Circuit board with positioning structure
By setting a positioning structure on the circuit board, including a protective film window and a copper layer hollow pattern, the problems of offset and rotation during the protective film lamination process are solved, and the lamination accuracy and product quality are improved.
Patent Information
- Application Number
- CN202422416993.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-09-30
AI Technical Summary
The existing technology makes it difficult to visually identify deviation and rotation reversal during the protective film lamination process, resulting in abnormal quality or scrap of circuit board products, especially in the case of dark protective films and similar symmetrical designs.
A positioning structure is set on the circuit board, including a window opening on the protective film and a hollow pattern on the copper layer. The hollow pattern corresponds to the window opening on the protective film. Accurate positioning is achieved through an annular mark and an anti-reverse sticking mark to prevent deviation and rotational reverse sticking.
It realizes intuitive identification of the lamination accuracy of the protective film, prevents deviation and rotation, and improves the quality stability and production efficiency of circuit board products.
Smart Images
Figure CN223379350U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of circuit boards, in particular to a circuit board with a positioning structure. Background Art
[0002] With the advancement of technology, more and more electronic devices are coming to market. As the carrier of electronic equipment, circuit boards play an extremely important role. Circuit boards can be used in almost all industries, from civilian to military, from ordinary low-end consumer electronics to high-end advanced equipment manufacturing.
[0003] Applying protective film to circuit boards is a crucial step in circuit board production. Existing protective film application processes involve applying the film to FPC circuit boards using a dummy jig, an automatic laminating machine, or manual alignment. During the protective film application process, the marking point, defined as the location of the PCB in the circuit board design for placement on the automatic placement machine, directly impacts film application efficiency.
[0004] At present, in the process of laminating the protective film on the FPC circuit board, the identification of whether the protective film is misaligned is carried out by identifying the distance between the CV mark point and the window on the protective film, or by confirming the laminating accuracy of the protective film through the CV identification line. Since the CV identification line is set on the outside, when the protective film is a dark protective film with low transparency such as black or brown, this method is not easy to intuitively check the problem of the protective film being misaligned; moreover, this precision alignment recognition method can only identify the accuracy, and cannot identify whether the protective film is rotated and reversed. The judgment is made by comparing the window position on the design drawing with the window position of the protective film in actual production.
[0005] Furthermore, when printed circuit boards have similar symmetrical designs, or when the applied protective film is a dark, low-transparency black or other dark-colored film, existing identification methods cannot clearly and intuitively identify whether the board has been rotated 180° and applied upside down. Failure to detect misalignment during alignment or the reversed application of the protective film can result in poor quality and even scrap of printed circuit boards. Utility Model Content
[0006] Based on this, it is necessary to provide a circuit board with a positioning structure.
[0007] In order to solve the above technical problems, the utility model provides a circuit board with a positioning structure, including a copper clad laminate, a protective film for superimposing on the surface of the copper layer of the copper clad laminate, and a positioning structure, the copper clad laminate including an insulating layer and a copper layer superimposed on the insulating layer, the positioning structure including a protective film window arranged on the protective film, and a hollow pattern arranged on the copper layer, the protective film window passes through the protective film, the position of the hollow pattern on the copper layer corresponds to the position of the protective film window set on the protective film, the hollow pattern includes a copper layer window passing through the copper layer and a ring mark, the ring mark is located at the center of the copper layer window, the size of the copper layer window is larger than the size of the protective film window, the ring mark has a first width, and the ring mark is partially located within the protective film window.
[0008] Preferably, a plurality of the positioning structures are respectively provided at the first end and the second end of the circuit board. The plurality of positioning structures provided at the edge of the first end of the circuit board constitute a first positioning structure arrangement, and the plurality of positioning structures provided at the edge of the second end of the circuit board constitute a second positioning structure arrangement. The positions of the first positioning structure arrangement and the second positioning structure arrangement are asymmetrical to each other.
[0009] Preferably, the first positioning structure arrangement includes a plurality of first positioning structures arranged in a "I" shape at the first end edge position of the circuit board, and the distance between two adjacent first positioning structures is a first distance. The second positioning structure arrangement includes a plurality of second positioning structures arranged in a "I" shape at the second end edge position of the circuit board, and the distance between two adjacent second positioning structures is a second distance. The first distance is greater than the second distance.
[0010] Preferably, the copper layer window is a circular window, and the diameter of the copper layer window is 3 mm.
[0011] Preferably, the protective film window is a circular window, and the diameter of the protective film window is 2.5 mm.
[0012] Preferably, the first width has a value range of (0.1-0.2) mm, and the hollow pattern is obtained by etching a copper layer.
[0013] Preferably, the color of the protective film is black, brown or white.
