Overflow glue cleaning device for automobile wheel cover bonding turning plate
By designing an overflow glue cleaning device for the bonding flap of an automobile wheel cover and adopting a combination of a cleaning shovel and an wiping component, the problem of incomplete overflow glue cleaning is solved, and one-time cleaning and efficient cleanliness of the overflow glue are achieved.
Patent Information
- Application Number
- CN202422527545.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-10-18
AI Technical Summary
In the prior art, cleaning of excess glue at the bonding point of automobile wheel covers requires multiple operations, and the cleaning is not thorough, which affects the working environment and efficiency.
A device for cleaning excess glue from a bonding flap of an automobile wheel cover is designed. The device comprises a cleaning shovel and an wiping component. The cleaning shovel is provided with a storage slot. The wiping component synchronously wipes away residual excess glue and is combined with a telescopic support rod for stable operation.
It realizes one-time cleaning of glue overflow, improves cleaning efficiency and cleanliness, reduces pollution of the operating table, and reduces cleaning difficulty.
Smart Images

Figure CN223367618U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of removing excess glue from automobile wheel covers, and in particular to an excess glue cleaning device for an automobile wheel cover bonding flap. Background Art
[0002] Wheel covers are a crucial component of a car, located between the rear wheels and the body. They primarily protect the wheels and body, enhance the vehicle's appearance, and reduce air resistance. They prevent dirt, rocks, and other debris thrown up by the rotating tires from directly impacting the vehicle's body, thereby minimizing damage, reducing noise, and extending the vehicle's lifespan. Furthermore, the design of wheel covers helps reduce air resistance and improve the vehicle's operating efficiency. This effect is particularly pronounced at high speeds.
[0003] To improve the structural strength and stability of wheel covers, some vehicle wheel cover assemblies also include wheel cover inner panels, side reinforcement beams, and wheel cover reinforcements. These components are connected together through snap-fit assembly, bonding, or welding to form an integral structure. Wheel covers are usually made of plastic, fiberglass, or aluminum alloy. In addition to protecting the tire, wheel covers are also equipped with some assembly plates, as shown in the attached manual. Figure 1 The structure shown is used to connect to the vehicle body, sealing strips, and other components. Because the wheel cover directly covers the tire, rainwater splashing from the tire directly contacts the wheel cover during rainy driving. To prevent leakage at the junction between the wheel cover and the assembly plate, sealant is applied to the junction after welding the assembly plate and wheel cover. However, sealant overflow typically occurs during the gluing process. Therefore, after a period of time, any excess glue between the wheel cover and the assembly plate must be removed to prevent contamination caused by the overflow on the wheel cover surface and adhesion during subsequent assembly.
[0004] At present, the removal of overflow glue is done by operators using Figure 2 The removal shovel shown is used to remove the overflowed glue, but the long side length of the entire wheel cover results in a large amount of overflowed glue, requiring multiple removal operations. After each removal operation, the overflowed glue on the shovel body is usually directly scraped to the side of the operating table, affecting the normal operation of the workbench. At the same time, after the overflowed glue is removed, the remaining overflowed glue must be wiped with a rag. The continuous use of the rag causes the residual overflowed glue to increase, resulting in incomplete wiping of the subsequent wheel cover, resulting in low quality of the overflowed glue removal operation and affecting the on-site working environment. Summary of the Invention
[0005] In response to the above-mentioned problems, the present application aims to provide a device for cleaning the overflow glue of the automobile wheel cover bonding flap, which can complete the cleaning of the overflow glue in one go, while solving the current time-consuming two-step operation of scraping and then wiping, thereby reducing the overall difficulty of cleaning the overflow glue and improving the cleanliness of the overflow glue cleaning.
[0006] In order to achieve the above-mentioned purpose, the technical solution adopted in this application is as follows: a glue overflow cleaning device for a car wheel cover bonding flap, a flap is bonded to the side of the wheel cover, and it is characterized in that: the glue overflow cleaning device is in contact with the junction of the side and the flap, and the glue overflow cleaning device moves along the length direction of the junction and receives and stores the glue overflow at the junction on the glue overflow cleaning device, and an wiping component for wiping off the residual glue overflow at the junction is also provided on the bottom side of the glue overflow cleaning device.
[0007] Preferably, the overflow glue cleaning device includes a cleaning shovel in contact with the joint, and a storage groove is provided on the surface of the cleaning shovel at the position where the cleaning shovel contacts the overflow glue and toward the rear of the cleaning shovel.
[0008] Preferably, the erasing member includes an embedding groove provided on the bottom surface of the cleaning shovel, the embedding groove is connected to the joint, and an erasing body is replaceably embedded in the embedding groove.
