Atomic layer deposition coating equipment
By adopting a stacked structure of a transfer chamber and a vacuum chamber in the atomic layer deposition coating equipment, combined with the design of a lifting device, a breaking hole and an exhaust hole, the problems of excessive equipment height and contamination are solved, space saving and cleanliness control are achieved, and the equipment's working efficiency and service life are improved.
Patent Information
- Application Number
- CN202422786917.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-11-15
AI Technical Summary
The existing atomic layer deposition coating equipment has an exposed lifting mechanism, which makes the equipment too high and occupies a large space. It is difficult to maintain vacuum and cleanliness, and it is easily contaminated by dust and impurity particles.
The stacked structure of the transfer chamber and vacuum chamber, combined with the design of lifting devices, air-breaking holes and exhaust holes, realizes the vertical movement of substrates and gas flow control, reduces the height of the equipment, maintains the vacuum state and blocks contamination.
Effectively reduce equipment space occupation, maintain vacuum state and cleanliness, avoid dust and impurity particle pollution, and improve equipment working efficiency and service life.
Smart Images
Figure CN223373223U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vacuum coating, in particular to an atomic layer deposition coating device. Background Art
[0002] Atomic layer deposition (ALD) is a high-precision thin-film deposition technology based on chemical vapor deposition (CVD). It deposits a material layer by layer onto a substrate in the form of a single atomic film, using the principles of CVD. Two or more precursor chemicals, each containing different elements of the material being deposited, are alternately introduced to the substrate surface. Each precursor saturates the surface, forming a single layer of material.
[0003] In existing atomic layer deposition (ALD) coating equipment, the substrates being coated are typically moved in and out of the vacuum chamber used for coating via a lifting mechanism located outside the coating chamber. This exposed lifting mechanism makes the equipment too tall, resulting in unnecessary space waste and a larger overall footprint. Furthermore, the need to remove and replace the substrates required to coat the film increases the vacuum and cleanliness requirements within the coating chamber, which is a current technical pain point. Utility Model Content
[0004] The purpose of the utility model is to provide an atomic layer deposition coating device that can reduce the height of the device and reduce space occupation; can control the vacuum state and cleanliness inside the device and effectively block dust and impurity particles from contaminating the substrate.
[0005] To achieve this purpose, the present invention adopts the following technical solutions:
[0006] Atomic layer deposition coating equipment, including:
[0007] A transfer chamber, the transfer chamber is used to place substrates; a lifting device is provided in the transfer chamber, the lifting device is used to transfer the substrates in a vertical reciprocating motion; a vent hole is provided at the top of the chamber wall of the transfer chamber, the vent hole is used to introduce clean air into the transfer chamber; an exhaust hole is provided at the bottom of the chamber wall of the transfer chamber, the exhaust hole is used to extract gas from the transfer chamber;
[0008] A vacuum chamber is stacked above the transfer chamber, and the bottom of the vacuum chamber is selectively connected to the top of the transfer chamber. When the bottom of the vacuum chamber is connected to the top of the transfer chamber, the lifting device can lift the substrate into the vacuum chamber, and after the substrate is coated, the lifting device can lower the substrate into the transfer chamber.
[0009] As an optional technical solution for the atomic layer deposition coating equipment, there are multiple air-breaking holes, and the multiple air-breaking holes are arranged at the same horizontal height, and / or there are multiple air-exhaust holes, and the multiple air-exhaust holes are arranged at the same horizontal height.
[0010] As an optional technical solution for the atomic layer deposition coating equipment, the plurality of air-breaking holes are symmetrically arranged, and / or the plurality of air-exhausting holes are symmetrically arranged.
[0011] As an optional technical solution for the atomic layer deposition coating equipment, a one-way valve for breaking air is provided on the breaking air hole, and a one-way valve for exhausting air is provided on the exhausting air hole.
[0012] As an optional technical solution for the atomic layer deposition coating equipment, two sub-chambers are separated and arranged in the transfer chamber; two lifting devices are arranged in the transfer chamber, and the lifting devices correspond to the sub-chambers one by one, and the lifting devices are placed in the sub-chambers.
[0013] As an optional technical solution for the atomic layer deposition coating equipment, sealing gate valves are provided at the bottom of the vacuum chamber and the top of the transfer chamber. When the transfer chamber is in a vacuum state, the sealing gate valve is opened to connect the vacuum chamber and the transfer chamber; when the transfer chamber is in a broken air state, the sealing gate valve is closed to ensure that the vacuum chamber is vacuum-sealed.
