Pressure head device for chip testing and temperature control testing machine

Abstract

The utility model relates to a pressure head device for chip testing and a temperature control testing machine. The pressure head for chip testing is used for being in contact with a tested chip for temperature control, the pressure head device comprises a first pressure head and a second pressure head, at least one of the first pressure head and the second pressure head is provided with an elastic piece so that the first pressure head and the second pressure head can float relatively, the first pressure head comprises a first temperature control piece, and the second pressure head comprises a second temperature control piece. The first pressure head comprises a first temperature control piece, the second pressure head comprises a second temperature control piece, the first temperature control piece and the second temperature control piece can be independently controlled, the first pressure head and the second pressure head are respectively in contact with different areas of a tested chip, and the temperatures of the different areas are respectively and independently controlled through the first temperature control piece and the second temperature control piece. The pressure head device for chip testing provided by the utility model can be in full contact with the chip and independently control the temperature, so that the reliability of testing is ensured. The temperature control testing machine provided by the utility model comprises the pressure head device.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a chip testing indenter device and a temperature-controlled testing machine. Background Art

[0002] Existing chip testing indenters are typically monolithic, forming a single flat surface in contact with the chip under test for temperature control. When different areas of the chip under test have different temperature control requirements, or when there are height differences between different areas of the chip under test, existing monolithic indenters struggle to properly adhere to the chip under test and cannot meet the requirements for zoned temperature control.

[0003] In view of this, it is necessary to propose a new technical solution to overcome the shortcomings of the existing technology. Utility Model Content

[0004] Based on this, the present application provides a chip testing pressure head device and a temperature control testing machine, which can fully contact the chip and independently control the temperature to ensure the reliability of the test.

[0005] To this end, the present application adopts the following technical solution: a chip testing pressure head device, which is used to contact and control the temperature of the chip under test, the pressure head device includes a first pressure head and a second pressure head, at least one of the first pressure head and the second pressure head is configured with an elastic part so that the first pressure head and the second pressure head can float relative to each other, the first pressure head includes a first temperature control part, and the second pressure head includes a second temperature control part, the first temperature control part and the second temperature control part can be independently controlled, wherein the first pressure head and the second pressure head respectively contact different areas of the chip under test, and the different areas are independently controlled in temperature through the first temperature control part and the second temperature control part.

[0006] In some embodiments, the pressure head device includes a base, the first pressure head is installed on the base, the elastic member is arranged between the second pressure head and the base, and the second pressure head is floatingly connected to the base through the elastic member.

[0007] In some embodiments, the second pressing head is pressed by the elastic member so that a gap exists between a bottom surface of the second pressing head and a bottom surface of the first pressing head.

[0008] In some embodiments, the first pressing head has a through slot, the second pressing head is installed in the through slot, and the through slot has an abutment surface that prevents the second pressing head from escaping from the through slot along the force applied by the elastic member.

[0009] In some embodiments, the first temperature control component includes a first heating component for heating the first pressure head alone, and the second temperature control component includes a second heating component for heating the second pressure head alone.

[0010] In some embodiments, the pressure head device includes a connecting plate and a thermal pad, the connecting plate is connected to the second pressure head, the second heating element is clamped between the connecting plate and the second pressure head, and the thermal pad is arranged between the connecting plate and the base, wherein the thermal pad is an elastomer, and during the floating process of the second pressure head, the thermal pad maintains contact with both the connecting plate and the base.

[0011] In some embodiments, the elastic member includes a disc spring.

[0012] In some embodiments, a flow channel is provided in the second pressure head, and the flow channel is used to pass a fluid medium to control the temperature of the second pressure head.

[0013] In some embodiments, there are multiple second pressure heads, and each of the multiple second pressure heads floats independently and has its temperature controlled independently.

[0014] The present application also adopts the following technical solution: a temperature control testing machine, which includes a conveying device and a pressure head device as described in any of the above embodiments, wherein the conveying device is used to convey the chip to the testing station, the pressure head device performs temperature control testing on the chip, and is used to sort and output the tested chips.

