Mounting structure and optical storage all-in-one machine

Abstract

The utility model provides an installation structure and an optical storage all-in-one machine, and the installation structure comprises a housing assembly which is internally provided with an installation space; the separation assembly is arranged in the shell assembly so as to separate the mounting space into a first mounting space and a second mounting space; the first mounting assembly is arranged in the first mounting space; the second mounting assembly is arranged in the second mounting space, so that the separation assembly isolates heat generated by the second mounting assembly; the mounting hole penetrates through the shell assembly, and the mounting hole is communicated with the first mounting space; the dismounting assembly is detachably connected with the shell assembly, at least part of the dismounting assembly is arranged in the first mounting space through the mounting hole, and the mounting structure solves the technical problem that the cost of the optical storage all-in-one machine is high.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated optical and storage devices, and in particular to a mounting structure and an integrated optical and storage device. Background Art

[0002] The photovoltaic and energy storage integrated machine is a device that integrates a photovoltaic controller and a bidirectional converter to form an integrated "photovoltaic and energy storage" solution.

[0003] Existing integrated optical and storage systems generate high heat due to their high system integration and compact component installation. This makes the controller susceptible to overheating and damage. Furthermore, if a controller fails, after-sales replacement requires disassembly of several upper components, which is time-consuming and labor-intensive, significantly increasing after-sales costs.

[0004] Therefore, the prior art needs to be further developed. Utility Model Content

[0005] The purpose of the present invention is to overcome the above technical deficiencies and provide a mounting structure and an integrated optical storage device to solve the technical problem of high cost of the integrated optical storage device in the related art.

[0006] In order to achieve the above-mentioned technical objectives, the present invention adopts the following technical solutions: providing an installation structure, including: a shell component, the shell component has an installation space; a partition component, arranged inside the shell component to divide the installation space into a first installation space and a second installation space; a first installation component, arranged in the first installation space; a second installation component, arranged in the second installation space, so that the partition component isolates the heat generated by the second installation component; a mounting hole, arranged through the shell component, the mounting hole is connected to the first mounting space; a disassembly component, the disassembly component is detachably connected to the shell component, and at least a portion of the disassembly component is arranged in the first installation space through the mounting hole.

[0007] Furthermore, the shell assembly includes: a mounting shell, the mounting shell includes a bottom plate and a vertical plate, there are two vertical plates, the two vertical plates are arranged at intervals, and the mounting space is located between the two vertical plates.

[0008] Furthermore, a mounting portion for connecting to the partition assembly is provided on the vertical plate, and the mounting portion protrudes from the vertical plate; and / or a mounting hole is provided on the vertical plate, and mounting holes for passing fasteners are provided around the mounting hole.

[0009] Furthermore, the shell assembly includes: an air inlet plate, which is connected to the vertical plate; an air inlet hole connected to the second installation space is provided on the air inlet plate; an air outlet plate, which is connected to the vertical plate; the air outlet plate is arranged opposite to the air inlet plate, and an air outlet hole connected to the second installation space is provided on the air outlet plate; a top plate, which is connected to the vertical plate, and the top plate is arranged opposite to the bottom plate to shield the first installation space.

[0010] Furthermore, the partition assembly includes a partition and a heat dissipation substrate, both of which are connected to the shell assembly; the heat dissipation substrate and the partition are arranged to be spaced apart, and the heat dissipation substrate and the partition are arranged to be spaced apart; and / or, the first installation space is located on one side of the partition assembly, and the second installation space is located on the other side of the partition assembly.

[0011] Furthermore, the first mounting assembly includes: a first circuit board; a second circuit board spaced apart from the first circuit board; and a metal sheet, one end of the metal sheet being connected to the first circuit board and the other end of the metal sheet being connected to the second circuit board.

[0012] Furthermore, the metal sheet includes: a first connecting sheet, the first connecting sheet is connected to the first circuit board; a second connecting sheet, the second connecting sheet is connected to the first connecting sheet, and the second connecting sheet and the first connecting sheet are arranged perpendicular to each other; a third connecting sheet, the third connecting sheet is connected to the second connecting sheet, and the third connecting sheet is connected to the second circuit board; the second connecting sheet and the third connecting sheet are arranged perpendicular to each other.

