Blowing temperature control test board and electronic component test machine
By designing a separate structure of the air outlet block and the air inlet block and a blowing temperature control test bench with multiple air outlets in the sorting equipment, the problems of insufficient temperature control capacity and heat waste are solved, and more efficient temperature control and energy utilization are achieved.
Patent Information
- Application Number
- CN202422332876.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-09-24
AI Technical Summary
Existing sorting equipment has problems with insufficient temperature control capability, insufficient heat utilization and energy waste in chip temperature testing. In particular, the blowing gas suffers from large heat loss during transportation, resulting in abnormal temperature in the cavity and potentially damaging the equipment's circuit components.
A blown temperature control test bench is designed. It adopts a separate structure of air outlet block and air inlet block. The air outlet block is made of good conductor and has multiple air outlets distributed radially. The gas is discharged after heat exchange in the air outlet block. The heat of the exhaust gas is used to control the temperature near the chip, and the excess heat is discharged into the cavity to reduce the temperature fluctuation of the cavity.
It improves the temperature control capability and thermal energy utilization rate, reduces the temperature fluctuation in the cavity, avoids equipment damage, and saves energy consumption.
Smart Images
Figure CN223377342U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor testing technology, and in particular to an air blowing temperature control test bench and an electronic component testing machine. Background Art
[0002] When testing the temperature performance of chips, existing sorting equipment generally uses a combination of heat transfer from a pressure head and air blowing elements to achieve rapid temperature response. That is, the pressure head conducts heat through direct contact with the top surface of the chip, while at the same time, the heat / cold is transferred to the test probe (pogo pin) through the gas channel inside the air blowing element, and then to the pins or pads on the bottom of the chip.
[0003] In existing sorting equipment, the blowing gas is typically only blown toward the test probe at the bottom of the chip. After being blown toward the test probe, the blowing gas is typically discharged directly into the sorting equipment's cavity. This means that the heat of the blowing gas is not fully utilized, resulting in insufficient heat exchange between the gas and the test probe, leading to insufficient temperature control of the chip. Furthermore, to avoid temperature loss during the delivery of the blowing gas, the blowing element is typically made of a material with poor thermal conductivity, such as polyetheretherketone (PEEK). This reduces heat loss before the blowing gas reaches the test probe. Since the heat loss of the blowing gas during delivery and during heat transfer and temperature control of the chip is not significant, the temperature of the blowing gas at discharge is not much different from the temperature at intake. Since the temperature of the blowing gas differs significantly from the ambient temperature of the cavity, discharging the gas directly into the cavity can cause the temperature inside the cavity to increase or decrease, leading to abnormal temperature inside the cavity. This can potentially cause high-temperature damage to the circuit components in the sorting equipment or frosting at low temperatures, adversely affecting the equipment. Furthermore, the direct discharge of heat / cold is also a waste of energy.
[0004] In view of this, it is necessary to propose a new technical solution to overcome the shortcomings of the existing technology. Utility Model Content
[0005] Based on this, the present application provides an air blowing temperature control test bench and an electronic component testing machine, which have better temperature control capabilities and can improve thermal energy utilization.
[0006] To this end, the present application adopts the following technical solution: an air-blowing temperature-controlled test bench for carrying electronic components and enabling the electronic components to be tested at different temperatures, the air-blowing temperature-controlled test bench comprising:
[0007] a base assembly having a test cavity formed therein for accommodating an electronic component, wherein a test probe for electrically contacting the electronic component is disposed within the base assembly; and
[0008] a blowing element having a blowing channel formed therein for passing gas into the base assembly and blowing gas toward the test probe;
[0009] In which, the blowing element includes an air inlet block and an air outlet block, the air outlet block has a clearance groove located above the test cavity and connected to the test cavity up and down, the air outlet block is provided with a plurality of air outlets, and the plurality of air outlets include at least a first air outlet that discharges air toward the clearance groove.
[0010] In one embodiment, the air outlet further includes a second air outlet for discharging air toward the outer peripheral side of the clearance groove.
