High-heat-dissipation server

Abstract

The utility model discloses a high-heat-dissipation server which comprises a case, a high-power-consumption board, a heat dissipation fan, first heat dissipation fins and an air duct structure. The case is provided with an air inlet and an air outlet which are oppositely arranged; the heat dissipation fan is installed close to the air outlet, the high power consumption board is arranged in the case, and the first heat dissipation fins are attached to the high power consumption board; the first radiating fins are provided with interval grooves for dividing the first radiating fins into at least two groups of radiating fins; the air duct structure is embedded into the interval groove and comprises a heat conduction channel and a heat absorption channel which are communicated with each other; the heat absorption channel is used for absorbing heat of the first heat dissipation fins far away from one side of the heat dissipation fan, and the heat conduction channel is arranged close to the heat dissipation fan and used for discharging the heat. According to the technical scheme, the balance of efficient heat dissipation and low noise is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, in particular to a high heat dissipation server. Background Art

[0002] In high-performance computing environments, server cooling has always been a critical issue. As server computing power continues to increase, server power consumption and heat generation are also increasing, placing higher demands on cooling systems. High-efficiency cooling technologies, such as fans and heat sinks, are widely used in servers to ensure stable system operation. However, while traditional high-efficiency fans provide powerful cooling capabilities, they often generate considerable noise.

[0003] Therefore, how to ensure the heat dissipation efficiency in high-heat dissipation servers while reducing noise has become an urgent problem to be solved in the current technical field. Utility Model Content

[0004] The purpose of the utility model is to provide a high heat dissipation server, aiming to achieve a balance between efficient heat dissipation and low noise.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A high-heat dissipation server comprises a chassis, a high-power consumption board, a cooling fan, a first cooling fin, and an air duct structure; the chassis has an air inlet and an air outlet arranged opposite to each other; the cooling fan is installed near the air outlet, the high-power consumption board is arranged inside the chassis, and the first cooling fin is attached to the high-power consumption board;

[0007] The first heat sink fins have a spacing groove that divides them into at least two groups of heat sinks; the air duct structure is embedded in the spacing groove, and the air duct structure includes a heat conduction channel and a heat absorption channel that are interconnected; the heat absorption channel is used to absorb heat from the first heat sink fins on the side away from the heat dissipation fan, and the heat conduction channel is arranged close to the heat dissipation fan to discharge the heat.

[0008] In one embodiment, the spacing groove is a T-shaped groove, and the connection between the heat-conducting channel and the heat-absorbing channel is located in the middle of the heat-absorbing channel.

[0009] In one embodiment, the heat absorption channel has a first opening on a side close to the air inlet and a second opening on a side close to the air outlet, and the area of ​​the first opening is larger than that of the second opening.

[0010] In one embodiment, the second opening is disposed away from the high power consumption board.

[0011] In one embodiment, the chassis further includes a low-power consumption board and a second heat dissipation fin, both of which are arranged inside the chassis; the high-power consumption board, the first heat dissipation fin, the low-power consumption board and the second heat dissipation fin are stacked in sequence;

[0012] The second heat sink fins are used to dissipate heat for the low-power consumption board. The heat dissipation gaps of the second heat sink fins are respectively connected to the air inlet and the air outlet. The heat dissipation fan is only used to dissipate heat for the first heat sink fins.

[0013] In one embodiment, it further includes a first mesh plate and a second mesh plate both provided at the air outlet, wherein the first mesh plate is used to protect the cooling fan, and the second mesh plate is used to protect the second cooling fins.

