Exhaust assembly and deposition device

Abstract

The utility model relates to the field of atomic layer deposition, in particular to an exhaust assembly and a deposition device. The exhaust seat is arranged to be annular, and the multiple exhaust holes are formed in the upper side of the exhaust seat in the circumferential direction at intervals, so that gas is evenly exhausted in the circumferential direction, gas distribution is more uniform, and the filter screen and the baffle form double-layer protection on the exhaust holes; and the situation that large particulate matter is adsorbed on the filter screen to cause blockage of the filter screen and large particulate matter enters the vacuum pipeline through the exhaust hole to cause blockage of the vacuum pipeline is avoided, the baffle is arranged above the exhaust hole in a striding mode, reaction gas can be prevented from directly entering the exhaust hole downwards, the reaction gas enters the exhaust hole from the side edge of the baffle, and the exhaust uniformity is further improved. According to the deposition device, the exhaust seat is arranged around the periphery of the bearing assembly, so that the gas is exhausted from the periphery of the bearing assembly, the exhaust is more uniform, the exhaust layout is optimized, the gas exhausted from the gas inlet pipeline is more uniformly distributed in the reaction chamber, and the uniformity of film layer growth is improved.

Description

Technical Field

[0001] The utility model relates to the field of vapor deposition, in particular to an exhaust component and a deposition device. Background Art

[0002] With the continuous development of the semiconductor industry, the requirements for the size and integration of various components are becoming increasingly higher, and atomic layer deposition technology has been widely used. Atomic layer deposition technology is a high-precision thin film deposition technology based on chemical vapor deposition. It is a technology that deposits material in the form of a single atomic film on the substrate surface layer by layer through chemical vapor deposition.

[0003] Existing atomic layer deposition equipment requires a vacuum line to discharge excess process gas and by-products of the process gas reaction when depositing atomic films. The vacuum line is generally designed on both sides of the lower end of the reaction chamber of the atomic layer deposition equipment to extract excess gas from the bottom of the reaction chamber.

[0004] However, the existing method of exhausting gas from both sides of the lower end of the reaction chamber can easily lead to uneven gas discharge at different positions in the reaction chamber, which in turn causes the problem that the introduced process gas cannot be evenly distributed on the surface of the substrate, resulting in inconsistent growth rates of the product film layer in all directions, affecting the uniformity and consistency of the film layer. At the same time, large particles produced by the reaction can also easily cause the exhaust holes to be blocked. When a certain exhaust hole is blocked, the overall exhaust rate will decrease, and the process gas distribution in the area corresponding to the exhaust hole is inconsistent with that in other areas, thereby affecting the uniformity and consistency of the product film layer. Therefore, it is urgent to propose an exhaust assembly and a deposition device to solve the above problems. Utility Model Content

[0005] The purpose of the present utility model is to provide an exhaust assembly to solve the problem in the prior art that the reaction gas cannot be evenly distributed on the substrate surface, resulting in inconsistent growth rates of the product film layer in all directions, and to achieve the technical effect of improving the uniformity and consistency of the product film layer.

[0006] Another object of the present invention is to provide a deposition device to solve the problem in the prior art that the reaction gas cannot be evenly distributed on the substrate surface, resulting in inconsistent growth rates of the product film layer in all directions, thereby achieving the technical effect of improving the uniformity and consistency of the product film layer.

[0007] As conceived above, the technical solution adopted by the utility model is:

[0008] The exhaust assembly includes an exhaust seat, which is annular and has an exhaust chamber. A plurality of exhaust holes are arranged at intervals along the circumference of the exhaust seat on the upper side, and the pipeline connection hole is opened on the lower side of the exhaust seat;

[0009] The exhaust assembly further includes a filter and a baffle. The filter covers the exhaust hole. The baffle is arranged across the exhaust hole and spaced apart from the filter.

[0010] Optionally, the baffle includes a baffle body and a plurality of support columns, one end of the plurality of support columns is connected to the baffle body and the other end is connected to the upper side of the exhaust seat.

[0011] Optionally, the baffle body includes a main board portion and a plurality of wing board portions, the plurality of wing board portions are arranged at intervals along the circumference of the main board portion, the wing board portions are arranged in a one-to-one correspondence with the support columns, and the upper ends of the support columns are connected to the wing board portions.

[0012] Optionally, a plurality of positioning grooves are provided on the upper side of the exhaust seat at intervals along the circumference of the exhaust hole, the positioning grooves correspond one-to-one to the support columns, and the lower ends of the support columns are inserted into the positioning grooves.

[0013] Optionally, the baffle is parallel to the upper end surface of the exhaust seat, and the orthographic projection of the baffle on the upper end surface of the exhaust seat covers the exhaust hole.

[0014] Optionally, the exhaust hole is an oblong hole extending along the circumference of the exhaust seat.

[0015] Optionally, a projection of the pipeline connecting hole on the upper end surface of the exhaust seat is offset from the exhaust hole.

[0016] Optionally, the exhaust seat includes an exhaust cover and an exhaust base, the exhaust cover is detachably covered on the upper side of the exhaust base and is arranged together with the exhaust base to form the exhaust chamber, the exhaust hole is opened on the exhaust cover, and a pipeline connection hole is opened on the lower side of the exhaust base, and the pipeline connection hole is used to connect with the vacuum pipeline.

