Semiconductor device turnover jig
By designing the loading tray and rack structure of the semiconductor device turnover fixture, the loading tray can be flexibly removed and fixed, solving the problems of low efficiency and high physical exertion in the existing technology, and improving the work efficiency and device protection effect during transportation.
Patent Information
- Application Number
- CN202422674677.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-04
AI Technical Summary
Existing semiconductor device turnover jigs require the grid disks to be removed one by one when removing chips, resulting in low work efficiency and high physical exertion of the user.
A semiconductor device turnover fixture was designed, which adopts a loading tray, a shell, a rack and a connecting plate structure. The loading tray can be directly pulled out from the side or taken out one by one. The loading tray can be flexibly fixed and moved by the cooperation of the gear and rack.
The work efficiency is improved, the physical exertion of the user is reduced, and the damage of the device caused by the displacement of the loading tray during transportation is avoided.
Smart Images

Figure CN223384942U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of turnover jigs, in particular to a turnover jig for semiconductor devices. Background Art
[0002] A fixture is a large category of tools used in carpentry, ironwork, fittery, machinery, electronic control, and other handicrafts. It is mainly used as a tool to assist in controlling position or movement. During the production process of semiconductors, semiconductor devices also need to be moved around, so a semiconductor device turnover fixture is needed.
[0003] The existing patent (publication number: CN218368974U) discloses that "the utility model provides a chip turnover jig, which relates to the technical field of chip turnover jigs. The chip turnover jig includes: several grid disks and clips; the grid disk includes: a chassis and a boss; a boss is provided on the top surface of the chassis, and a receiving groove corresponding to the boss is provided on the bottom surface of the chassis; a plurality of grid grooves are provided on the top surface of the boss, and the grid grooves are used to clamp the chip; several grid disks are stacked layer by layer, and the boss of the lower grid disk is accommodated in the receiving groove of the upper grid disk; the clips fix the stacked layers of grid disks; the chip is clamped in the grid groove and then accommodated in the receiving groove of the upper layer. Each chip is loaded in an independent space, and the top grid disk does not contain chips, which ensures the excellent protection effect of the chip turnover jig on the chip. Even if it accidentally falls during the turnover process, the turnover jig can protect the chip from damage; and the number of chips loaded on each layer of grid disk is clear, which is convenient for determining the specific number of chips obtained by the chip turnover jig in one use."
[0004] In the process of realizing this application, the inventors discovered that the prior art has the following problems: when the device is in use, although the grid slots can protect the chips from damage, when removing the chips, the grid plates need to be removed one by one, which is not conducive to improving work efficiency. In addition, multiple handling will also increase the workload of the user and make him easily fatigued.
[0005] Therefore, those skilled in the art provide a semiconductor device turnover jig to solve the problems raised in the above background technology. Utility Model Content
[0006] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor device turnover jig. When using the device, the user can take out the loading trays one by one or directly pull out the loading tray at the west end. There is no need to carry the loading trays one by one, which is conducive to improving work efficiency and reducing the user's physical exertion.
[0007] To achieve the above objectives, the present invention provides the following technical solutions: a semiconductor device turnover jig, comprising a loading tray, a housing, two racks, and a connecting plate, wherein the loading tray comprises a main body, a grid plate fixedly disposed on the upper end of the main body, first convex strips fixedly disposed on both sides of the upper end of the main body, two protrusions fixedly disposed on the front side of the upper end of the main body, second convex strips fixedly disposed on both sides of the lower end of the main body, and second grooves formed at the lower ends of the two second convex strips;
[0008] Fixed blocks are slidably arranged on both sides of the front end of the shell, and a groove No. 1 is provided at the lower ends of the two fixed blocks. There are multiple loading trays, and the multiple loading trays are all arranged inside the shell.
[0009] Furthermore, a bottom plate is fixedly provided at the lower end of the shell, and the front end of the shell penetrates the outside world.
[0010] Furthermore, the length of the main body is eight centimeters longer than that of the grid plate, and the cross-sectional area of the second groove is equal to the cross-sectional area of the protrusion.
[0011] Furthermore, fixing rods are fixedly provided on the upper ends of both sides of the shell, and a plurality of fixing holes are formed through the two fixing rods.
[0012] Furthermore, the connecting plate is fixedly arranged between the two fixed blocks, the two racks are slidably arranged at the front end of the connecting plate, the front end of the connecting plate is rotatably provided with a gear, and the two racks are engaged with the gear.
[0013] Furthermore, a connecting rod is fixedly provided on one end of the two racks that are away from each other, and a fixing column is fixedly provided on one side of the two connecting rods that are close to each other.
[0014] Furthermore, a No. 2 connecting block is fixedly provided on one side of the front end of the connecting plate, and a No. 1 connecting block is fixedly provided on the end of the upper one of the two racks away from the connecting rod, and a spring is connected between the No. 1 connecting block and the No. 2 connecting block.
