Temperature control component and reagent temperature control device for digital micro-fluidic chip

Abstract

The utility model relates to a temperature control component for a digital micro-fluidic chip and a reagent temperature control device, the temperature control component comprises a flow channel substrate, a first temperature control assembly and a negative pressure module, the flow channel substrate is provided with at least one temperature control flow channel, the temperature control flow channel is configured to contain liquid drops, and at least partial area of the temperature control flow channel is provided with a breathable waterproof layer; the first temperature control assembly is arranged on one side of the flow channel substrate and is configured to heat or cool the temperature control flow channel; the negative pressure module is connected to the flow channel substrate and / or the first temperature control assembly and pumps out bubbles in the liquid drops or gas dissolved in the liquid drops through the breathable waterproof layer. Compared with the prior art, the reagent heating device has the advantages that the reagent can be independently heated, direct heating on the surface of the chip is avoided, the chip material is not limited, the heating efficiency is high, the heating time is short, and the problem of bubbles caused by high-temperature heating of the reagent can be solved; and when the heating temperature is high, the problems that the reagent adheres to the chip and the performance of the chip is reduced cannot occur.

Description

Technical Field

[0001] The present application relates to the field of digital microfluidics technology, and in particular to a temperature control component and a reagent temperature control device for a digital microfluidics chip. Background Art

[0002] Digital microfluidics (DMF) is a disruptive technology based on programmable droplet control for the design, integration, and operation of microfluidic systems. It leverages the precise manipulation of droplets in the microliter to nanoliter range to enable complex laboratory analyses. The key to digital microfluidics is the discretization of liquid flows. In this droplet-based microfluidics, droplets act as individual reaction vessels, controlled individually through electrowetting on a specialized dielectric (EWOD). This enables processing small volumes of reagents and samples, separating interfering substances, and preventing analyte loss within the droplets. Furthermore, DMF does not rely on micropumps, microvalves, or micromixers, nor does it require complex fluidic channels. It offers advantages such as simple structure, high containment, cross-contamination prevention, and high automation. DMF is often used in conjunction with analytical tools such as mass spectrometry, colorimetry, electrochemical analysis, and electrochemiluminescence. In this technology, complex laboratory procedures can be implemented through a series of combined steps or automated serial operations.

[0003] Digital microfluidics usually requires temperature control of reagents. Existing technologies often heat the lower end of the microfluidic chip directly through heat conduction, without any additional device designed to achieve temperature control. Digital microfluidic chips are mostly made of pure glass or PCB substrates. Due to the limitations of the chip material, heating affects the heating efficiency, resulting in low heating efficiency and long heating times. In addition, for digital microfluidic chips that require PCR processes, the chip needs to be heated to 95°C-98°C, which brings two problems: 1. High temperature causes the active ingredients of the reagents to deform and easily adsorb on the chip surface, thereby reducing the hydrophilic and hydrophobic properties of the chip surface coating, which in turn weakens or fails the droplet-driving function; 2. High temperature can cause bubbles to precipitate from the reagents or the actual ingredients to volatilize to form bubbles, which hinder liquid movement and also weaken or fail the droplet-driving function. Utility Model Content

[0004] The purpose of this application is to provide a temperature control component and a reagent temperature control device for a digital microfluidic chip. The temperature control component and the reagent temperature control device for a digital microfluidic chip can realize separate heating of the reagent, avoid direct heating on the chip surface, are not limited by the chip material, have high heating efficiency, short heating time, and better droplet temperature consistency. It can also solve the bubble problem caused by high-temperature heating of the reagent, and there will be no problem of reagent adhesion to the chip and chip performance degradation when the heating temperature is high.

[0005] In order to achieve the above purpose, the present invention is implemented through the following scheme:

[0006] In a first aspect, the present invention provides a temperature control component for a digital microfluidic chip, comprising:

[0007] A flow channel substrate, wherein the flow channel substrate is provided with at least one temperature-controlled flow channel, the temperature-controlled flow channel is configured to accommodate droplets and is connected to the reaction chamber of the digital microfluidic chip, and at least a portion of the temperature-controlled flow channel is provided with a breathable and waterproof layer;

[0008] a first temperature control component, which is disposed on one side of the flow channel substrate and is configured to heat and / or cool the temperature control flow channel;

[0009] A negative pressure module is connected to the flow channel substrate and / or the first temperature control component, and extracts bubbles in the liquid droplets or gases dissolved in the liquid droplets through the breathable and waterproof layer.

[0010] In an optional embodiment, the flow channel substrate and / or the first temperature control component is provided with a negative pressure channel, one end of the negative pressure channel is connected to the temperature control flow channel through the breathable and waterproof layer, and the negative pressure module is connected to the other end of the negative pressure channel.

[0011] In an optional embodiment, the breathable and waterproof layer includes a polymer waterproof and breathable membrane.

[0012] In an optional embodiment, a flow channel groove opening toward the first temperature control component is formed on one side of the flow channel substrate close to the first temperature control component, the breathable waterproof layer is laid at the opening of the flow channel groove, and the breathable waterproof layer and the inner wall of the flow channel groove are surrounded to form the temperature control flow channel.