[0014] Preferably, the hollow pattern further includes an anti-reverse sticker mark arranged inside the annular mark, the forward pattern of the anti-reverse sticker mark is rotated 180 degrees to obtain a reverse pattern, and the forward pattern and reverse pattern of the anti-reverse sticker mark are different.
[0015] The beneficial effects of the present invention are as follows: the structure of the present application is capable of identifying the deviation of the protective film and can also judge the alignment accuracy according to the width of the arc mark observed on the window of the protective film. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and other purposes, features and advantages of the present invention will become more apparent through a more detailed description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals indicate the same parts throughout the drawings, and the drawings are not intentionally scaled to actual size. The emphasis is on illustrating the subject matter of the present invention.
[0017] Figure 1 A schematic diagram of the arrangement of the first positioning structure and the second positioning structure on a circuit board according to a preferred embodiment of the present utility model;
[0018] Figure 2 This is a schematic diagram of the overall structure of the positioning structure on the circuit board of the preferred embodiment of the utility model;
[0019] Figure 3 This is a schematic diagram of a hollow pattern on the copper layer of a copper-clad laminate according to a preferred embodiment of the present invention;
[0020] Figure 4 A schematic diagram of a protective film window on a protective film according to a preferred embodiment of the present invention;
[0021] Figure 5 The view under the standard state when the boundary line of the protective film window is located in the center of the circular mark;
[0022] In the figure: circuit board 1; copper layer 11; protective film 12; protective film window 120; copper layer window 110; arc mark 111; first positioning structure 21; second positioning structure 22; anti-reverse sticking mark 112. DETAILED DESCRIPTION
[0023] In order to facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0024] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element and integrated therewith, or there may be an intermediate element. The terms "mounted", "one end", "the other end" and similar expressions used herein are for illustrative purposes only.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.
[0026] refer to Figure 1-Figure 5 The utility model provides a circuit board 1 with a positioning structure, comprising a copper-clad laminate, a protective film 12 for superimposing on the surface of the copper layer of the copper-clad laminate, and a positioning structure, wherein the copper-clad laminate comprises an insulating layer and a copper layer 11 superimposed on the insulating layer, the positioning structure comprises a protective film window 120 arranged on the protective film 12, and a hollow pattern arranged on the copper layer 11, the protective film window 120 passes through the protective film 12, the position of the hollow pattern on the copper layer 11 corresponds to the position of the protective film window 120 set on the protective film 12, the hollow pattern comprises a copper layer window 110 passing through the copper layer 11 and a ring-shaped mark, the ring-shaped mark is located at the center of the copper layer window 110, and the size of the copper layer window 110 is larger than the size of the protective film window 120. The annular mark is a circular ring, or the annular mark is composed of multiple arc marks 111 of the same circular ring, the multiple arc marks 111 all have a first width, the multiple arc marks 111 are surrounded in a circular ring, and there is a distance between two adjacent arc marks 111. Part of the arc marks 111 is located in the protective film window 120, and the circular edge line of the protective film window 120 is designed to fall at the center of the annular mark.
[0027] In a preferred embodiment, the copper layer window 110 and the protective film window 120 are both circular windows, and the edge line circle of the copper layer window 110, the edge line circle of the protective film window 120 and the annular mark are all concentric circles, and are designed so that the edge line of the circle of the protective film window 120 falls at the center of the annular mark.
[0028] The positioning structure of the present application can meet the requirements of fitting accuracy identification, so that the boundary line of the protective film window 120 is located in the exact center of the annular mark. The overlapping position of the circular edge line of the protective film window 120 falling on the annular mark is used to visually identify the deviation, thereby determining whether the protective film fitting accuracy is within the range.
[0029] In a preferred embodiment, a plurality of positioning structures are provided at the first and second ends of the circuit board, respectively. The plurality of positioning structures provided at the edge of the first end of the circuit board constitute a first positioning structure arrangement, and the plurality of positioning structures provided at the edge of the second end of the circuit board constitute a second positioning structure arrangement. The positions of the first and second positioning structure arrangements are asymmetrical. The asymmetry of the positions of the first and second positioning structure arrangements can serve as a foolproofing measure. Optionally, the first and second positioning structure arrangements each include only two positioning structures.
[0030] In a preferred embodiment, the first positioning structure arrangement includes a plurality of first positioning structures 21 arranged in a "I" shape at the first end edge position of the circuit board 1, and the distance between two adjacent first positioning structures 21 is a first distance. The second positioning structure arrangement includes a plurality of second positioning structures 22 arranged in a "I" shape at the second end edge position of the circuit board, and the distance between two adjacent second positioning structures 22 is a second distance. The first distance is greater than the second distance.