[0009] Preferably, an operating handle is provided at the tail end of the cleaning shovel, and a telescopic support rod is provided on the tail side of the operating handle so as to be lockable and rotatable.
[0010] The beneficial effect of the present application is that the overflow glue cleaning device can store the continuously cleaned overflow glue on the cleaning device, so as to complete the cleaning along the length direction of the side edge in one go, thereby solving the current problem of needing to clean in multiple times and scraping the overflow glue on the operating table each time.
[0011] While the erasing mechanism is used in the process of scraping off the overflowed glue by the cleaning device, the erasing component simultaneously erases the residual overflowed glue on the surface of the joint, thereby solving the current time-consuming two operations of scraping and then erasing, thereby reducing the overall difficulty of cleaning the overflowed glue and improving the cleanliness of the overflowed glue cleaning. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 The diagram shows the process of connecting the flap and the side of the wheel arch.
[0013] Figure 2 This is a diagram showing the current operation of using a shovel to remove excess glue at the junction of the flap and the side.
[0014] Figure 3 For Figure 2 Illustration of the glue overflowing from the shovel during the cleaning process.
[0015] Figure 4 This is a diagram of the front structure of the cleaning shovel for this application.
[0016] Figure 5 This is a side view of the cleaning shovel for this application.
[0017] Figure 6 This is a diagram showing the overflow glue entering the storage tank during the process of clearing the overflow glue with a cleaning shovel in this application.
[0018] Figure 7 This is a diagram of the back structure of the cleaning shovel for this application.
[0019] Figure 8 For this application Figure 7 Side view structural diagram.
[0020] Figure 9 Illustration of a cleaning shovel cleaning glue spills and removing residual glue in this application.
[0021] In the picture: 6- glue overflow. DETAILED DESCRIPTION
[0022] In order to enable ordinary technicians in this field to better understand the technical solution of the present application, the technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.
[0023] Refer to the attached Figures 1 to 9 The device for cleaning glue overflow of a car wheel cover bonding flap shown in the figure has a flap 2 bonded to the side 11 of the wheel cover 1. The bonding operation is to fix the flap 2 to the side 11 of the wheel cover 1 by welding or snap-fitting, and then apply glue to seal the flap 2 and the side 11. In order to solve the problem of cleaning glue overflow after gluing, the present application is provided with a glue overflow cleaning device, such as Figure 6 As shown, it contacts the junction a of the side 11 and the flap 2, and the overflow glue cleaning device moves along the length direction of the junction a and receives and stores the overflow glue at the junction a on the overflow glue cleaning device. That is, during the process of cleaning the overflow glue at the junction a between the flap 2 and the side 11, the overflow glue cleaning device receives the overflow glue on the cleaning device, and stores the continuously cleaned overflow glue on the cleaning device, thereby completing the cleaning along the length direction of the side 11 in one go, thereby solving the problem of currently needing to clean in multiple times and scraping the overflow glue cleaned each time onto the operating table.
[0024] In order to solve the problem that the residual glue spill needs to be wiped off twice with a rag after the glue spill is removed, Figure 9As shown, an wiping member is further provided on the bottom side of the overflow glue cleaning device for wiping off residual overflow glue at the junction a. Since overflow glue will be scraped to the upper side (surface) of the cleaning device during scraping, the wiping member provided on the bottom side of the cleaning device abuts against the junction a. During the process of scraping off the overflow glue by the cleaning device, the wiping member simultaneously wipes off the residual overflow glue on the surface of the junction a, thereby solving the current time-consuming two-step operation of scraping and then wiping.
[0025] Specifically, such as Figure 4-5 As shown, the overflow glue cleaning device includes a cleaning shovel 3 in contact with the joint a, and a storage groove 3a is provided on the surface of the cleaning shovel 3 at the position where the cleaning shovel 3 contacts the overflow glue and toward the rear of the cleaning shovel 3. Figure 6 As shown, during the cleaning process of the cleaning shovel 3 cleaning the overflow glue on the joint a along the length direction of the side 11, the overflow glue will be as follows Figure 6 The glue flowing in the direction of arrow b1 enters storage tank 3a for storage. The storage tank 3a preferably has an inner cavity that can accommodate the glue spilled along the entire side 11, thereby completely removing the glue spilled at the junction a in a single operation. This solves the problem that currently, glue spillage can only be removed in small quantities at the side of the shovel body, requiring frequent scraping and cleaning of the glue spilled from the shovel body. The cleaning shovel 3 of the present application performs cleaning after a single scraping operation, greatly improving the efficiency of glue spillage cleaning.