[0013] In an optional embodiment, the breathable and waterproof layer is wound to form a flow channel pipeline, the flow channel pipeline is arranged on a side of the flow channel substrate close to the first heat transfer block, and the temperature control flow channel is formed in the flow channel pipeline.

[0014] In an optional embodiment, the first temperature control component has at least one first temperature zone, the first temperature zone corresponds to the temperature control channel, and the first temperature control component is configured to raise, lower or maintain the first temperature zone to a preset temperature.

[0015] In an optional embodiment, the first temperature control component includes a first heat transfer block and a first temperature control unit, the first heat transfer block is arranged on the surface of the flow channel substrate and is arranged corresponding to the temperature control flow channel, the first temperature control unit is connected to the first heat transfer block, and the first heat transfer block is configured to realize heat transfer between the first temperature control unit and the temperature control flow channel.

[0016] In an optional embodiment, a receiving groove opening toward the flow channel substrate is further provided on a side of the first heat transfer block close to the flow channel substrate, the flow channel substrate covers the opening of the receiving groove, the receiving groove corresponds to at least one of the temperature control flow channels, the breathable and waterproof layer is accommodated in the receiving groove, and the negative pressure channel is connected to the receiving groove.

[0017] In an optional embodiment, the bottom wall of the accommodating groove is provided with a first through hole, the outer wall of the first heat transfer block is provided with a second through hole, the second through hole is connected to the negative pressure module, and the first through hole and the second through hole are connected through the negative pressure channel.

[0018] In an optional embodiment, a sealing gasket is further provided between the first heat transfer block and the flow channel substrate. The sealing gasket ring is arranged around the accommodating groove, and both sides of the sealing ring gasket are sealed and connected to the first heat transfer block and the flow channel substrate.

[0019] In an optional embodiment, the accommodating groove includes a plurality of groove bodies and connecting grooves, and the plurality of groove bodies are distributed on the first heat transfer block. The breathable and waterproof layer is provided in each of the groove bodies, and corresponds to at least one of the temperature control flow channels. The connecting groove is provided between the plurality of groove bodies and is connected with the plurality of groove bodies at the same time. The first through hole is provided on the bottom wall of the connecting groove.

[0020] In an optional embodiment, the temperature control component for the digital microfluidic chip also includes a second temperature control component, which is arranged on a side of the flow channel substrate away from the first temperature control component, and the second temperature control component is configured to heat or cool the temperature control flow channel.

[0021] In an optional embodiment, the second temperature control component has at least one second temperature zone, the second temperature zone corresponds to the temperature control channel, and the second temperature control component is configured to raise, lower or maintain the second temperature zone to a preset temperature.

[0022] In an optional embodiment, the second temperature control component includes a second heat transfer block and a second temperature control unit, the second heat transfer block is arranged on a side surface of the flow channel substrate away from the first temperature control component and is arranged corresponding to the temperature control flow channel, the second temperature control unit is connected to the second heat transfer block, and the second heat transfer block is configured to realize heat transfer between the second temperature control unit and the temperature control flow channel.

[0023] In a second aspect, the utility model provides a reagent temperature control device, comprising a digital microfluidic chip, a power component, and a temperature control component for a digital microfluidic chip as described in any one of the aforementioned embodiments, wherein the digital microfluidic chip has a reaction chamber, the reaction chamber is connected to the temperature control channel, the power component is connected to the reaction chamber and / or the temperature control channel, and the power component is configured to move the droplets from the reaction chamber to the temperature control channel or to move the droplets from the temperature control channel to the reaction chamber.

[0024] Through the above technical solution, the utility model utilizes a temperature-controlled flow channel in a separately provided flow channel substrate to accommodate droplets, and utilizes a first temperature-controlled component for heating or cooling, thereby enabling individual temperature control of the droplets and avoiding direct heating in the reaction chamber of the digital microfluidic chip. During the heating process, a negative pressure module is utilized for suction, and under the action of negative pressure, bubbles in the droplets or gases dissolved in the droplets can be extracted through the breathable and waterproof layer. Compared with the prior art, the utility model can achieve individual heating of the reagents, avoid direct heating on the chip surface, is not limited by the chip material, has high heating efficiency, short heating time, and better droplet temperature consistency, and can solve the bubble problem caused by high-temperature heating of the reagents. When the heating temperature is high, there will be no problem of reagents adhering to the chip and chip performance degradation.

[0025] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic structural diagram of a temperature control component for a digital microfluidic chip provided in an embodiment of the present application;

[0028] Figure 2A schematic structural diagram of a reagent temperature control device provided in an embodiment of the present application from a first perspective;

[0029] Figure 3 A schematic diagram of the structure of the reagent temperature control device provided in an embodiment of the present application from a second perspective;

[0030] Figure 4 A structural perspective view of the reagent temperature control device provided in an embodiment of the present application at a second viewing angle;

[0031] Figure 5 for Figure 3 Schematic diagram of the cross-sectional structure at AA in the middle;

[0032] Figure 6 for Figure 3 Schematic diagram of the cross-sectional structure at the middle BB;

[0033] Figure 7 for Figure 3 Schematic diagram of the cross-section structure at CC;

[0034] Figure 8 This is an exploded schematic diagram of the reagent temperature control device provided in an embodiment of the present application from a third perspective;

[0035] Figure 9 An exploded schematic diagram of the reagent temperature control device provided in an embodiment of the present application from a fourth viewing angle;

[0036] Figure 10 A schematic diagram of a temperature control component for a digital microfluidic chip provided in another preferred embodiment of the present application;

[0037] Figure 11 for Figure 9 Schematic diagram of the structure of the first temperature control component.