[0014] In one embodiment, a heat insulation plate is further included inside the chassis, and the heat insulation plate is provided above the second heat dissipation fins to achieve heat conduction and heat insulation of the second heat dissipation fins.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The technical solution of the present invention achieves efficient heat dissipation while reducing noise by providing a first heat dissipation fin and an air duct structure. Specifically, the technical solution utilizes the first heat dissipation fin to achieve preliminary heat dissipation of the high-power board. Furthermore, by using a heat dissipation fan, the heat dissipation efficiency of the first heat dissipation fin is accelerated to achieve efficient heat dissipation. However, when the heat dissipation fan is used alone for efficient heat dissipation, the required speed of the heat dissipation fan is relatively high, resulting in excessive noise during the heat dissipation process. In the technical solution of the present invention, when the heat dissipation fan dissipates heat for the first heat dissipation fin, the heat dissipation fin of the first heat dissipation fin away from the heat dissipation fan is closer to the air inlet, so the heat dissipation effect of this part is better. However, the temperature of the natural wind received by the heat dissipation fin of the first heat dissipation fin close to the heat dissipation fan is higher, resulting in poor heat dissipation effect of the heat dissipation fin close to the heat dissipation fan. In the technical solution of the present invention, the heat dissipation fins on the first heat dissipation fin are divided into at least two groups of heat dissipation fins by configuring spacing grooves on the first heat dissipation fins. The air duct structure is embedded in the spacing groove and includes interconnected heat-conducting channels and heat-absorbing channels. The heat-absorbing channel is used to absorb heat from the first heat sink fin on the side away from the cooling fan, while the heat-conducting channel is located near the cooling fan and is used to discharge heat. This achieves efficient heat dissipation from the heat sink on the side away from the cooling fan. Furthermore, the remaining heat sinks near the cooling fan also achieve efficient heat dissipation due to the stronger wind force they receive and the lower temperature of the natural wind they receive. Furthermore, the air duct structure divides the first heat sink fin into at least two sections for heat dissipation, adopting segmented heat dissipation. This allows the cooling fan to achieve efficient heat dissipation at low speed and low noise, thereby achieving a balance between efficient heat dissipation and low noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in this specification so as to facilitate understanding and reading by those familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the efficacy and objectives that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed in the present invention.

[0019] Figure 1 This is a structural diagram of an embodiment of a high heat dissipation server of the present utility model;

[0020] Figure 2 for Figure 1 An exploded view of an embodiment of the present invention;

[0021] Figure 3 for Figure 1 An exploded view of another embodiment of the present invention;

[0022] Figure 4 This is a schematic structural diagram of an embodiment of a partial structure of the utility model;

[0023] Illustration: 100, high heat dissipation server;

[0024] 110. Chassis; 111. Air inlet; 112. Air outlet;

[0025] 120. High power consumption board; 130. Cooling fan;

[0026] 140. First heat dissipation fin; 141. Spacer groove;

[0027] 150, air duct structure; 151, heat conduction channel; 152, heat absorption channel; 1521, first opening; 1522, second opening;

[0028] 160, low power consumption board; 170, second heat sink fin; 181, first mesh board; 182, second mesh board;

[0029] 190. Heat insulation board. DETAILED DESCRIPTION

[0030] In order to make the technical purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0032] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0033] An embodiment of the present utility model provides a high heat dissipation server 100.

[0034] See also Figures 1 to 4 In a specific embodiment of the present invention, the high heat dissipation server 100 includes a chassis 110, a high power consumption board 120, a cooling fan 130, a first heat dissipation fin 140, and an air duct structure 150; the chassis 110 has an air inlet 111 and an air outlet 112 arranged opposite to each other; the cooling fan 130 is installed near the air outlet 112, the high power consumption board 120 is arranged inside the chassis 110, and the first heat dissipation fin 140 is in contact with the high power consumption board 120;

[0035] The first heat sink fins 140 have a spacing groove 141 that divides them into at least two groups of heat sinks; the air duct structure 150 is embedded in the spacing groove 141, and the air duct structure 150 includes a heat conduction channel 151 and a heat absorption channel 152 that are interconnected; the heat absorption channel 152 is used to absorb heat from the first heat sink fins 140 on the side away from the heat dissipation fan 130, and the heat conduction channel 151 is arranged close to the heat dissipation fan 130 to discharge the heat.