[0031] like Figure 1 As shown, each PNL product has 3 SETs. The protective film is laminated according to the product precision and the difficulty of lamination. Conventionally, each lamination unit will laminate according to SET or according to the entire PNL. Figure 1 These are the differences between the first positioning structure 21 and the second positioning structure 22 in the 3SET. The PNL product is the uncut circuit board during the production process, and the SET is the product after the PNL product has been cut.
[0032] In a preferred embodiment, the diameter of the copper layer window 110 is 3 mm, and the diameter of the protective film window 120 is 2.5 mm.
[0033] In a preferred embodiment, the first width is in the range of (0.1-0.2) mm, and the hollow pattern is made by etching the copper layer. Figure 5 As shown, when performing lamination accuracy verification, under standard conditions, the boundary line of the protective film window 120 is located at the center of the annular mark. The overlap position of the circular edge line of the protective film window 120 on the annular mark is used to visually identify the misalignment deviation, thereby determining whether the protective film lamination accuracy is within the range. When the first width is 0.1mm, if the circular edge line of the protective film window 120 falls on the inner circle line of the annular mark when the protective film is laminating, and the circular edge line of the protective film window 120 is tangent to the inner circle line of the annular mark, the protective film alignment deviation is 0.05mm.
[0034] In a preferred embodiment, the color of the protective film is black, brown or white.
[0035] In a preferred embodiment, the hollow pattern also includes an anti-reverse pasting mark 112 arranged inside the circular arc mark 111, and the forward pattern of the anti-reverse pasting mark 112 is rotated 180 degrees to obtain a reverse pattern, and the forward pattern and reverse pattern of the anti-reverse pasting mark are different. The design of the anti-reverse pasting mark 112 is suitable for the lamination of protective films of all colors such as black and yellow. By directly visually observing whether the "CV" mark is exposed, it is determined whether the protective film is reversed by 180° rotation. In particular, for circuit board products with high similarity and symmetry when the product is rotated 180° (that is, two types of circuit board products with slight differences in actual rotation of 180°), conventional designs are not easy to identify the problem of 180° reverse pasting of the protective film of such products. This new design can facilitate identification.
[0036] In the copper layer window 110, except for the arc mark 111 and the anti-reverse sticking mark 112, the positions are all copper-cut out to avoid excess copper at the window position of the protective film and to avoid waste of gold salt during the gold-plating and gold-plating processes.
[0037] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0038] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.
[0039] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. A circuit board with a positioning structure, characterized in that: It includes a copper clad laminate, a protective film for overlapping the surface of the copper layer of the copper clad laminate, and a positioning structure, the copper clad laminate includes an insulating layer and a copper layer overlapped on the insulating layer, the positioning structure includes a protective film window arranged on the protective film, and a hollow pattern arranged on the copper layer, the protective film window passes through the protective film, the position of the hollow pattern on the copper layer corresponds to the position of the protective film window set on the protective film, the hollow pattern includes a copper layer window passing through the copper layer and an annular mark, the annular mark is located at the center of the copper layer window, the size of the copper layer window is larger than the size of the protective film window, the annular mark has a first width, and the annular mark is partially located in the protective film window.
2. The circuit board according to claim 1, wherein: A plurality of positioning structures are respectively provided at the first end and the second end of the circuit board. The plurality of positioning structures provided at the edge of the first end of the circuit board constitute a first positioning structure arrangement, and the plurality of positioning structures provided at the edge of the second end of the circuit board constitute a second positioning structure arrangement. The positions of the first positioning structure arrangement and the second positioning structure arrangement are asymmetrical to each other.
3. The circuit board according to claim 2, wherein: The first positioning structure arrangement includes a plurality of first positioning structures arranged in a "I" shape at the first end edge position of the circuit board, and the distance between two adjacent first positioning structures is a first distance. The second positioning structure arrangement includes a plurality of second positioning structures arranged in a "I" shape at the second end edge position of the circuit board, and the distance between two adjacent second positioning structures is a second distance. The first distance is greater than the second distance.
4. The circuit board according to claim 1, wherein: The copper layer window is a circular window, and the diameter of the copper layer window is 3 mm.
5. The circuit board according to claim 4, wherein: The protective film window is a circular window, and the diameter of the protective film window is 2.5 mm.
6. The circuit board according to claim 1, wherein: The first width has a value range of (0.1-0.2) mm, and the hollow pattern is obtained by etching a copper layer.
7. The circuit board according to claim 1, wherein: The color of the protective film is black, brown or white.
8. The circuit board according to claim 1, wherein: The hollow pattern also includes an anti-reverse sticker mark arranged inside the annular mark. The forward pattern of the anti-reverse sticker mark is rotated 180 degrees to obtain a reverse pattern. The forward pattern and reverse pattern of the anti-reverse sticker mark are different.