[0038] icon:

[0039] 100-temperature control component for digital microfluidic chip; 110-channel substrate; 111-temperature control channel; 112-channel groove; 113-channel pipeline; 120-first temperature control component; 121-first heat transfer block; 122-first temperature control unit; 123-accommodating groove; 124-first through hole; 125-second through hole; 126-sealing gasket; 127-groove body; 128-connecting groove; 130-negative pressure module; 131-negative pressure channel; 140-breathable and waterproof layer; 150-second temperature control component; 151-second heat transfer block; 152-second temperature control unit; 200-reagent temperature control device; 210-digital microfluidic chip; 211-reaction chamber; 230-power component. DETAILED DESCRIPTION

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0041] In the description of this application, it should be noted that the terms "inner" and "outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" and the like are used solely for distinction and should not be construed as indicating or implying relative importance.

[0042] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0043] As disclosed in the background art, the current temperature control solution for regulating the temperature of reagents within a microfluidic chip is to directly heat / cool the chip. This temperature control method is limited by the chip material. On the one hand, for a digital microfluidic chip 210 based on a glass substrate, there is a temperature gradient in the horizontal direction, making it difficult to ensure temperature consistency across the entire droplet. On the other hand, for a digital microfluidic chip 210 based on a PCB substrate, the PCB substrate has poor thermal conductivity and poor heating efficiency. In addition, for a digital microfluidic chip 210 that requires a PCR process, the chip needs to be heated to 95°C-98°C, which brings two problems: 1. High temperature causes the active ingredients of the reagents to deform and easily adsorb on the chip surface, thereby reducing the hydrophilicity and hydrophobicity of the chip surface coating, which in turn weakens or fails the droplet-driving function; 2. High temperature can cause the reagent to precipitate bubbles or the actual ingredients to volatilize to form bubbles, which can hinder liquid movement, similarly weakening or failing the droplet-driving function.

[0044] In order to solve the above problems, the existing technology mainly adopts two methods to solve them. One is to optimize the chip structure design, enhance the thermal conductivity and improve the heating uniformity; the other is to introduce a special bubble capture structure in the chip to isolate and discharge the bubbles. The former is mainly achieved by changing the chip material, adding heat dissipation structure, etc., while the latter requires the design of special structures such as micro valves and channels inside the chip. Although optimizing the chip structure design can improve the heating efficiency, it is difficult to apply it directly to existing chips and is not compatible with existing chips, which greatly increases the cost. In addition, changing the chip material and structure may affect the chip function and performance. Although the introduction of a bubble capture structure can effectively remove bubbles, it will increase the complexity and cost of the chip, and the bubble capture effect is not ideal. In addition, the existing technology cannot solve the problems of easy adhesion and chip performance degradation when the heating temperature is high.

[0045] In order to solve the above problems, the embodiment of the present invention provides a new temperature control component 100 and reagent temperature control device 200 for a digital microfluidic chip. The temperature control component 100 and reagent temperature control device 200 for a digital microfluidic chip are introduced in detail below. It should be noted that, in the absence of conflict, the features in the embodiments of this application can be combined with each other.

[0046] See also Figures 1 to 7 The embodiment of the present invention provides a temperature control component 100 for a digital microfluidic chip, which is independently arranged relative to the digital microfluidic chip 210, and can realize independent heating of the reagent, avoid direct heating on the chip surface, and is not limited by the chip material. It has high heating efficiency, short heating time, and better droplet temperature consistency. It can also solve the bubble problem caused by high-temperature heating of the reagent. When the heating temperature is high, there will be no problem of reagent adhering to the chip and chip performance degradation.

[0047] The temperature control component 100 for a digital microfluidic chip provided by an embodiment of the present invention includes a flow channel substrate 110, a first temperature control component 120 and a negative pressure module 130. The flow channel substrate 110 is provided with at least one temperature control flow channel 111, which is configured to accommodate droplets and is connected to the reaction chamber 211 of the digital microfluidic chip 210, and at least a portion of the temperature control flow channel 111 is provided with a breathable waterproof layer 140; the first temperature control component 120 is provided on one side of the flow channel substrate 110 and is configured to heat or cool the temperature control flow channel 111; the negative pressure module 130 is connected to the flow channel substrate 110 and / or the first temperature control component 120, and extracts bubbles in the droplets and / or gases dissolved in the droplets through the breathable waterproof layer 140.

