Middle frame assembly and electronic equipment

Abstract

The embodiment of the utility model provides a middle frame assembly and electronic equipment, and relates to the technical field of electronics. The middle frame assembly comprises a base, a frame and a retaining wall, and the retaining wall is connected with one face of the base. A space defined by the base, the frame and the first face of the retaining wall is used for containing a main board, and the first face of the retaining wall is provided with a step structure. According to the middle frame assembly, the step structure is arranged on the first face, close to the main board, of the retaining wall, the local thickness of the retaining wall is increased through the step structure, the arrangement space of the main board cannot be affected by the step structure, the thicker retaining wall is adopted in the middle frame assembly, and the overall strength of the middle frame assembly can be improved; therefore, the middle frame assembly is not easy to damage during falling or collision.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to a middle frame assembly and an electronic device. Background Art

[0002] Currently, mobile phones and other electronic devices are mostly miniaturized. To improve phone performance, these devices require the placement of larger electronic components, such as larger batteries and camera modules, within limited internal space. Related technologies have increased the space available for electronic components by using smaller midframes, such as by thinning the battery compartment walls. However, this reduced midframe size reduces its overall strength, making it susceptible to damage if the phone is dropped. Utility Model Content

[0003] In view of this, embodiments of the present disclosure provide a middle frame assembly and an electronic device, which can improve the strength of the middle frame assembly.

[0004] In a first aspect, an embodiment of the present disclosure provides a middle frame assembly, the middle frame assembly comprising a base, a frame, and a retaining wall, wherein the retaining wall is connected to one side of the base;

[0005] The space enclosed by the base, the frame and the first surface of the retaining wall is used to accommodate a mainboard, and the first surface of the retaining wall is provided with a step structure.

[0006] Optionally, the step structure includes a step body and a support ear portion, the step body is located on the first surface of the retaining wall, the support ear portion is connected to the side surface of the step body, and the support ear portion protrudes in a direction away from the first surface.

[0007] Optionally, the supporting ear portion is provided with a connection hole, and the main board is fixedly connected to the retaining wall through the connection hole.

[0008] Optionally, there are three supporting ears, two of which are located at two ends of the retaining wall, and the other one is located in the middle area of ​​the retaining wall.

[0009] Optionally, the thickness of the retaining wall at the step body is 0.8mm-0.9mm.

[0010] Optionally, the frame is in a rectangular ring shape, and both ends of the retaining wall are respectively connected to two opposite sides of the frame.

[0011] Optionally, the length direction of the retaining wall is parallel to the width direction of the frame.

[0012] Optionally, a first convex portion is provided on a surface of the retaining wall away from the base, and a chamfered structure is provided at a connection between the first convex portion and the retaining wall.

[0013] In a second aspect, an embodiment of the present disclosure provides an electronic device, comprising a mainboard, a shielding cover, and a middle frame assembly as described in any one of the first aspects above, wherein the shielding cover is connected to a side of the mainboard close to the base, and the mainboard and the shielding cover are located in a space enclosed by the base, the frame, and the first side of the retaining wall.

[0014] Optionally, an orthographic projection of the step structure on the substrate at least partially overlaps with an orthographic projection of the main board on the substrate.

[0015] The beneficial effects of the technical solutions provided by the embodiments of the present disclosure include at least:

[0016] In the middle frame assembly provided in the disclosed embodiments, one side of the retaining wall is used to accommodate the motherboard. A stepped structure is provided on the first side of the retaining wall, adjacent to the motherboard. This stepped structure increases the thickness of the retaining wall without compromising the space available for the motherboard. The thicker retaining wall in the middle frame assembly provided in the disclosed embodiments increases the overall strength of the middle frame assembly, making it less susceptible to damage from drops or collisions. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A schematic diagram of a middle frame assembly provided in an embodiment of the present disclosure;

[0019] Figure 2 A partial cross-sectional view of a middle frame assembly provided in an embodiment of the present disclosure;

[0020] Figure 3 A partial cross-sectional view of a middle frame assembly provided in an embodiment of the present disclosure;

[0021] Figure 4 An exploded diagram of an electronic device provided in an embodiment of the present disclosure.