[0014] As an optional technical solution for the atomic layer deposition coating equipment, the sealing gate valve is configured as a water-cooled gate valve, and the water-cooled gate valve is used to isolate the high temperature in the vacuum chamber when coating the substrate.
[0015] As an optional technical solution for the atomic layer deposition coating equipment, a sealed door is provided on the front of the transfer chamber, which can be opened for placing and removing the substrate; and the sealed door can be closed to seal and isolate the transfer chamber from the outside world.
[0016] As an optional technical solution for the atomic layer deposition coating equipment, the sealed chamber door is provided with an observation window, and the observation window is sealed and embedded with a transparent part.
[0017] As an optional technical solution for the atomic layer deposition coating equipment, adjustment seats are respectively provided at the four corners of the bottom of the transfer chamber, and the adjustment seats can be selectively extended and fixed to change the relative position of the transfer chamber and the ground.
[0018] Beneficial effects of the utility model:
[0019] The atomic layer deposition coating equipment provided by the utility model includes a transport chamber and a vacuum chamber, wherein the transport chamber is used to place substrates, the vacuum chamber is stacked above the transport chamber, and the bottom of the vacuum chamber is selectively connected to the bottom of the transport chamber; a lifting device is provided in the transport chamber to meet the need of reducing the height of the equipment and reducing space waste, the lifting device is used to transport the substrate to move back and forth in a vertical direction, when the bottom of the vacuum chamber is connected to the bottom of the transport chamber, the lifting device can transport the substrate up to the vacuum chamber, and after the substrate is coated in the vacuum chamber, the lifting device can transport the substrate down to the transport chamber. A vent hole is provided at the top of the chamber wall of the transport chamber, and the vent hole is used to introduce qualified clean air into the transport chamber, which can release the vacuum state of the atomic layer deposition coating equipment and facilitate opening the transport chamber to take and place substrates; an exhaust hole is provided at the bottom of the chamber wall of the transport chamber, and the exhaust hole is used to exhaust the gas in the transport chamber to restore the vacuum negative pressure state in the transport chamber, and at the same time control the flow direction of the gas in the transport chamber so that the gas is exhausted from top to bottom, effectively preventing dust and impurity particles from contaminating the substrates placed in the middle of the transport chamber. The equipment manufacturing and structural installation are simple and quick, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a structural diagram of a transport chamber of an atomic layer deposition coating device provided in a specific embodiment of the present utility model;
[0021] Figure 2 It is a cross-sectional view of a sub-chamber of an atomic layer deposition coating device provided in a specific embodiment of the present utility model;
[0022] Figure 3 It is a schematic diagram of the layout of the exhaust holes and the air-breaking holes in the transfer chamber of the atomic layer deposition coating equipment provided by the specific embodiment of the present invention.
[0023] In the picture:
[0024] 100. Transfer chamber; 101. Sub-chamber; 102. Breaking hole; 103. Exhaust hole; 110. Lifting device; 111. Guide rail; 120. Sealed door; 121. Observation window; 130. Transparent part; 140. Adjustment seat. DETAILED DESCRIPTION
[0025] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.
[0026] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0027] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0028] In the description of this embodiment, terms such as "upper," "lower," "right," and "left" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0029] like Figures 1 to 3 As shown in , the utility model discloses an atomic layer deposition coating equipment, including a transfer chamber 100 and a vacuum chamber. The transfer chamber 100 is used to place a substrate. The vacuum chamber is stacked above the transfer chamber 100, and the bottom of the vacuum chamber is selectively connected to the bottom of the transfer chamber 100. A lifting device 110 is provided in the transfer chamber 100. The lifting device 110 is a key component for moving the substrate from the transfer chamber 100 to the vacuum chamber. Placing the lifting device 110 in the transfer chamber 100 can meet the requirements of lowering the height of the equipment and reducing space waste. The lifting device 110 is used to transport the substrate to move back and forth in the vertical direction. When the bottom of the vacuum chamber is connected to the bottom of the transfer chamber 100, the lifting device 110 can transport the substrate up into the vacuum chamber; then the vacuum chamber is resealed and the substrate is coated in the vacuum chamber; the vacuum chamber and the transfer chamber 100 are connected again, and the lifting device 110 can transport the substrate down into the transfer chamber 100.
[0030] The top of the transfer chamber 100's wall is provided with a vent hole 102, which is used to introduce qualified clean air into the transfer chamber 100. This vent hole 102 can release the vacuum state of the atomic layer deposition coating equipment and facilitate opening the transfer chamber 100 for loading and unloading substrates. The bottom of the transfer chamber 100's wall is provided with an exhaust hole 103, which is used to extract the gas within the transfer chamber 100 to restore the vacuum negative pressure state. The exhaust hole 103 also controls the flow direction of the gas within the transfer chamber 100, so that the gas is extracted from top to bottom, preventing dust and impurity particles from contaminating the substrates placed in the center of the transfer chamber 100. By constructing the vent hole and exhaust mechanism, the effect of effectively blocking contaminants is achieved, maintaining the cleanliness of the atomic layer deposition coating equipment. The equipment is simple and quick to manufacture and install, with low cost.