[0048] It should be noted that the flow channel substrate 110 can be made of a material with good thermal conductivity, such as glass or metal, and the first temperature control component 120 is directly attached to the surface of the flow channel substrate 110, which can directly heat the temperature control channel 111, avoiding the problems caused by heating through the chip in conventional technology. Furthermore, in this embodiment, the temperature control channel 111 in the separately set flow channel substrate 110 is used to accommodate the droplets, and the first temperature control component 120 is used for heating or cooling, so that the droplets can be individually temperature controlled, avoiding direct heating in the reaction chamber 211 of the digital microfluidic chip 210. It is not limited to the chip material, has high heating efficiency, short heating time, and better droplet temperature consistency. During the heating process, the negative pressure module 130 is used for suction. Under the action of negative pressure, the bubbles in the droplets or the gas dissolved in the droplets can be extracted through the breathable waterproof layer 140, which can solve the bubble problem caused by high-temperature heating of the reagent. When the heating temperature is high, there will be no problem of reagent adhering to the chip and chip performance degradation.

[0049] In some embodiments, the flow channel substrate 110 and / or the first temperature control component 120 are provided with a negative pressure channel 131, or both the flow channel substrate 110 and the first temperature control component 120 are provided with a negative pressure channel 131. Preferably, in this embodiment, the first temperature control component 120 is provided with a negative pressure channel 131, one end of the negative pressure channel 131 is connected to the temperature control flow channel 111 through the breathable waterproof layer 140, and the negative pressure module 130 is connected to the other end of the negative pressure channel 131. Here, the negative pressure channel 131 can be an internal flow channel structure of the first temperature control component 120. In other preferred embodiments of the present invention, the negative pressure channel 131 can also be a separately provided pipeline structure, which directly penetrates the first temperature control component 120 and realizes communication between the breathable waterproof layer 140 and the negative pressure module 130. In particular, the breathable waterproof layer 140 can extract gas dissolved in droplets or dielectric oil during actual operation, thereby being able to extract gas molecules before large particle bubbles are formed.

[0050] It should be noted that, in this embodiment, the negative pressure module 130 can be a negative pressure suction structure, such as a negative pressure pump. The negative pressure module 130 can be independently controlled. When the droplets in the temperature-controlled channel 111 are heated, especially when a PCR process is required, they are usually heated to 95-98°C. At this time, the high temperature will cause bubbles to appear in the droplets. If the bubbles are not cleaned, the movement of the liquid will be hindered. During the heating process, the negative pressure module 130 can be used to extract the gas in the negative pressure channel 131, so that the pressure in the negative pressure channel 131 is reduced, and the breathable waterproof layer 140 can allow gas to pass through and isolate the liquid. Therefore, the bubbles in the droplets will pass through the breathable waterproof layer 140 under the action of strong suction and enter the negative pressure channel 131 and be extracted by the negative pressure module 130, thereby completing the elimination of bubbles.

[0051] In some embodiments, the breathable waterproof layer 140 includes a polymer waterproof breathable membrane. Specifically, the breathable waterproof layer 140 can be a loose porous structure made of a hydrophobic material, such as polypropylene (PP), polytetrafluoroethylene (PTFE), or polyurethane (PU), etc., which is not specifically limited here.

[0052] See also Figure 8 and Figure 9 In some embodiments, a flow channel 112 opening toward the first temperature control component 120 is formed on one side of the flow channel substrate 110 close to the first temperature control component 120, a breathable and waterproof layer 140 is laid at the opening of the flow channel 112, and the breathable and waterproof layer 140 and the inner wall of the flow channel 112 are surrounded to form a temperature control flow channel 111. Among them, one side of the flow channel substrate 110 close to the first temperature control component 120 is partially raised and formed with a number of flow channel grooves 112. The breathable waterproof layer 140 can be directly laid at the opening of the flow channel groove 112, and the breathable waterproof layer 140 can seal the flow channel groove 112 by extrusion or bonding, thereby forming a temperature control flow channel 111. The breathable waterproof layer 140 is located on the heating side of the temperature control flow channel 111, and the heating side is more likely to generate bubbles. Through the strong negative pressure effect of the negative pressure module 130, the bubbles generated in the temperature control flow channel 111 can be directly sucked into the negative pressure channel 131 through the breathable waterproof layer 140 in time.

[0053] It should be noted that in this embodiment, the flow channel 112 can be curved, so that the temperature control flow channel 111 is also curved, thereby reducing the actual occupied area of ​​the temperature control flow channel 111 compared to the straight temperature control flow channel 111, and can increase the flow resistance of the droplets, so that the droplets can be more evenly distributed in the temperature control flow channel 111.

[0054] See also Figure 10 In other preferred embodiments of the present invention, the breathable waterproof layer 140 is wound to form a flow channel 113, which is arranged on the side of the flow channel substrate 110 close to the first heat transfer block 121, and a temperature-controlled flow channel 111 is formed in the flow channel 113. Specifically, the breathable waterproof layer 140 can be directly used to form the flow channel 113, so that the flow channel 113 can be directly heated, with the same heating effect, and the bubbles generated during heating can also be sucked out in time. In addition, since the flow channel 113 can be prepared separately, the difficulty of preparing the flow channel substrate 110 is reduced, which is more conducive to rapid assembly and improved manufacturing efficiency.