[0011] In one embodiment, the air outlet further includes a third air outlet for discharging air in a direction away from the clearance groove, wherein the first air outlet, the second air outlet and the third air outlet extend radially in the air outlet block.
[0012] In one embodiment, the air outlet block has a top wall surface and a bottom wall surface that are oppositely arranged, and a side wall surface connected between the top wall surface and the bottom wall surface, and the first air outlet, the second air outlet and the third air outlet are opened on the side wall surface.
[0013] In one embodiment, the base assembly includes a base and a supporting member assembled on the bottom surface of the base, the supporting member is provided with the test probe and a gas chamber for blowing air to the test probe, the bottom wall surface of the air outlet block is provided with an air outlet channel connected to the gas chamber, and the air outlet channel is connected to the air outlet.
[0014] In one embodiment, the bottom wall of the gas outlet block is provided with a gas outlet column passing through the base, and the gas outlet channel is provided in the gas outlet column. The gas inlet block is provided with a gas inlet column passing through the base, and the gas inlet column is provided with an gas inlet channel connected to the gas chamber.
[0015] In one embodiment, a mounting groove is provided on the top surface of the base, and the air inlet block and the air outlet block are separate components, which are respectively installed in the mounting groove.
[0016] In one embodiment, the installation slot includes an air outlet avoidance slot provided corresponding to the second air outlet and the third air outlet.
[0017] In one embodiment, the heat conduction performance of the air outlet block is better than the heat conduction performance of the air inlet block.
[0018] The present application also adopts the following technical solution: an electronic component testing machine, comprising a loading device, a receiving device and a conveying device, the electronic component testing machine also comprising an air blowing temperature control test bench as described above, the conveying device being used to transfer the electronic components to be tested provided by the loading device to the air blowing temperature control test bench, and being used to move the electronic components tested on the air blowing temperature control test bench to the receiving device for recycling.
[0019] The air blowing temperature control test bench provided in the present application includes a base assembly and an air blowing element, the air blowing element includes an air inlet block and an air outlet block, the air outlet block has a clearance groove located above the test cavity in the base assembly and connected to the test cavity up and down, the air outlet block is provided with a plurality of air outlets, and the plurality of air outlets include at least a first air outlet that discharges air toward the clearance groove; in this way, the exhausted gas is blown toward the vicinity of the electronic components, and the heat of the exhausted gas can be further utilized, thereby improving the temperature control capability and thermal energy utilization rate of the air blowing temperature control test bench. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 This is a three-dimensional combination diagram of an embodiment of the air blowing temperature control test bench of this application.
[0022] Figure 2 This is a three-dimensional combination diagram from another perspective of an embodiment of the air blowing temperature control test bench of the present application.
[0023] Figure 3 This is a three-dimensional exploded view of an embodiment of the air blowing temperature control test bench of the present application.
[0024] Figure 4 for Figure 3 A partial enlarged view of point A in the middle.
[0025] Figure 5 This is a three-dimensional assembly diagram of the supporting parts in one embodiment of the air blowing temperature control test bench of this application.
[0026] Figure 6 This is a three-dimensional exploded view of the supporting member in one embodiment of the air blowing temperature control test bench of this application.
[0027] Figure 7 This is a three-dimensional exploded view of the supporting member from another perspective in one embodiment of the air blowing temperature control test bench of this application.
[0028] Figure 8For the Figure 1 A partial enlarged cross-sectional view taken along the midline BB.
[0029] Figure 9 This is a schematic diagram showing the air blowing path of an embodiment of the air blowing temperature control test bench of the present application.
[0030] Figure 10 For the Figure 1 A partial enlarged cross-sectional view taken along the CC line.
[0031] Figure 11 This is a three-dimensional diagram of the air outlet block in one embodiment of the air blowing temperature control test bench of this application.
[0032] Figure 12 This is a three-dimensional view of the air outlet block from another perspective in one embodiment of the air blowing temperature control test bench of this application.
[0033] Figure 13 A schematic diagram showing the air flow path inside the air block in one embodiment of an air blowing temperature control test bench is provided.
