Material shuttle assembly and material shuttle temperature control system

Abstract

The utility model relates to a material shuttle assembly and a material shuttle temperature control system. The material shuttle assembly comprises a material shuttle and a temperature control piece. The material shuttle is provided with a containing groove for containing an electronic device. The temperature control piece is provided with an air blowing channel for temperature control airflow to flow, and the air blowing channel is provided with an air blowing opening. The material shuttle is installed on the temperature control piece, and the air blowing opening blows air flow towards the containing groove so as to control the temperature of the electronic device in the containing groove. According to the material shuttle assembly, the cost can be reduced, the risk of refrigerant leakage is avoided, thermal deformation of the material shuttle is reduced, and the structural precision of the material shuttle assembly is improved. The material shuttle temperature control system comprises the material shuttle assembly.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a shuttle assembly and a shuttle temperature control system. Background Art

[0002] The shuttle device is one of the important components in semiconductor testing equipment. Its main function is to preheat the electronic devices to be tested and to transport the electronic devices in a reciprocating motion. In the prior art, the shuttle device usually includes a shuttle body (also known as a shuttle kit in the industry) for carrying electronic devices and a flow channel plate. The shuttle kit is fixed to the flow channel plate by bolts. The flow channel plate is provided with an internal flow channel for passing the refrigerant, and a heating device is installed on the flow channel plate. The heating device heats the entire flow channel plate and the shuttle kit to achieve overall high-temperature temperature control. The low-temperature refrigerant is input into the internal flow channel of the flow channel plate through a chiller, so that the low-temperature temperature control of the entire flow channel plate and the shuttle kit can be achieved.

[0003] With this existing technology, since the shuttle device needs to reciprocate and needs to prevent the refrigerant from leaking due to the movement, the connection between the flow plate and the chiller needs to use a bellows with very high requirements for sealing and reliability. In addition, considering that the bellows moves back and forth with the shuttle device, there should be no obstacles on the movement path of the bellows, so a large movement space needs to be reserved. However, the cost of the bellows is relatively high, and it is easy to fatigue and be damaged after long-term reciprocating movement, resulting in an increased risk of refrigerant leakage and an increase in the maintenance cost of the machine; leaving a large movement space increases the overall size of the machine; the overall temperature control of the flow plate and the shuttle kit causes large thermal deformation, affecting the accuracy; the flow plate needs to be made of copper with good thermal conductivity, and the refrigerant inside it and the heating device installed on it make the overall weight of the flow plate larger and the cost higher.

[0004] In view of this, it is necessary to propose a new technical solution to overcome the shortcomings of the existing technology. Utility Model Content

[0005] Based on this, the present application provides a shuttle assembly and a shuttle temperature control system, which can reduce costs, avoid the risk of refrigerant leakage, reduce thermal deformation of the shuttle, and improve its structural accuracy.

[0006] To this end, the present application adopts the following technical solution: a material shuttle assembly, including a material shuttle and a temperature control component, the material shuttle having a receiving groove for receiving electronic components, the temperature control component having an air blowing channel for supplying temperature-controlled airflow, the air blowing channel having an air blowing port, the material shuttle being installed on the temperature control component, and the air blowing port blowing airflow toward the receiving groove to control the temperature of the electronic components in the receiving groove.

[0007] In some embodiments, the material shuttle has a front and a back side that are relatively arranged, the receiving groove is arranged on the front side, and a blowing groove is arranged at a position on the back side corresponding to the receiving groove, and the blowing port blows air toward the blowing groove.

[0008] In some embodiments, the shuttle includes a plurality of exhaust channels extending from the blowing slot to an edge of the shuttle, and the exhaust channels form exhaust ports at the edge.

[0009] In some embodiments, each of the blowing slots is connected to a plurality of exhaust channels, and the plurality of exhaust channels extend radially from the blowing slot to the edge of the shuttle.

[0010] In some embodiments, the exhaust channel is opened in the shuttle; or, the exhaust channel is opened on the back side of the shuttle.

[0011] In some embodiments, the depth of the exhaust channel is smaller than the depth of the blowing groove.