[0013] Furthermore, the disassembly assembly includes: a bracket, which is connected to the shell assembly; the bracket is located outside the installation space; an information substrate, which is connected to the bracket; an information board, which is connected to the information substrate; and the information board is located in the installation space.

[0014] Furthermore, the installation structure further includes: a shielding cover, the shielding cover is located in the installation space, and the shielding cover is provided on the disassembly component.

[0015] An integrated optical and storage device includes a mounting structure, which is the above-mentioned mounting structure.

[0016] Beneficial effects:

[0017] The heating device of the installation structure of the utility model is isolated from other devices, which reduces the occurrence rate of controller failure;

[0018] The controller of the installation structure of the utility model is convenient to install, disassemble and replace;

[0019] The installation structure of the utility model can promptly detect controller failure from the outside;

[0020] The installation structure of the utility model adopts the form of upper and lower layered isolation to isolate the heat source, thereby preventing the device from failing due to heat and ensuring the reliable operation of the system.

[0021] The modular design of the mounting structure of the utility model makes the controller easy to install, disassemble and replace, thus reducing maintenance and after-sales costs;

[0022] The transparent module bracket of the mounting structure of the utility model allows the status indicator light to be seen from the outside, so that controller failure can be discovered in time for maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the exploded structure of the installation structure used in the embodiment of the present utility model;

[0024] Figure 2 This is a structural diagram of the first mounting assembly of the mounting structure adopted in an embodiment of the present utility model;

[0025] Figure 3 yes Figure 2 A partial enlarged view of part I;

[0026] Figure 4 This is a structural diagram of a partition assembly of the installation structure adopted in an embodiment of the present utility model;

[0027] Figure 5 It is a structural diagram of the second mounting assembly of the mounting structure adopted in the embodiment of the present utility model;

[0028] Figure 6 It is a structural schematic diagram of the disassembly assembly of the installation structure provided by an embodiment of the utility model.

[0029] The above drawings include the following reference numerals:

[0030] 10. Installation space;

[0031] 1. Housing assembly; 11. Mounting housing; 111. Bottom plate; 112. Vertical plate; 113. Mounting portion; 12. Air inlet plate; 121. Air inlet hole; 13. Air outlet plate; 131. Air outlet hole; 14. Top plate;

[0032] 2. Separation component; 21. Partition plate; 22. Heat dissipation substrate;

[0033] 3. First mounting assembly; 31. First circuit board; 32. Second circuit board; 33. Metal sheet; 331. First connecting sheet; 332. Second connecting sheet; 333. Third connecting sheet;

[0034] 4. Second installation component;

[0035] 5. Mounting hole;

[0036] 6. Disassembly assembly; 61. Bracket; 62. Information substrate; 63. Information board;

[0037] 7. Shielding cover. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0039] join Figures 1 to 6 According to an embodiment of the present invention, an installation structure is provided, comprising: a housing assembly 1, wherein the housing assembly 1 has an installation space 10; a partition assembly 2, arranged inside the housing assembly 1, to divide the installation space 10 into a first installation space and a second installation space; a first installation assembly 3, arranged in the first installation space; a second installation assembly 4, arranged in the second installation space, so that the partition assembly 2 isolates the heat generated by the second installation assembly 4; a mounting hole 5, which is arranged through the housing assembly 1 and is connected to the first installation space; and a disassembly assembly 6, wherein the disassembly assembly 6 is detachably connected to the housing assembly 1, and at least a portion of the disassembly assembly 6 is arranged in the first installation space through the mounting hole 5. By adopting the above-mentioned arrangement, the interior of the housing assembly 1 is separated and arranged, which can effectively isolate the heat-generating components from other components, prevent other components from failing due to heat, and greatly ensure the safe operation of the system. In addition, the disassembly assembly 6, which is easily damaged and often needs to be replaced, is detachably arranged in the installation space, which increases work efficiency, reduces costs, and solves the technical problem of high cost of the optical storage integrated machine.

