Paper cup bonding device
The design of the water cooling module solves the problem of insufficient heat dissipation of the ultrasonic welding head, achieves efficient heat dissipation and stable system operation, and improves the quality of paper cup bonding.
Patent Information
- Application Number
- CN202422868274.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In traditional paper cup production, the heat dissipation method of the ultrasonic welding head is not sufficient to cope with the high heat, affecting the bonding quality.
A water-cooling module is used, including a liquid-cooling water tank, a water-cooling annular pipe and hollow heat sinks. The combination of liquid-cooling water circulation and hollow heat sinks achieves efficient heat dissipation, and the pressure balance pipe and dust filter design ensure stable system operation.
It achieves efficient heat dissipation of the ultrasonic welding head, improves the bonding quality, and ensures the stability and efficiency of the system.
Smart Images

Figure CN223370255U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of paper cup bonding devices, in particular to a paper cup bonding device. Background Art
[0002] Ultrasonic bonding of paper cups is an advanced paper cup production technology that uses the high-frequency vibration of ultrasound to achieve bonding of the various parts of the paper cup. Ultrasonic bonding uses the high-frequency vibration of ultrasound to relax the welding surface and reduce contact resistance, thereby achieving material welding. In paper cup production, ultrasound is mainly used to weld the wall and bottom of the paper cup together.
[0003] During the ultrasonic bonding process of paper cups, the ultrasonic welding head will continuously generate heat. When the heat is too high, it will affect the quality of bonding. The traditional heat dissipation method is simple air cooling, which is not enough to meet the heat dissipation requirements of the ultrasonic welding head. Therefore, a paper cup bonding device is urgently needed to solve the above problem. Utility Model Content
[0004] The purpose of the present invention is to provide a paper cup bonding device to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a paper cup bonding device, comprising a bonding support frame and a water-cooling module, the water-cooling module comprising a liquid-cooling water tank and a water-cooling annular pipe, the bottom end of the liquid-cooling water tank is fixedly connected to a mounting plate, the top of the liquid-cooling water tank is evenly fixedly connected to hollow heat sinks, the top of the hollow heat sink is fixedly connected to a return water tank, the top of the return water tank is provided with a water tank top cover, the bottom end of one end of the liquid-cooling water tank is fixedly connected to an output pipe, the end of the output pipe away from the liquid-cooling water tank is fixedly installed with a delivery water pipe, the end of the delivery water pipe away from the output pipe is fixedly installed at one end of the water-cooling annular pipe, the other end of the water-cooling annular pipe is fixedly installed with a return pipe, and the end of the return pipe away from the water-cooling annular pipe is fixedly installed at the middle of the top end of the water tank top cover.
[0006] Preferably, one end of the top end of the water tank top cover is fixedly connected to a pressure balancing pipe, and the inner top end of the pressure balancing pipe is provided with a dustproof filter.
[0007] Preferably, a diverter plate is fixedly connected to the interior of the liquid cooling water tank, the diverter plate is arc-shaped, and both sides of the diverter plate are bent downward.
[0008] Preferably, an electric push rod is fixedly mounted on the middle part of the bottom end of the bonding support frame, an ultrasonic welding head is fixedly mounted on the bottom end of the electric push rod, and a cooling fan is fixedly mounted on one end of the top end of the bonding support frame.
[0009] Preferably, a water pump is fixedly installed at one end of the return pipe close to the water tank top cover, and the input end of the water pump is connected to the water-cooling annular pipe through the return pipe.
[0010] Preferably, the mounting plate is fixedly mounted on the middle portion of the top end of the bonding support frame, and the water-cooling annular pipe is fixedly mounted on the outer side of the ultrasonic welding head.
[0011] Preferably, the hollow heat sink and the water-cooling annular tube are made of metallic copper.
[0012] Preferably, both sides of the hollow heat sink are designed to be pointed, and the liquid cooling water tank and the return water tank are connected through the hollow heat sink.
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0014] The utility model realizes efficient heat dissipation of the ultrasonic welding head through the combination of the water-cooling annular tube and the hollow heat sink. The water-cooling annular tube can quickly absorb the heat generated by the welding head and take the heat away through the liquid-cooled water circulation. At the same time, the liquid-cooled water is guided through the hollow heat sink to increase the heat dissipation area of the liquid-cooled water, thereby improving the heat dissipation efficiency. The design of the pressure balance tube and the dust-proof filter effectively solves the pressure problem that may be caused by the expansion of the liquid-cooled water due to heat, thereby ensuring the stable operation of the system. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the main three-dimensional structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the water cooling module structure in the present utility model;
[0017] Figure 3 This is a schematic diagram of the partially disassembled structure of the water cooling module in the present utility model;
[0018] Figure 4 This is a schematic diagram of the partial cross-section structure of the water cooling module in the present invention.