[0022] The reference numerals in the figures represent respectively:

[0023] 1-base; 2-frame; 3-retaining wall; 4-mainboard; 5-shielding cover;

[0024] 31-step structure; 32-first convex portion; 33-second convex portion; 34-chamfered structure; 41-through hole;

[0025] 311 - step body; 312 - ear portion; 313 - connection hole; 301 - first surface; 302 - second surface.

[0026] The above drawings illustrate specific embodiments of the present disclosure, which will be described in more detail below. These drawings and textual descriptions are not intended to limit the scope of the present disclosure in any way, but rather to illustrate the concepts of the present disclosure to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0028] The directional nouns involved in the embodiments of the present disclosure, such as "upper", "lower", "side", etc., are generally expressed in the form of Figure 1 The relative relationships shown in the figure are used as a reference, and these directional terms are used only to more clearly describe the relationship between structures, not to describe absolute directions. When the product is placed in different postures, the direction may change, for example, "up" and "down" may be interchangeable.

[0029] In related art, a midframe assembly is equipped with a battery compartment retaining wall, which is used to separate the space within the midframe to accommodate the circuit board and battery. In this midframe assembly, the two opposing sides of the battery compartment retaining wall are flat, and the thickness of the battery compartment retaining wall is relatively small, resulting in low strength and easy damage to the midframe assembly in the event of a collision.

[0030] In view of this, an embodiment of the present disclosure provides a middle frame assembly, which can improve the strength of the middle frame assembly. Figure 1 A schematic diagram of a middle frame assembly provided in an embodiment of the present disclosure, such as Figure 1 As shown, the middle frame assembly includes a base 1, a frame 2, and a retaining wall 3, which is connected to one side of the base 1. The space enclosed by the base 1, the frame 2, and the first side 301 of the retaining wall 3 is used to accommodate the motherboard, and the first side 301 of the retaining wall 3 is provided with a step structure 31.

[0031] In the middle frame assembly provided in the disclosed embodiment, one side of the retaining wall 3 is used to accommodate the motherboard. A stepped structure 31 is provided on the first surface of the retaining wall 3, adjacent to the motherboard. This stepped structure 31 increases the local thickness of the retaining wall 3 without compromising the space available for the motherboard. The thicker retaining wall 3 employed in the middle frame assembly provided in the disclosed embodiment increases the overall strength of the middle frame assembly, making it less susceptible to damage from drops or collisions.

[0032] To make the technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be described in further detail below with reference to the accompanying drawings.

[0033] like Figure 1 As shown, the middle frame assembly provided by the embodiment of the present disclosure includes a base 1, a frame 2 and a retaining wall 3, and the retaining wall 3 is connected to one side of the base 1. The space enclosed by the base 1, the frame 2 and the first surface 301 of the retaining wall 3 is used to accommodate the mainboard. The first surface 301 of the retaining wall 3 is a plane, and a step structure 31 is provided in the bottom area of ​​the first surface 301 close to the base 1. The height of the step structure 31 is relatively small to prevent interference with the mainboard. The step structure 31 is provided in the bottom area of ​​the retaining wall 3, which can increase the overall strength of the retaining wall 3. The middle frame assembly is suitable for use in electronic devices. When the electronic device falls or is hit, the middle frame assembly has higher strength, so that the electronic device is not easily damaged.

[0034] In some embodiments of the present disclosure, Figure 1 As shown, the step structure 31 includes a step body 311 and a support ear 312. The step body 311 is located on the first surface 301 of the retaining wall 3. The support ear 312 is connected to the side of the step body 311 and protrudes away from the first surface 301. When the motherboard is installed in the middle frame assembly, the support ear 312 can provide support for the motherboard, maintaining a certain distance between the motherboard and the base 1.

[0035] In some embodiments of the present disclosure, see Figure 1 The ear portion 312 is provided with a connection hole 313, and the main board is fixedly connected to the retaining wall 3 through the connection hole 313. Specifically, the axis direction of the connection hole 313 is parallel to the thickness direction of the base 1, and the connection hole 313 is provided with an internal thread, and the main board is detachably connected to the connection hole 313 by screws.

