Array pinhole X-ray imaging device
By combining an array pinhole X-ray imaging device with a laser collimation module, the complexity and high cost problems of traditional X-ray imaging devices are solved, and efficient and low-cost high-energy density plasma imaging is achieved.
Patent Information
- Application Number
- CN202422569558.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-10-23
AI Technical Summary
Traditional X-ray imaging devices are complex and costly, and the replacement and alignment of equipment components during multiple imaging processes are complicated, making it difficult to efficiently obtain image information of high-energy-density plasmas.
An array pinhole X-ray imaging device is used in combination with a laser collimation module to achieve rapid alignment, reduce structural complexity, and utilize an array pinhole plate, positioning components, and framing camera components to simplify the equipment manufacturing and use process.
The imaging collimation accuracy is improved, the equipment manufacturing and use costs are reduced, the experimental process is simplified, and the efficiency and effect of high-energy-density plasma imaging are improved.
Smart Images
Figure CN223377508U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of X-ray imaging, and in particular to an array pinhole X-ray imaging device. Background Art
[0002] In recent decades, with the continuous improvement of the driving capabilities of ion beams, pulsed power sources, and lasers, the temperature, pressure, and density have been continuously pushed to more extreme directions. High-energy-density physics has also become one of the most popular frontier interdisciplinary research fields. When a strong driving source compresses and heats the target, the temperature, density, and pressure of the target continue to rise, and the target changes from a solid state to a dense plasma state with high energy density. In this state, due to the high pressure and high density of the internal atoms or molecules and the existence of the plasma shielding effect, diagnosing the state of matter in the central region of the target is a very challenging task. However, in this complex and dense extreme environment, the plasma emits X-rays, which can penetrate highly ionized matter, including plasma, making them very suitable for probing the internal structure of matter, especially in the dynamic phase of high-energy-density experiments. X-ray imaging, based on the pinhole principle, has advantages such as its simple and easy-to-use imaging principle. Pinhole arrays can also produce multiple images on a single detector. It is a key diagnostic method for experimental studies of high-energy-density plasmas and laboratory astrophysical plasmas. It has been widely applied in related fields and has achieved significant results. For example, in inertial confinement fusion (ICF) research, self-emission X-ray imaging can provide information on plasma shape, volume, and temperature. In heavy-ion beam-driven high-energy-density physics research, X-ray imaging can be used to diagnose the intensity distribution of heavy-ion beams irradiating solid targets online and in situ, and has important application value in heavy-ion beam studies of the equation of state of high-energy-density materials.
[0003] X-ray emission from high-energy-density plasmas is often transient and exhibits significant spatial variation. Traditionally, X-ray imaging data has been acquired using time-integrating detectors such as IP plates (IPs) or time-gated detectors such as X-ray CCD cameras. While X-ray CCD cameras provide information on X-ray dynamics and offer relatively high spectral resolution, they are bulky, expensive, and have a small detection area. Acquiring valuable energy information requires multiple imaging cycles.
[0004] Moreover, in order to obtain different X-ray image information during multiple imaging processes, it is necessary to continuously replace equipment components. After replacing different equipment components, the equipment needs to be realigned using a dedicated collimator. Not only is it difficult to replace equipment components, but the alignment is also relatively complicated. This undoubtedly increases the complexity of the equipment and the experimental process, and increases the cost of equipment manufacturing and use. Utility Model Content
[0005] The present application provides an array pinhole X-ray imaging device, which realizes rapid alignment of the device by setting a laser collimation module, effectively reducing the structural complexity, thereby reducing the manufacturing and use costs of the device.