[0055] Please continue to see Figures 1 to 8In some embodiments, the first temperature-control assembly 120 has at least one first temperature zone, which corresponds to the temperature-control channel 111. The first temperature-control assembly 120 is configured to raise, lower, or maintain the first temperature zone at a predetermined temperature. Specifically, in this embodiment, each temperature-control channel 111 can correspond to a first temperature zone, so that the entire temperature-control channel 111 can be heated or cooled to a uniform temperature.

[0056] In other preferred embodiments of the present invention, the first temperature control component 120 has multiple first temperature zones, each temperature control channel 111 can correspond to a different first temperature zone, and the preset temperatures of the multiple first temperature zones can be different. Therefore, by controlling the different positions of the droplets in the temperature control channel 111, corresponding to different first temperature zones, different heating temperatures can be achieved, and the applicability is better. Among them, the first temperature control component 120 can be heated or cooled by multiple independent sub-modules, thereby forming multiple independent temperature-controlled first temperature zones. Preferably, each temperature control channel 111 can be provided with two first temperature zones, and the two first temperature zones can be temperature-controlled separately to achieve different preset temperatures. The droplets move in the temperature control channel 111, thereby being able to switch between the two first temperature zones to achieve different heating or cooling temperatures.

[0057] The first temperature control assembly 120 includes a first heat transfer block 121 and a first temperature control element 122. The first heat transfer block 121 is disposed on the surface of the flow channel substrate 110 and corresponds to the temperature-controlled flow channel 111. The first temperature control element 122 is connected to the first heat transfer block 121 and is configured to facilitate heat transfer between the first temperature control element 122 and the temperature-controlled flow channel 111. Specifically, the first temperature control element 122 includes a first semiconductor refrigeration element, and the first heat transfer block 121 includes a first heat-conducting metal block. The first semiconductor refrigeration element is configured to heat or cool the first heat-conducting metal block. The first heat-conducting metal block is made of a metal material with good thermal conductivity, such as copper, which effectively facilitates heat transfer between the flow channel substrate 110 and the first semiconductor refrigeration element. The first semiconductor refrigeration element has a TEC structure and utilizes the Peltier principle to achieve heating or cooling functions. Specifically, the position of the cold end and the hot end can be switched by controlling the direction of the current. Its basic structure and heating / cooling principles can refer to semiconductor refrigeration elements in the prior art.

[0058] It should be noted that in other preferred embodiments of the present invention, when it comes to heating, the first temperature control unit 122 can also adopt or add other types of heating structures, such as thermal resistance heating stickers or chemical heating sheets, etc. The specific type of the first temperature control unit 122 is not specifically limited here.

[0059] It is worth noting that the first heat transfer block 121 can also be made of other materials with good thermal conductivity, such as glass or ceramic, without limitation. Furthermore, the first heat transfer block 121 can be directly laid on the surface of the flow channel substrate 110 and completely cover the multiple temperature-controlled flow channels 111. The size and shape of the first temperature control unit 122 are adapted to the first heat transfer block 121, and can evenly heat or cool the first heat transfer block 121. Thus, the first heat transfer block 121 can achieve uniform heat transfer, making the first heat transfer block 121 act as a uniform temperature plate, further ensuring the uniformity of heating and temperature consistency of the droplets in the temperature-controlled flow channels 111.

[0060] See also Figure 7 、 Figure 8 and Figure 11 In some embodiments, a receiving groove 123 is further provided on a side of the first heat transfer block 121 adjacent to the flow channel substrate 110, opening toward the flow channel substrate 110. The flow channel substrate 110 covers the opening of the receiving groove 123. The receiving groove 123 corresponds to at least one temperature-controlled flow channel 111. The breathable and waterproof layer 140 is received in the receiving groove 123, and the negative pressure channel 131 communicates with the receiving groove 123. Specifically, the receiving groove 123 can accommodate the raised portion and flow channel groove 112 on the flow channel substrate 110, and can also accommodate the breathable and waterproof layer 140, thereby allowing the temperature-controlled flow channel 111 to be accommodated within the receiving groove 123, achieving uniform heating or cooling. Furthermore, the receiving groove 123 can form a negative pressure suction buffer chamber. The negative pressure channel 131 draws gas from the receiving groove 123, thereby creating a local negative pressure within the negative pressure suction buffer chamber, which facilitates the extraction of gas from the breathable and waterproof layer 140.

[0061] In some embodiments, the bottom wall of the receiving groove 123 is provided with a first through-hole 124, and the outer wall of the first heat transfer block 121 is provided with a second through-hole 125. The second through-hole 125 is connected to the negative pressure module 130, and the first through-hole 124 and the second through-hole 125 are connected through a negative pressure channel 131. The second through-hole 125 can be connected to the negative pressure module 130 via an external pipe, and a sealing pipe joint can be provided at the second through-hole 125 to ensure the sealing of the interface. The negative pressure channel 131 is located inside the first heat transfer block 121, and the first through-hole 124 and the second through-hole 125 respectively realize air intake and air outlet at both ends.