[0015] The chip testing pressure head device provided in the present application includes a first pressure head and a second pressure head. The first pressure head and the second pressure head can float relative to each other. The first pressure head and the second pressure head respectively contact different areas of the chip under test, and independently control the temperature of different areas through the first temperature control component and the second temperature control component, so that the pressure head device can fully contact the chip under test and independently control the temperature, thereby ensuring the reliability of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a three-dimensional assembly diagram of an embodiment of a chip testing indenter device of the present application.

[0018] Figure 2 This is a three-dimensional combination diagram from another perspective of an embodiment of the chip testing indenter device of the present application.

[0019] Figure 3 This is a three-dimensional exploded view of an embodiment of a chip testing indenter device of the present application.

[0020] Figure 4 For the Figure 1 Sectional view along line AA.

[0021] Figure 5 For the Figure 1 Cross-sectional view at the midline BB.

[0022] Figure 6 for Figure 5 A partial enlarged view of point C in the middle.

[0023] The components are numbered as follows: 100, pressure head device; 1, base; 21, first pressure head; 210, through groove; 211, abutment surface; 22, first heating element; 31, second pressure head; 310, flow channel; 32, second heating element; 33, connecting plate; 34, thermal pad; 35, elastic member. DETAILED DESCRIPTION

[0024] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0025] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0027] In this application, unless otherwise expressly specified or limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or that the first feature and the second feature are indirectly in contact through an intermediate medium. Furthermore, a first feature being “above,” “above,” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below,” “below,” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0028] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0029] See also Figures 1 to 6 As shown, the present application provides a chip testing pressure head device 100 for contacting and controlling the temperature of the chip under test. The pressure head device 100 includes a first pressure head 21 and a second pressure head 31. At least one of the first pressure head 21 and the second pressure head 31 is configured with an elastic member 35 so that the first pressure head 21 and the second pressure head 31 can float relative to each other. The first pressure head 21 includes a first temperature control member, and the second pressure head 31 includes a second temperature control member. The first temperature control member and the second temperature control member can be independently controlled. The first pressure head 21 and the second pressure head 31 respectively contact different areas of the chip under test, and the first temperature control member and the second temperature control member are used to independently control the temperature of the different areas.

[0030] The chip testing pressure head device 100 provided in the present application includes a first pressure head 21 and a second pressure head 31. The first pressure head 21 and the second pressure head 31 can float relative to each other. The first pressure head 21 and the second pressure head 31 respectively contact different areas of the chip under test, and independently control the temperature of different areas through the first temperature control component and the second temperature control component, so that the pressure head device 100 can fully contact the chip under test and independently control the temperature, thereby ensuring the reliability of the test.

[0031] See also Figures 1 to 3 As shown, the pressing head device 100 includes a base 1 , and the first pressing head 21 and the second pressing head 31 are both installed on the base 1 .

[0032] Specifically, the first press head 21 is installed on the bottom side of the base 1, that is, when the press head device 100 is in use, the base 1 is on top and the first press head 21 is facing downward to contact the chip under test. In this embodiment, the first press head 21 has a through groove 210, and the through groove 210 is used for the installation of the second press head 31. Please refer to Figure 5 As shown, the through-groove 210 includes a straight-walled section extending vertically and a slanted-walled section extending in a bell-mouth-shaped manner. The second pressing head 31 has an outer profile that matches the groove wall of the through-groove 210. The second pressing head 31 is installed in the through-groove 210 with a certain amount of vertical movement. When the second pressing head 31 abuts the slanted-walled section, the slanted-walled section restricts its movement, i.e., the slanted-walled section forms an abutment surface 211 that prevents the second pressing head 31 from escaping the through-groove 210.

[0033] See also Figure 3 and Figure 4 As shown, the first temperature control component includes a first heating element 22 for independently heating the first pressing head 21. In this embodiment, the first heating element 22 is a heating plate, which is located between the first pressing head 21 and the base 1. The first pressing head 21 is provided with a corresponding groove for accommodating the first heating element 22, so that the first heating element 22 is embedded in the side of the first pressing head 21 facing the base 1.

