Rotatable and telescopic infrared preheating device with temperature measuring function

Abstract

The utility model discloses a rotatable telescopic infrared preheating device with a temperature measuring function, which comprises a mounting base, a hinge structure, a rotating component, a device bottom plate, a telescopic component and an infrared heating component, the fixed end of the rotating component is hinged on the mounting base, and the output end of the rotating component is rotatably connected with the device bottom plate; the rotating assembly drives the device bottom plate to rotate around the hinge structure, and the telescopic assembly drives the infrared heating assembly to reciprocate. The infrared heating device is driven by the rotating cylinder hinged between the equipment and the device bottom plate, so that the infrared heating assembly can be switched between a state of being attached to an equipment frame and a state of being parallel to a circuit board to be heated, and the space of the equipment cannot be occupied; the soldering flux spraying and welding process can be completed in the same equipment space in sequence, the soldering flux spraying and welding process is not affected, meanwhile, the infrared temperature measuring assembly is arranged, and the accuracy and consistency of the preheating temperature are effectively guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic product welding equipment, in particular to an infrared preheating device with self-temperature measurement and the ability to rotate and retract. Background Art

[0002] With the continuous development of electronic equipment, selective wave soldering is a new method that has emerged in recent years to use equipment to solder specific through-hole components. It is widely used in automotive electronics, digital, electronics, electroacoustics, LCD, circuit boards and other fields. The current selective wave soldering mainly consists of three modules: flux spraying, preheating, and soldering.

[0003] Preheating the circuit board is a key step in selective wave soldering, because selective wave soldering is local soldering. Direct soldering on a circuit board with a lower temperature will result in defects such as poor soldering quality and board deformation. Secondly, good preheating treatment of the circuit board can effectively prevent poor soldering such as cold solder joints, sharp joints and bridging.

[0004] Conventional selective wave soldering equipment is designed to more completely complete the flux spraying, preheating, and soldering processes. These three modules are arranged in parallel in the order of the process and each occupies a section of the equipment structure. This makes the equipment itself generally have disadvantages such as large size, complex structure, large floor space, heavy weight, inconvenient transportation, and insufficient flexibility in installation and use.

[0005] In order to reduce the size of the equipment itself while ensuring the complete functions of selective wave soldering to adapt to more flexible and convenient application scenarios, the three major modular structures of selective wave soldering, namely flux spraying, preheating and welding, need to be designed to be more centralized, flexible and convenient to meet market demand.

[0006] Because improper preheating of circuit boards can easily lead to various poor soldering quality issues, accurate preheating of the circuit board becomes a critical step. Currently, selective wave soldering equipment on the market uses either preheating time or temperature measurement to control the preheating temperature. However, preheating time alone cannot guarantee consistent preheating temperature, and therefore soldering quality, across batches of products. Adding a temperature measurement unit increases the internal space of the equipment, hindering the ability to minimize size.

[0007] Therefore, the prior art has defects and needs to be improved. Utility Model Content

[0008] The purpose of the utility model is to overcome the deficiencies of the prior art and provide an infrared preheating device which has temperature measurement function and can be rotated and retracted.

[0009] The technical solution of the present utility model is as follows: a rotatable and retractable infrared preheating device with built-in temperature measurement is provided, comprising: a mounting base fixed on the equipment, a hinge structure arranged on the mounting base, a device base connected to the hinge structure, a rotating assembly hinged on the device base, a telescopic assembly arranged on the device base, and an infrared heating assembly arranged on the moving end of the telescopic assembly, the fixed end of the rotating assembly is hinged on the equipment, the output end of the rotating assembly is rotatably connected to the device base, the rotating assembly drives the device base to rotate around the hinge structure, and the telescopic assembly drives the infrared heating assembly to move back and forth.