[0034] The components are numbered as follows: 100, air blowing temperature control test bench; 1, base assembly; 11, base; 101, test cavity; 111, mounting slot; 112, air outlet avoidance slot; 12, supporting member; 121, upper supporting body; 1210, through slot; 1211, air diffusion hole; 122, middle supporting body; 1220, gas chamber; 123, lower supporting body; 13, electronic component; 2, air blowing element; 21, air inlet block; 210, air blowing channel; 211, air inlet column; 2110, air inlet channel; 22, air outlet block; 220, avoidance slot; 221, first air outlet; 222, second air outlet; 223, third air outlet; 224, air outlet column; 2240, air outlet channel; 14, test probe; 3, diverter. DETAILED DESCRIPTION
[0035] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0036] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.
[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0038] In this application, unless otherwise expressly specified or limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or that the first feature and the second feature are indirectly in contact through an intermediate medium. Furthermore, a first feature being “above,” “above,” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below,” “below,” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0039] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.
[0040] See also Figures 1 to 13As shown, the present application provides an air blowing temperature control test bench 100, which is used to carry electronic components 13 and enable the electronic components 13 to be tested at different temperatures. The air blowing temperature control test bench 100 includes a base assembly 1 and an air blowing element 2. The base assembly 1 is formed with a test cavity 101 suitable for accommodating the electronic component 13, and a test probe 14 electrically in contact with the electronic component 13 is arranged in the base assembly 1. A blowing channel 210 is formed in the air blowing element 2 for passing gas into the base assembly 1 and blowing toward the test probe 14. The air blowing element 2 includes an air inlet block 21 and an air outlet block 22, and the air outlet block 22 has a clearance groove 220 located above the test cavity 101 and connected to the test cavity 101 up and down, and the air outlet block 22 is provided with a first air outlet 221 toward the clearance groove 220 to discharge air.
[0041] The air blowing temperature control test bench 100 provided in this application enables the exhaust gas to be blown toward the vicinity of the electronic component 13, thereby further utilizing the heat of the exhaust gas, thereby improving the temperature control capability and thermal energy utilization rate of the air blowing temperature control test bench 100. It should be noted that air blowing temperature control can control the electronic component 13 to be at a high temperature or at a low temperature. In other words, air blowing temperature control can heat or cool the electronic component 13. The heat, thermal energy, etc. mentioned in this article should be understood as a form of energy, and not as a heating state. That is, expressions such as heat and thermal energy include not only heating conditions, but also cooling conditions.
[0042] See also Figures 1 to 3 As shown, in this embodiment, the air blowing temperature control test bench 100 includes a base assembly 1, multiple air blowing elements 2, and a diverter 3. The multiple air blowing elements 2 and the diverter 3 are assembled on the base assembly 1. Gas is input into the diverter 3 and distributed by the diverter 3 to the multiple air blowing elements 2. The gas is then blown toward the multiple electronic components 13 to achieve simultaneous testing of the multiple electronic components 13.
[0043] See also Figure 2 and Figure 3 As shown, the base assembly 1 includes a base 11 and a supporting member 12 mounted on the bottom surface of the base 11. In this embodiment, the base 11 is a plate with a plurality of mounting grooves 111 on its top surface. The plurality of blowing elements 2 are mounted in the mounting grooves 111 one by one. A through hole is opened in the mounting groove 111 corresponding to the electronic component 13, and the through hole is used for the test machine pressure head to pass through and contact the electronic component 13. Please refer to Figure 4 As shown, the shape of the mounting groove 111 roughly matches the shape of the blowing element 2 mounted therein, and further includes a plurality of air outlet avoidance grooves 112, which are used to avoid the plurality of air outlets on the blowing element 2 to avoid blocking the air outlets and causing poor air outlet.
