Packaging structure compatible with crystal oscillator

Abstract

The utility model relates to the technical field of crystal oscillator packaging, in particular to a packaging structure compatible with a crystal oscillator, which comprises a novel plastic package, a novel lower die is covered on the surface of the novel plastic package, base islands are arranged in the novel plastic package and the novel lower die, a compatible crystal oscillator mechanism is arranged on one side of the novel plastic package, and the compatible crystal oscillator mechanism is arranged on the other side of the novel plastic package. The compatible crystal oscillator mechanism is composed of an existing packaging structure and a compatible groove, efficient heat dissipation mechanisms are arranged on the two sides of the novel plastic package, and efficient heat dissipation assemblies and heat dissipation grooves are arranged in the efficient heat dissipation mechanisms. According to the utility model, not only can the packaging problem of a customer's crystal oscillator mounted on a stamping frame be solved, the frame structure and the plastic packaging thickness be improved, the crystal oscillator mounting is compatible, the customer's product requirements are met, but also the heat dissipation effect of the packaging structure in use is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal oscillator packaging, in particular to a packaging structure compatible with a crystal oscillator. Background Art

[0002] As we all know, the chip packaging structure is a device that packages semiconductor chips in a specific chip packaging form. It has been widely used in the field of circuit boards. As a common clock component, the crystal oscillator plays an important role in the design process of circuit boards.

[0003] The current packaging structure is as follows Figure 2 As shown, the frame can only be packaged and wired on one side, and the crystal oscillator cannot function after being mounted, resulting in failure to meet product requirements; heat is generated when the crystal oscillator is used, but the general packaging structure only conducts heat through itself, and the heat dissipation effect is poor. Utility Model Content

[0004] The purpose of the present invention is to provide a packaging structure compatible with a crystal oscillator, so as to solve the problem in the above background technology that the packaging structure proposed in the above background technology cannot realize the function after the crystal oscillator is mounted, resulting in failure to meet product requirements and poor heat dissipation effect.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaging structure compatible with a crystal oscillator, including a new plastic package, the surface cover of the new plastic package is provided with a new lower mold, a base island is provided inside the new plastic package and the new lower mold, a compatible crystal oscillator mechanism is provided on one side of the new plastic package, the compatible crystal oscillator mechanism is composed of an existing packaging structure and a compatible groove, high-efficiency heat dissipation mechanisms are provided on both sides of the new plastic package, and the interior of the high-efficiency heat dissipation mechanism includes a high-efficiency heat dissipation component and a heat dissipation groove.

[0006] Preferably, the thickness of the new plastic package is 2.40 mm MAX, and the thickness of the new lower mold is 1.97 mm MAX.

[0007] Preferably, compatible grooves are provided at both ends of one side of the base island, and an existing packaging structure is provided on one side of the novel plastic package.

[0008] Preferably, the existing packaging structure includes an existing plastic seal and an existing lower mold, and the existing plastic seal is provided on one side of the novel plastic seal, and the thickness of the existing plastic seal is 1.60 mm MAX.

[0009] Preferably, the surface cover of the existing plastic package is provided with an existing lower mold, and the thickness of the existing lower mold is 0.76 mm MAX.

[0010] Preferably, heat dissipation grooves with equal spacing are provided at the edge of the base island, and high-efficiency heat dissipation components are provided on the surfaces of the new plastic package and the new lower mold.

[0011] Preferably, the high-efficiency heat dissipation component is composed of a graphite heat dissipation film and a heat dissipation patch, the surface of the new plastic package is adhered with the heat dissipation patch, and the surface of the new lower mold is covered with a graphite heat dissipation film.

[0012] Compared with the prior art, the beneficial effects of the present invention are: the packaging structure compatible with crystal oscillators can not only solve the packaging problem of customer crystal oscillators in stamping frame mounting, improve the frame structure and plastic package thickness, be compatible with crystal oscillator mounting, meet customer product requirements, but also improve the heat dissipation effect of the packaging structure when in use;

[0013] 1. By setting up a compatible crystal oscillator mechanism and opening two compatible grooves on the surface of the base island, the crystal oscillator can be reverse mounted and wired normally according to the product function to meet customer product needs. At the same time, since the thickness of the existing plastic package is 1.60mm MAX and the thickness of the existing lower mold is 0.76mm MAX, which is less than the crystal oscillator 0.8mm, it is not compatible. The thickness of the new plastic package is 2.40mm MAX. The thickness of the new plastic package is thicker, and the crystal oscillator package thickness is more compatible. The thickness of the new lower mold is 1.97mm MAX, which is greater than the crystal oscillator 0.8mm and is compatible with the crystal oscillator. It can solve the packaging problem of the customer's crystal oscillator in the stamping frame mounting, improve the frame structure and plastic package thickness, and be compatible with the crystal oscillator mounting to meet customer product needs.

