Wafer welding device for FPC (Flexible Printed Circuit) board

Abstract

The utility model relates to the field of camera modules, and discloses an FPC board wafer welding device which comprises a conveyor, a base is arranged on the left portion of the rear side of the conveyor, a pasting mechanism is arranged on the upper portion of the base, the pasting mechanism comprises a moving assembly and a centering assembly, the centering assembly comprises a driving piece and an adjusting piece, and the driving piece is connected with the adjusting piece. The number of the driving parts and the number of the adjusting parts are both two, a deviation rectifying mechanism is arranged on the upper portion of the conveyor, the deviation rectifying mechanism comprises two adjusting assemblies, each adjusting assembly comprises two electric push rods, and the two electric push rods are fixedly connected with the conveyor; the output ends of the two electric push rods are jointly and fixedly connected with an adjusting plate. According to the chip position adjusting device, the conveyor is matched with the adjusting assembly, and the electric push rod is matched with the adjusting plate and the guide plate, so that the chip position adjusting device can better adjust the position of a chip, and is more practical.

Description

Technical Field

[0001] The utility model relates to the field of camera modules, and in particular to an FPC board wafer welding device. Background Art

[0002] A wafer is a thin sheet in the semiconductor manufacturing process, usually made of single-crystal silicon or other semiconductor materials. The wafer is the basis of integrated circuits and other microelectronic devices. After a series of manufacturing processes, the unit circuits on the wafer will be cut into independent chips. When producing camera modules, the FPC board and the wafer chip need to be welded. In order to ensure the stability of the gold wire welding between the wafer and the FPC board, before the gold wire welding, the wafer needs to be fixed to the FPC board by gluing. At this time, the wafer and the FPC board are not electrically connected.

[0003] After searching, Chinese patent announcement number: CN219626623U discloses a high-precision bonding device for chip production, which relates to the field of chip production and includes a workbench and an adjustment device. The adjustment device includes a cylinder, a push plate fixed to the top of the cylinder, an adjustment plate provided on the push plate, an automatic telescopic rod fixed to one side of the adjustment plate, a slide rod fixed to the other side of the adjustment plate, a sleeve rod slidably connected to the other end of the slide rod, a baffle fixed to one end of the push plate, and a fixed connection between the other end of the sleeve rod and the baffle. The utility model is provided with a cylinder, a push plate, an adjustment plate, a rotating shaft, a connecting rod and an automatic telescopic rod. When the chip is conveyed from the conveyor belt to the top of the adjustment mechanism, the cylinder is activated to push the chip out, the automatic telescopic rod is activated to slide the adjustment plate inward, and the position of the chip is adjusted. After the chip is in the correct position, the robotic arm grabs the chip onto the operating table, which can further adjust the position of the electronic chip and increase the bonding accuracy.

[0004] Although the above-mentioned device can adjust the position of the chip by setting up a cylinder, a push plate, an adjustment plate, a rotating shaft, a connecting rod and an automatic telescopic rod, when the chip is transported from the conveyor belt to the adjustment mechanism, since the conveyor belt is located on one side of the adjustment mechanism, it is impossible to ensure that the chip falls accurately on the adjustment mechanism when it is sent down the conveyor belt. The chip may be offset, tilted, or only partially fall on the adjustment mechanism, resulting in the adjustment mechanism being unable to adjust the chip well, which is not practical. Therefore, an FPC board wafer welding device is proposed to solve the above problems. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides an FPC board wafer welding device, which aims to improve the problem in the prior art that when the chip is transported from the conveyor belt to the adjustment mechanism, the chip may be offset, tilted, or only a part of it may fall on the adjustment mechanism, resulting in the adjustment mechanism being unable to adjust the chip well, which is not practical enough.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: an FPC board wafer welding device, comprising a conveyor, a base is provided on the left rear side of the conveyor, a pasting mechanism is provided on the upper part of the base, the pasting mechanism includes a moving component and a centering component, the centering component includes a driving part and an adjusting part, and the number of the driving part and the adjusting part are both two; a correction mechanism is provided on the upper part of the conveyor, the correction mechanism includes an adjustment component and the number is two, the adjustment component includes an electric push rod and the number is two, the two electric push rods are fixedly connected to the conveyor, and the output ends of the two electric push rods are commonly fixedly connected to an adjustment plate.