[0019] In the figure: 1- bonding support frame, 2- ultrasonic welding head, 3- electric push rod, 4- cooling fan, 5- water cooling module, 6- liquid cooling water tank, 7- mounting plate, 8- return water tank, 9- pressure balance pipe, 10- water tank top cover, 11- hollow heat sink, 12- return pipe, 13- water cooling annular pipe, 14- water delivery pipe, 15- water pump, 16- output pipe, 17- manifold, 18- dust filter. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] See also Figure 1-4 The utility model provides an embodiment: a paper cup bonding device, comprising a bonding support frame 1 and a water cooling module 5, the water cooling module 5 comprises a liquid cooling water tank 6 and a water cooling annular pipe 13, the bottom end of the liquid cooling water tank 6 is fixedly connected to a mounting plate 7, the top of the liquid cooling water tank 6 is evenly fixedly connected to hollow heat sinks 11, the top of the hollow heat sink 11 is fixedly connected to a return water tank 8, the top of the return water tank 8 is provided with a water tank top cover 10, the bottom end of one end of the liquid cooling water tank 6 is fixedly connected to an output pipe 16, the end of the output pipe 16 away from the liquid cooling water tank 6 is fixedly installed with a water delivery pipe 14, the end of the delivery water pipe 14 away from the output pipe 16 is fixedly installed at one end of the water cooling annular pipe 13, the other end of the water cooling annular pipe 13 is fixedly installed with a return pipe 12, and the end of the return pipe 12 away from the water cooling annular pipe 13 is fixedly installed at the middle of the top of the water tank top cover 10.
[0022] One end of the top of the water tank top cover 10 is fixedly connected to a pressure balancing pipe 9, and a dust filter 18 is provided at the inner top of the pressure balancing pipe 9. When the liquid cooling water expands due to heat, it squeezes the air inside the reflux water tank 8, and the squeezed air is discharged through the pressure balancing pipe 9. When the work stops, the liquid cooling water cools down and draws in external air through the pressure balancing pipe 9 and filters it through the dust filter 18 to maintain the purity of the liquid cooling water.
[0023] An electric push rod 3 is fixedly installed in the middle of the bottom end of the bonding support frame 1, and an ultrasonic welding head 2 is fixedly installed at the bottom end of the electric push rod 3. A cooling fan 4 is fixedly installed at one end of the top of the bonding support frame 1, and the mounting plate 7 is fixedly installed in the middle of the top end of the bonding support frame 1. The water-cooled annular pipe 13 is fixedly installed on the outside of the ultrasonic welding head 2. The heat generated by the ultrasonic welding head 2 is absorbed by the water-cooled annular pipe 13 and transferred to the liquid cooling water inside the water-cooled annular pipe 13 to cool the ultrasonic welding head 2.
[0024] The interior of the liquid-cooled water tank 6 is fixedly connected to a diverter plate 17, which is designed in an arc shape, and both sides of the diverter plate 17 are bent downward. A water pump 15 is fixedly installed at one end of the return pipe 12 close to the water tank top cover 10, and the input end of the water pump 15 is connected to the water-cooled annular pipe 13 through the return pipe 12. The started water pump 15 transports the water inside the water-cooled annular pipe 13 into the interior of the return water tank 8 through the return pipe 12. The water entering the return water tank 8 falls on the top of the diverter plate 17. Due to the arc design of the top of the diverter plate 17, the water is evenly diverted to both sides and flows into the liquid-cooled water tank 6 through the hollow heat sink 11, and then transported to the interior of the water-cooled annular pipe 13 through the delivery water pipe 14 to form a water circulation.
[0025] The hollow heat sink 11 and the water-cooled annular tube 13 are made of metallic copper. Copper has high thermal conductivity and heat dissipation properties, which facilitates accelerated heat dissipation. The two sides of the hollow heat sink 11 are designed with pointed tips, and the liquid cooling water tank 6 and the return water tank 8 are connected through the hollow heat sink 11. The pointed design on both sides of the hollow heat sink 11 facilitates the rapid flow of air blown by the cooling fan 4, thereby accelerating the heat dissipation effect.