[0006] The present application discloses an array pinhole X-ray imaging device, comprising:
[0007] The array pinhole plate is provided with a plurality of pinhole groups arranged in parallel, each pinhole group including a plurality of pinholes;
[0008] A positioning assembly, comprising a mounting position, on which the array pinhole plate is disposed, for fine-tuning the positioning of the array pinhole plate;
[0009] A framing camera assembly is provided with a plurality of microstrips for imaging corresponding to the optical paths of the pinhole groups, wherein the microstrips correspond to the pinhole groups on a one-to-one basis; and
[0010] a vacuum assembly, disposed between the positioning assembly and the framing camera assembly, for providing a vacuum environment inside the device, wherein the vacuum assembly is provided with a first flange on a side connected to the framing camera assembly;
[0011] The device further includes a laser alignment module, which includes a first alignment plate adapted to the positioning assembly, a second alignment plate adapted to the first flange, and a laser; the laser cooperates with the first alignment plate and the second alignment plate to align the array pinhole plate and the framing camera assembly.
[0012] In one embodiment, the positioning assembly includes a first reset plate and a second reset plate;
[0013] The middle parts of the first reset plate and the second reset plate are respectively provided with mounting holes, and the array pinhole plate or the first collimating plate can be mounted and fixed on the mounting holes of the first reset plate and the second reset plate.
[0014] In one embodiment, the first reset plate and the second reset plate are reset by magnetic attraction.
[0015] In one embodiment, the same pinhole group shares the same attenuation plate, and the attenuation plates corresponding to the pinhole groups have different thicknesses.
[0016] In one embodiment, the same pinhole group is provided with at least two attenuation plates with different thicknesses.
[0017] In one embodiment, the device further includes a positioning assembly, the positioning assembly including a mounting position, the array pinhole plate is disposed on the mounting position, and is used to fine-tune the positioning of the array pinhole plate; the vacuum assembly is provided with a first flange on a side connected to the framing camera assembly;
[0018] The device further includes a laser alignment module, which includes a first alignment plate, a second alignment plate, and a laser;
[0019] The first collimation plate is adapted to the mounting position;
[0020] The second collimating plate is adapted to fit the first flange.
[0021] In one embodiment, the positioning assembly further includes a fine-tuning mechanism, and the fine-tuning mechanism includes an adjuster for adjusting the pitch.
[0022] In one embodiment, the device further comprises a regulating conduit;
[0023] One end of the regulating pipe is connected to one end of the vacuum component through a flange, and the other end of the regulating pipe is connected to the fine-tuning mechanism.
[0024] In one embodiment, a connection hole is provided at one end of the regulating pipe, and the regulating pipe is connected to another regulating pipe or the fine-tuning mechanism through the connection hole.
[0025] In one embodiment, the vacuum assembly includes a three-way chamber;
[0026] The first end of the three-way chamber is connected to the framing camera assembly through a first flange, and the second end opposite to the positioning assembly is connected to the positioning assembly through a second flange; the third end of the three-way chamber is used to connect to a vacuum pump.
[0027] From the above, it can be seen that the array pinhole X-ray imaging device in the present application utilizes the cooperation of the array pinhole plate, the positioning assembly and the framing camera assembly, combined with the laser alignment module that can be used in conjunction with the array pinhole plate and the framing camera assembly, so that the device does not need to add additional connection structures to the device, does not need to replace too many parts, improves experimental efficiency and reduces the cost of use, and after the device is aligned by the laser alignment module, compared with the error problem caused by the difficulty in position matching when installing additional alignment equipment, its alignment accuracy is higher, and it can better ensure the imaging effect of the plasma in the target area. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 Schematic diagram of the exploded structure of the array pinhole imaging device provided in an embodiment of the present application.
[0029] Figure 2This is a schematic structural diagram of the first usage state of the array pinhole imaging device provided in an embodiment of the present application.
[0030] Figure 3 A schematic structural diagram of the array pinhole plate and positioning assembly provided in an embodiment of the present application.
[0031] Figure 4 This is a schematic structural diagram of the second usage state of the array pinhole imaging device provided in an embodiment of the present application.
[0032] Figure 5 Schematic diagram of the collimation principle of the array pinhole imaging device provided in an embodiment of the present application.
[0033] Figure 6 Schematic diagram of the installation method of the attenuation plate of the array pinhole plate provided in the embodiment of the present application.