[0040] See also Figure 1 In the installation structure of this embodiment, the shell assembly 1 includes: a mounting shell 11, the mounting shell 11 includes a bottom plate 111 and a vertical plate 112, there are two vertical plates 112, the two vertical plates 112 are arranged at intervals, and the installation space 10 is located between the two vertical plates 112.

[0041] In the installation structure of this embodiment, a mounting portion 113 for connecting to the partition assembly 2 is provided on the vertical plate 112, and the mounting portion 113 protrudes from the vertical plate 112; and / or, a mounting hole 5 is provided on the vertical plate 112, and mounting holes 5 for passing fasteners are provided around the mounting hole 5.

[0042] Specifically, the disassembly component 6 is installed by fasteners, thereby facilitating the replacement of the disassembly component 6 .

[0043] See also Figure 1In the installation structure of this embodiment, the housing assembly 1 includes: an air inlet plate 12 connected to a vertical plate 112; provided with an air inlet hole 121 communicating with the second installation space; an air outlet plate 13 connected to the vertical plate 112; disposed opposite the air inlet plate 12 and provided with an air outlet hole 131 communicating with the second installation space; and a top plate 14 connected to the vertical plate 112 and disposed opposite the bottom plate 111 to shield the first installation space. This creates an airflow channel within the second installation space, facilitating heat dissipation within the space.

[0044] See also Figure 4 In the installation structure of this embodiment, the partition component 2 includes a partition 21 and a heat dissipation substrate 22, and the partition 21 and the heat dissipation substrate 22 are both connected to the shell component 1; the heat dissipation substrate 22 is arranged to be spaced apart from the partition 21, and the heat dissipation substrate 22 is arranged to be spaced apart from the partition 21; and / or, the first installation space is located on one side of the partition component 2, and the second installation space is located on the other side of the partition component 2.

[0045] Specifically, the mounting structure adopts an upper and lower layered design, where the partition 21 and the heat dissipation substrate 22 together form a partition layer, isolating the heat from the lower radiator fins and reactor, preventing heat rise from affecting the normal operation of other devices.

[0046] See also Figure 2 、 Figure 3 In the installation structure of this embodiment, the first installation component 3 includes: a first circuit board 31; a second circuit board 32 spaced apart from the first circuit board 31; a metal sheet 33, one end of the metal sheet 33 is connected to the first circuit board 31, and the other end of the metal sheet 33 is connected to the second circuit board 32.

[0047] Specifically, for the electrical connections between the internal photovoltaic controller and the current converter, as well as other locations requiring high current (>84A), conventional wires have insufficient current carrying capacity, while thicker wires would be difficult to bend and connect. Therefore, a metal sheet 33 with a cross-sectional area of ​​3 x 15 mm is used as the conductor. The material is a highly conductive metal such as copper or its alloy.

[0048] Specifically, metal sheets 33 are used for connection at locations with large overcurrent, such as the AC input terminal, energy storage input terminal, and bus capacitor connection terminal. The metal sheet 33 is wrapped with an insulating layer on the outside and can pass a larger current.

[0049] See also Figure 3In the mounting structure of this embodiment, the metal sheet 33 includes: a first connecting sheet 331, the first connecting sheet 331 is connected to the first circuit board 31; a second connecting sheet 332, the second connecting sheet 332 is connected to the first connecting sheet 331, and the second connecting sheet 332 and the first connecting sheet 331 are arranged perpendicular to each other; a third connecting sheet 333, the third connecting sheet 333 is connected to the second connecting sheet 332, and the third connecting sheet 333 is connected to the second circuit board 32; the second connecting sheet 332 and the third connecting sheet 333 are arranged perpendicular to each other.

[0050] Specifically, the shape of the metal sheet 33 in this embodiment can be a Z-shape or other shape that meets installation requirements.

[0051] In the installation structure of this embodiment, see Figure 2 、 Figure 3 The disassembly component 6 includes: a bracket 61, which is connected to the shell component 1; the bracket 61 is located outside the installation space 10; an information substrate 62, which is connected to the bracket 61; an information board 63, which is connected to the information substrate 62; and the information board 63 is located inside the installation space 10.