[0034] The second ram 31 is mounted on the bottom side of the base 1, that is, when the ram device 100 is in use, the base 1 is on top, and the first ram 21 and the second ram 31 are both facing downward to contact the chip under test. An elastic member 35 is disposed between the second ram 31 and the base 1, and the second ram 31 is floatingly connected to the base 1 via the elastic member 35. The second ram 31 is supported by the elastic member 35, so that there is a gap between the bottom surface of the second ram 31 and the bottom surface of the first ram 21. That is, the bottom surface of the second ram 31 protrudes from the bottom surface of the first ram 21, so that the ram device 100 can adapt to situations where different areas of the chip under test have height differences. At the same time, because the second ram 31 elastically floats and has a variable displacement, it can adapt to different height differences, ensuring that the ram device 100 is in more complete contact with each area of ​​the chip under test. When the second pressing head 31 contacts the abutting surface 211 of the through groove 210 of the first pressing head 21, the abutting surface 211 prevents the second pressing head 31 from separating from the through groove 210 along the force direction of the elastic member 35, thereby limiting the maximum floating position of the second pressing head 31.

[0035] See also Figures 3 to 6As shown, the second temperature control component includes a second heating element 32 for heating the second pressure head 31 separately. In this embodiment, the second heating element 32 is a heating plate, and the second heating element 32 is located between the second pressure head 31 and the base 1. A groove for accommodating the second heating element 32 is correspondingly opened on the second pressure head 31, so that the second heating element 32 is embedded in the side of the second pressure head 31 facing the base 1. In order to avoid the floating of the second pressure head 31 causing a gap between the second heating element 32 and the base 1, which affects the heating performance and the consistency of the heating effect, in this embodiment, the pressure head device 100 also includes a connecting plate 33 and a thermal pad 34. The connecting plate 33 is connected to the second pressure head 31 and can be fixed to the second pressure head 31 by screws. The second heating element 32 is clamped between the connecting plate 33 and the second pressure head 31, and the thermal pad 34 is arranged between the connecting plate 33 and the base 1. Among them, the thermal pad 34 is an elastomer. During the floating process of the second pressure head 31, the thermal pad 34 maintains contact with both the connecting plate 33 and the base 1. In one embodiment, the thermal pad 34 is made of TIM (Thermal Interface Material). The thermal pad 34 made of TIM can significantly reduce contact thermal resistance and improve heat conduction efficiency.

[0036] See also Figure 5 As shown, in this embodiment, a flow channel 310 is provided in the second pressure head 31, and a fluid medium is passed through the flow channel 310 to control the temperature of the second pressure head 31. In some embodiments, the fluid medium can be, for example, a gas, that is, the temperature is controlled by blowing air; in other embodiments, the fluid medium can also be a fluid, such as a liquid refrigerant. The temperature control of the second pressure head 31 can be achieved by heating by the second heating element 32, or by passing a fluid medium into the flow channel 310, or by a combination of these methods.

[0037] See also Figure 6 As shown, the elastic member 35 comprises a disc spring, also known as a disk spring. In this embodiment, the elastic member 35 comprises multiple stacked disc springs, which are sleeved onto the positioning post and clamped between the base 1 and the connecting plate 33 to provide elastic buoyancy for the connecting plate 33 and the second pressing head 31 connected thereto. Disc springs have the advantages of small footprint and excellent performance stability. When selecting a disc spring, care should be taken to select one with appropriate rigidity to avoid a situation where the spring force is greater than the downward pressure, making it difficult to compress the spring.

[0038] In some embodiments, there are multiple second indenters 31, each of which independently floats and has independent temperature control. In this embodiment, there are two second indenters 31, symmetrically arranged on either side of the first indenter 21, forming three relatively independent indenters suitable for fully contacting and independently controlling the temperature of three different areas on the chip under test. In other embodiments, there may be three or more second indenters 31, and their arrangement may be in any manner. This application does not impose any restrictions on the number or arrangement of the second indenters 31.

[0039] The chip testing pressure head device 100 provided in the present application is assembled on a temperature-controlled testing machine for use. When in use, the pressure head device 100 is controlled to be assembled on the temperature-controlled testing machine with the first pressure head 21 and the second pressure head 31 facing downward. When the chip to be tested is located at the test station below the pressure head device 100, the pressure head device 100 moves toward the chip to be tested so that the first pressure head 21 and the second pressure head 31 contact different areas of the chip to be tested; since the second pressure head 31 can float, each pressure head can maintain full contact with the chip to be tested, and since each pressure head has an independent temperature control component, independent temperature control of different areas of the chip to be tested can be achieved.