[0034] Among them, 1. Array pinhole plate; 121. First attenuation plate; 122. Second attenuation plate; 2. Positioning assembly; 21. Fine-tuning mechanism; 22. First reset plate; 23. Second reset plate; 221. Mounting position; 222. Magnet; 223. Countersunk screw hole; 3. Framing camera assembly; 4. Vacuum assembly; 51. First flange; 52. Second flange; 53. Third flange; 61. First collimator plate; 62. Second collimator plate; 63. Collimation laser; 7. Adjustment pipeline. DETAILED DESCRIPTION
[0035] The technical solution of the present application is further described below with reference to the accompanying drawings and embodiments.
[0036] Example 1
[0037] See also Figure 1-2 , the figure shows the explosion structure and the first usage state of an array pinhole imaging device provided in an embodiment of the present application.
[0038] like Figure 1-2 As shown, the array pinhole imaging device includes an array pinhole plate 1, a positioning component 2, a framing camera component 3 and a vacuum component 4.
[0039] The array pinhole plate 1 is provided with a plurality of parallel pinhole groups, each pinhole group including a plurality of pinholes. Each pinhole on the array pinhole plate 1 can cooperate with the framing camera assembly 3 to complete X-ray imaging.
[0040] In one embodiment, the pinholes of the array pinhole plate 1 can be configured to have a diameter of 0.05 mm to 0.10 mm, for example, 0.05 mm, 0.06 mm, 0.07 mm, or 0.1 mm. The specific pinhole diameter can be determined based on the X-ray imaging hardware requirements. The number of pinholes in the array can correspond to the image sensor of a framing camera. For example, if a framing camera has four microstrips corresponding to the image sensor, the array can be configured to have at least four rows of pinholes, forming a 4*N pinhole array.
[0041] In one embodiment, the pinholes can be arranged in a 4*3 array. In addition, the size of the array pinhole plate 1 can be designed according to demand, for example, the size of the array pinhole plate 1 is set to 32*32mm, so as to facilitate the adaptation and use of other parts of the device.
[0042] The positioning component 2 includes a mounting position 221, and the array pinhole plate 1 is provided on the mounting position 221 for fine-tuning the positioning of the array pinhole plate 1. In one embodiment, the mounting position 221 may include a through hole with a size corresponding to the size of the array pinhole plate 1, so that the array pinhole plate 1 can be embedded in the mounting position 221, and the positioning of the array pinhole plate 1 can be achieved by limiting the mounting position 221. In another embodiment, the mounting position 221 may also include a mounting structure for mounting with the array pinhole plate 1, and the positioning component 2 can position the array pinhole plate 1 through the mounting structure. Of course, the specific implementation method of the positioning component 2 can be determined according to actual conditions.
[0043] Please refer to Figure 3 , the figure shows the structure of the array pinhole plate 1 and the positioning component 2.
[0044] The array pinhole plate 1 includes a plurality of pinholes, and the positioning assembly 2 includes a first reset plate 22 and a second reset plate 23. Mounting holes are provided in the middle of each of the first and second reset plates 22, 23. The shape and size of the mounting holes correspond to those of the array pinhole plate 1, facilitating placement and securing of the array pinhole plate 1 within the mounting holes. The positioning between the first and second reset plates 22, 23 allows for relatively precise positioning of the array pinhole plate 1, thereby ensuring imaging quality.
[0045] Furthermore, the first reset plate 22 and the second reset plate 23 are magnetically reset. Specifically, a plurality of magnets 222 can be provided between the first reset plate 22 and the second reset plate 23. The magnets 222 are evenly distributed on the first reset plate 22 and / or the second reset plate 23. The first reset plate 22 and the second reset plate 23 can be positioned by the magnetic attraction of the magnets 222. More preferably, the magnets 222 can be provided on the first reset plate 22, and a plurality of grooves that match the specifications of the magnets 222 can be provided on the second reset plate 23. When the first reset plate 22 and the second reset plate 23 are reset, the magnets 222 are embedded in the grooves, which can further improve the reset accuracy. In addition, the magnetic design can facilitate disassembly and assembly, thereby improving disassembly and assembly efficiency.