[0012] In some embodiments, in a vertical projection from the front surface to the back surface, the projection of the receiving groove falls within the projection range of the blowing groove.

[0013] In some embodiments, the temperature control component includes a mounting plate and a plurality of air blowing blocks mounted on the mounting plate, and each of the air blowing blocks includes a plurality of air blowing ports to simultaneously blow air to a plurality of receiving slots.

[0014] In some embodiments, the air blowing channel is provided in the air blowing block, the air blowing port is provided on the top surface of the air blowing block, and an air inlet is provided on the side surface of the air blowing block.

[0015] The present application also adopts the following technical solution: a shuttle temperature control system, comprising an air flow temperature adjustment component, a conveying pipeline, and the shuttle component described in any of the above embodiments, the air flow temperature adjustment component comprising a refrigerant machine, a heat exchanger and an air heater, the air heater being connected downstream of the heat exchanger, and the air flowing through the heat exchanger and undergoing heat exchange with the refrigerant machine is heated to a preset temperature by the air heater and then conveyed to the shuttle component.

[0016] The material shuttle assembly provided in the present application includes a material shuttle and a temperature control component, wherein the temperature control component is provided with an air blowing channel for blowing air to the material shuttle for temperature control, and the air port of the air blowing channel blows air toward the receiving tank to control the temperature of the electronic components in the receiving tank; compared with the existing solution of using refrigerant direct cooling for temperature control, it cancels the bellows design, reduces space occupancy, reduces product cost, and avoids the risk of refrigerant leakage; air blowing temperature control can perform local and directional air blowing on the receiving tank, avoiding the problem of large thermal deformation of the material shuttle caused by overall temperature control of the material shuttle, which is beneficial to maintaining the structural accuracy of the material shuttle; the temperature control component only serves as an air distribution component, the thickness can be reduced, the material can be selected with low density, and there is no need to fill it with liquid refrigerant, so its weight and material cost can be greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a three-dimensional diagram of an embodiment of the material shuttle temperature control system of the present application.

[0019] Figure 2 This is a three-dimensional combination diagram of an embodiment of the shuttle assembly of the present application.

[0020] Figure 3 This is a three-dimensional exploded view of an embodiment of the shuttle assembly of the present application.

[0021] Figure 4 This is a three-dimensional view of the shuttle in one embodiment of the shuttle assembly of the present application.

[0022] Figure 5 This is a partial view of the blow block in one embodiment of the shuttle assembly of the present application.

[0023] Figure 6 This is a cross-sectional view of an embodiment of the shuttle assembly of the present application.

[0024] Figure 7 This is a schematic diagram of the system modules of an embodiment of the material shuttle temperature control system of the present application.

[0025] The components are numbered as follows: 100, material shuttle temperature control system; 200, material shuttle assembly; 1, material shuttle; 101, front; 102, back; 11, receiving groove; 12, blowing groove; 13, exhaust channel; 130, exhaust port; 14, pin sleeve; 2, temperature control component; 21, mounting plate; 210, mounting groove; 22, blowing block; 220, blowing channel; 221, air inlet; 222, blowing port; 23, pin; 3, refrigerant machine; 4, heat exchanger; 5, air heater; 6, delivery pipeline. DETAILED DESCRIPTION

[0026] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0027] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0029] In this application, unless otherwise expressly specified or limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or that the first feature and the second feature are indirectly in contact through an intermediate medium. Furthermore, a first feature being “above,” “above,” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below,” “below,” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0031] See also Figures 1 to 7 As shown, the present application provides a shuttle assembly 200 and a shuttle temperature control system 100 having the shuttle assembly 200. The shuttle assembly 200 includes a shuttle 1 and a temperature control component 2. The shuttle 1 has a receiving slot 11 for accommodating electronic components. The temperature control component 2 has an air blowing channel 220 for providing a temperature-control airflow. The air blowing channel 220 has an air blowing port 222. The shuttle 1 is mounted on the temperature control component 2, and the air blowing port 222 blows air toward the receiving slot 11 to control the temperature of the electronic components in the receiving slot 11.