[0010] Furthermore, the rotating assembly includes: a cylinder mounting seat, a rotating cylinder hinged to the cylinder mounting seat, and a cylinder connecting piece arranged on the bottom plate of the device, the main part of the rotating cylinder is hinged to the cylinder mounting seat, and the output shaft of the rotating cylinder is hinged to the cylinder connecting piece.

[0011] Furthermore, first cylinder magnetic sensors are respectively provided at both ends of the main body of the rotating cylinder.

[0012] Furthermore, the telescopic component includes: a telescopic cylinder arranged on the bottom plate of the device, a telescopic sliding shaft arranged on both sides of the bottom plate of the device, and a telescopic slider sleeved on the telescopic sliding shaft. The output end of the telescopic cylinder is connected to the infrared heating component, and the telescopic sliders on both sides are connected to the bottom of the infrared heating component.

[0013] Furthermore, a second cylinder magnetic sensor is respectively provided at both ends of the main body of the telescopic cylinder.

[0014] Furthermore, the infrared heating assembly includes: a heating box connected to the moving end of the telescopic assembly, a plurality of reflective structures arranged in the heating box, and infrared heating tubes respectively arranged on the reflective structures.

[0015] Furthermore, the reflective structure adopts a V-shaped mirror reflective plate, and the infrared heating tube is arranged at the center line position of the V-shaped mirror reflective plate.

[0016] Furthermore, the heating box body is covered with a cover plate, and the cover plate adopts a fence-type structure.

[0017] Furthermore, an infrared temperature measuring component is provided on the bottom plate of the device, and the infrared temperature measuring component includes: a temperature measuring guide rail provided on the bottom plate of the device, a positioning optical axis parallel to the temperature measuring guide rail, a positioning slider mounted on the temperature measuring guide rail, a sensor mounting plate connected to the positioning slider, and an infrared temperature measuring sensor provided on the sensor mounting plate, and limiting columns are respectively provided at both ends of the positioning optical axis.

[0018] Furthermore, a dust cover is provided on the top of the infrared temperature sensor, and a cooling sleeve is provided on the outside of the main body of the infrared temperature sensor.

[0019] By adopting the above scheme, the utility model drives the infrared heating component by being hinged between the equipment and the bottom plate of the device, so that the infrared heating component can be switched between a state of being in contact with the equipment frame and a state of being parallel to the circuit board to be heated, so that the infrared preheating device does not occupy the space of the equipment, and can be completed successively with the flux spraying and welding process in the same equipment space without affecting the flux spraying and welding process. At the same time, it has its own infrared temperature measurement component, which effectively ensures the accuracy and consistency of the preheating temperature and effectively reduces the size, volume and weight of the selective wave soldering equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural diagram of the present utility model.

[0021] Figure 2 It is a schematic diagram of the bottom structure of the utility model.

[0022] Figure 3 It is a schematic diagram of the structure on the bottom plate of the device.

[0023] Figure 4 Schematic diagram of the structure of the infrared heating component.

[0024] Figure 5 It is a schematic diagram of the structure inside the heating box. DETAILED DESCRIPTION

[0025] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] See also Figure 1 The utility model provides an infrared preheating device with built-in temperature measurement and can be rotated and retracted, comprising: a mounting base 1 fixed to the device, a hinge structure 11 arranged on the mounting base 1, a device base plate 12 connected to the hinge structure 11, a rotating component 2 hinged to the device base plate, a telescopic component 3 arranged on the device base plate 12, and an infrared heating component 4 arranged on the moving end of the telescopic component 3, the fixed end of the rotating component 2 is hinged to the device, the output end of the rotating component 2 is rotatably connected to the device base plate 12, the rotating component 2 drives the device base plate 12 to rotate around the hinge structure 11, and the telescopic component 3 drives the infrared heating component 4 to move back and forth.