[0046] In some embodiments, please combine Figure 1 The positioning assembly 2 may further be provided with countersunk screw holes 223 at the four corners of the first reset plate 22 and the second reset plate 23 , and further positioning is performed between the first reset plate 22 and the second reset plate 23 through the countersunk screw holes 223 .
[0047] More specifically, if the first reset plate 22 is plate A and the second reset plate 23 is plate B, the two plates are magnetically adsorbed together and can be disassembled at any time. The length and width of the two plates are 60mm*60mm respectively. There are four M4 countersunk screw holes 223 at the four corners of plate A with a depth of 6mm. There are four 4.5mm countersunk screw holes 223 at the four corners of plate B. The total thickness of the two plates is 16mm. Among them, a 32*32mm rectangular hole with a thickness of 7mm can be opened in the middle of plate A, and a 32*32mm rectangular hole with a thickness of 7mm can be opened in the middle of plate B. The function of the rectangular holes is to place the array pinhole plate 1 and the collimation plate. In addition, a 30*30mm boss is built at both ends of the two plates to prevent the array pinhole plate 1 from loosening and falling. The above specifications are only one of the implementation methods. The specific values and settings can be determined according to actual conditions.
[0048] In order to further improve the collimation accuracy and imaging effect, the positioning component 2 can also include a fine-tuning mechanism 21, which includes an adjuster for adjusting the pitch. The adjuster is arranged between the first reset plate 22, the second reset plate 23 and the vacuum component 4, and is used to fine-tune the position of the first reset plate 22 and the second reset plate 23 relative to the vacuum component 4, thereby ensuring the collimation of the optical path. The fine-tuning mechanism 21 can adopt an AMC-2B coaxial system reflector frame, which has three adjusters, an aperture of 50.8mm, a surface treated with black anodizing, and three built-in mounting threaded holes for fixing. The adjustable pitch is ±3, the material is 6061-T6 aluminum alloy, the specification of the adjuster is M6*0.25, the adjustment accuracy is 0.2 degrees / turn, and the adjustable linear movement range is ±3mm. The positioning component 2 can fine-tune the reset plate and play a role in collimation fine-tuning during the collimation process, thereby improving the accuracy of the equipment collimation.
[0049] The framing camera assembly 3 is equipped with several microstrips for imaging that correspond to the optical paths of the pinhole groups. There is a one-to-one correspondence between these microstrips and the pinhole groups. One side of the framing camera assembly 3 can be assembled and mounted with the framing camera, allowing the assembly to be securely connected to the framing camera. The microstrips in the framing camera assembly 3 correspond to the image sensors in the framing camera, ensuring that the pinholes on the pinhole array plate 1 and the image sensor of the framing camera are located in the same optical path, thereby ensuring the imaging quality of the framing camera.
[0050] Specifically, the framing camera may have a structure for mounting and fixing to the framing camera. The structure may include a seal for sealing connection, and fasteners for mounting to the framing camera, such as screws / screw holes or snaps. The specific structure may depend on the structure of the framing camera, as long as the device can be fixed to the framing camera.
[0051] The framing camera is the core component of the entire system. It effectively receives signals transmitted from the pinhole plate. Temporal resolution is achieved by adjusting the microstrip timing of the framing camera. The framing camera consists of four frames, corresponding to four rows of pinholes. The imaging area of a single frame is 66mm*12mm, the single-frame gating time is 5ns, and the relative delay between two frames is 3ps-10ns, although no delay is required. Framing imaging control enables both temporal and non-temporal resolution of the plasma in the target area. The size of the framing camera's single-frame imaging area can be customized based on the hardware specifications of the framing camera.
[0052] The vacuum assembly 4, located between the positioning assembly 2 and the framing camera assembly 3, is used to provide a vacuum environment within the device. This assembly ensures that the space between the pinhole and the framing camera remains in a vacuum state, minimizing the impact of air inside the device on imaging and ensuring that the framing camera maintains a vacuum condition for normal operation.