[0062] Furthermore, a sealing gasket 126 is provided between the first heat transfer block 121 and the flow channel substrate 110. The sealing gasket 126 is disposed around the accommodating groove 123, and the two sides of the sealing ring gasket are sealedly connected to the first heat transfer block 121 and the flow channel substrate 110, thereby maintaining the negative pressure state in the negative pressure channel 131. The sealing gasket 126 may be a silicone thermally conductive pad. On the one hand, it can achieve a sealed connection between the first heat transfer block 121 and the flow channel substrate 110, ensuring the sealing properties of the accommodating groove 123, maintaining the negative pressure state of the negative pressure channel 131, and preventing pressure loss and air leakage during bubble extraction. On the other hand, it can achieve a good thermal conductivity effect, allowing heat to be smoothly transferred between the flow channel substrate 110 and the first heat transfer block 121, and ensuring good heat radiation and heat conduction around the accommodating groove 123, further improving the heating uniformity of the temperature-controlled flow channel 111.

[0063] In some embodiments, the accommodating groove 123 includes multiple groove bodies 127 and connecting grooves 128. The multiple groove bodies 127 are distributed on the first heat transfer block 121. Each groove body 127 is provided with a breathable and waterproof layer 140 and corresponds to at least one temperature-controlled flow channel 111. The connecting groove 128 is provided between the multiple groove bodies 127 and is connected to the multiple groove bodies 127. The first through hole 124 is provided on the bottom wall of the connecting groove 128. Preferably, there are two groove bodies 127, symmetrically distributed on both sides of the connecting groove 128. The connecting groove 128 is narrower than the width of the two groove bodies 127 and connects the two groove bodies 127. Each groove body 127 can correspond to two temperature-controlled flow channels 111. The two temperature-controlled flow channels 111 can be curved, and the two temperature-controlled flow channels 111 in the same groove body 127 can be discharged through the same breathable and waterproof layer 140. The first through hole 124 is provided on the bottom wall of the connecting groove 128, so that during suction, the two groove bodies 127 can be suctioned simultaneously, and the pressure drop in the two groove bodies 127 is the same, achieving uniform suction and ensuring that the bubbles in each temperature-controlled flow channel 111 can be suctioned in a timely manner. Of course, in other preferred embodiments of the present invention, the groove bodies 127 can also be 4 or 6, and each groove body 127 can also correspond to 3 or 4 temperature-controlled flow channels 111. The number of temperature-controlled flow channels 111 and groove bodies 127 can be set according to actual needs.

[0064] See also Figure 2 、 Figure 5 、 Figures 6 to 9Furthermore, the temperature control component 100 for the digital microfluidic chip also includes a second temperature control assembly 150. The second temperature control assembly 150 is disposed on a side of the flow channel substrate 110 away from the first temperature control assembly 120. The second temperature control assembly 150 is configured to heat or cool the temperature-controlled flow channel 111. The second temperature control assembly 150 is attached to the side of the flow channel substrate 110 away from the first temperature control assembly 120. The second temperature control assembly 150 can control the temperature of the flow channel substrate 110 and the temperature-controlled flow channel 111 from above, primarily serving to maintain temperature, ensuring that the droplet temperature is within the temperature control range and ensuring temperature stability. Furthermore, the temperature control principle and temperature control range of the second temperature control assembly 150 can be consistent with those of the first temperature control assembly 120.

[0065] In some embodiments, the second temperature control assembly 150 has at least one second temperature zone, which is attached to the temperature-controlled channel 111. The second temperature control assembly 150 is configured to raise, lower, or maintain the temperature of the second temperature zone at a predetermined temperature. Specifically, in this embodiment, each temperature-controlled channel 111 can correspond to a second temperature zone, so that the entire temperature-controlled channel 111 can be heated to a uniform temperature.

[0066] In other preferred embodiments of the present invention, the second temperature control component 150 has multiple second temperature zones, each temperature control channel 111 can correspond to a different second temperature zone, and the preset temperatures of the multiple second temperature zones can be different. Therefore, by controlling the different positions of the droplets in the temperature control channel 111, the droplets can correspond to different second temperature zones to achieve different heating temperatures, which has better applicability. Among them, the second temperature control component 150 can also be heated or cooled by multiple independent sub-modules, thereby forming multiple second temperature zones that are independently temperature-controlled. Preferably, each temperature control channel 111 can be provided with two second temperature zones, and the two second temperature zones can be temperature-controlled independently to achieve different preset temperatures. The droplets move in the temperature control channel 111, so that they can switch between the two second temperature zones to achieve different heating or cooling temperatures. Among them, the second temperature zones and the first temperature zones are preferably the same in number and correspond to each other, so as to better perform heating or cooling.

[0067] In some embodiments, the second temperature control assembly 150 includes a second heat transfer block 151 and a second temperature control element 152. The second heat transfer block 151 is disposed on a surface of the flow channel substrate 110 away from the first temperature control assembly 120 and corresponds to the temperature control channel 111. The second temperature control element 152 is connected to the second heat transfer block 151 and is configured to facilitate heat transfer between the second temperature control element 152 and the temperature control channel 111. Specifically, the second temperature control element 152 includes a second semiconductor refrigeration plate, and the second heat transfer block 151 includes a second heat-conducting metal block. The second heat-conducting metal block can also be made of a metal material with good thermal conductivity, such as copper, which effectively facilitates heat transfer between the flow channel substrate 110 and the second semiconductor refrigeration plate. The second semiconductor refrigeration plate has a TEC structure and utilizes the Peltier principle to achieve heating or cooling functions. Specifically, the position of the cold end and the hot end can be switched by controlling the direction of the current. Its basic structure and heating / cooling principles can refer to semiconductor refrigeration plates in the prior art.