[0031] Specifically, two sub-chambers 101 are separated by partitions in the transfer chamber 100, and the two sub-chambers 101 are respectively arranged on both symmetrical sides of the transfer chamber 100; two lifting devices 110 are respectively provided in the transfer chamber 100, and the lifting devices 110 correspond to the sub-chambers 101 one by one and are placed in the sub-chambers 101. The two lifting devices 110 are symmetrical and operate synchronously to further stabilize the movement of the substrate; the independent sub-chambers 101 on both sides can reduce the impact of the motor operation of the lifting devices 110 and the vibration of the motor on the particle flow in the large chamber in the middle of the transfer chamber 100.
[0032] In this embodiment, the lifting device 110 includes a guide rail 111 and a synchronous toothed belt assembly embedded in the guide rail 111. The guide rail 111 can limit the moving path of the substrate. Compared with ordinary belt transmission, the synchronous toothed belt assembly has a very small deformation of the strength layer after being loaded, the circumference of the toothed belt remains basically unchanged, there is no relative sliding between the belt and the pulley, the transmission ratio is balanced and accurate, the toothed belt is thin and light, and can be used for high-speed transmission; it has a compact structure, is oil-resistant and moisture-resistant, does not require lubrication, and has good wear resistance, and assists the substrate in stably lifting and lowering in a vacuum.
[0033] Furthermore, sealing gate valves are provided at the bottom of the vacuum chamber and the top of the transfer chamber 100. When the transfer chamber 100 is in a vacuum state, the sealing gate valve is opened to connect the vacuum chamber and the transfer chamber 100, so that the substrate can be transferred to the vacuum chamber; when the transfer chamber 100 is in a vacuum state, the sealing gate valve is closed to ensure that the vacuum chamber is maintained in a vacuum-sealed state.
[0034] For example, high temperature is generated inside the vacuum chamber when coating is carried out. In order to effectively prevent the vacuum chamber from transmitting high temperature to the transfer chamber 100, the sealing gate valve is set as a water-cooled gate valve. The water-cooled gate valve is placed between the transfer chamber 100 and the vacuum chamber. The water-cooled gate valve is used to isolate the high temperature inside the vacuum chamber when the substrate is coated, and the effect is good, ensuring that the high temperature inside the vacuum chamber will not be transmitted to the transfer chamber 100, affecting the service life of the components of the transfer chamber 100, and further protecting the lifting device 110 and the atomic layer deposition coating equipment.
[0035] It is understandable that a water cooling device may also be provided on the outside of the atomic layer deposition coating equipment to effectively cool the equipment from the outside, thereby greatly increasing the service life and safety of the atomic layer deposition coating equipment.
[0036] Specifically, a plurality of air-breaking holes 102 are provided, and the plurality of air-breaking holes 102 are arranged at the same level, and / or a plurality of air-extraction holes 103 are provided, and the plurality of air-extraction holes 103 are arranged at the same level. Such an arrangement can speed up the vacuuming or vacuum-breaking speed and improve the working efficiency of the atomic layer deposition coating equipment.
[0037] Optionally, multiple puncture holes 102 and multiple exhaust holes 103 are symmetrically arranged to further stabilize the gas flow path within the transfer chamber 100 and avoid turbulence. To create a better gas flow path, puncture holes 102 are arranged in the center of the transfer chamber 100, and exhaust holes 103 are arranged on both sides of the transfer chamber 100. Gas flows diagonally from the upper middle portion of the transfer chamber 100 to the lower sides, which can remove as many floating particles as possible within the transfer chamber 100 while avoiding the lifting of foreign particles remaining in the gaps between the components of the lifting device 110 on both sides of the transfer chamber 100.
[0038] For example, a one-way valve for breaking air is provided on the breaking hole 102, and a one-way valve for exhausting air is provided on the exhaust hole 103, which can further ensure the functional stability of the breaking hole 102 and the exhaust hole 103. The breaking hole 102 can only transport clean air from the outside to the transfer chamber 100 and cannot flow back. Similarly, the exhaust hole 103 can only exhaust the gas in the transfer chamber 100 to the outside.