[0027] In some embodiments, the rotating assembly 2 is located below the rear side of the mounting base 1. When in its initial state, the rotating assembly 2 is not activated, causing the infrared heating assembly 4 to droop, thereby fitting against the side wall of the device frame, avoiding interference with the movement and operation of other mechanisms and equipment, and meeting the requirement of avoidance. When it is necessary to preheat the circuit board, the rotating assembly 2 is activated to lift the device base 12, causing the device base 12 to rotate about the hinge structure 11, so that the heating surface of the infrared heating assembly 4 is parallel to the circuit board product to be heated, thereby providing uniform and effective preheating for the circuit board product.

[0028] In some embodiments, see Figure 2 The rotating assembly 2 includes a cylinder mounting base 21, a rotating cylinder 22 hingedly connected to the cylinder mounting base 21, and a cylinder connecting member 23 disposed on the device base 12. The main body of the rotating cylinder 22 is hingedly connected to the cylinder mounting base 21, and the output shaft of the rotating cylinder 22 is hingedly connected to the cylinder connecting member 23. During operation, the rotating cylinder 22 is activated, causing the output shaft of the rotating cylinder 22 to be pushed outward, thereby pushing the device base 12 to move. Since one end of the device base plate 12 is hinged to the mounting base 1, and the cylinder mounting seat 21 hinged to the main part of the rotating cylinder 22 is arranged at the rear side and lower part of the mounting base 1, therefore, when the rotating cylinder 22 pushes the device base plate 12 out, due to the gap in the hinge position, the rotating cylinder 22 and the device base plate 12 rotate around the hinge position respectively, thereby lifting the device base plate 12 to a horizontal position, and providing support for the device base plate 12 through the rotating cylinder 22, so that the infrared heating component 4 is maintained in a position parallel to the circuit board product, so as to provide a uniform and effective preheating effect for the circuit board product.

[0029] In some embodiments, first cylinder magnetic sensors 221 are provided at both ends of the main body of the rotary cylinder 22. The first cylinder magnetic sensors 221 detect the current position of the output shaft inside the main body of the rotary cylinder 22, thereby determining whether the infrared heating assembly 4 is in the jacking state or the storage state.

[0030] In some embodiments, the telescopic component 3 includes: a telescopic cylinder 31 provided on the device base plate 12, a telescopic sliding shaft 32 provided on both sides of the device base plate 12, and a telescopic slider 33 sleeved on the telescopic sliding shaft 32. The output end of the telescopic cylinder 31 is connected to the infrared heating component 4, and the telescopic sliders 33 on both sides are connected to the bottom of the infrared heating component 4. Optical axes are provided on both sides of the device base plate 12 as the telescopic sliding shaft 32, and two sets of linear bearings are provided on each telescopic sliding shaft 32 as the telescopic slider 33, which are connected to the bottom of the infrared heating component 4. Therefore, when the telescopic cylinder 31 pushes the infrared heating component 4 to move, the telescopic sliding shafts 32 on both sides provide a guiding effect for the movement of the infrared heating component 4, and the cooperation between the telescopic slider 33 and the telescopic sliding shaft 32 effectively reduces the friction force during the movement, thereby improving the stability and smoothness of the infrared heating component 4 during the movement.

[0031] In some embodiments, a second cylinder magnetic sensor 311 is provided at each end of the main body of the telescopic cylinder 31. The second cylinder magnetic sensor 311 detects the current position of the output shaft inside the main body of the telescopic cylinder 31, thereby determining whether the infrared heating assembly 4 is in the ejected state or the stored state.

[0032] In some embodiments, see Figure 4 、 Figure 5 The infrared heating assembly 4 includes a heating box 41 connected to the moving end of the telescopic assembly 3, a plurality of reflective structures 42 disposed within the heating box 41, and infrared heating tubes 43 correspondingly disposed on the reflective structures 42. By disposing multiple infrared heating tubes 43 within the heating box 41 and placing each infrared heating tube 43 in the middle of the reflective structure 42, the reflective structure 42 reflects heat from the sides and bottom of the infrared heating tube 43, thereby concentrating the heat on the circuit board. This improves energy utilization and greatly enhances the efficiency of preheating the circuit board.