[0068] It should be noted that in other preferred embodiments of the present invention, the second temperature control unit 152 may also employ or incorporate other types of heating structures, such as a thermal resistor heating pad or a chemical heating sheet, with no specific limitation on the specific type of the second temperature control unit 152. Furthermore, the second heat transfer block 151 may also be made of other materials with good thermal conductivity, such as glass or ceramic, without limitation.

[0069] See also Figures 2 to 9 The embodiment of the present invention also provides a reagent temperature control device 200, including a digital microfluidic chip 210, a power component and the aforementioned temperature control component 100 for the digital microfluidic chip, the digital microfluidic chip 210 having a reaction chamber 211, the reaction chamber 211 being connected to the temperature-controlled flow channel 111, the power component 230 being connected to the reaction chamber 211, the flow channel substrate 110 and / or the temperature-controlled flow channel 111, preferably, the power component 230 being connected to the flow channel substrate 110 and connected to the temperature-controlled flow channel 111, and the power component 230 being configured to move droplets from the reaction chamber 211 to the temperature-controlled flow channel 111 or to move droplets from the temperature-controlled flow channel 111 to the reaction chamber 211.

[0070] It should be noted that, in this embodiment, the power component 230 can also be connected to the temperature control channel 111 through a suction channel. The temperature control channel 111 and the reaction chamber 211, and the suction channel and the temperature control channel 111 can be filled with dielectric oil. The power component 230 can use the method of squeezing the dielectric oil to suck the droplets from the reaction chamber 211 to the temperature control channel 111 or push the droplets from the temperature control channel 111 back to the reaction chamber 211. In actual use, droplets containing reagents can be first injected into the reaction chamber 211 of the digital microfluidic chip 210, and then the power component 230 is used to adjust the pressure of the medium oil in the temperature-controlled channel 111, and the droplets in the reaction chamber 211 are sucked into the temperature-controlled channel 111. The temperature control unit is used to heat or cool the droplets in the temperature-controlled channel 111. After reaching the preset temperature, the power component is used again to adjust the pressure of the medium oil in the temperature-controlled channel 111, thereby pushing the droplets in the temperature-controlled channel 111 back to the reaction chamber 211. In this way, the droplets can be moved out of the reaction chamber 211 and then heated or cooled, thereby effectively solving the problem of direct heating of the reagents on the chip.

[0071] In summary, the embodiment of the present invention provides a temperature control component 100 and a reagent temperature control device 200 for a digital microfluidic chip, which uses a temperature control channel 111 in a separately provided flow channel substrate 110 to accommodate droplets, and uses a first temperature control component 120 for heating or cooling, thereby achieving separate temperature control of the droplets, avoiding direct heating in the reaction chamber 211 of the digital microfluidic chip 210. During the heating process, a negative pressure module 130 is used for suction, and under the action of negative pressure, bubbles in the droplets or gases dissolved in the droplets can be extracted through the breathable and waterproof layer 140. Compared with the prior art, the present invention can achieve separate heating of the reagent, avoid direct heating on the chip surface, is not limited by the chip material, has high heating efficiency, short heating time, and better droplet temperature consistency, and can solve the bubble problem caused by high-temperature heating of the reagent. When the heating temperature is high, there will be no problem of reagent adhesion to the chip and chip performance degradation.

[0072] It should be noted that, unless there is any conflict, the features in the embodiments of this application can be combined with each other.

[0073] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A temperature control component for a digital microfluidic chip, characterized in that: include: A flow channel substrate (110), wherein the flow channel substrate (110) is provided with at least one temperature-controlled flow channel (111), the temperature-controlled flow channel (111) being configured to accommodate droplets and connected to a reaction chamber (211) of a digital microfluidic chip (210), and at least a portion of the temperature-controlled flow channel (111) is provided with a breathable and waterproof layer (140); a first temperature control component (120), the first temperature control component (120) being disposed on one side of the flow channel substrate (110) and configured to heat or cool the temperature control flow channel (111); A negative pressure module (130) is connected to the flow channel substrate (110) and / or the first temperature control component (120), and extracts bubbles in the liquid droplets and / or gases dissolved in the liquid droplets through the breathable and waterproof layer (140).

2. The temperature control component for a digital microfluidic chip according to claim 1, characterized in that: The flow channel substrate (110) and / or the first temperature control component (120) is provided with a negative pressure channel (131), one end of the negative pressure channel (131) is connected to the temperature control flow channel (111) through the breathable and waterproof layer (140), and the negative pressure module (130) is connected to the other end of the negative pressure channel (131).

3. The temperature control component for a digital microfluidic chip according to claim 2, characterized in that: The breathable and waterproof layer (140) comprises a polymer waterproof and breathable membrane.

