end, and a frame 27 is fixedly connected to a corner of the upper end of the base 1. A wafer detector 28 is provided on the upper end of the frame 27, which can realize automatic transportation and detection of wafers, thereby improving production efficiency and product quality. The lower end of the support column 3 extends into the interior of the base 1 and is slidably connected thereto, which can ensure the stable support of the support column 3 on the base 1, and at the same time facilitate the adjustment of the position of each movable disk 6 at the upper end of the support column 3 to meet work requirements. One end of the first spring 18 is fixedly connected to the supporting plate 16, and the other end of the first spring 18 is fixedly connected to the external protrusion of the limit rod 17. The stability of the spring is guaranteed by the fixed connection at both ends, so that it can stably control the limit rod 17 to limit its limit ring 20. One side end face of multiple limit rods 17 is fixedly connected with a handle 19, which is convenient for the operator to manually adjust the position of the limit rod 17, thereby improving the operation convenience of the device.

[0040] Working principle: When the device is in use, the staff places the wafers to be sorted on the upper end of the conveyor belt 26, so that they pass through the wafer detector 28 for size detection. Then, the conveyor belt 26 transports the wafers to the lower end of the rotating disk 4, and controls the first electric telescopic rod 5 through the external central control box to drive the movable disk 6 to descend, so that the suction cup 7 fits the wafer, and at the same time, the air pump 8 sucks out the gas inside the suction cup 7 to firmly adsorb the wafer. Then, the second electric telescopic rod 11 drives the clamping plate 12 to further clamp the adsorbed wafer to achieve double fixation. After the wafer is fixed, the rotating disk 4 is driven to rotate by the first servo motor 2, and the second servo motor 13 drives the threaded rod 14 to rotate, so that the inspected wafers enter the collection box 21 of the corresponding size for sorting. While one suction cup 7 is adsorbing the wafer and placing it in the collection box 21, the other suction cup 7 can simultaneously perform adsorption and clamping operations to achieve parallel processing, thereby significantly improving the sorting efficiency.

[0041] Finally, it should be noted that the above is only a preferred specific implementation method of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned specific implementation methods, those skilled in the art can still modify the technical solutions described in the aforementioned specific implementation methods or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A sorting mechanical grasping device capable of stably grasping wafers, comprising a base (1), characterized in that: A first servo motor (2) is provided on one side of the inner upper end of the base (1); an output end of the first servo motor (2) is fixedly connected to a support column (3); an upper end of the support column (3) is fixedly connected to a rotating disk (4); a plurality of first electric telescopic rods (5) are evenly spaced outside the upper end of the rotating disk (4); the output ends of the plurality of first electric telescopic rods (5) extend to the lower end of the rotating disk (4) and are fixedly connected to a moving disk (6); a plurality of lower ends of the moving disks (6) are provided with suction cups (7); a plurality of second electric telescopic rods (11) are evenly spaced outside the inner portion of the rotating disk (4); one end surface of the plurality of second electric telescopic rods (11) is fixedly connected to a clamping plate (12); the upper ends of the plurality of clamping plates (12) are all located inside the rotating disk (4) and are slidably connected thereto; A second servo motor (13) is provided at a corner of the upper end of the interior of the base (1), and the output end of the second servo motor (13) is fixedly connected to a threaded rod (14), and a sleeve (15) is threaded on the outer side of the threaded rod (14), and the upper end of the sleeve (15) is fixedly connected to a bearing plate (16), and the inner middle part of the bearing plate (16) is slidably connected to a limiting rod (17), and the outer side of the plurality of limiting rods (17) is sleeved with a first spring (18), and the outer sides of the plurality of limiting rods (17) are respectively provided with a first spring (18). A limiting ring (20) is sleeved on one side, and the upper ends of the plurality of limiting rings (20) are fixedly connected to a collection box (21), and both sides of the interior of the plurality of collection boxes (21) are fixedly connected to a slide bar (22), and the exterior of the plurality of slide bars (22) is sleeved with a second spring (23), and the upper ends of the plurality of second springs (23) are fixedly connected to a support plate (24), and the upper ends of the plurality of support plates (24) are provided with a rubber pad (25), and both ends of the plurality of support plates (24) are slidably connected to the slide bar (22).

2. The mechanical grasping device for stably grasping wafers according to claim 1, characterized in that: Two sliding grooves (30) are provided on one side of the inner upper end of the base (1), and sliders (29) are fixedly connected to both sides of the outer side of the sleeve (15), and the two sliders (29) are both located inside the sliding grooves (30) and are slidably connected thereto.

3. The mechanical grasping device for stably grasping wafers according to claim 1, characterized in that: An air pump (8) is provided in the middle of the upper end of the rotating disk (4), and one end of the air pump (8) is connected to a plurality of hoses (9), which all extend to the interior of the movable disk (6) and are fixedly connected to the suction cup (7).

4. The mechanical grasping device for stably grasping wafers according to claim 3, characterized in that: A solenoid valve (10) is provided at the outer middle portion of each of the plurality of hoses (9).

5. The mechanical grasping device for stably grasping wafers according to claim 1, characterized in that: A conveyor belt (26) is provided on one side of the upper end of the base (1), a frame (27) is fixedly connected to a corner of the upper end of the base (1), and a wafer detector (28) is provided at the inner upper end of the frame (27).

6. The mechanical grasping device for stably grasping wafers according to claim 1, characterized in that: The lower end of the support column (3) extends into the interior of the base (1) and is slidably connected thereto.

7. The mechanical grasping device for stably grasping wafers according to claim 1, characterized in that: One end of the first spring (18) is fixedly connected to the bearing plate (16), and the other end of the first spring (18) is fixedly connected to the external protrusion of the limiting rod (17).

8. The mechanical grasping device for stably grasping wafers according to claim 1, characterized in that: One side end surface of each of the plurality of limiting rods (17) is fixedly connected with a handle (19).

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