[0014] 2. By providing an efficient heat dissipation mechanism, the heat dissipation area at the edge of the base island can be increased under the action of the heat dissipation groove, thereby accelerating the heat dissipation speed of the base island. At the same time, the new lower mold can be opened for heat conduction under the action of the graphite heat dissipation film, and the heat dissipation of the new plastic package can be accelerated under the action of the heat dissipation patch, so as to realize the efficient heat dissipation function of the packaging structure, thereby improving the heat dissipation effect of the packaging structure when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional appearance structure of the utility model;

[0016] Figure 2 This is a schematic side view of the existing packaging structure of the present utility model;

[0017] Figure 3 This is a schematic diagram of the main structure of the utility model;

[0018] Figure 4 It is a side structural schematic diagram of the utility model.

[0019] In the figure: 1. New plastic package; 101. New lower mold; 102. Base island; 2. High-efficiency heat dissipation mechanism; 201. High-efficiency heat dissipation component; 2011. Graphite heat dissipation film; 2012. Heat dissipation patch; 202. Heat dissipation groove; 3. Compatible crystal oscillator mechanism; 301. Existing packaging structure; 3011. Existing plastic package; 3012. Existing lower mold; 302. Compatible slot. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly stipulated and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] The utility model provides a packaging structure compatible with the crystal oscillator. Figure 1 and Figure 3 As shown, it includes a new plastic package 1, the thickness of the new plastic package 1 is 2.40mm MAX, the surface cover of the new plastic package 1 is provided with a new lower mold 101, the thickness of the new lower mold 101 is 1.97mm MAX, and a base island 102 is provided inside the new plastic package 1 and the new lower mold 101.

[0022] Furthermore, if Figure 2 、 Figure 3 and Figure 4 As shown, a compatible crystal oscillator mechanism 3 is provided on one side of the new plastic package 1. The compatible crystal oscillator mechanism 3 is composed of an existing packaging structure 301 and a compatible groove 302. Compatible grooves 302 are provided at both ends of one side of the base island 102. An existing packaging structure 301 is provided on one side of the new plastic package 1. The interior of the existing packaging structure 301 contains an existing plastic package 3011 and an existing lower mold 3012. An existing plastic package 3011 is provided on one side of the new plastic package 1. The thickness of the existing plastic package 3011 is 1.60 mm MAX. The surface cover of the existing plastic package 3011 is provided with an existing lower mold 3012. The thickness of the existing lower mold 3012 is 0.76 mm MAX.

[0023] During use, by opening two compatible grooves 302 on the surface of the base island 102, the crystal oscillator can be reverse mounted and the wires can be welded normally according to the product function to meet customer product needs. At the same time, since the thickness of the existing plastic package 3011 is 1.60mm MAX, the thickness of the existing lower mold 3012 is 0.76mm MAX, which is less than the crystal oscillator 0.8mm and is not compatible, the thickness of the new plastic package 1 is 2.40mm MAX, the thickness of the new plastic package 1 is thicker, and the crystal oscillator package thickness is more compatible. The thickness of the new lower mold 101 is 1.97mm MAX, which is greater than the crystal oscillator 0.8mm and is compatible with the crystal oscillator.

[0024] Furthermore, if Figure 2 and Figure 4 As shown, high-efficiency heat dissipation mechanisms 2 are provided on both sides of the new plastic package 1. The interior of the high-efficiency heat dissipation mechanism 2 includes a high-efficiency heat dissipation component 201 and a heat dissipation groove 202. Heat dissipation grooves 202 are provided at equal intervals at the edge of the base island 102. High-efficiency heat dissipation components 201 are provided on the surfaces of the new plastic package 1 and the new lower mold 101. The high-efficiency heat dissipation components 201 are composed of a graphite heat dissipation film 2011 and a heat dissipation patch 2012. The surface of the new plastic package 1 is adhered with a heat dissipation patch 2012, and the surface of the new lower mold 101 is covered with a graphite heat dissipation film 2011.