[0040] The present application also provides a temperature control testing machine, which includes a conveying device and a pressure head device 100 as in any of the above embodiments, wherein the conveying device is used to convey the chip to the test station, and the pressure head device 100 performs temperature control testing on the chip, and is used to sort and output the tested chips. The conveying device specifically includes a loading conveying device and a unloading conveying device, the loading conveying device is used to convey the chip to the test station, and the unloading conveying device is used to sort and output the tested chips. Other components included in the temperature control testing machine provided by the present application can be implemented with reference to the existing technology and will not be described here in detail.

[0041] From the above description of the specific embodiments, it can be seen that the chip testing pressure head device 100 provided in the present application includes a first pressure head 21 and a second pressure head 31. The first pressure head 21 and the second pressure head 31 can float relative to each other. The first pressure head 21 and the second pressure head 31 respectively contact different areas of the chip under test, and independently control the temperature of different areas through the first temperature control component and the second temperature control component, so that the pressure head device 100 can fully contact the chip under test and independently control the temperature, thereby ensuring the reliability of the test.

[0042] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A chip testing indenter device, used for contacting and controlling the temperature of the chip under test, characterized in that: The pressure head device (100) includes a first pressure head (21) and a second pressure head (31), at least one of the first pressure head (21) and the second pressure head (31) is provided with an elastic member (35) so that the first pressure head (21) and the second pressure head (31) can float relative to each other, the first pressure head (21) includes a first temperature control member, the second pressure head (31) includes a second temperature control member, the first temperature control member and the second temperature control member can be independently controlled, wherein the first pressure head (21) and the second pressure head (31) are in contact with different areas of the chip under test respectively, and the temperatures of the different areas are independently controlled by the first temperature control member and the second temperature control member.

2. The chip testing indenter device according to claim 1, wherein: The pressure head device (100) comprises a base (1), the first pressure head (21) is mounted on the base (1), the elastic member (35) is arranged between the second pressure head (31) and the base (1), and the second pressure head (31) is floatingly connected to the base (1) via the elastic member (35).

3. The chip testing indenter device according to claim 2, wherein: The second pressing head (31) is pressed against by the elastic member (35), so that a gap exists between the bottom surface of the second pressing head (31) and the bottom surface of the first pressing head (21).

4. The chip testing indenter device according to claim 2 or 3, characterized in that: The first pressing head (21) has a through groove (210), the second pressing head (31) is installed in the through groove (210), and the through groove (210) has an abutment surface (211) that prevents the second pressing head (31) from escaping from the through groove (210) along the force direction of the elastic member (35).

5. The chip testing indenter device according to claim 2 or 3, characterized in that: The first temperature control component includes a first heating component (22) for independently heating the first pressing head (21), and the second temperature control component includes a second heating component (32) for independently heating the second pressing head (31).

6. The chip testing indenter device according to claim 5, wherein: The pressure head device (100) includes a connecting plate (33) and a thermal pad (34), wherein the connecting plate (33) is connected to the second pressure head (31), the second heating element (32) is sandwiched between the connecting plate (33) and the second pressure head (31), and the thermal pad (34) is arranged between the connecting plate (33) and the base (1), wherein the thermal pad (34) is an elastic body, and when the second pressure head (31) floats, the thermal pad (34) maintains contact with both the connecting plate (33) and the base (1).

7. The chip testing indenter device according to claim 1 or 2, characterized in that: The elastic member (35) comprises a disc spring.

8. The chip testing indenter device according to claim 2 or 3, characterized in that: A flow channel (310) is provided in the second pressure head (31), and the flow channel (310) is used to pass a fluid medium to control the temperature of the second pressure head (31).

9. The chip testing indenter device according to claim 2 or 3, characterized in that: There are multiple second pressure heads (31), and the multiple second pressure heads (31) are independently floated and temperature-controlled.

10. A temperature control testing machine, characterized in that: It comprises a conveying device and a pressing head device (100) as described in any one of claims 1 to 9, wherein the conveying device is used to convey the chip to a testing station, the pressing head device (100) performs temperature control testing on the chip, and is used to sort and output the tested chip.

Images