[0007] As a further description of the above technical solution:

[0008] The adjustment assembly further includes a guide plate, which is fixedly connected to the right end of the adjustment plate.

[0009] As a further description of the above technical solution:

[0010] The rear portion of the top surface of the base is fixedly connected with an operating table.

[0011] As a further description of the above technical solution:

[0012] The moving assembly includes a rotating rod, which is fixedly connected to the base. The top of the rotating rod is fixedly connected to a connecting plate, the front lower side of the connecting plate is fixedly connected to a vertical pole, the front and rear parts of the vertical pole are fixedly connected to slide rails, the interior of the slide rails is slidably connected to a slider, and an adsorption head is provided at the bottom of the vertical pole.

[0013] As a further description of the above technical solution:

[0014] The driving member includes a cylinder, the upper part of the cylinder close to the vertical pole is fixedly connected to the slider, the bottom of the cylinder is fixedly connected to a circular plate, the left and right parts of the bottom surface of the circular plate are provided with support rods, the upper and lower ends of the support rods are movably connected to connecting blocks, the connecting block located at the upper part is fixedly connected to the circular plate, the lower part of the connecting block located at the lower part is fixedly connected to the connecting rod, and the lower parts of the two support rods are jointly provided with a limiting plate.

[0015] As a further description of the above technical solution:

[0016] The adjusting member comprises a center plate, and the front and rear parts of the top of the center plate are fixedly connected with pillars, and the pillars are fixedly connected to the connecting rods.

[0017] As a further description of the above technical solution:

[0018] An air rod is provided at the output end of the air cylinder. The air rod penetrates the circular plate and is movably connected thereto. The air rod is fixedly connected to the limiting plate.

[0019] As a further description of the above technical solution:

[0020] The left and right parts of the limiting plate are both provided with sliding openings, and the connecting rod is slidably connected with the sliding openings.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the present invention, by arranging the mutual cooperation between the conveyor and the adjustment component, and by arranging the mutual cooperation between the electric push rod and the adjustment plate and the guide plate, the device can better adjust the chip position and is more practical.

[0023] 2. In the present invention, by setting up a pasting mechanism and by setting up the mutual cooperation between the moving component, the centering component and the adsorption head, the device can limit the chip when picking up the chip to prevent it from shifting during the adsorption process, thereby effectively ensuring the accuracy of chip installation and being more practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is an overall three-dimensional schematic diagram of an FPC board wafer welding device proposed by the present invention;

[0025] Figure 2 This is a disassembled three-dimensional schematic diagram of an FPC board wafer welding device proposed by the present invention;

[0026] Figure 3 This is a disassembled three-dimensional schematic diagram of the moving components of an FPC board wafer welding device proposed by the present invention;

[0027] Figure 4 This is a three-dimensional schematic diagram of a centering component of an FPC board wafer welding device proposed by the present invention.

[0028] Legend:

[0029] 1. Conveyor; 2. Adjustment assembly; 3. Base; 4. Moving assembly; 5. Centering assembly; 21. Electric push rod; 22. Adjustment plate; 23. Guide plate; 31. Operating table; 41. Rotating rod; 42. Connecting plate; 43. Vertical rod; 44. Slide rail; 45. Slider; 46. Adsorption head; 51. Cylinder; 52. Round plate; 53. Support rod; 54. Connecting block; 55. Limiting plate; 56. Connecting rod; 57. Pillar; 58. Centering plate; 511. Air rod; 551. Slide. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Reference Figure 1 - Figure 2 The utility model provides an embodiment: an FPC board wafer welding device, including a conveyor 1 for conveying wafer chips, a base 3 is provided on the left rear side of the conveyor 1 for cooperating and connecting various components, and an operating table 31 is fixedly connected to the rear portion of the top surface of the base 3 for cooperating with the adhesion between the wafer and the FPC board, and a pasting mechanism is provided on the upper part of the base 3 for cooperating with the connection between the FPC board and the wafer chip, the pasting mechanism includes a moving component 4 and a centering component 5, and the centering component 5 includes a driving part and an adjusting part, and the number of the driving part and the adjusting part are both two, which are used to center and limit the chip when taking the chip to ensure the accuracy of the position when the chip is installed. A correction mechanism is provided on the upper part of the conveyor 1 for adjusting the wafer chip during transportation to prevent it from deflecting.