[0052] Specifically, the disassembly component 6 in this embodiment is an information controller module, comprising a bracket 61, an information substrate 62, and an information board 63. The information substrate 62 is secured to the bracket 61 using screws or snap-fit ​​connections, while the information board 63 is connected to the information substrate 62 via pins, achieving an electrical connection. As described above, the bracket 61, information substrate 62, and information board 63 are interconnected to form a module. This module is embedded from the outside, making installation, maintenance, and replacement simple and time-saving.

[0053] In the installation structure of this embodiment, see Figure 5 The installation structure further includes: a shielding cover 7 , the shielding cover 7 is located in the installation space 10 , and the shielding cover 7 is provided on the disassembly component 6 .

[0054] The information controller module is located next to the reactor, a device that generates significant heat and possesses a strong magnetic field. This can easily damage the module due to heat and electromagnetic interference, leading to malfunction. The shielding cover 7 forms a housing cavity, which, in conjunction with the partition assembly 2, isolates the module from heat and electromagnetic interference, ensuring proper operation.

[0055] The integrated optical and storage device of this embodiment includes a mounting structure, which is the aforementioned mounting structure.

[0056] The utility model provides an integrated optical storage device to solve the problems of inconvenient replacement of the lower controller and severe heat generation in the prior art.

[0057] Example 1:

[0058] The PV-storage system is divided into two layers: the upper layer is the controller layer, which includes components such as the PV controller module and the inverter controller module; the lower layer is the heat generation layer, which includes the cooling fan module, radiator, reactor, and information controller. This layered design effectively isolates heat-generating components from other components, preventing them from failing due to heat and greatly ensuring safe system operation.

[0059] The cooling fan is located on the lower layer near the air inlet plate 12, and the cooling fan is electrically connected to the inverter controller. When the cooling fan is running, the airflow flows through the radiator and the reactor in sequence, achieving the effect of forced air cooling for the radiator and the reactor; the reactor is located on the lower layer near the rear side plate; the radiator is located between the cooling fan and the reactor on the lower layer; the information controller is located next to the reactor on the lower layer, and the information controller (the disassembly component 6 of this embodiment) adopts a modular design, in which the information board 63 is connected to the information substrate 62 through a pin header and is electrically connected at the same time. The information substrate 62 is installed on the bracket 61, so that the bracket 61, the information substrate 62, and the information board 63 are integrated into one piece. During installation, it only needs to be embedded and installed from the side of the electrical box (that is, the shell component 1 of this embodiment), which makes it easy to disassemble and replace.

[0060] The optical storage integrated device adopts an upper and lower layered design. The partition 21 and the heat dissipation substrate 22 together form a partition, which isolates the heat from the lower radiator fins and the reactor, preventing the heat rise from affecting the normal operation of other devices.

[0061] The information controller module is located next to the reactor, a device that generates significant heat and has a strong magnetic field. This can easily damage the module due to heat and electromagnetic interference, leading to malfunction. The shielding cover 7 forms a housing cavity, which, along with the partition 21, isolates the module from heat and electromagnetic interference, ensuring proper operation.

[0062] In addition, the bracket 61 is made of transparent PC. This allows the status indicator to be seen from the outside of the electrical box if the information controller module fails. A steady on indicator indicates the module is functioning properly, while a flashing indicator indicates a module failure requiring repair. This design allows for prompt detection of faults in the underlying information controller module, allowing for prompt repair and replacement.

[0063] For the electrical connections between the internal PV controller and the current converter, as well as other applications requiring high current (>84A), conventional wires have insufficient current carrying capacity, while thicker wires are difficult to bend and connect. Therefore, a metal sheet 33 is used as the conductor. This sheet has a cross-sectional area of ​​3 x 15 mm and is made of a highly conductive metal such as copper or its alloys. The sheet can be shaped like a Z, or any other suitable configuration to meet installation requirements. Mounting holes are provided at both ends of the sheet, allowing it to be screwed to the corresponding terminal blocks.