[0036] It is understandable that the technical solution of the present invention achieves efficient heat dissipation while reducing noise by providing the first heat dissipation fins 140 and the air duct structure 150. Specifically, the technical solution uses the first heat dissipation fins 140 to achieve preliminary heat dissipation of the high-power board. Furthermore, by using the heat dissipation fan 130, the heat dissipation efficiency of the first heat dissipation fins 140 is accelerated to achieve efficient heat dissipation. However, when the heat dissipation fan 130 is used alone for efficient heat dissipation, the required speed of the heat dissipation fan 130 is relatively high, resulting in excessive noise during the heat dissipation process. In this embodiment, when the heat dissipation fan 130 dissipates heat for the first heat dissipation fins 140, the heat dissipation fins of the first heat dissipation fins 140 that are away from the heat dissipation fan 130 are closer to the air inlet 111, so the heat dissipation effect of this part is better. However, the temperature of the natural wind received by the heat dissipation fins of the first heat dissipation fins 140 that are close to the heat dissipation fan 130 is higher, resulting in poor heat dissipation effect of the heat dissipation fins close to the heat dissipation fan 130. In the technical solution of the present invention, a spacing groove 141 is configured on the first heat sink 140 to divide the heat sinks on the first heat sink 140 into at least two groups of heat sinks. An air duct structure 150 is embedded in the spacing groove 141. The air duct structure 150 includes a heat conduction channel 151 and a heat absorption channel 152 that are interconnected. The heat absorption channel 152 is used to absorb heat from the first heat sink 140 on the side away from the heat dissipation fan 130, while the heat conduction channel 151 is located near the heat dissipation fan 130 and is used to discharge heat. This achieves efficient heat dissipation from the heat sink on the side away from the heat dissipation fan 130. Furthermore, the remaining heat sinks near the heat dissipation fan 130 can also achieve efficient heat dissipation because they receive stronger wind force and lower temperature natural wind. Furthermore, because the air duct structure 150 divides the first heat sink 140 into at least two sections for heat dissipation, segmented heat dissipation is adopted, enabling efficient heat dissipation from the heat dissipation fan 130 at low speed and low noise, thereby achieving a balance between efficient heat dissipation and low noise.

[0037] It should also be noted that the air duct structure 150 can be either a physical structure or a spatial structure; when the air duct structure 150 is a spatial structure, the space where the spacing grooves 141 are located forms the air duct structure 150 .

[0038] When the air duct structure 150 is a solid structure, Figure 4 As shown, the air duct structure 150 itself forms a heat conducting channel 151 and a heat absorbing channel 152 .

[0039] See also Figure 2 and Figure 4 In a preferred embodiment of the present invention, the spacing groove 141 is a T-shaped groove, and the connection between the heat-conducting channel 151 and the heat-absorbing channel 152 is located in the middle of the heat-absorbing channel 152.

[0040] It is understandable that when the heat conducting channel 151 is used as an exhaust duct, if the connection between the heat conducting channel 151 and the heat absorbing channel 152 is located in the middle of the heat absorbing channel 152 , it is beneficial to uniform heat dissipation on both sides of the heat absorbing channel 152 .

[0041] More specifically, if Figure 4 As shown, the heat absorption channel 152 has a first opening 1521 on the side near the air inlet 111 and a second opening 1522 on the side near the air outlet 112. The first opening 1521 has a larger area than the second opening 1522. It is understood that the first opening 1521 is primarily used to extract heat-carrying natural wind, while the second opening 1522 is primarily used to allow natural wind to pass through. The larger area of ​​the first opening 1521 than the second opening 1522 allows most of the heat-carrying natural wind to be quickly discharged through the heat conduction channel 151.

[0042] Furthermore, the second opening 1522 is disposed away from the high power consumption board 120 . It is understood that the temperature of the natural wind away from the high power consumption board 120 is lower, which is more conducive to accelerating the heat dissipation of the heat sink near the heat dissipation fan 130 .

[0043] Please refer again Figure 1 、 Figure 2 and Figure 3 The technical solution of the present utility model further includes a low-power consumption board 160 and a second heat dissipation fin 170 both of which are arranged inside the chassis 110; the high-power consumption board 120, the first heat dissipation fin 140, the low-power consumption board 160 and the second heat dissipation fin 170 are stacked in sequence;

[0044] The second heat dissipation fins 170 are used to dissipate heat from the low-power consumption board 160 . The heat dissipation gaps of the second heat dissipation fins 170 are connected to the air inlet 111 and the air outlet 112 , respectively. The heat dissipation fan 130 is only used to dissipate heat from the first heat dissipation fins 140 .