[0026] In the above-mentioned process of cleaning the overflowed glue, in order to realize the synchronous erasing operation, as shown in FIG. Figure 7-8 As shown, the erasing member includes an embedding groove 3b formed on the bottom surface of the cleaning shovel 3, the embedding groove 3b is connected to the joint a, and an erasing body 4 is replaceably embedded in the embedding groove 3b. The erasing body 4 can preferably be a small piece of erasing cloth or toilet paper. Before removing the overflowed glue, the erasing body 4 is first embedded in the embedding groove 3b, and then the end of the cleaning shovel 3 is placed on the joint a to perform the overflowed glue removal operation. During the removal process, the overflowed glue is removed along the Figure 9 The glue in the direction of arrow b2 is stored in the storage slot 3a on the upper surface of the cleaning shovel 3, while the eraser 4 embedded below contacts the residual glue on the surface of the interface a. During the glue removal process, the eraser 4 simultaneously cleans the remaining glue (in the direction indicated by arrow c1), achieving a clean, one-time glue cleanup. After cleaning is complete, the glue in the storage slot 3a is processed uniformly, and the eraser 4 is removed from the embedded slot 3b to be collected. A new eraser 4 is then replaced for the next glue cleanup. This replaceable eraser 4 solves the current problem of using a rag for wiping, which results in excess glue on the rag and hinders subsequent removal of residual glue.
[0027] In order to reduce the weight of the vehicle body, the wheel cover and the assembly plate are usually thinner while ensuring the strength, and the step height formed by the two is smaller. Therefore, when the operator removes the overflow glue along the length direction of the side 11, the cleaning shovel 3 is inevitably affected by the unstable factors of human operation and separated from the joint a, which will cause the removed overflow glue to adhere to other surface positions of the wheel cover. Therefore, in order to solve this problem, Figure 6 As shown, the rear end of the cleaning shovel 3 is provided with an operating handle 31, and a telescopic support rod 5 is provided on the rear side of the operating handle 31 for locking rotation. The telescopic support rod 5 is penetrated by a locking bolt (not shown) that abuts against the surface of the operating handle 31. The telescopic support rod 5 is rotated and locked by tightening the locking bolt. The length of the telescopic support rod 5 is adjustable, so that its end (preferably a circular surface structure to reduce contact resistance during sliding) abuts against the side wall of the flap 2. Therefore, during the overflow glue removal process, the support provided by the telescopic support rod 5 effectively prevents the cleaning shovel 3 from being separated from the joint a due to the instability of manual movement.
[0028] The principle of the present application is: in the process of cleaning the overflow glue at the junction a of the wheel cover and the flap, first embed the erasing body 4 in the embedding groove 3b at the bottom of the cleaning shovel 3, then contact the cleaning shovel 3 on the junction a, and adjust the length of the telescopic support rod 5 so that its end is against the side wall of the flap, and then drive the cleaning shovel 3 to move along the length direction of the side by operating the handle 31. During the movement, the overflow glue will enter the storage groove 3a on the upper surface of the cleaning shovel 3 for storage, and the erasing body 4 at the bottom will synchronously erase the residual overflow glue on the surface of the junction a. After the overflow glue is removed and erased along the length direction of the side 11, the overflow glue in the storage groove 3a will be cleaned uniformly, and the erasing body 4 will be replaced at the same time, waiting for the next overflow glue cleaning operation of the wheel cover.
[0029] The above shows and describes the basic principles, main features and advantages of this application. Without departing from the spirit and scope of this application, this application will also have various changes and improvements, which fall within the scope of this application.
Claims
1. A device for cleaning glue overflow of a vehicle wheel cover adhesive flap, wherein a flap (2) is adhered to the side (11) of the wheel cover (1), and characterized in that: The overflow glue cleaning device is in contact with the junction (a) between the side (11) and the flap (2), and the overflow glue cleaning device moves along the length direction of the junction (a) and receives and stores the overflow glue at the junction (a) on the overflow glue cleaning device, and an wiping component for wiping the residual overflow glue at the junction (a) is also provided on the bottom side of the overflow glue cleaning device.
2. The overflow glue cleaning device according to claim 1, characterized in that: The overflow glue cleaning device comprises a cleaning shovel (3) in contact with the joint (a), and a storage groove (3a) is provided on the surface of the cleaning shovel (3) at the position where the cleaning shovel (3) contacts the overflow glue and toward the rear of the cleaning shovel (3).
3. The overflow glue cleaning device according to claim 2, characterized in that: The erasing component comprises an embedding groove (3b) provided on the bottom surface of the cleaning shovel (3), the embedding groove (3b) being connected to the connecting portion (a), and an erasing body (4) being replaceably embedded in the embedding groove (3b).
4. The overflow glue cleaning device according to claim 3, characterized in that: An operating handle (31) is provided at the tail end of the cleaning shovel (3), and a telescopic support rod (5) is provided on the tail side of the operating handle (31) so as to be lockable and rotatable.