[0044] See also Figures 5 to 8 As shown, the support member 12 is used to support the electronic components 13 during the testing process. There are multiple support members 12, and they are arranged one-to-one with the multiple electronic components 13. The base 11 and the support member 12 together form a test cavity 101, and the electronic components 13 can be placed in the test cavity 101 for testing. In this embodiment, the support member 12 includes an upper support body 121, a middle support body 122, and a lower support body 123. The upper support body 121, the middle support body 122, and the lower support body 123 are stacked in sequence from top to bottom. A through-groove 1210 is formed in the middle of the upper support body 121, which runs vertically through it. The electronic components 13 can pass through the through-groove 1210 and be supported on the upper surface of the middle support body 122. The base 11 has a through hole corresponding to the through groove 1210. The through hole on the base 11 and the through groove 1210 on the upper support body 121 together form the test cavity 101 for testing the electronic components 13. The upper support body 121 is also provided with a gas diffusion hole 1211 that is connected to the through groove 1210 and is used to vent gas laterally to the outside. The gas diffusion hole 1211 is used to allow the gas in the test chamber 101 to dissipate. The upper surface of the middle support body 122 is flat and is used to support the electronic component 13. The middle support body 122 is provided with a plurality of through holes corresponding to the positions of the electronic component 13. The through holes are used to allow the test probe 14 to pass through and make electrical contact with the electronic component 13. A gas chamber 1220 is provided on the lower surface of the middle support body 122. The test probe 14 is inserted into the gas chamber 1220. Gas enters the gas chamber 1220 and is blown toward the test probe 14 to control the temperature of the test probe 14 and the electronic component 13. The lower support body 123 is used to fix the lower end of the test probe 14 and provide power and control for the operation of the test probe 14. In one embodiment, the lower support body 123 is a circuit board.
[0045] See also Figure 4 As shown, each blowing element 2 includes an air inlet block 21 and an air outlet block 22. The air inlet block 21 and the air outlet block 22 are separate parts, which are respectively installed in the installation groove 111. The gas input by the air inlet block 21 enters the base 11 and the supporting member 12, and is discharged from the air outlet block 22 after heat exchange and temperature control with the test probe 14 and the electronic component 13. In this embodiment, the thermal conductivity of the air outlet block 22 is better than that of the air inlet block 21; that is, the air inlet block 21 adopts a poor thermal conductor, and the air outlet block 22 adopts a good thermal conductor; in this way, the heat loss of the air inlet block 21 during the air intake process can be avoided, and at the same time, the heat during the air outlet can be dissipated more to the electronic component 13 and the surrounding area of the test cavity 101, thereby improving the temperature control ability. In a specific embodiment, the material of the air inlet block 21 is PEEK material, that is, polyetheretherketone plastic; the material of the air outlet block 22 is copper, aluminum or its alloy, etc. Please refer to Figure 8 and Figure 9As shown, the air inlet block 21 is provided with an air blowing channel 210, which is connected to the diverter 3 and is used to pass gas into the base assembly 1. In this embodiment, the air inlet block 21 is generally flat and has an air inlet column 211 that extends through the base 11. The flat and plate-shaped body is provided with a transversely extending flow channel. The air inlet column 211 is provided with an air inlet channel 2110. The upper end of the air inlet channel 2110 is connected to the transversely extending flow channel to form the air blowing channel 210, and the lower end of the air inlet channel 2110 is connected to the gas chamber 1220.
