Polycrystalline silicon etching machine arm suitable for double-polishing sheet

Abstract

The utility model provides a polycrystalline silicon etching machine arm suitable for double polished wafers, and belongs to the technical field of double polished wafers. The polycrystalline silicon etching machine arm suitable for the double-polishing piece comprises a connecting assembly and a fixing assembly, a placing plate is arranged at one end of an arm body, a hole groove is correspondingly formed in one side of the placing plate, an arc-shaped clamping plate is arranged on one side of the placing plate, and an anti-skid layer is arranged on one side of the placing plate. The aperture is slightly increased to change the size of a vacuum adsorption space, then through an anti-skid layer on the placing plate, the effect of rapidly releasing vacuum is achieved, different sizes of vacuum spaces caused by different aperture distances and adsorption can influence the response time during later release, and due to the fact that the surface of the placing plate is smooth, the friction force is increased through the anti-skid layer, so that the effect of rapidly releasing vacuum is achieved. Therefore, the time of wafer vacuum release can be effectively shortened, the purposes of no wafer dragging and no wafer falling are achieved, and the practicability is improved.

Description

Technical Field

[0001] The present application relates to the field of double-polished wafers, and more specifically, to a polysilicon etching machine arm suitable for double-polished wafers. Background Art

[0002] Double-polished silicon wafers are made using a special process involving double-sided polishing of silicon wafers. Elemental silicon is a gray, brittle, tetravalent, non-metallic chemical element. Silicon makes up 27.8% of the Earth's crust, second only to oxygen in abundance. Silicon is a relatively abundant element in nature. Silicon can be found in quartz, agate, flint, and common beach rock. Silicon wafers, also known as wafers, are processed from silicon ingots. Through specialized processes, millions of transistors can be etched onto these wafers, making them widely used in integrated circuit manufacturing. However, existing polysilicon etching machine arms suitable for double-polished wafers typically have a smooth backside. This makes it difficult to release the wafer after vacuum application, resulting in wafer drag and drop, severely impacting production efficiency and reducing practicality. Utility Model Content

[0003] In order to make up for the above shortcomings, the present application provides a polysilicon etching machine arm suitable for double-polished wafers, which aims to improve the existing polysilicon etching machine arm suitable for double-polished wafers. Usually, the back of the double-polished wafers is relatively smooth. After the original arm is vacuum-adsorbed, it is not convenient to release, resulting in problems such as wafer dragging and wafer falling, which seriously affects production efficiency and reduces practicality.

[0004] An embodiment of the present application provides a polysilicon etching machine arm suitable for double-throw wafers, including a connecting component and a fixing component.

[0005] The connecting component includes an arm body and a placement plate, the placement plate is arranged at one end of the arm body, and a hole groove is correspondingly arranged on one side of the placement plate. The fixing component includes an arc-shaped clamping plate and an anti-slip layer, the arc-shaped clamping plate is arranged on one side of the placement plate, and the anti-slip layer is arranged on one side of the placement plate.

[0006] In a specific embodiment, a positioning plate is provided at one end of the arm body.

[0007] In the above implementation process, a positioning plate is provided at one end of the arm body, and the positioning plate can play a connecting role.

[0008] In a specific embodiment, a positioning groove is provided on one side of the positioning plate, the placement plate is in contact with the positioning groove, and a first screw hole is correspondingly provided on one side of the positioning plate.

[0009] In the above implementation process, a positioning groove is provided on one side of the positioning plate, and the positioning groove can play a role of limiting.

[0010] In a specific embodiment, a second screw hole is correspondingly provided on one side of the placement plate.

[0011] In the above implementation process, a second screw hole is correspondingly provided on one side of the placement plate, and the second screw hole can play a connecting role.

[0012] In a specific embodiment, a strip groove is provided on one side of the placement plate.

[0013] In the above implementation process, a strip groove is provided on one side of the placement plate, and the provision of the strip groove can facilitate vacuum adsorption.

[0014] In a specific embodiment, a screw rod is correspondingly provided on one side of the arc-shaped clamping plate, and the screw rod is threadedly connected to the first screw hole and the second screw hole.

[0015] In the above implementation process, a screw is provided on one side of the arc-shaped clamping plate. The screw can fix the arc-shaped clamping plate and the placement plate, and at the same time facilitate the disassembly of the arc-shaped clamping plate and the placement plate.

[0016] In a specific embodiment, a groove is provided on one side of the arc-shaped clamping plate.

[0017] In the above implementation process, a groove is provided on one side of the arc-shaped clamping plate, and the groove can play a role of limiting.

[0018] In a specific embodiment, the anti-slip layer is a coating containing silicon dioxide.

[0019] In the above implementation process, the anti-slip layer is a coating containing silicon dioxide. The silicon dioxide coating material can effectively shorten the time when the wafer is released from vacuum, so as to achieve the purpose of preventing the wafer from dragging or falling.

[0020] Compared with the prior art, the beneficial effects of the present application are: first, the size of the adsorption vacuum space is changed by using the hole grooves or by appropriately increasing the position distance of the hole grooves and slightly increasing the aperture; secondly, the anti-slip layer on the placement plate can achieve the effect of rapid vacuum release. Different aperture distances will result in different sizes of vacuum spaces caused by adsorption, which will affect the response time during the later release. Since the surface of the placement plate is relatively smooth, the friction is increased by the anti-slip layer, which can effectively shorten the time for vacuum release of the wafer, achieving the purpose of no wafer dragging or falling, thereby improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the implementation methods of the present application, the following is a brief introduction to the drawings required for use in the implementation methods. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the arm structure of a polysilicon etching machine suitable for double-throw wafers provided in an embodiment of the present application;

[0023] Figure 2 A schematic diagram of the arm body structure provided in an embodiment of the present application;

[0024] Figure 3 A schematic diagram of the placement plate structure provided in an embodiment of the present application;

[0025] Figure 4 Schematic diagram of the arc-shaped card plate structure provided in the embodiment of this application.