[0045] It can be understood that the technical solution of the present invention adopts a heat dissipation method that combines air cooling and natural heat dissipation in parallel, further achieving a balance between efficient heat dissipation and low noise.

[0046] like Figure 3 As shown, the high heat dissipation server 100 further includes a first mesh plate 181 and a second mesh plate 182 . The first mesh plate 181 is used to protect the cooling fan 130 , and the second mesh plate 182 is used to protect the second cooling fins 170 .

[0047] It is understandable that both the first mesh plate 181 and the second mesh plate 182 are capable of ventilation, and the separate arrangement of the first mesh plate 181 and the second mesh plate 182 is conducive to reducing noise and improving the heat dissipation efficiency of the second heat dissipation fins 170 .

[0048] Further, if Figure 2 As shown, the high heat dissipation server 100 further includes a heat insulation board 190 disposed inside the chassis 110 . The heat insulation board 190 is disposed above the second heat dissipation fins 170 to achieve heat conduction and heat insulation of the second heat dissipation fins 170 .

[0049] It can be understood that the contact between the heat insulation plate 190 and the second heat dissipation fins 170 can realize heat conduction, thereby accelerating the heat dissipation of the second heat dissipation fins 170; and the heat insulation plate 190 is arranged above the second heat dissipation fins 170, which reduces the temperature of the outer surface of the chassis 110, avoids overheating of the outer surface of the chassis 110, and improves the user experience.

[0050] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high heat dissipation server, characterized in that: The invention comprises a chassis, a high-power consumption board, a cooling fan, a first cooling fin, and an air duct structure; the chassis has an air inlet and an air outlet arranged opposite to each other; the cooling fan is installed near the air outlet, the high-power consumption board is arranged inside the chassis, and the first cooling fin is attached to the high-power consumption board; The first heat sink fins have a spacing groove that divides them into at least two groups of heat sinks; the air duct structure is embedded in the spacing groove, and the air duct structure includes a heat conduction channel and a heat absorption channel that are interconnected; the heat absorption channel is used to absorb heat from the first heat sink fins on the side away from the heat dissipation fan, and the heat conduction channel is arranged close to the heat dissipation fan to discharge the heat.

2. The high heat dissipation server according to claim 1, characterized in that: The spacing groove is a T-shaped groove, and the connection between the heat-conducting channel and the heat-absorbing channel is located in the middle of the heat-absorbing channel.

3. The high heat dissipation server according to claim 2, characterized in that: The heat absorption channel has a first opening on a side close to the air inlet and a second opening on a side close to the air outlet, and the area of ​​the first opening is larger than that of the second opening.

4. The high heat dissipation server according to claim 3, characterized in that: The second opening is arranged away from the high power consumption board.

5. The high heat dissipation server according to claim 1, characterized in that: It also includes a low-power consumption board and a second heat dissipation fin, both of which are arranged inside the chassis; the high-power consumption board, the first heat dissipation fin, the low-power consumption board and the second heat dissipation fin are stacked in sequence; The second heat sink fins are used to dissipate heat for the low-power consumption board. The heat dissipation gaps of the second heat sink fins are respectively connected to the air inlet and the air outlet. The heat dissipation fan is only used to dissipate heat for the first heat sink fins.

6. The high heat dissipation server according to claim 5, characterized in that: It also includes a first mesh plate and a second mesh plate both arranged at the air outlet, the first mesh plate is used to protect the cooling fan, and the second mesh plate is used to protect the second cooling fins.

7. The high heat dissipation server according to claim 5, characterized in that: It also includes a heat insulation plate arranged inside the chassis, and the heat insulation plate is arranged above the second heat dissipation fins to achieve heat conduction and heat insulation of the second heat dissipation fins.

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