[0053] For details, please combine Figure 1 The vacuum assembly 4 includes a three-way chamber and flanges on both sides of the three-way chamber for connecting the positioning assembly 2 and the framing camera assembly 3. The bottom of the three-way chamber is used to connect a molecular pump, which can maintain the vacuum environment between the positioning assembly 2 and the framing camera assembly 3 at 10 -6 mbar or lower, thereby ensuring that the vacuum environment inside the device meets the working and imaging requirements of the framing camera.
[0054] In some embodiments, the three-way chamber consists of a 75mm adjustment pipe 7, a second flange 52 (CF100-69mm), a 69-80-122mm three-way chamber, a first flange 51, and a third flange 53 (CF100-80mm). The 75mm adjustment pipe 7 has four M2 screw holes at its front end, which are screwed to the collimation fine-tuning plate. To ensure that the framing camera is completely parallel to the array pinhole plate 1, the second flange 52 is a slip-on flange. The first flange 51 is a special flange for coupling to the framing camera. The third flange 53 is used to connect to a molecular pump to ensure the chamber's vacuum level. The entire chamber can be made of duralumin. It is understood that the structural parameters of the three-way chamber described above are only one implementation method and can be arbitrarily configured based on experimental requirements and the device's hardware specifications. This is not limited by this application. Furthermore, the adjustment pipe 7 is equipped with a connection hole, through which it connects to another adjustment pipe 7 or the fine-tuning mechanism 21. This allows for adjustment and replacement based on optical path requirements, making optical path adjustment more convenient and accurate.
[0055] The array pinhole plate 1 is further provided with a plurality of attenuation sheets, which cover one side of the pinholes. The attenuation sheets include at least two different thicknesses, with the attenuation sheets of different thicknesses positioned over different pinholes. The attenuation sheets are used to filter X-rays of different energy ranges and direct the X-rays of the desired energy range to the framing camera, allowing the framing camera to image the X-rays of the corresponding energy range.
[0056] In some embodiments, the attenuation sheet can be attached to the array pinhole plate 1 by various means, such as adhesive bonding, magnetic attraction, snap-fitting, or screw fastening. The attenuation sheet can be selected from a variety of thicknesses and materials, depending on the energy range of the X-rays to be filtered. For example, materials such as Al, Be, Au, Cu, Ag, or Fe can be used, and the thickness can be selected to be between 1 and 150 microns to filter X-rays within the corresponding energy range, thereby enabling the framing camera to obtain images of different energy ranges within the plasma.
[0057] Example 2
[0058] Please refer to Figure 4-5 , the figure shows the second use state and alignment principle of the array pinhole imaging device provided by the embodiment of the present application. In order to improve the imaging effect, the device can also use a corresponding laser alignment module. The laser alignment module includes a first alignment plate 61, a second alignment plate 62 and a laser. The first alignment plate 61 is adapted to the mounting position 221; the second alignment plate 62 is adapted to the first flange 51. Among them, the center of the first alignment plate 61 and the second alignment plate 62 has a through hole for the laser to pass through. When alignment is required, the first alignment plate 61 is installed on the mounting position 221 of the positioning assembly 2, and the second alignment plate 62 is installed on the first flange 51. The first alignment plate 61 and the second alignment plate 62 are irradiated by the laser, and the first alignment plate 61 and the second alignment plate 62 can be used to achieve a rapid alignment effect of the positioning assembly 2 and the framing camera assembly 3. The first collimation plate 61 of the above-mentioned laser collimation module corresponds to the installation method of the array pinhole plate 1, and the second collimation plate 62 corresponds to the installation method of the framing camera assembly 3. In this way, the device does not need to add additional connection structures to the device, and does not need to replace too many parts, thereby improving experimental efficiency and reducing usage costs. Moreover, after the device is collimated by the laser collimation module, its collimation accuracy is higher than the error problem caused by the difficulty in position matching when installing additional collimation equipment, and it can better ensure the imaging effect of the plasma in the target area.