[0015] Furthermore, a convex plate is fixedly provided on one side of the two fixing blocks away from each other, and the length of the two No. 2 grooves is equal to the length of the grid disk.
[0016] The utility model has the following beneficial effects:
[0017] 1. The utility model proposes a semiconductor device turnover jig. When the device is in use, the connecting rod is pulled to drive the fixed column to disengage from the fixed rod, and at the same time drive the rack to move, and the gear drives the other rack to move, so that both fixed columns are disengaged from the fixing holes, and then the convex plate is pulled to drive the fixed block to move upward and fix it inside different fixing holes, so that the No. 2 groove is aligned with different loading trays, which is conducive to pulling out loading trays at different positions from the side of the shell, and there is no need to take out the loading trays one by one, which is conducive to improving the loading speed of semiconductor devices. At the same time, the loading trays can also be directly taken out one by one, which is conducive to improving the practicality of the device.
[0018] 2. The utility model proposes a semiconductor device turnover jig. When the device is in use, when pulling the loading tray to load the semiconductor device, multiple loading trays are stacked and placed inside the shell, which helps to avoid the offset of multiple loading trays when they are stacked on each other, resulting in damage to the semiconductor device. In addition, by installing the protrusion, when the grid tray is fully pulled out when pulling out the loading tray, the No. 2 protrusion can be blocked to avoid pulling out the entire loading tray. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is an axonometric diagram of the present utility model;
[0020] Figure 2 This is an axonometric diagram of the fixing block of the present invention;
[0021] Figure 3 This is an explosion diagram of the utility model;
[0022] Figure 4 This is an axonometric diagram of the loading tray of the present invention.
[0023] Legend:
[0024] 1. Loading plate; 2. Housing; 3. Connecting rod; 4. Fixing column; 5. Rack; 6. Fixing block; 7. Groove No. 1; 8. Gear; 9. Connecting block No. 1; 10. Spring; 11. Connecting block No. 2; 12. Bottom plate; 13. Fixing hole; 14. Fixing rod; 15. Connecting plate; 101. Grid plate; 102. Main body; 103. Raised strip No. 1; 104. Raised block; 105. Raised strip No. 2; 106. Groove No. 2. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] Reference Figure 1 、 Figure 2 and Figure 3 The utility model provides an embodiment of a semiconductor device turnover fixture, comprising a loading tray 1, a shell 2, two racks 5 and a connecting plate 15. The loading tray 1 comprises a main body 102, a bottom plate 12 is fixedly provided at the lower end of the shell 2, the front end of the shell 2 is connected to the outside world, and a fixing rod 14 is fixedly provided at the upper end of both sides of the shell 2. The two fixing rods 14 are penetrated and have a plurality of fixing holes 13. The connecting plate 15 is fixedly provided between the two fixing blocks 6, and the two racks 5 are slidably provided at the front end of the connecting plate 15. The connecting plate 15 The front end of the gear 8 is rotated, and the two racks 5 are meshed with the gear 8. The ends of the two racks 5 away from each other are fixed with a connecting rod 3, and the two connecting rods 3 are fixed with a fixed column 4 on the side close to each other. A second connecting block 11 is fixed on one side of the front end of the connecting plate 15. The upper end of the two racks 5 away from the connecting rod 3 is fixed with a first connecting block 9. A spring 10 is connected between the first connecting block 9 and the second connecting block 11. A convex plate is fixed on the side of the two fixed blocks 6 away from each other.
[0027] Specifically, stacking multiple loading trays 1 inside the housing 2 is beneficial to preventing the turnover fixture from shifting during the transfer process, causing damage to the semiconductor devices; pulling the connecting rod 3 drives the rack 5 to move, and the rack 5 drives another rack 5 to move through the gear 8, which is beneficial to driving the two connecting rods 3 away from each other, thereby driving the two fixing columns 4 away from each other, and then disengaging from the fixing holes 13, making it convenient to adjust the height of the fixing block 6; the moving convex plate drives the fixing block 6, the connecting rod 3 and the fixing column 4 to move. When the fixing column 4 is aligned with different fixing holes 13, the spring 10 pulls the No. 1 connecting plate 15, driving the rack 5 to move, so that the two racks 5 return to their original position, and then driving the fixing column 4 to insert into the fixing hole 13, which is beneficial to fixing the fixing block 6 at different heights, aligning the No. 1 groove 7 with the loading tray 1, and taking out the loading trays 1 of different heights. There is no need to take out the loading trays 1 one by one, which is beneficial to improving work efficiency and reducing the workload of users.