[0036] Specifically, see Figure 1 There are three lugs 312, two of which are located at both ends of the retaining wall 3, and the other lug 312 is located in the middle area of ​​the retaining wall 3. Optionally, the two lugs 312 at both ends of the retaining wall 3 are symmetrically arranged about the bisector of the length direction of the retaining wall 3.

[0037] In some embodiments of the present disclosure, Figure 1As shown, a first protrusion 32 is provided on the side of the retaining wall 3 away from the base 1. A chamfered structure 34 is provided at the connection between the first protrusion 32 and the retaining wall 3, and the first protrusion 32 is located in the middle of the retaining wall 3. A second protrusion 33 is provided on the side of the first protrusion 32 away from the base 1, and the second protrusion 33 is located in the middle of the first protrusion 32. A chamfered structure 34 is provided at the connection between the second protrusion 33 and the first protrusion 32. The first protrusion 32 and the second protrusion 33 are used to cooperate with the housing of the electronic device to assemble the middle frame assembly with the housing.

[0038] Figure 2 A partial cross-sectional view of a middle frame assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 2 As shown, the space enclosed by the base 1, the frame 2 and the first surface 301 of the retaining wall 3 is used to accommodate the main board 4. A through hole 41 is provided on the main board 4. The through hole 41 is opposite to the connecting hole 313. A screw can pass through the through hole 41 and be threadedly connected to the connecting hole 313, thereby fixing the main board 4 to the support ear 312.

[0039] For example, the main board 4 may be provided with a plurality of through holes 41, with three through holes 41 provided at the edge of the main board 4 near the retaining wall 3, each through hole 41 being opposite to a connection hole 313. The through holes 41 at other edge areas of the main board 4 may be connected to the connection holes provided on the base 1.

[0040] Alternatively, see Figure 2 The retaining wall 3, the base 1 and the frame 2 can be an integral structure, and the ear portion 312 is integrally formed with the base 1. For example, the retaining wall 3, the base 1 and the frame 2 are formed by CNC processing.

[0041] Figure 3 A partial cross-sectional view of a middle frame assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 3 As shown, the thickness d of the retaining wall 3 at the step body 311 is 0.8mm-0.9mm. The retaining wall 3 has a second surface 302 opposite the first surface 301. The space enclosed by the second surface 302 of the retaining wall 3, the frame 2, and the base 1 can be used to accommodate battery components. The distance between the first surface 301 and the second surface 302, that is, the thickness w of the retaining wall 3 above the step body 311, is 0.5mm-0.6mm. The thickness w of the retaining wall 3 above the step body 311 can be 0.2mm-0.3mm less than the thickness d of the retaining wall 3 at the step body 311.

[0042] In some embodiments of the present disclosure, the frame 2 is rectangular in shape, and the connections of the frames 2 extending in different directions are provided with rounded corners. The two ends of the retaining wall 3 are respectively connected to the two opposite frames of the rectangular frame 2. Specifically, the two ends of the retaining wall 3 are respectively connected to the two longer frames of the rectangular frame 2, and the length direction of the retaining wall 3 is parallel to the width direction of the rectangular frame 2.

[0043] In addition, an embodiment of the present disclosure also provides an electronic device. Figure 4 An exploded diagram of an electronic device provided in an embodiment of the present disclosure, such as Figure 4 As shown, the electronic device includes a motherboard 4, a shielding cover 5, and a midframe assembly according to any of the above-described embodiments. The shielding cover 5 is connected to the surface of the motherboard 4 that is closest to the base 1. The motherboard 4 and the shielding cover 5 are located in the space enclosed by the base 1, the frame 2, and the first surface of the retaining wall 3. For example, there may be multiple shielding covers 5, each with its edge welded to the surface of the motherboard 4 that is closest to the base 1. The shielding covers 5 cover the electronic components of the motherboard 4, isolating the electronic components on the motherboard 4 from the base 1.