[0046] Please continue reading Figure 4 As shown, the outlet block 22 is generally flat and arranged with the inlet block 21 in the direction of gas flow. The outlet block 22 has a top wall and a bottom wall that are arranged opposite each other, as well as a side wall connected between the top and bottom walls. A clearance groove 220 is provided on the outlet block 22 and extends vertically therethrough. The clearance groove 220 corresponds to the test cavity 101 formed on the base assembly 1, and the electronic component 13 can be contacted from top to bottom through the clearance groove 220 and the test cavity 101. The bottom wall of the outlet block 22 is provided with an outlet column 224 that penetrates the base 11. An outlet channel 2240 is provided in the outlet column 224. The outlet channel 2240 communicates with the gas chamber 1220 formed by the support member 12. The gas after heat exchange between the test probe 14 and the electronic component 13 in the gas chamber 1220 enters the outlet block 22 through the outlet channel 2240 and is discharged from the outlet port provided on the outlet block 22. In this embodiment, there are multiple air outlets, which are opened on the side wall of the air outlet block 22; some of the air outlets are set to discharge air into the clearance groove 220, or to further utilize the heat of the exhaust gas to maintain the temperature around the test chamber 101 at an ideal temperature. Figures 11 to 13As shown, in this embodiment, the air outlet includes a first air outlet 221 for discharging air into the clearance groove 220, a second air outlet 222 for discharging air toward the outer peripheral side of the clearance groove 220, and a third air outlet 223 for discharging air in a direction away from the clearance groove 220, wherein the first air outlet 221, the second air outlet 222, and the third air outlet 223 are all connected to the air outlet channel 2240, and the first air outlet 221, the second air outlet 222, and the third air outlet 223 extend radially in the air outlet block 22. The present application increases the flow area of the gas in the air outlet block 22 by providing multiple air outlets and extending them radially in the air outlet block 22, so that the heat exchange between the gas and the air outlet block 22 is more sufficient, so that more heat is retained near the electronic component 13 through the air outlet block 22. The first air outlet 221 discharges air toward the clearance groove 220, so that the air surrounds the electronic component 13. The heat of the discharged air helps to maintain the temperature environment around the electronic component 13 within the ideal temperature range. The gas discharged through the second air outlet 222 and the third air outlet 223 is discharged into the cavity of the test equipment after heat exchange with the air outlet block 22. On the one hand, this allows the heat to be absorbed by the air outlet block 22, which is beneficial to maintaining the temperature near the electronic component 13. On the other hand, it also reduces the heat discharged into the cavity of the test equipment, reducing the impact on the temperature in the cavity and energy waste. In order to avoid the second air outlet 222 and the third air outlet 223 from being blocked, the mounting groove 111 opened on the base 11 is provided with an air outlet avoidance groove 112 corresponding to the second air outlet 222 and the third air outlet 223 to avoid blocking the air outlet of the second air outlet 222 and the third air outlet 223. In this embodiment, there are two first air outlets 221, two second air outlets 222, and two third air outlets 223, respectively, that is, the air outlet block 22 forms six air outlets. The air discharged from the first air outlet 221 surrounds the electronic component 13, and the heat of the discharged air helps maintain the temperature environment around the electronic component 13 within the ideal temperature range. It is understood that in other embodiments, the number of the first air outlet 221, the second air outlet 222, and the third air outlet 223 is not limited to two, and can be one, or three or more.
[0047] See also Figures 8 to 10 and Figure 13 As shown, during assembly, the air inlet block 21 and the air outlet block 22 of the blowing element 2 are assembled in the mounting groove 111 on the top surface of the base 11, the supporting member 12 is assembled on the bottom surface of the base 11, and the clearance groove 220 provided in the air outlet block 22 is connected with the test cavity 101 formed by the base assembly 1 from top to bottom. The air inlet block 21, the base 11, the supporting member 12 and the air outlet block 22 form a connected air flow channel; Figure 9As shown by the middle arrow, the air flow is input by the air inlet block 21, flows through the test probe 14, and is discharged from the air outlet block 22; part of the exhausted gas is discharged through the first air outlet 221 and surrounds the top of the electronic component 13, and the other part is discharged into the cavity of the test equipment through the second air outlet 222 and the third air outlet 223.
[0048] The present application also provides an electronic component testing machine, which includes a loading device, a receiving device and a conveying device. The electronic component testing machine also includes the air blowing temperature control test bench 100 as described above. The conveying device is used to transfer the electronic components 13 to be tested provided by the loading device to the air blowing temperature control test bench 100, and to move the electronic components 13 tested on the air blowing temperature control test bench 100 to the receiving device for recycling.