[0028] Reference Figure 3 、 Figure 4, a grid disk 101 is fixedly provided at the upper end of the main body 102, and a No. 1 convex strip 103 is fixedly provided on both sides of the upper end of the main body 102, and two protrusions 104 are fixedly provided on the front side of the upper end of the main body 102, and a No. 2 convex strip 105 is fixedly provided on both sides of the lower end of the main body 102, and a No. 2 groove 106 is provided at the lower end of the two No. 2 convex strips 105. The length of the main body 102 is eight centimeters longer than the grid disk 101, and the cross-sectional area of the No. 2 groove 106 is equal to the cross-sectional area of the protrusion 104. Fixed blocks 6 are slidably provided on both sides of the front end of the shell 2, and a No. 1 groove 7 is provided at the lower end of the two fixed blocks 6. A plurality of loading trays 1 are provided, and the plurality of loading trays 1 are arranged inside the shell 2. The length of the two No. 2 grooves 106 is equal to the length of the grid disk 101;
[0029] Specifically, when multiple loading trays 1 are stacked on each other, the two No. 2 ridges 105 of the upper loading tray 1 and the two No. 1 ridges 103 of the lower loading tray 1 will be locked together, which helps to prevent the grid tray 101 from being squeezed and thus damaging the internal semiconductor devices; when pulling the loading tray 1, when the grid tray 101 is pulled out of the shell 2, the protrusion 104 will block the No. 2 ridge 105, preventing the loading tray 1 from being completely pulled out, causing the upper loading tray 1 to fall downward; at the same time, the part of the main body 102 that is more than the grid tray 101 is located between the two loading trays 1, which helps to prevent the loading tray 1 from tilting to one end.
[0030] Working principle: When the device is in use, the semiconductor device is placed inside the grid disk 101, and then multiple grid disks 101 are stacked up and placed inside the shell 2, which is beneficial to avoid multiple loading disks 1 being stacked together and offset during transportation, resulting in damage to the semiconductor device. When taking out the loading disk 1, the loading disk 1 can be taken out from top to bottom in sequence. In addition, the connecting rod 3 can also be pulled, and the connecting rod 3 drives the rack 5 to move. The rack 5 moves the other rack 5 in the opposite direction through the gear 8, driving the two connecting plates 15 away from each other, so that the two fixing columns 4 are disengaged from the fixing holes 13, and then the fixing block 6 is pulled to fix the fixing columns 4 inside the fixing holes 13 at different heights, so that the No. 1 groove 7 is aligned with different loading disks 1, and then the loading disk 1 aligned with the No. 1 groove 7 is pulled out of the shell 2, and the semiconductor device inside it can be taken out. There is no need to take out the loading disks 1 one by one, which is beneficial to improve work efficiency and reduce user consumption.
[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A semiconductor device turnover jig, comprising a loading tray (1), a housing (2), two racks (5) and a connecting plate (15), characterized in that: The loading tray (1) comprises a main body (102), a grid plate (101) is fixedly provided at the upper end of the main body (102), a No. 1 convex strip (103) is fixedly provided on both sides of the upper end of the main body (102), two protrusions (104) are fixedly provided on the front side of the upper end of the main body (102), a No. 2 convex strip (105) is fixedly provided on both sides of the lower end of the main body (102), and a No. 2 groove (106) is provided at the lower end of the two No. 2 convex strips (105); Fixed blocks (6) are slidably provided on both sides of the front end of the housing (2), and a first groove (7) is provided at the lower ends of the two fixed blocks (6). A plurality of loading trays (1) are provided, and the plurality of loading trays (1) are all provided inside the housing (2).
2. The semiconductor device turnover jig according to claim 1, characterized in that: A bottom plate (12) is fixedly provided at the lower end of the shell (2), and the front end of the shell (2) penetrates the outside world.
3. The semiconductor device turnover jig according to claim 1, characterized in that: The length of the main body (102) is eight centimeters longer than that of the grid plate (101), and the cross-sectional area of the second groove (106) is equal to the cross-sectional area of the protrusion (104).
4. The semiconductor device turnover jig according to claim 1, characterized in that: Fixing rods (14) are fixedly provided at the upper ends of both sides of the housing (2), and a plurality of fixing holes (13) are formed through the two fixing rods (14).
5. The semiconductor device turnover jig according to claim 1, characterized in that: The connecting plate (15) is fixedly arranged between the two fixed blocks (6), the two racks (5) are slidably arranged at the front end of the connecting plate (15), the front end of the connecting plate (15) is rotatably provided with a gear (8), and the two racks (5) are meshed with the gear (8).
6. The semiconductor device turnover jig according to claim 1, characterized in that: A connecting rod (3) is fixedly provided on the ends of the two racks (5) that are away from each other, and a fixing column (4) is fixedly provided on the sides of the two connecting rods (3) that are close to each other.
7. The semiconductor device turnover jig according to claim 1, characterized in that: A second connecting block (11) is fixedly provided on one side of the front end of the connecting plate (15); a first connecting block (9) is fixedly provided on the end of the upper one of the two racks (5) away from the connecting rod (3); and a spring (10) is connected between the first connecting block (9) and the second connecting block (11).
8. The semiconductor device turnover jig according to claim 1, characterized in that: A convex plate is fixedly provided on one side of the two fixed blocks (6) away from each other, and the length of the two No. 2 grooves (106) is equal to the length of the grid plate (101).
Citation Information
Patent Citations
Chip turnover jig
CN218368974U