[0033] In some embodiments, the reflective structure 42 utilizes a V-shaped mirror reflector, and the infrared heating tube 43 is positioned at the centerline of the V-shaped mirror reflector. Using the V-shaped mirror reflector as the reflective structure 42 allows the V-shaped mirror reflector to reflect the heat generated by the sides and bottom of the infrared heating tube 43 multiple times, ultimately emitting it toward the opening of the V-shaped mirror reflector. The reflected heat, along with the heat generated by the infrared heating tube 43, is directed toward the top surface, acting on the circuit board to preheat it.

[0034] In some embodiments, the heating box 41 is covered with a cover 44, which adopts a fence-like structure. It can prevent objects above from accidentally falling and causing damage to the infrared heating tube 43, while allowing the heat generated by the infrared heating tube 43 to pass through the fence-like cover 44 and act on the circuit board for preheating.

[0035] In some embodiments, see Figure 3 An infrared temperature measurement assembly 5 is mounted on the device base plate 12. The infrared temperature measurement assembly 5 comprises a temperature measurement rail 51 mounted on the device base plate 12, a positioning optical axis 52 parallel to the temperature measurement rail 51, a positioning slider 53 mounted on the temperature measurement rail 51, a sensor mounting plate 54 connected to the positioning slider 53, and an infrared temperature sensor 55 mounted on the sensor mounting plate 54. Limiting posts 521 are provided at each end of the positioning optical axis 52. The infrared temperature measurement assembly 5 is mounted on one side of the device base plate 12, near a central, airtight position, with the probe portion of the infrared temperature measurement assembly 5 facing upward to facilitate acquisition of the real-time temperature to be measured.

[0036] In some embodiments, a dust cover 56 is provided on the top of the infrared temperature sensor 55, and a cooling sleeve 57 is provided on the outside of the main body of the infrared temperature sensor 55. The dust cover 56, with a transparent center, is installed on the top of the infrared temperature sensor 55 to facilitate cleaning of debris and dust around the infrared temperature sensor 55. The cooling sleeve 57, which is hollow inside and connected to the air pipe, is provided on the outside of the main body of the infrared temperature sensor 55 to reduce the impact of heat from the infrared heating tube 43 on the infrared temperature sensor 55, thereby ensuring the accuracy of the temperature measurement results.

[0037] In a specific embodiment, the infrared preheating device's mounting base 1 is mounted on the inner side of a horizontal beam on the machine's welding area frame base. The cylinder mounting base 21 of the rotating assembly 2 is positioned on the underside of the horizontal beam. When not in use, the infrared preheating device hangs down between the front and rear columns on one side of the machine's frame base, near the lower side door, perpendicular to the machine's bottom, and does not occupy internal space.

[0038] When the selective wave soldering equipment is in operation, the circuit board enters the soldering area via the transport track. The flux spray mechanism, controlled by the motion axis, completes the solder resist spraying process. After the flux spray mechanism returns to its origin, the infrared preheating device activates the rotating cylinder 22, rotating the device base plate 12 around the hinge structure 11 and raising it to a lower position parallel to the transport track. The telescopic cylinder 31 then activates, pushing the infrared heating assembly 4 forward and moving it below the circuit board on the transport track. The infrared heating tube 43 activates its heating function, preheating the circuit board above and completing the preheating process according to the preheating temperature set in the soldering procedure. Simultaneously, the infrared temperature sensor 55 mounted on the device base plate 12 activates to monitor the circuit board's temperature, ensuring the accuracy and consistency of the preheating temperature. After preheating is complete, the telescopic cylinder 31 resets, retracting the infrared heating assembly 4. The rotating cylinder 22 resets, rotating the device base plate 12 in the opposite direction and returning it to the position between the front and rear columns of the device frame base. This completes the infrared preheating process, and the selective wave soldering equipment enters the next soldering process.