[0032] Furthermore, the correction mechanism includes two adjustment components 2, and the adjustment component 2 includes two electric push rods 21 for adjusting the position of the adjustment plate 22. The two electric push rods 21 are fixedly connected to the conveyor 1, and the output ends of the two electric push rods 21 are fixedly connected to the adjustment plate 22 for correcting the wafer chip. The adjustment component 2 also includes a guide plate 23, which is tilted and used to guide the chip. The guide plate 23 is fixedly connected to the right end of the adjustment plate 22.

[0033] like Figure 3 - Figure 4 The moving component 4 includes a rotating rod 41, which is electrically driven and is used to adjust the position of the adsorption head 46 and the centering component 5 through the connecting plate 42 and the vertical rod 43. The rotating rod 41 is fixedly connected to the base 3. The top of the rotating rod 41 is fixedly connected to the connecting plate 42 for connecting various components. The front lower side of the connecting plate 42 is fixedly connected to the vertical rod 43 for connecting various components. The front and rear parts of the vertical rod 43 are fixedly connected to the slide rail 44, which is electric and is used to adjust the height of the slider 45. The internal sliding connection of the slide rail 44 is connected to the slider 45 for connecting the centering component 5. The bottom of the vertical rod 43 is provided with an adsorption head 46, the upper part of which is connected to the vertical rod 43 through an electric telescopic rod, which can adsorb the chip through vacuum and drive the chip to move.

[0034] Furthermore, the driving member includes a cylinder 51 for driving the assembly. The upper part of the cylinder 51 near the side of the vertical rod 43 is fixedly connected to the slider 45 for cooperating with the drive of the slide rail 44. The bottom of the cylinder 51 is fixedly connected to a circular plate 52 for cooperating with the connection of various components. The output end of the cylinder 51 is provided with a gas rod 511 for cooperating with the adjustment assembly. The gas rod 511 passes through the circular plate 52 and is movably connected thereto. The gas rod 511 is fixedly connected to the limiting plate 55. Support rods 53 are provided on the left and right parts of the bottom surface of the circular plate 52 for cooperating with the connection of various components. The upper and lower ends of the support rods 53 are movably connected to connecting blocks 54 for cooperating with the connection of the support rods 53. The upper connecting block 54 is fixedly connected to the circular plate 52, and the lower part of the lower connecting block 54 is fixedly connected to the connecting rod 56 for In conjunction with the driving pillar 57, a limiting plate 55 is commonly provided at the lower part of the two support rods 53 for cooperating in adjusting the position of the centering plate 58. The adjusting part includes the centering plate 58, which is used to adjust and limit the position of the chip when the adsorption head 46 adsorbs and picks up the chip, so as to ensure that the chip is more accurately fitted. The front and rear parts of the top of the centering plate 58 are fixedly connected with pillars 57 for cooperating with the connection of the centering plate 58. The pillars 57 are fixedly connected to the connecting rod 56. The left and right parts of the limiting plate 55 are provided with sliding openings 551 for cooperating in limiting the moving direction of the connecting rod 56. At the same time, the connecting block 54 on the upper part of the connecting rod 56 and the pillars 57 on the lower part can limit the upper and lower ends of the connecting rod 56. In conjunction with the adjustment of the centering plate 58, the connecting rod 56 is slidably connected to the sliding opening 551.