[0044] In the electronic device provided in the embodiment of the present disclosure, one side of the first surface 301 of the retaining wall 3 is used to accommodate the motherboard 4. A stepped structure 31 is provided on the first surface 301 of the retaining wall 3 near the motherboard 4. This stepped structure 31 increases the local thickness of the retaining wall 3 without affecting the layout space of the motherboard 4. The thicker retaining wall 3 used in the middle frame assembly provided in the embodiment of the present disclosure helps increase the overall strength of the middle frame assembly, making the electronic device less susceptible to damage from drops or collisions.

[0045] It should be noted that the electronic device provided in the embodiments of the present disclosure may be, but is not limited to, a mobile phone, a remote control, a tablet computer, an MP3 player (Moving Picture Experts Group Audio Layer III), or an MP4 player (Moving Picture Experts Group Audio Layer IV). The electronic device may also be referred to as a user device, a portable terminal, a laptop terminal, or other similar names. The electronic device provided in the embodiments of the present disclosure may be an electronic device with a foldable function, such as a foldable mobile phone.

[0046] In some embodiments of the present disclosure, see Figure 4The orthographic projection of the step structure 31 on the base 1 at least partially overlaps with the orthographic projection of the mainboard 4 on the base 1. The step structure 31 is partially located between the mainboard 4 and the base 1. The step structure 31 fully utilizes the gap between the mainboard 4 and the base 1, and the step structure 31 does not occupy the space where the mainboard 4 is arranged, thereby making the internal structure of the electronic device more compact. In addition, the step structure 31 can increase the strength of the retaining wall 3.

[0047] It should be noted that the terms "several" and "at least one" in this document refer to one or more, while "multiple" and "at least two" refer to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates an "or" relationship between the associated objects.

[0048] In the description of this disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections; they may refer to direct connections or indirect connections through an intermediate medium; they may refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0049] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0050] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0051] In the description of this specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure.

[0052] The above descriptions are merely embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the scope of protection of the present disclosure.

Claims

1. A middle frame assembly, characterized in that: It comprises a base (1), a frame (2) and a retaining wall (3), wherein the retaining wall (3) is connected to one side of the base (1); The space enclosed by the base (1), the frame (2) and the first surface of the retaining wall (3) is used to accommodate a mainboard, and the first surface of the retaining wall (3) is provided with a step structure (31).

2. The middle frame assembly according to claim 1, characterized in that: The step structure (31) comprises a step body (311) and a supporting ear portion (312); the step body (311) is located on the first surface of the retaining wall (3); the supporting ear portion (312) is connected to the side surface of the step body (311); and the supporting ear portion (312) protrudes in a direction away from the first surface.

3. The middle frame assembly according to claim 2, characterized in that: The supporting ear portion (312) is provided with a connection hole (313), and the main board is fixedly connected to the retaining wall (3) through the connection hole (313).

4. The middle frame assembly according to claim 2, characterized in that: There are three supporting ears (312), two of which are located at two ends of the retaining wall (3), and the other supporting ear (312) is located in the middle area of ​​the retaining wall (3).

5. The middle frame assembly according to claim 2, characterized in that: The thickness of the retaining wall (3) at the step body (311) is 0.8 mm to 0.9 mm.

6. The middle frame assembly according to claim 1, characterized in that: The frame (2) is rectangular in shape, and the two ends of the retaining wall (3) are respectively connected to the two opposite sides of the frame (2).

7. The middle frame assembly according to claim 6, characterized in that: The length direction of the retaining wall (3) is parallel to the width direction of the frame (2).

8. The middle frame assembly according to claim 1, wherein: A first convex portion (32) is provided on a side of the retaining wall (3) away from the base (1), and a chamfered structure (34) is provided at the connection between the first convex portion (32) and the retaining wall (3).

9. An electronic device, characterized in that: The invention comprises a mainboard (4), a shielding cover (5) and a middle frame assembly according to any one of claims 1 to 8, wherein the shielding cover (5) is connected to a side of the mainboard (4) close to the base (1), and the mainboard (4) and the shielding cover (5) are located in a space enclosed by the base (1), the frame (2) and the first side of the retaining wall (3).

10. The electronic device according to claim 9, characterized in that The orthographic projection of the step structure (31) on the base (1) at least partially overlaps with the orthographic projection of the main board (4) on the base (1).

Images