[0039] In this embodiment, a sealed chamber door 120 is provided on the front of the transfer chamber 100. The sealed chamber door 120 can be opened to place and remove substrates from the transfer chamber 100; the sealed chamber door 120 can be closed to seal and isolate the transfer chamber 100 from the outside world. The sealed chamber door 120 can be installed with the transfer chamber 100 through a hinge, and sealing strips are attached around the sealed chamber door 120, and a door lock structure is provided to stabilize the opening and closing of the sealed chamber door 120.
[0040] Furthermore, an observation window 121 is provided at a suitable position of the sealed chamber door 120 , and a transparent part 130 is sealed and embedded in the observation window 121 . The transparent part 130 can be a transparent plastic sheet or glass, so that the staff can observe the working conditions in the atomic layer deposition coating equipment at any time.
[0041] Specifically, adjustment seats 140 are respectively provided at the four corners of the bottom of the transfer chamber 100. The adjustment seats 140 can be selectively extended and fixed to change the relative position of the transfer chamber 100 and the ground. The adjustment seats 140 are adjusted by rotating the threads to ensure the parallelism and stability of the main body of the atomic layer deposition coating equipment when it is suspended above the ground.
[0042] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. Atomic layer deposition coating equipment, characterized in that, include: A transport chamber (100) is provided, wherein the transport chamber (100) is used to place a substrate; a lifting device (110) is provided in the transport chamber (100), wherein the lifting device (110) is used to transport the substrate to reciprocate in a vertical direction; a puncture hole (102) is provided at the top of the chamber wall of the transport chamber (100), wherein the puncture hole (102) is used to introduce clean air into the transport chamber (100); an exhaust hole (103) is provided at the bottom of the chamber wall of the transport chamber (100), wherein the exhaust hole (103) is used to extract gas from the transport chamber (100); A vacuum chamber is stacked above the transfer chamber (100), and the bottom of the vacuum chamber is selectively connected to the top of the transfer chamber (100). When the bottom of the vacuum chamber is connected to the top of the transfer chamber (100), the lifting device (110) can lift the substrate into the vacuum chamber, and after the substrate is coated, the lifting device (110) can lower the substrate into the transfer chamber (100).
2. The atomic layer deposition coating equipment according to claim 1, characterized in that: There are multiple air-breaking holes (102), and the multiple air-breaking holes (102) are arranged at the same level, and / or there are multiple air-extraction holes (103), and the multiple air-extraction holes (103) are arranged at the same level.
3. The atomic layer deposition coating equipment according to claim 2, characterized in that: The plurality of air-breaking holes (102) are symmetrically arranged, and / or the plurality of air-extraction holes (103) are symmetrically arranged.
4. The atomic layer deposition coating equipment according to claim 1, characterized in that: The air-breaking hole (102) is provided with an air-breaking one-way valve, and the air-extraction hole (103) is provided with an air-extraction one-way valve.
5. The atomic layer deposition coating equipment according to claim 1, characterized in that: Two sub-chambers (101) are separated in the transport chamber (100); two lifting devices (110) are provided in the transport chamber (100), and the lifting devices (110) correspond to the sub-chambers (101) one by one, and the lifting devices (110) are placed in the sub-chambers (101).
6. The atomic layer deposition coating equipment according to claim 1, characterized in that: Sealing gate valves are provided at the bottom of the vacuum chamber and the top of the transfer chamber (100). When the transfer chamber (100) is in a vacuum state, the sealing gate valve is opened to connect the vacuum chamber and the transfer chamber (100); when the transfer chamber (100) is in a vacuum state, the sealing gate valve is closed to ensure that the vacuum chamber is vacuum-sealed.
7. The atomic layer deposition coating equipment according to claim 6, characterized in that: The sealing gate valve is configured as a water-cooled gate valve, and the water-cooled gate valve is used to isolate the high temperature in the vacuum chamber when the substrate is being coated.
8. The atomic layer deposition coating equipment according to claim 1, characterized in that: A sealed door (120) is provided on the front of the transfer chamber (100). The sealed door (120) can be opened to place the substrate in and take it out of the transfer chamber (100); and the sealed door (120) can be closed to seal and isolate the transfer chamber (100) from the outside.
9. The atomic layer deposition coating equipment according to claim 8, characterized in that: The sealed compartment door (120) is provided with an observation window (121), and the observation window (121) is sealed and embedded with a transparent part (130).
10. The atomic layer deposition coating device according to any one of claims 1 to 9, characterized in that: Adjustment seats (140) are respectively provided at the four corners of the bottom of the transfer chamber (100). The adjustment seats (140) can be selectively extended and fixed to change the relative position of the transfer chamber (100) and the ground.