[0035] Working principle: When in use, according to the size of the chip, the electric push rod 21 is turned on to push the adjustment plate 22 connected to it to move toward the middle of the conveyor 1, and the adjustment plate 22 will drive the guide plate 23 connected to it to move together. When the two adjustment components 2 are adjusted, the conveyor 1 is turned on, and the wafer chip will be transported to the pasting mechanism through the conveyor 1. Under the guidance of the guide plate 23, the chip will be guided between the two adjustment plates 22. The two adjustment plates 22 will adjust the position and placement angle of the chip. When the chip is transported to the lower part of the pasting mechanism, the slide rail 44 will drive the centering component 5 to move downward through the slider 45, so that the centering component 5 covers the chip, and then the two cylinders 51 are turned on. The cylinder 51 will then drive the limiting plate 55 to move in position through the gas rod 511. When the position of the limiting plate 55 changes, the slider 45 will drive the centering component 5 to adjust the height so that the lower end of the centering plate 58 can always be close to the upper surface of the conveyor 1. At the same time, when the limiting plate 55 changes in position, due to the connecting rod 5 6 cooperates with the connecting block 54 and the support 57 at the bottom, and the limiting plate 55 will drive the lower end of the support rod 53 to change its position through the lower connecting block 54. Since the upper end of the support rod 53 is connected to the circular plate 52 through the upper connecting block 54, the lower ends of the two support rods 53 will move closer to each other according to the movement direction of the limiting plate 55, thereby driving the centering plate 58 connected to the connecting rod 56 through the support 57 to change its position. The two centering plates 58 will move closer to each other, thereby adjusting and limiting the position of the chip, and the electric telescopic rod drives the adsorption head 46 downward to adsorb the chip, and then the cylinder 51 can drive the two centering plates 58 away from each other, and the slider 45 drives the entire centering assembly 5 to move upward, and then the rotating rod 41 drives the connecting plate 42 and the vertical rod 43 connected to the connecting plate 42 and the adsorption head 46 at its bottom and other components to rotate together, so that the adsorption head 46 drives the chip to move to the operating table 31 to complete the installation of the FPC board and the wafer chip.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An FPC board wafer welding device, comprising a conveyor (1), characterized in that: A base (3) is provided on the left rear side of the conveyor (1), and a pasting mechanism is provided on the upper part of the base (3). The pasting mechanism includes a moving component (4) and a centering component (5). The centering component (5) includes a driving component and an adjusting component. The number of the driving component and the number of the adjusting component are both two. A correction mechanism is provided on the upper part of the conveyor (1), and the correction mechanism includes an adjustment component (2) and the number of the adjustment component (2) is two. The adjustment component (2) includes an electric push rod (21) and the number of the two electric push rods (21) is fixedly connected to the conveyor (1), and the output ends of the two electric push rods (21) are fixedly connected to an adjustment plate (22).

2. The FPC board wafer welding device according to claim 1, characterized in that: The adjustment assembly (2) further comprises a guide plate (23), and the guide plate (23) is fixedly connected to the right end of the adjustment plate (22).

3. The FPC board wafer welding device according to claim 1, characterized in that: An operating table (31) is fixedly connected to the rear portion of the top surface of the base (3).

4. The FPC board wafer welding device according to claim 1, characterized in that: The moving assembly (4) comprises a rotating rod (41), the rotating rod (41) is fixedly connected to the base (3), the top of the rotating rod (41) is fixedly connected to a connecting plate (42), the front lower side of the connecting plate (42) is fixedly connected to a vertical rod (43), the front and rear parts of the vertical rod (43) are fixedly connected to a slide rail (44), the interior of the slide rail (44) is slidably connected to a slider (45), and the bottom of the vertical rod (43) is provided with an adsorption head (46).

5. The FPC board wafer welding device according to claim 4, characterized in that: The driving member comprises a cylinder (51), wherein the upper portion of the cylinder (51) is fixedly connected to the slider (45) on one side close to the vertical rod (43), the bottom of the cylinder (51) is fixedly connected to a circular plate (52), the left and right portions of the bottom surface of the circular plate (52) are both provided with support rods (53), the upper and lower ends of the support rods (53) are both movably connected to connecting blocks (54), the upper connecting block (54) is fixedly connected to the circular plate (52), the lower portion of the lower connecting block (54) is fixedly connected to a connecting rod (56), and the lower portions of the two support rods (53) are jointly provided with a limiting plate (55).

6. The FPC board wafer welding device according to claim 1, characterized in that: The adjusting member comprises a center plate (58), and the front and rear parts of the top of the center plate (58) are fixedly connected to pillars (57), and the pillars (57) are fixedly connected to the connecting rods (56).

7. The FPC board wafer welding device according to claim 5, characterized in that: The output end of the cylinder (51) is provided with a gas rod (511), the gas rod (511) passes through the circular plate (52) and is movably connected thereto, and the gas rod (511) is fixedly connected to the limiting plate (55).

8. The FPC board wafer welding device according to claim 5, characterized in that: The left and right parts of the limiting plate (55) are both provided with sliding openings (551), and the connecting rod (56) is slidably connected to the sliding openings (551).

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