Controller with vertically arranged MOS (Metal Oxide Semiconductor) transistors

Abstract

The utility model discloses a controller with MOS tubes arranged up and down, which relates to the field of controllers, and adopts the technical scheme that the controller comprises a shell, a circuit board and MOS tubes, the circuit board is arranged in the shell, a plurality of MOS tubes are arranged on the circuit board, each MOS tube comprises an upper tube and a lower tube, the controller is characterized in that the upper tubes and the lower tubes are distributed in two rows, and the upper tubes and the lower tubes are arranged in two rows. And the upper tubes and the lower tubes of the same group of MOS tubes are distributed in a one-to-one correspondence manner. The upper tube and the lower tube are arranged in two rows, the distance between the upper tube and the lower tube is closer, the wiring inductive reactance is smaller, the electrical parameters of the controller are more ideal, the heating position is more dispersed, the heat dissipation speed is high, a phase line copper bar can be omitted, and the cost is lower.

Description

Technical Field

[0001] The utility model relates to the field of controllers, in particular to a controller with MOS tubes arranged up and down. Background Art

[0002] MOS transistors are important electrical components in controllers. They are field-effect transistors, typically consisting of a P-type substrate, N-type source and drain electrodes, and a metal gate. Based on the circuit structure, MOS transistors are divided into upper and lower transistors.

[0003] In a MOS tube, the source of the upper tube is connected to the drain of the lower tube. Figure 3 As shown, the commonly used arrangement of MOS tubes at present is a single-line arrangement of each group of MOS tubes or an alternating arrangement of upper and lower tubes.

[0004] The single-line arrangement, where upper and lower transistors are arranged alternately, creates a greater distance between the MOS transistors and the terminal blocks, requiring additional conductive components such as phase copper bars, which is costly. This alternating arrangement increases wiring distances, leading to varying distances between the upper and lower transistors within a phase, and suboptimal controller electrical parameters. Utility Model Content

[0005] To address the above technical issues, the present invention provides a controller with MOS tubes arranged in an upper and lower row. Arranging the upper and lower tubes in two rows reduces the distance between them, reduces wiring inductance, and achieves ideal electrical parameters. Heat generation is more dispersed, resulting in faster heat dissipation and the elimination of copper wires, thus reducing costs.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a controller with MOS tubes arranged up and down, comprising a housing, a circuit board and MOS tubes, wherein the circuit board is arranged in the housing, and a plurality of MOS tubes are arranged on the circuit board, wherein the MOS tubes include upper tubes and lower tubes, and wherein the upper tubes and lower tubes of the same group of MOS tubes are arranged one by one relative to each other.

[0007] This solution arranges the upper and lower tubes in two rows, which creates a closer distance between them and reduces wiring inductance. This results in ideal controller electrical parameters, minimal oscillation when the MOS tubes are turned on, and smaller voltage spikes when they are turned off, reducing switching losses. Furthermore, the two rows provide a large heat dissipation area, dispersing heat more efficiently and quickly. This eliminates the need for copper wires in the phase conductors, resulting in lower costs.

[0008] Preferably, the MOS tube is pressed against the inner wall of the housing by the circuit board, so that the housing can be used for heat dissipation, and the circuit board presses the MOS tube, making the fixation more stable and firm.

[0009] Preferably, the outer wall of the housing is provided with heat dissipation fins corresponding to the MOS tube, which can improve the heat dissipation efficiency of the housing to the MOS tube.

[0010] Preferably, the housing is made of aluminum, which is durable and reliable.

[0011] Preferably, the shell is filled with glue. After the glue is filled inside, the thermal capacity is increased, and the controller with the same MOS tube parameters can achieve a larger phase current, which saves more cost.

[0012] Preferably, the connector is located between the upper tube and the lower tube. The copper bar of the phase line can be omitted, reducing costs.

[0013] Preferably, the connector includes a terminal block.

[0014] Preferably, the screws pass through the terminal block and the circuit board in sequence and are connected to the support bar, and the support bar is clamped with the inner wall of the housing, thereby fixing the circuit board, the terminal block and the MOS tube at the same time.

[0015] Preferably, the inner wall of the housing is provided with a strip-shaped slot parallel to the MOS tube, and the lower end of the support bar is snapped into the strip-shaped slot, so as to facilitate the installation of the support bar.

[0016] Beneficial effects of the utility model:

[0017] 1. The upper and lower tubes are arranged in two rows. The distance between the upper and lower tubes is closer, the wiring inductance is smaller, the electrical parameters of the controller are more ideal, the oscillation when the MOS tube is turned on is small, and the voltage spike when it is turned off is also smaller, which can reduce the switching loss of the MOS tube.

[0018] 2. The two rows of heat dissipation have a large area, which can disperse the heat generation position, dissipate heat quickly and efficiently. The connector is in the middle of the MOS tube, eliminating the phase copper bar and reducing the cost.

[0019] 3. The internal glue filling treatment not only fixes the MOS tube, but also increases the thermal capacity, so that the temperature rise of the controller is better controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only three of the drawings of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 An exploded view of an embodiment of the present utility model;

[0022] Figure 2This is a diagram showing the distribution of MOS tubes relative to the circuit board according to an embodiment of the utility model;

[0023] Figure 3 A schematic diagram of the prior art of an embodiment of the present utility model;

[0024] Among them, 1. Shell; 2. Circuit board; 3. MOS tube; 4. Lower tube; 5. Upper tube; 6. Support bar; 7. Strip slot; 8. Heat sink fin; 9. Connector; 10. Copper bar. DETAILED DESCRIPTION

[0025] In order to deepen the understanding of the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. The embodiments are only used to explain the present invention and do not limit the scope of protection of the present invention.