[0032] Compared with the existing solution of direct cooling and temperature control using refrigerant, the shuttle assembly 200 provided in the present application eliminates the bellows design, reduces space occupancy, reduces product cost, and avoids the risk of refrigerant leakage; the air blowing temperature control can perform local and directional air blowing on the receiving tank 11, avoiding the problem of large thermal deformation of the shuttle 1 caused by overall temperature control of the shuttle 1, which is beneficial to maintaining the structural accuracy of the shuttle 1; the temperature control component 2 only serves as an air distribution component, the thickness can be reduced, the material can be selected with low density, and there is no need to fill it with liquid refrigerant, so its weight and material cost can be greatly reduced.

[0033] See also Figure 2 and Figure 3 As shown, in this embodiment, the shuttle 1 is plate-shaped, having a front face 101 and a back face 102 disposed opposite each other. A receiving slot 11 is provided on the front face 101. Multiple receiving slots 11 are arranged in an array on the front face 101 to accommodate multiple electronic components at once. In this embodiment, eight receiving slots 11 are provided on the front face 101 of the shuttle 1, arranged in two rows of four. In other embodiments, the number and arrangement of the receiving slots 11 are not limited to the above.

[0034] See also Figure 4As shown, a blowing groove 12 is provided at a position on the back side 102 of the shuttle 1 corresponding to the receiving groove 11. The blowing groove 12 is provided in a one-to-one correspondence with the receiving groove 11. In this embodiment, the blowing groove 12 is a non-through circular groove. The gas blown into the blowing groove 12 mainly transfers heat to the electronic components in the receiving groove 11 through the wall between the blowing groove 12 and the receiving groove 11. Since the receiving groove 11 is recessed downward from the front side 101 and the blowing groove 12 is recessed upward from the back side, the wall between the receiving groove 11 and the blowing groove 12 is thinner and has efficient heat transfer performance. In other embodiments, a part of the blowing groove 12 may also be provided with a through hole, so that the gas blown into the blowing groove 12 can pass through the through hole into the receiving groove 11 to transfer heat to the electronic components. In other embodiments, the shape of the blowing groove 12 may also be square or other shapes.

[0035] Please also refer to Figure 6 As shown, in the vertical projection from the front surface 101 to the back surface 102 , the projection of the receiving groove 11 falls within the projection range of the blowing groove 12 . Figure 6 The range between the two dotted lines shown in is the radial size range of the blowing slot 12, and the receiving slot 11 is located within this radial size range. This arrangement allows the receiving slot 11 to be fully heated, avoiding uneven heating at different positions in one receiving slot 11.

[0036] Please continue reading Figure 4 As shown, the shuttle 1 also includes a plurality of exhaust channels 13. The exhaust channels 13 extend from the blowing slots 12 toward the edge of the shuttle 1, and exhaust ports 130 are formed at the edges of the exhaust channels 13. The exhaust channels 13 are used to exhaust the gas blown into the blowing slots 12 after heat exchange. In this embodiment, each blowing slot 12 is connected to multiple exhaust channels 13, and the multiple exhaust channels 13 extend radially from the blowing slots 12 toward the edge of the shuttle 1. This arrangement facilitates the dispersion and smooth discharge of the airflow within the blowing slots 12, avoiding congestion and confusion during exhaust. In this embodiment, each blowing slot 12 is connected to three exhaust channels 13; in other embodiments, each blowing slot 12 may be connected to one, two, or more exhaust channels 13.

[0037] In this embodiment, the exhaust duct 13 is formed on the back surface 102 of the shuttle 1. Specifically, the exhaust duct 13 is a recessed groove cut inward from the back surface 102 of the shuttle 1. During use, the shuttle 1 is mounted on the temperature-control element 2, with the back surface 102 of the shuttle 1 resting against the upper surface of the temperature-control element 2. This blocks the opening of the exhaust duct 13 on the back surface 102, allowing air to flow along the exhaust duct 13 toward the exhaust port 130. This embodiment, in which the exhaust duct 13 is formed on the back surface 102 of the shuttle 1, facilitates fabrication and installation.