[0026] Working principle: During use, first open the water tank top cover 10 to pour liquid cooling water into the return water tank 8, and flow into the liquid cooling water tank 6 through the hollow heat sink 11. The liquid cooling water in the liquid cooling water tank 6 flows into the water cooling annular pipe 13 through the delivery water pipe 14. When the paper cup bonding process is started, turn on the cooling fan 4 and the water pump 15. The heat generated by the welding end of the ultrasonic welding head 2 is transferred to the liquid cooling water inside the water cooling annular pipe 13 through the water cooling annular pipe 13. The started water pump 15 transports the water inside the water cooling annular pipe 13 to the return water tank 8 through the return pipe 12. The reflux water falls on the top of the diverter plate 17 through the top of the return water tank 8. The liquid cooling water is diverted to both sides through the arc design of the diverter plate 17, and the diverted liquid cooling water enters the hollow heat sink 11. The liquid-cooled water in the water-cooling annular pipe 13 is pumped into the return water tank 8 by the water pump 15, so that the internal pressure of the water-cooling annular pipe 13 is reduced. The water-cooling annular pipe 13 sucks the liquid-cooled water inside the liquid-cooling water tank 6 into the water-cooling annular pipe 13 through the delivery water pipe 14 to replenish the liquid-cooled water. In the process of the liquid-cooled water flowing downward in the hollow heat sink 11, the heat in the liquid-cooled water is transferred to the hollow heat sink 11, and the hollow heat sink 11 diffuses the heat to the outside. At the same time, the started cooling fan 4 accelerates the air flow outside the hollow heat sink 11, thereby accelerating the heat dissipation effect. When the liquid-cooled water expands due to heat, the liquid-cooled water squeezes and discharges the air inside the return water tank 8 through the pressure balance pipe 9, thereby achieving the internal and external pressure balance of the return water tank 8.
[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A paper cup bonding device, comprising a bonding support frame (1) and a water cooling module (5), characterized in that: The water cooling module (5) includes a liquid cooling water tank (6) and a water cooling annular pipe (13), the bottom end of the liquid cooling water tank (6) is fixedly connected to a mounting plate (7), the top end of the liquid cooling water tank (6) is evenly fixedly connected to a hollow heat sink (11), the top end of the hollow heat sink (11) is fixedly connected to a return water tank (8), the top end of the return water tank (8) is provided with a water tank top cover (10), the bottom end of one end of the liquid cooling water tank (6) is fixedly connected to an output pipe (16 ), a water delivery pipe (14) is fixedly installed at one end of the output pipe (16) away from the liquid-cooled water tank (6), an end of the water delivery pipe (14) away from the output pipe (16) is fixedly installed at one end of the water-cooled annular pipe (13), a return pipe (12) is fixedly installed at the other end of the water-cooled annular pipe (13), and an end of the return pipe (12) away from the water-cooled annular pipe (13) is fixedly installed at the middle of the top end of the water tank top cover (10).
2. The paper cup bonding device according to claim 1, characterized in that: One end of the top end of the water tank top cover (10) is fixedly connected to a pressure balance pipe (9), and the inner top end of the pressure balance pipe (9) is provided with a dustproof filter (18).
3. The paper cup bonding device according to claim 1, characterized in that: A diverter plate (17) is fixedly connected to the interior of the liquid cooling water tank (6), and the diverter plate (17) is designed to be arc-shaped, with both sides of the diverter plate (17) bent downward.
4. The paper cup bonding device according to claim 1, characterized in that: An electric push rod (3) is fixedly mounted on the middle of the bottom end of the bonding support frame (1), an ultrasonic welding head (2) is fixedly mounted on the bottom end of the electric push rod (3), and a heat dissipation fan (4) is fixedly mounted on one end of the top end of the bonding support frame (1).
5. The paper cup bonding device according to claim 1, characterized in that: A water pump (15) is fixedly installed at one end of the return pipe (12) close to the water tank top cover (10), and the input end of the water pump (15) is connected to the water-cooling annular pipe (13) through the return pipe (12).
6. The paper cup bonding device according to claim 4, characterized in that: The mounting plate (7) is fixedly mounted on the middle portion of the top end of the bonding support frame (1), and the water-cooling annular pipe (13) is fixedly mounted on the outside of the ultrasonic welding head (2).
7. The paper cup bonding device according to claim 1, characterized in that: The hollow heat sink (11) and the water-cooling annular tube (13) are made of metallic copper.
8. The paper cup bonding device according to claim 1, characterized in that: Both sides of the hollow fin (11) are designed to be pointed, and the liquid cooling water tank (6) and the return water tank (8) are connected through the hollow fin (11).