[0064] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in a sequence other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0065] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments, and this embodiment will not be described in detail here.

[0066] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0067] In the above embodiments of the present application, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0068] The above is only a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A mounting structure, characterized in that: include: A housing assembly (1), wherein the housing assembly (1) has an installation space (10); A partition assembly (2) is arranged inside the housing assembly (1) to separate the installation space (10) into a first installation space and a second installation space; A first installation component (3), arranged in the first installation space; a second mounting assembly (4) disposed in the second mounting space so that the partition assembly (2) isolates heat generated by the second mounting assembly (4); A mounting hole (5) is provided through the housing assembly (1), the mounting hole (5) being in communication with the first mounting space; A disassembly assembly (6) is detachably connected to the housing assembly (1), and at least a portion of the disassembly assembly (6) is disposed in the first installation space through the installation hole (5).

2. The mounting structure according to claim 1, wherein: The housing assembly (1) comprises: The mounting shell (11) comprises a bottom plate (111) and a vertical plate (112). There are two vertical plates (112), and the two vertical plates (112) are arranged at intervals. The mounting space (10) is located between the two vertical plates (112).

3. The mounting structure according to claim 2, wherein: The vertical plate (112) is provided with a mounting portion (113) for connecting to the partition assembly (2), and the mounting portion (113) is provided protruding from the vertical plate (112); and / or, The mounting hole (5) is provided on the vertical plate (112), and mounting holes (5) for inserting fasteners are provided around the mounting hole (5).

4. The mounting structure according to claim 2, wherein: The housing assembly (1) comprises: an air inlet plate (12), the air inlet plate (12) being connected to the vertical plate (112); an air inlet hole (121) communicating with the second installation space being provided on the air inlet plate (12); an air outlet plate (13), the air outlet plate (13) being connected to the vertical plate (112); the air outlet plate (13) being arranged opposite to the air inlet plate (12), and the air outlet plate (13) being provided with an air outlet hole (131) communicating with the second installation space; A top plate (14), the top plate (14) being connected to the vertical plate (112), and the top plate (14) being arranged opposite to the bottom plate (111) to shield the first installation space.

5. The mounting structure according to claim 1, wherein: The partition assembly (2) comprises a partition (21) and a heat dissipation substrate (22), wherein the partition (21) and the heat dissipation substrate (22) are both connected to the housing assembly (1); the heat dissipation substrate (22) is spaced apart from the partition (21); and / or, The first installation space is located on one side of the partition component (2), and the second installation space is located on the other side of the partition component (2).

6. The mounting structure according to claim 1, wherein: The first installation component (3) comprises: a first circuit board (31); a second circuit board (32) spaced apart from the first circuit board (31); A metal sheet (33), one end of the metal sheet (33) is connected to the first circuit board (31), and the other end of the metal sheet (33) is connected to the second circuit board (32).

7. The mounting structure according to claim 6, wherein: The metal sheet (33) comprises: a first connecting piece (331), the first connecting piece (331) being connected to the first circuit board (31); a second connecting piece (332), the second connecting piece (332) being connected to the first connecting piece (331), the second connecting piece (332) and the first connecting piece (331) being arranged perpendicular to each other; A third connecting piece (333), the third connecting piece (333) is connected to the second connecting piece (332), and the third connecting piece (333) is connected to the second circuit board (32); the second connecting piece (332) and the third connecting piece (333) are arranged perpendicular to each other.

8. The mounting structure according to claim 1, wherein: The disassembly assembly (6) comprises: a bracket (61), the bracket (61) being connected to the housing assembly (1); the bracket (61) being located outside the installation space (10); An information substrate (62) connected to the bracket (61); An information board (63), the information board (63) is connected to the information substrate (62); the information board (63) is located in the installation space (10).

9. The mounting structure according to claim 1, wherein: The mounting structure further comprises: A shielding cover (7), the shielding cover (7) is located in the installation space (10), and the shielding cover (7) is arranged on the disassembly component (6).

10. An integrated optical storage device, comprising a mounting structure, characterized in that: The mounting structure is the mounting structure according to any one of claims 1 to 9.

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