[0038] In another embodiment, the exhaust channel 13 is provided within the shuttle 1. Specifically, the exhaust channel 13 is arranged as a tunnel within the shuttle 1, not penetrating the front 101 or back 102 of the shuttle 1. One end of the exhaust channel 13 is connected to the blowing slot 12, while the other end forms an exhaust port 130. The exhaust channel 13 is circumferentially closed. This structure effectively guides the exhaust flow, but compared to the method where the exhaust channel 13 is provided on the back 102 of the shuttle 1, the manufacturing process for the exhaust channel 13 is more complicated.

[0039] Please continue reading Figure 4 As shown, the depth of the exhaust channel 13 is less than that of the blowing slot 12. This arrangement slows the exhaust flow, allowing the airflow to properly linger within the blowing slot 12, thereby enhancing heat exchange between the airflow and the blowing slot 12 and improving the blowing temperature control effect. In this embodiment, the depth of the exhaust channel 13 extending from the back surface 102 toward the inside of the shuttle 1 is less than the depth of the blowing slot 12. For embodiments in which the exhaust channel 13 is provided within the shuttle 1, the depth of the exhaust channel 13 is less than the depth of the blowing slot 12. This should be understood as meaning that the dimension of the exhaust channel 13 in the thickness direction of the shuttle 1 is less than the depth of the blowing slot 12.

[0040] See also Figure 3 、 Figure 5 and Figure 6 As shown, in this embodiment, the temperature control element 2 is generally plate-shaped. The temperature control element 2 includes a mounting plate 21 and a plurality of blow blocks 22 mounted on the mounting plate 21. Each blow block 22 includes multiple blow ports 222 to simultaneously blow air into multiple receiving slots 11. The mounting plate 21 is provided with multiple mounting slots 210 to accommodate the multiple blow blocks 22. A blow channel 220 is disposed within the blow block 22, and the blow ports 222 are disposed on the top surface of the blow block 22. An air inlet 221 is provided on the side of the blow block 22. In this embodiment, each blow block 22 is T-shaped. After airflow is delivered from the air inlet 221 to the blow channel 220, it is split to the sides and then blown out through two blow ports 222. The blow ports 222 are opposite the blow slots 12 on the shuttle 1 to blow air into the blow slots 12.

[0041] See also Figure 2 and Figure 3 As shown, a pin 23 is further provided on the mounting plate 21, and a pin sleeve 14 is provided on the material shuttle 1. The material shuttle 1 can be accurately installed and positioned on the temperature control component 2 through the cooperation of the pin 23 and the pin sleeve 14, and then the connection is locked by bolts.

[0042] During use, the air flow with adjusted temperature is input into the blowing channel 220 in the blowing block 22 from the air inlet 221. The air flow is guided by the blowing channel 220 and blown into the blowing groove 12 from the blowing port 222. The air flow exchanges heat with the blowing groove 12, so that the temperature of the electronic device in the receiving groove 11 directly above the blowing groove 12 changes, so as to preheat the electronic device carried on the material shuttle 1.

[0043] Please refer again Figure 1 As shown, the shuttle temperature control system 100 provided by the present application includes an air flow temperature adjustment component, a delivery pipeline 6, and a shuttle component 200 of any of the above embodiments. The air flow temperature adjustment component includes a refrigerant machine 3, a heat exchanger 4 and an air heater 5. The air heater 5 is connected to the downstream of the heat exchanger 4. After the air flows through the heat exchanger 4 and exchanges heat with the refrigerant machine 3, it is heated to a preset temperature by the air heater 5 and then delivered to the shuttle component 200. Figure 7 As shown, in this embodiment, the heat exchanger 4 can be a plate heat exchanger. Plate heat exchangers have the advantages of compact structure and high heat exchange efficiency, and can be used for heat exchange between liquid refrigerant and gas. It will be appreciated that the shuttle temperature control system 100 also includes components such as a detection sensor, a relay, and a thermostat. The detection sensor is used to detect the airflow temperature. The thermostat is electrically connected to the detection sensor and to the air heater 5 via a relay. Based on the temperature signal detected by the detection sensor, the thermostat controls the operating state of the air heater 5 via the relay to increase or decrease the temperature of the input dry gas.