[0026] Example

[0027] like Figure 1 As shown, a controller with MOS tubes arranged up and down includes a housing 1, a circuit board 2, and MOS tubes 3. The circuit board 2 is arranged in the housing 1, and a plurality of MOS tubes 3 are arranged on the circuit board 2. The MOS tubes 3 include upper tubes 5 and lower tubes 4. It is characterized in that the upper tubes 5 and lower tubes 4 are arranged in two rows, and the upper tubes 5 and lower tubes 4 of the same group of MOS tubes 3 are arranged one by one relative to each other.

[0028] This solution adopts the arrangement of upper tubes 5 and lower tubes 4 in two rows. The distance between the upper tubes 5 and the lower tubes 4 is closer, the wiring inductance is smaller, the electrical parameters of the controller are more ideal, the oscillation when the MOS tube 3 is turned on is small, and the voltage spike when it is turned off is also smaller, which can reduce the switching loss of the MOS tube 3. In addition, the two rows have a large heat dissipation area, which can make the heat generation location more dispersed, the heat dissipation speed is fast, the efficiency is high, and the cost is reduced. At the same time, the heat generation of the copper bar 10, the current carrier, is reduced. It can save Figure 3 The copper bars of the three phases U, V and W.

[0029] Combine Figure 2 As shown, the MOS tube 3 is pressed against the inner wall of the housing 1 by the circuit board 2. The housing 1 can be used for heat dissipation, and the circuit board 2 presses the MOS tube 3, making the fixation more stable and firm.

[0030] The outer wall of the housing 1 is provided with heat dissipation fins 8 corresponding to the MOS tube 3 , which can improve the heat dissipation efficiency of the housing 1 to the MOS tube 3 .

[0031] The housing 1 is made of aluminum, which is durable and reliable.

[0032] The housing 1 is filled with glue to increase the thermal capacity. A controller with the same MOS tube 3 parameters can achieve a larger phase current, thus saving costs.

[0033] The connector 9 is located between the upper tube 5 and the lower tube 4. Figure 3 Copper bars for U, V and W phases to reduce costs

[0034] The plug connector 9 includes a wiring socket.

[0035] The screws pass through the terminal block and the circuit board 2 in sequence and are connected to the support bar 6, which is clamped to the inner wall of the housing 1. At the same time, the circuit board 2, the terminal block and the MOS tube 3 are fixed at the same time.

[0036] The inner wall of the housing 1 is provided with a strip-shaped slot 7 parallel to the MOS tube 3 , and the lower end of the support bar 6 is snapped into the strip-shaped slot 7 , so as to facilitate the installation of the support bar 6 .

[0037] Beneficial effects of the utility model:

[0038] 1. The upper tubes 5 and lower tubes 4 are arranged in two rows. The upper tubes 5 and lower tubes 4 are closer together, the wiring inductance is smaller, the electrical parameters of the controller are more ideal, the oscillation when the MOS tube 3 is turned on is small, and the voltage spike when it is turned off is also smaller, which can reduce the switching loss of the MOS tube 3.

[0039] 2. The two rows of heat dissipation area are large, which can make the heat dissipation position more dispersed, the heat dissipation speed is fast and the efficiency is high. The connector is in the middle of the MOS tube 3, which can save Figure 3 The copper bars for the three phases U, V and W are lower in cost.

[0040] 3. The internal glue filling process not only fixes the MOS tube 3, but also increases the thermal capacity, so that the temperature rise of the controller is better controlled.

[0041] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A controller with MOS tubes arranged in an upper and lower arrangement, comprising a housing (1), a circuit board (2) and a MOS tube (3), wherein the circuit board (2) is arranged in the housing (1), and a plurality of MOS tubes (3) are arranged on the circuit board (2), wherein the MOS tubes (3) include an upper tube (5) and a lower tube (4), and wherein: The upper tubes (5) and the lower tubes (4) are arranged in two rows, and the upper tubes (5) and the lower tubes (4) of the same group of MOS tubes (3) are arranged relative to each other.

2. The controller with MOS tubes arranged up and down according to claim 1, characterized in that: The MOS tube (3) is pressed by the circuit board (2) against the inner wall of the housing (1).

3. The controller with MOS tubes arranged up and down according to claim 2, characterized in that: The outer wall of the housing (1) is provided with heat dissipation fins (8) corresponding to the MOS tube (3).

4. The controller with MOS tubes arranged up and down according to claim 3, characterized in that: The housing (1) is made of aluminum.

5. The controller with MOS tubes arranged up and down according to claim 1, characterized in that: The interior of the shell (1) is filled with glue.

6. The controller with MOS tubes arranged up and down according to claim 1, characterized in that: The connector (9) is located between the upper tube (5) and the lower tube (4).

7. The controller with MOS tubes arranged up and down according to claim 6, characterized in that: The plug connector (9) comprises a wiring seat.

8. The controller with MOS tubes arranged up and down according to claim 7, characterized in that: The screws pass through the wiring seat and the circuit board (2) in sequence and are connected to the support bar (6), and the support bar (6) is clamped to the inner wall of the housing (1).

9. The controller with MOS tubes arranged up and down according to claim 8, characterized in that: The inner wall of the housing (1) is provided with a strip-shaped slot (7) parallel to the MOS tube (3), and the lower end of the support bar (6) is snap-connected to the strip-shaped slot (7).

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