[0049] From the above description of the specific embodiments, it can be seen that the air blowing temperature control test bench 100 provided in the present application includes a base assembly 1 and an air blowing element 2, the air blowing element 2 includes an air inlet block 21 and an air outlet block 22, the air outlet block 22 has a clearance groove 220 located above the test cavity 101 in the base assembly 1 and connected to the test cavity 101 up and down, the air outlet block 22 is provided with a first air outlet 221 toward the clearance groove 220 for discharging air; in this way, the exhausted gas is blown toward the vicinity of the electronic component 13, and the heat of the exhausted gas can be further utilized, thereby improving the temperature control capability and thermal energy utilization rate of the air blowing temperature control test bench 100.
[0050] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0051] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.
Claims
1. A blowing temperature control test bench for carrying electronic components (13) and enabling the electronic components (13) to be tested at different temperatures, characterized in that: The air blowing temperature control test bench (100) comprises: A base assembly (1) is formed with a test cavity (101) suitable for accommodating an electronic component (13), wherein a test probe (14) electrically contacting the electronic component (13) is arranged in the base assembly (1); and a blowing element (2) having a blowing channel (210) formed therein for passing gas into the base assembly (1) and blowing gas toward the test probe (14); The blowing element (2) comprises an air inlet block (21) and an air outlet block (22), the air outlet block (22) having a clearance groove (220) located above the test cavity (101) and connected to the test cavity (101) in an upper and lower manner, and the air outlet block (22) is provided with a plurality of air outlets, the plurality of air outlets at least including a first air outlet (221) for discharging air into the clearance groove (220).
2. The air blowing temperature control test bench according to claim 1, characterized in that: The air outlet further comprises a second air outlet (222) for discharging air toward the outer peripheral side of the clearance groove (220).
3. The air blowing temperature control test bench according to claim 2, characterized in that: The air outlet further comprises a third air outlet (223) for discharging air in a direction away from the clearance groove (220); wherein the first air outlet (221), the second air outlet (222) and the third air outlet (223) extend radially in the air outlet block (22).
4. The air blowing temperature control test bench according to claim 3, characterized in that: The air outlet block (22) has a top wall surface and a bottom wall surface that are arranged opposite to each other, and a side wall surface connected between the top wall surface and the bottom wall surface, and the first air outlet (221), the second air outlet (222) and the third air outlet (223) are opened on the side wall surface.
5. The air blowing temperature control test bench according to claim 3, characterized in that: The base assembly (1) comprises a base (11) and a supporting member (12) mounted on the bottom surface of the base (11); the supporting member (12) is provided with the test probe (14) and a gas chamber (1220) for blowing air toward the test probe (14); the bottom wall surface of the air outlet block (22) is provided with an air outlet channel (2240) connected to the gas chamber (1220); and the air outlet channel (2240) is connected to the air outlet.
6. The air blowing temperature control test bench according to claim 5, characterized in that: The bottom wall of the gas outlet block (22) is provided with a gas outlet column (224) penetrating the base (11), and the gas outlet channel (2240) is provided in the gas outlet column (224); the gas inlet block (21) is provided with a gas inlet column (211) penetrating the base (11), and the gas inlet channel (2110) communicating with the gas chamber (1220) is provided in the gas inlet column (211).
7. The air blowing temperature control test bench according to claim 5, characterized in that: The top surface of the base (11) is provided with a mounting groove (111), and the air inlet block (21) and the air outlet block (22) are separate parts, and are respectively mounted in the mounting groove (111).
8. The air blowing temperature control test bench according to claim 7, characterized in that: The installation groove (111) comprises an air outlet avoidance groove (112) provided corresponding to the second air outlet (222) and the third air outlet (223).
9. The air blowing temperature control test bench according to claim 7, characterized in that: The heat conduction performance of the air outlet block (22) is better than the heat conduction performance of the air inlet block (21).
10. An electronic component testing machine, comprising a loading device, a receiving device and a conveying device, characterized in that: The electronic component testing machine also includes an air blowing temperature control test bench (100) as described in any one of claims 1 to 9, and the conveying device is used to transfer the electronic components (13) to be tested provided by the loading device to the air blowing temperature control test bench (100), and to move the electronic components (13) tested on the air blowing temperature control test bench (100) to the receiving device for recycling.