[0044] From the above description of the specific embodiment, it can be seen that the shuttle assembly 200 provided by the present application includes a shuttle 1 and a temperature control component 2. The temperature control component 2 is provided with a blowing channel 220 to blow air to the shuttle 1 for temperature control, and the blowing port 222 of the blowing channel 220 blows air toward the receiving tank 11 to control the temperature of the electronic components in the receiving tank 11. Compared with the existing solution of using refrigerant direct cooling for temperature control, the present application solution eliminates the bellows design, reduces space occupancy, reduces product cost, and avoids the risk of refrigerant leakage. Moreover, the present application solution adopts air blowing for temperature control, and blows air towards the blowing slot 12 directly below the receiving tank 11, which can achieve local and directional blowing of the receiving tank 11, enhance the local temperature control effect, avoid the problem of large thermal deformation of the shuttle 1 caused by overall temperature control of the shuttle 1, and is conducive to maintaining the structural accuracy of the shuttle 1. In addition, the temperature control component 2 in the present application only serves as an air distribution component, the thickness can be reduced, the material can be selected with low density, and there is no need to fill it with liquid refrigerant, so its weight and material cost can be greatly reduced.

[0045] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A shuttle assembly, comprising a shuttle (1) and a temperature control element (2), characterized in that: The material shuttle (1) has a receiving groove (11) for receiving electronic devices, the temperature control component (2) has a blowing channel (220) for the flow of temperature-controlled airflow, the blowing channel (220) has a blowing port (222), the material shuttle (1) is mounted on the temperature control component (2), and the blowing port (222) blows airflow toward the receiving groove (11) to control the temperature of the electronic devices in the receiving groove (11).

2. The shuttle assembly according to claim 1, characterized in that The shuttle (1) has a front side (101) and a back side (102) that are arranged opposite to each other; the receiving groove (11) is arranged on the front side (101); a blowing groove (12) is arranged on the back side (102) at a position corresponding to the receiving groove (11); and the blowing port (222) blows air toward the blowing groove (12).

3. The shuttle assembly according to claim 2, characterized in that The shuttle (1) comprises a plurality of exhaust channels (13), wherein the exhaust channels (13) extend from the blowing slot (12) to the edge of the shuttle (1), and the exhaust channels (13) form exhaust ports (130) at the edge.

4. The shuttle assembly according to claim 3, characterized in that Each of the air blowing grooves (12) is connected to a plurality of exhaust channels (13), and the plurality of exhaust channels (13) extend radially from the air blowing grooves (12) toward the edge of the material shuttle (1).

5. The shuttle assembly according to claim 3, characterized in that The exhaust channel (13) is opened in the material shuttle (1); or, the exhaust channel (13) is opened on the back side (102) of the material shuttle (1).

6. The shuttle assembly according to claim 5, characterized in that The depth of the exhaust channel (13) is smaller than the depth of the blowing groove (12).

7. The shuttle assembly according to claim 2, characterized in that In a vertical projection from the front side (101) to the back side (102), the projection of the receiving groove (11) falls within the projection range of the blowing groove (12).

8. The shuttle assembly according to claim 1, wherein: The temperature control component (2) comprises a mounting plate (21) and a plurality of air blowing blocks (22) mounted on the mounting plate (21), each of the air blowing blocks (22) comprising a plurality of air blowing ports (222) for simultaneously blowing air to a plurality of receiving slots (11).

9. The shuttle assembly according to claim 8, characterized in that The air blowing channel (220) is arranged in the air blowing block (22), the air blowing port (222) is arranged on the top surface of the air blowing block (22), and an air inlet (221) is opened on the side of the air blowing block (22).

10. A shuttle temperature control system (100), characterized in that: It comprises an air flow temperature adjustment component, a conveying pipeline (6), and a shuttle component (200) as described in any one of claims 1 to 9, wherein the air flow temperature adjustment component comprises a refrigerant machine (3), a heat exchanger (4) and an air heater (5), wherein the air heater (5) is connected downstream of the heat exchanger (4), and the air flowing through the heat exchanger (4) and undergoing heat exchange with the refrigerant machine (3) is heated to a preset temperature by the air heater (5) and then conveyed to the shuttle component (200).

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