[0025] When in use, the heat dissipation groove 202 can increase the heat dissipation area at the edge of the base island 102 and accelerate the heat dissipation speed of the base island 102. At the same time, the graphite heat dissipation film 2011 can be used to conduct heat to the new lower mold 101, and the heat dissipation patch 2012 can accelerate the heat dissipation of the new plastic package 1 to achieve efficient heat dissipation function of the packaging structure.

[0026] Working principle: When in use, first, by opening two compatible grooves 302 on the surface of the base island 102, the crystal oscillator can be reverse mounted, and then the wires can be normally welded according to the product function to meet customer product needs. At the same time, since the thickness of the existing plastic package 3011 is 1.60mm MAX, the thickness of the existing lower mold 3012 is 0.76mm MAX, which is less than the crystal oscillator 0.8mm and is not compatible, the thickness of the new plastic package 1 is 2.40mm MAX, the thickness of the new plastic package 1 is thickened, and the crystal oscillator packaging thickness is more compatible. The thickness of the new lower mold 101 is 1.97mm MAX, which is greater than the crystal oscillator 0.8mm and is compatible with the crystal oscillator. It can solve the customer's crystal oscillator packaging problem in the stamping frame mounting, improve the frame structure and plastic package thickness, and is compatible with crystal oscillator mounting to meet customer product needs.

[0027] At the same time, under the action of the heat dissipation groove 202, the heat dissipation area of ​​the edge of the base island 102 can be increased, and the heat dissipation speed of the base island 102 can be accelerated. At the same time, under the action of the graphite heat dissipation film 2011, the new lower mold 101 can be opened for heat conduction, and under the action of the heat dissipation patch 2012, the heat dissipation of the new plastic package 1 can be accelerated to realize the efficient heat dissipation function of the packaging structure, thereby improving the heat dissipation effect of the packaging structure when it is used, and finally completing the use of the packaging structure.

[0028] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A crystal oscillator-compatible packaging structure, comprising a novel plastic package (1), characterized in that: The surface cover of the novel plastic package (1) is provided with a novel lower mold (101); a base island (102) is provided inside the novel plastic package (1) and the novel lower mold (101); a compatible crystal oscillator mechanism (3) is provided on one side of the novel plastic package (1); the compatible crystal oscillator mechanism (3) is composed of an existing packaging structure (301) and a compatible groove (302); high-efficiency heat dissipation mechanisms (2) are provided on both sides of the novel plastic package (1); the interior of the high-efficiency heat dissipation mechanism (2) includes a high-efficiency heat dissipation component (201) and a heat dissipation groove (202).

2. The crystal oscillator-compatible packaging structure according to claim 1, characterized in that: The thickness of the novel plastic package (1) is 2.40 mm MAX, and the thickness of the novel lower mold (101) is 1.97 mm MAX.

3. The crystal oscillator-compatible packaging structure according to claim 1, characterized in that: Both ends of one side of the base island (102) are provided with compatible grooves (302), and one side of the novel plastic package (1) is provided with an existing packaging structure (301).

4. The crystal oscillator-compatible packaging structure according to claim 3, characterized in that: The existing packaging structure (301) includes an existing plastic seal (3011) and an existing lower mold (3012) inside. The existing plastic seal (3011) is provided on one side of the novel plastic seal (1). The thickness of the existing plastic seal (3011) is 1.60 mm MAX.

5. The crystal oscillator-compatible packaging structure according to claim 4, characterized in that: The surface cover of the existing plastic package (3011) is provided with an existing lower mold (3012), and the thickness of the existing lower mold (3012) is 0.76 mm MAX.

6. The crystal oscillator-compatible packaging structure according to claim 1, characterized in that: Heat dissipation grooves (202) with equal spacing are provided at the edge of the base island (102), and high-efficiency heat dissipation components (201) are provided on the surfaces of the novel plastic package (1) and the novel lower mold (101).

7. The crystal oscillator-compatible packaging structure according to claim 6, characterized in that: The high-efficiency heat dissipation component (201) is composed of a graphite heat dissipation film (2011) and a heat dissipation patch (2012); the heat dissipation patch (2012) is adhered to the surface of the novel plastic package (1); and the surface of the novel lower mold (101) is covered with the graphite heat dissipation film (2011).

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