[0059] When working, the device can provide at least two different working modes, including time-resolved mode and non-time-resolved mode. Among them, for the time-resolved mode, the first step is to align the array pinhole plate 1, positioning component 2 and framing camera component 3 in the device through the collimated laser to ensure that the collimated laser can pass through the pinhole to reach the target; the second step is to remove the collimation system and replace it with the framing camera and array pinhole plate 1 in its original position. Note that in this mode, no filter film is added to the array pinhole. The system avoids interference from visible light by adding a filter film in front of the detector. The successful debugging of these two steps can be considered as the completion of system debugging. Then the vacuum system starts to work. The vacuum condition of the entire chamber is required to be 10 -6mbar or less. The third step is to adjust the laser or ion beam to interact with the target to produce X-rays. The fourth step is that the X-rays form an image after passing through the array pinholes. The size of the image is determined by the object-image distance ratio. The image is then detected by a framing camera at the back end. The framing camera provides four frames, each corresponding to three pinholes. The gating time is 5ns, and a certain time delay can be adjusted between adjacent frames. The adjustable range is 200ps-10ns. By adjusting the time between adjacent frames, the temporal evolution of the plasma can be obtained, thereby obtaining information such as the shape and volume of the plasma in the target area.
[0060] The basic steps for implementing the non-time-resolved mode are similar to those for the time-resolved mode, except that in the second step, attenuation sheets of varying thickness are placed in front of the array pinhole plate 1 to filter X-rays of varying energies. In the fourth step, the static function of the framing camera is used, and no time delay is set for any of the four frames. This is because high-power laser / ion beam targeting can generate broad-band X-rays that carry spatial information, allowing spatial locations to be imaged through the pinholes. Without adding filters, the image formed by each pinhole is consistent. However, gradually adding filters of different thicknesses means that X-rays of different energies can be filtered (for example, the transmittance of 1.5keV X-rays through 5, 10, 20, and 50 micron thick beryllium is 85%, 72%, 51%, and 19%, respectively; while 1keV X-rays are basically unable to pass through 50 micron beryllium). Then, it can present differentiated images. This image actually represents the X-rays emitted from different locations. By using image processing methods to process the differentiated images, it can provide important data support for the reconstruction of the three-dimensional spatial information of the target area. Of course, the choice of attenuation filter material and thickness is diverse. If you want to filter high-energy X-rays, you need to choose a high-Z (such as Au, Ag, Cu, etc.) and thick attenuation filter. If you want to filter low-energy X-rays, you need to choose a low-Z (such as Be, Al, etc.) and thin attenuation filter. Typically, the thickness of the selected attenuation sheet is generally on the order of microns, and attenuation sheets of different thicknesses can be selected according to different requirements.
[0061] Example 3
[0062] For further information, please refer to Figure 6, the figure shows the installation method of the attenuation plate of the array pinhole plate 1 provided in an embodiment of the present application. In one embodiment, the same pinhole group 11 is provided with at least two attenuation plates of different thicknesses. Each pinhole group 11 can transmit X-rays of different energies, so that the imaging in the same pinhole group 11 can simultaneously reflect the plasma distribution of different states in the target area, thereby enabling a single imaging to obtain an image with a sufficiently rich range. In another embodiment, the same pinhole group 11 shares the same attenuation plate, and the thickness of the attenuation plate corresponding to each pinhole group is different. If it is necessary to obtain X-ray imaging of different energy ranges, the attenuation plates at different pinhole positions can be replaced, thereby achieving the purpose of improving the experimental efficiency.
[0063] In addition, the attenuation sheet can be set as a whole and set to different thicknesses at the corresponding pinhole positions to achieve imaging of X-rays of different energies. If different experiments are required, they can be achieved by replacing the attenuation sheet, making the experiment easier to perform, improving experimental efficiency and ensuring experimental results. It is understandable that the arrangement of the attenuation sheet can be determined according to actual experimental needs.