[0026] In the figure: 100-connecting component; 110-arm body; 111-positioning plate; 112-positioning groove; 113-first screw hole; 120-placing plate; 121-second screw hole; 122-strip groove; 130-hole groove; 200-fixing component; 210-arc-shaped clamping plate; 211-screw; 212-groove; 220-anti-slip layer. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0028] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0029] See also Figure 1-4 The present application provides a polysilicon etching machine arm suitable for double-throw wafers, including a connecting component 100 and a fixing component 200.

[0030] See also Figure 1-3The connecting component 100 includes an arm body 110 and a placement plate 120. The placement plate 120 is arranged at one end of the arm body 110, and a hole groove 130 is correspondingly provided on one side of the placement plate 120. A positioning plate 111 is provided at one end of the arm body 110. The positioning plate 111 can play a connecting role. A positioning groove 112 is provided on one side of the positioning plate 111. The placement plate 120 contacts the positioning groove 112. A first screw hole 113 is correspondingly provided on one side of the positioning plate 111. The positioning groove 112 can play a limiting role. A second screw hole 121 is correspondingly provided on one side of the placement plate 120. The second screw hole 121 can play a connecting role. A strip groove 122 is provided on one side of the placement plate 120. The strip groove 122 can facilitate vacuum adsorption. The original front end of the arm body 110 has two small holes for use during vacuum adsorption. Because the vacuum is difficult to release after the double-throw plate is vacuumed, the distance between the holes 130 is appropriately increased, and the hole diameter is slightly enlarged to change the size of the vacuum space for adsorption. The larger the object surface, the more adsorption sites there are, and the better the adsorption effect. This means that by changing the size of the vacuum space for adsorption, the effective area of ​​the object surface can be adjusted, thereby affecting the adsorption efficiency.

[0031] See also Figure 1 and Figure 4 The fixing component 200 includes an arc-shaped card plate 210 and an anti-slip layer 220. The arc-shaped card plate 210 is arranged on one side of the placement plate 120, and the anti-slip layer 220 is arranged on one side of the placement plate 120. A screw 211 is correspondingly provided on one side of the arc-shaped card plate 210. The screw 211 is threadedly connected to the first screw hole 113 and the second screw hole 121. A groove 212 is provided on one side of the arc-shaped card plate 210. The groove 212 can play a limiting role. The anti-slip layer 220 is a coating containing silicon dioxide. The silicon dioxide coating material can effectively shorten the time when the wafer is released from vacuum, so as to achieve the purpose of not dragging or falling off the wafer.

[0032] The working principle of the polysilicon etching machine arm suitable for double-throw wafers is as follows: first, the size of the vacuum adsorption space is changed by using the hole groove 130 or appropriately increasing the position distance of the hole groove 130, and slightly increasing the aperture. Secondly, the anti-slip layer 220 is a coating containing silicon dioxide. The silicon dioxide coating material can effectively shorten the time when the wafer is released from vacuum, so as to achieve the purpose of not dragging or dropping the wafer, and achieve the effect of rapid vacuum release. The size of the vacuum space caused by adsorption is different for different aperture distances, which will affect the response time during the later release. Since the surface of the placement plate 120 is relatively smooth, the friction is increased by the anti-slip layer 220, which can effectively shorten the time when the wafer is released from vacuum, so as to achieve the purpose of not dragging or dropping the wafer, thereby improving practicality.

[0033] It should be noted that the specific model specifications of the arm body 110 need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0034] The power supply of the arm body 110 and its principle are clear to those skilled in the art and will not be described in detail here.

[0035] The foregoing is merely an embodiment of the present application and is not intended to limit the scope of protection of the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included within the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures.

[0036] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A polysilicon etching machine arm suitable for double-throw wafers, characterized in that: include A connecting assembly (100), the connecting assembly (100) comprising an arm body (110) and a placement plate (120), the placement plate (120) being arranged at one end of the arm body (110), and a hole groove (130) being correspondingly provided on one side of the placement plate (120); A fixing assembly (200) comprising an arc-shaped clamping plate (210) and an anti-slip layer (220), wherein the arc-shaped clamping plate (210) is arranged on one side of the placement plate (120), and the anti-slip layer (220) is arranged on one side of the placement plate (120), and the anti-slip layer (220) is a coating containing silicon dioxide.

2. The polysilicon etching machine arm suitable for double-throw wafers according to claim 1, characterized in that: A positioning plate (111) is provided at one end of the arm body (110).

3. The polysilicon etching machine arm suitable for double-throw wafers according to claim 2, characterized in that: A positioning groove (112) is provided on one side of the positioning plate (111), the placement plate (120) is in contact with the positioning groove (112), and a first screw hole (113) is correspondingly provided on one side of the positioning plate (111).

4. The polysilicon etching machine arm suitable for double-throw wafers according to claim 3, characterized in that: A second screw hole (121) is correspondingly provided on one side of the placement plate (120).

5. The polysilicon etching machine arm suitable for double-throw wafers according to claim 1, characterized in that: A strip-shaped groove (122) is provided on one side of the placement plate (120).

6. The polysilicon etching machine arm suitable for double-throw wafers according to claim 4, characterized in that: A screw rod (211) is correspondingly provided on one side of the arc-shaped clamping plate (210), and the screw rod (211) is threadedly connected to the first screw hole (113) and the second screw hole (121).

7. The polysilicon etching machine arm suitable for double-throw wafers according to claim 1, characterized in that: A groove (212) is provided on one side of the arc-shaped clamping plate (210).

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