[0039] In summary, the utility model is driven by a rotating cylinder hinged between the equipment and the bottom plate of the device, so that the infrared heating component can be converted between a state of being in contact with the equipment frame and a state of being parallel to the circuit board to be heated, so that the infrared preheating device does not occupy the space of the equipment, and can be completed in the same equipment space as the flux spraying and welding process, without affecting the flux spraying and welding process. At the same time, it has its own infrared temperature measurement component, which effectively ensures the accuracy and consistency of the preheating temperature and effectively reduces the size, volume and weight of the selective wave soldering equipment.

[0040] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A rotatable and retractable infrared preheating device with temperature measurement, characterized in that: include: A mounting base installed and fixed on the equipment, a hinge structure arranged on the mounting base, a device base connected to the hinge structure, a rotating component hinged on the device base, a telescopic component arranged on the device base, and an infrared heating component arranged on the moving end of the telescopic component, the fixed end of the rotating component is hinged on the equipment, the output end of the rotating component is rotatably connected to the device base, the rotating component drives the device base to rotate around the hinge structure, and the telescopic component drives the infrared heating component to move back and forth.

2. The infrared preheating device with temperature measurement and rotatable extension according to claim 1 is characterized in that: The rotating assembly includes: a cylinder mounting seat, a rotating cylinder hinged on the cylinder mounting seat, and a cylinder connecting piece arranged on the bottom plate of the device. The main part of the rotating cylinder is hinged on the cylinder mounting seat, and the output shaft of the rotating cylinder is hinged on the cylinder connecting piece.

3. The infrared preheating device with temperature measurement and rotatable extension according to claim 2 is characterized in that: Both ends of the main body of the rotary cylinder are respectively provided with first cylinder magnetic sensors.

4. The infrared preheating device with temperature measurement and rotatable extension according to claim 1 is characterized in that: The telescopic component includes: a telescopic cylinder arranged on the bottom plate of the device, a telescopic sliding shaft arranged on both sides of the bottom plate of the device, and a telescopic slider sleeved on the telescopic sliding shaft. The output end of the telescopic cylinder is connected to the infrared heating component, and the telescopic sliders on both sides are connected to the bottom of the infrared heating component.

5. The rotatable and retractable infrared preheating device with temperature measurement according to claim 4 is characterized in that: The two ends of the main body of the telescopic cylinder are respectively provided with a second cylinder magnetic sensor.

6. The rotatable and retractable infrared preheating device with temperature measurement according to claim 1 is characterized in that: The infrared heating assembly comprises: a heating box connected to the moving end of the telescopic assembly, a plurality of reflective structures arranged in the heating box, and infrared heating tubes respectively arranged on the reflective structures.

7. The rotatable and retractable infrared preheating device with temperature measurement according to claim 6 is characterized in that: The reflective structure adopts a V-shaped mirror reflective plate, and the infrared heating tube is arranged at the center line position of the V-shaped mirror reflective plate.

8. The rotatable and retractable infrared preheating device with temperature measurement according to claim 6 is characterized in that: The heating box body is covered with a cover plate, and the cover plate adopts a fence structure.

9. The rotatable and retractable infrared preheating device with temperature measurement according to claim 1, characterized in that: An infrared temperature measuring component is provided on the bottom plate of the device, and the infrared temperature measuring component includes: a temperature measuring guide rail provided on the bottom plate of the device, a positioning optical axis parallel to the temperature measuring guide rail, a positioning slider mounted on the temperature measuring guide rail, a sensor mounting plate connected to the positioning slider, and an infrared temperature measuring sensor provided on the sensor mounting plate, and limiting columns are respectively provided at both ends of the positioning optical axis.

10. The rotatable and retractable infrared preheating device with temperature measurement according to claim 9, characterized in that: A dust cover is provided on the top of the infrared temperature sensor, and a cooling sleeve is provided on the outside of the main body of the infrared temperature sensor.

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