[0064] In one embodiment, a certain delay can be set for the imaging between the pinholes in the pinhole group. The delay can be used to achieve X-ray imaging of different energies at different times, so that an image with a time-resolved effect can be obtained in a single imaging.
[0065] The array pinhole imaging device in the present application utilizes the cooperation of the array pinhole plate 1, the positioning component 2 and the framing camera component 3 to facilitate the alignment of the array pinhole plate 1, thereby solving the problem of low imaging efficiency. In addition, a number of attenuation plates of different thicknesses are arranged on the array pinhole plate 1 and are arranged on different pinholes, so that at least two image information of X-rays of different energies can be obtained in a single imaging, thereby providing important data support for the reconstruction of the three-dimensional spatial information of the target area.
[0066] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0067] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0068] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation methods of the present application. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the claims of the present application.
Claims
1. An array pinhole X-ray imaging device, characterized in that: The device comprises: The array pinhole plate is provided with a plurality of pinhole groups arranged in parallel, each pinhole group including a plurality of pinholes; A positioning assembly, comprising a mounting position, on which the array pinhole plate is disposed, for fine-tuning the positioning of the array pinhole plate; A framing camera assembly is provided with a plurality of microstrips for imaging corresponding to the optical paths of the pinhole groups, wherein the microstrips correspond to the pinhole groups on a one-to-one basis; and a vacuum assembly, disposed between the positioning assembly and the framing camera assembly, for providing a vacuum environment inside the device, wherein the vacuum assembly is provided with a first flange on a side connected to the framing camera assembly; The device further includes a laser alignment module, which includes a first alignment plate adapted to the positioning assembly, a second alignment plate adapted to the first flange, and a laser; the laser cooperates with the first alignment plate and the second alignment plate to align the array pinhole plate and the framing camera assembly.
2. The array pinhole X-ray imaging device according to claim 1, wherein: The positioning assembly includes a first reset plate and a second reset plate; The middle parts of the first reset plate and the second reset plate are respectively provided with mounting holes, and the array pinhole plate or the first collimating plate can be mounted and fixed on the mounting holes of the first reset plate and the second reset plate.
3. The array pinhole X-ray imaging device according to claim 2, wherein: There is magnetic reset between the first reset plate and the second reset plate.
4. The array pinhole X-ray imaging device according to claim 1, wherein: The same pinhole group shares the same attenuation sheet, and the attenuation sheets corresponding to the pinhole groups have different thicknesses.
5. The array pinhole X-ray imaging device according to claim 4, characterized in that: The same pinhole group is provided with at least two attenuation plates with different thicknesses.
6. The array pinhole X-ray imaging device according to claim 1, wherein: The device further includes a positioning assembly, the positioning assembly including a mounting position, the array pinhole plate is disposed on the mounting position, and is used to fine-tune the positioning of the array pinhole plate; the vacuum assembly is provided with a first flange on a side connected to the framing camera assembly; The device further includes a laser alignment module, which includes a first alignment plate, a second alignment plate, and a laser; The first collimation plate is adapted to the mounting position; The second collimating plate is adapted to fit the first flange.
7. The array pinhole X-ray imaging device according to claim 1, wherein: The positioning assembly further includes a fine-tuning mechanism, which includes an adjuster for adjusting the pitch.
8. The array pinhole X-ray imaging device according to claim 7, wherein: The device also includes a regulating conduit; One end of the regulating pipe is connected to one end of the vacuum component through a flange, and the other end of the regulating pipe is connected to the fine-tuning mechanism.
9. The array pinhole X-ray imaging device according to claim 8, characterized in that: One end of the regulating pipe is provided with a connecting hole, and the regulating pipe is connected to another regulating pipe or the fine-tuning mechanism through the connecting hole.
10. The array pinhole X-ray imaging device according to claim 1, wherein: The vacuum assembly includes a three-way chamber; The first end of the three-way chamber is connected to the framing camera assembly through a first flange, and the second end opposite to the positioning assembly is connected to the positioning assembly through a second flange; the third end of the three-way chamber is used to connect to a vacuum pump.