4. The temperature control component for a digital microfluidic chip according to claim 2, characterized in that: A flow channel groove (112) opening toward the first temperature control component (120) is formed on a side of the flow channel substrate (110) close to the first temperature control component (120); the breathable waterproof layer (140) is laid at the opening of the flow channel groove (112); and the breathable waterproof layer (140) and the inner wall of the flow channel groove (112) are arranged to form the temperature control flow channel (111).

5. The temperature control component for a digital microfluidic chip according to claim 2, characterized in that: The breathable and waterproof layer (140) is wound to form a flow channel pipeline (113), the flow channel pipeline (113) is arranged on a side of the flow channel substrate (110) close to the first temperature control component (120), and the temperature control flow channel (111) is formed in the flow channel pipeline (113).

6. The temperature control component for a digital microfluidic chip according to claim 2, characterized in that: The first temperature control component (120) has at least one first temperature zone, the first temperature zone corresponds to the temperature control channel (111), and the first temperature control component (120) is configured to increase or decrease the temperature of the first temperature zone or maintain it at a preset temperature.

7. The temperature control component for a digital microfluidic chip according to claim 6, characterized in that: The first temperature control component (120) includes a first heat transfer block (121) and a first temperature control unit (122); the first heat transfer block (121) is arranged on the surface of the flow channel substrate (110) and is arranged corresponding to the temperature control flow channel (111); the first temperature control unit (122) is connected to the first heat transfer block (121); the first heat transfer block (121) is configured to realize heat transfer between the first temperature control unit (122) and the temperature control flow channel (111).

8. The temperature control component for a digital microfluidic chip according to claim 7, characterized in that: A receiving groove (123) opening toward the flow channel substrate (110) is further provided on a side of the first heat transfer block (121) close to the flow channel substrate (110); the flow channel substrate (110) covers the opening of the receiving groove (123); the receiving groove (123) corresponds to at least one of the temperature-controlled flow channels (111); the breathable and waterproof layer (140) is accommodated in the receiving groove (123); and the negative pressure channel (131) is connected to the receiving groove (123).

9. The temperature control component for a digital microfluidic chip according to claim 8, characterized in that: The bottom wall of the accommodating groove (123) is provided with a first through hole (124), the outer side wall of the first heat transfer block (121) is provided with a second through hole (125), the second through hole (125) is connected to the negative pressure module (130), and the first through hole (124) and the second through hole (125) are communicated through the negative pressure channel (131).

10. The temperature control component for a digital microfluidic chip according to claim 9, characterized in that: A sealing gasket (126) is further provided between the first heat transfer block (121) and the flow channel substrate (110), wherein the sealing gasket (126) is arranged around the accommodating groove (123), and both sides of the sealing gasket (126) are sealedly connected to the first heat transfer block (121) and the flow channel substrate (110).

11. The temperature control component for a digital microfluidic chip according to claim 9, characterized in that: The accommodating groove (123) includes a plurality of groove bodies (127) and a connecting groove (128). The plurality of groove bodies (127) are distributed on the first heat transfer block (121). Each of the groove bodies (127) is provided with the breathable and waterproof layer (140) and corresponds to at least one of the temperature control channels (111). The connecting groove (128) is provided between the plurality of groove bodies (127) and is connected to the plurality of groove bodies (127) at the same time. The first through hole (124) is provided on the bottom wall of the connecting groove (128).

12. The temperature control component for a digital microfluidic chip according to claim 1 or 7, characterized in that: The temperature control component for the digital microfluidic chip further includes a second temperature control component (150), which is arranged on a side of the flow channel substrate (110) away from the first temperature control component (120), and the second temperature control component (150) is configured to heat or cool the temperature control flow channel (111).

13. The temperature control component for a digital microfluidic chip according to claim 12, characterized in that: The second temperature control component (150) has at least one second temperature zone, and the second temperature zone is correspondingly attached to the temperature control channel (111). The second temperature control component (150) is configured to increase or decrease the temperature of the second temperature zone or maintain it at a preset temperature.

14. The temperature control component for a digital microfluidic chip according to claim 13, characterized in that: The second temperature control component (150) includes a second heat transfer block (151) and a second temperature control unit (152). The second heat transfer block (151) is arranged on a side surface of the flow channel substrate (110) away from the first temperature control component (120) and is arranged corresponding to the temperature control flow channel (111). The second temperature control unit (152) is connected to the second heat transfer block (151). The second heat transfer block (151) is configured to realize heat transfer between the second temperature control unit (152) and the temperature control flow channel (111).

15. A reagent temperature control device (200), characterized in that: The invention comprises a digital microfluidic chip (210), a power component (230) and a temperature control component for a digital microfluidic chip according to any one of claims 1 to 14, wherein the digital microfluidic chip (210) has a reaction chamber (211), the reaction chamber (211) is connected to the temperature control channel (111), the power component (230) is connected to the reaction chamber (211) and / or the temperature control channel (111), and the power component (230) is configured to move the droplets from the reaction chamber (211) to the temperature control channel (111) or to move the droplets from the temperature control channel (111) to the reaction chamber (211).

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