[0017] The deposition device includes a carrier assembly and a reaction chamber assembly having a reaction chamber, wherein an air inlet pipeline is provided at the upper end of the reaction chamber and a vacuum pipeline is provided at the lower end of the reaction chamber. The deposition device also includes the exhaust assembly, and the exhaust assembly and the carrier assembly are both located in the reaction chamber.

[0018] The exhaust seat is arranged around the outer periphery of the bearing assembly, the exhaust seat is lower than the bearing surface of the bearing assembly, and the vacuum pipeline is communicated with the pipeline connecting hole.

[0019] Optionally, the bottom of the exhaust seat abuts against the bottom of the reaction chamber, and the peripheral side of the exhaust seat fits against the peripheral side wall of the reaction chamber.

[0020] The utility model provides an exhaust assembly, which, by configuring the exhaust seat in an annular shape and providing a plurality of exhaust holes at intervals along the circumference of the exhaust seat, allows the gas to be discharged evenly from the circumference, thereby making the gas distribution more uniform. The exhaust hole is prevented from being clogged by providing a filter, and the filter is prevented from being clogged by providing a baffle, thereby forming a double layer of protection for the exhaust hole, thereby preventing large particles from being adsorbed on the filter, causing the filter to be clogged, and large particles from entering the vacuum line through the exhaust hole, causing the vacuum line to be clogged. In addition, the baffle is arranged across the exhaust hole to prevent the reaction gas from directly entering the exhaust hole downward, but instead enters the exhaust hole from the side of the baffle, further improving the exhaust uniformity, thereby improving the uniformity of gas distribution in the reaction chamber.

[0021] The utility model provides a deposition device, which arranges the exhaust seat around the outer periphery of the supporting component so that the gas is discharged from the periphery of the supporting component, the exhaust is more uniform, the exhaust layout is optimized, and the gas discharged from the air inlet pipe is more evenly distributed in the reaction chamber, thereby improving the uniformity of the film growth; it also avoids the exhaust hole from being clogged by arranging the filter screen and the filter screen from being clogged by arranging the baffle plate, thereby forming a double layer of protection for the exhaust hole, avoiding large particles adsorbed on the filter screen to cause the filter screen to be clogged, and large particles entering the vacuum pipeline through the exhaust hole, causing the vacuum pipeline to be clogged, thereby affecting the deposition effect of the deposition device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a front view of a deposition device provided by an embodiment of the present utility model;

[0023] Figure 2 This is an exploded view of a deposition device provided by an embodiment of the present utility model;

[0024] Figure 3 This is a schematic diagram of the connection between an exhaust assembly and a vacuum pipeline provided by an embodiment of the present utility model;

[0025] Figure 4 This is an exploded view of an exhaust assembly provided by an embodiment of the present utility model;

[0026] Figure 5 It is a structural schematic diagram of a sealing flange provided in an embodiment of the present utility model.

[0027] In the picture:

[0028] 1. Exhaust assembly; 11. Exhaust seat; 111. Exhaust cover; 1111. Exhaust hole; 112. Exhaust base; 1121. Pipe connection hole; 12. Filter; 13. Baffle; 131. Baffle body; 1311. Main plate; 1312. Wing plate; 132. Support column;

[0029] 2. Load-bearing components;

[0030] 3. Reaction chamber assembly; 31. Reaction chamber cover; 32. Reaction chamber base;

[0031] 4. Air intake pipe;

[0032] 5. Vacuum pipeline;

[0033] 6. Sealing flange; 61. Sealing ring groove. DETAILED DESCRIPTION

[0034] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention more clearly understood, the technical solutions of the present invention are further described below with reference to the accompanying drawings and through specific embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of it.

[0035] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0036] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0037] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0038] The exhaust assembly and the deposition device including the exhaust assembly provided in this embodiment are used to solve the problem that the reaction gas cannot be evenly distributed on the substrate surface, resulting in inconsistent growth rates of the product film layer in all directions.

[0039] like Figure 1-Figure 2 As shown, the deposition apparatus includes a reaction chamber assembly 3, a carrier assembly 2, and an exhaust assembly 1. The reaction chamber assembly 3 has a reaction chamber, within which both the exhaust assembly 1 and the carrier assembly 2 are located. An air inlet is provided at the top of the reaction chamber, connected to an inlet line 4 for process gas. The process gas is discharged from the inlet line 4 into the reaction chamber, where it is deposited on the workpiece supported on top of the carrier assembly 2 using a vapor deposition method.

[0040] The exhaust assembly 1 includes an exhaust seat 11, which has an exhaust chamber. The exhaust seat 11 is annular as a whole and surrounds the outer periphery of the supporting assembly 2. The exhaust seat 11 is lower than the supporting surface of the supporting assembly 2. An exhaust hole 1111 connected to the exhaust chamber is opened on the upper side of the exhaust seat 11. A vacuum pumping line 5 is provided at the bottom of the reaction chamber, and the vacuum pumping line 5 is connected to the exhaust chamber.

[0041] It is understood that during the atomic film deposition process, the exhaust assembly 1 is used to exhaust excess gas and byproducts generated by the gas reaction from the reaction chamber through the vacuum line 5. The process gas needs to be deposited on the workpiece supported by the support assembly 2 to form an atomic film on the workpiece surface. If the exhaust seat 11 is not lower than the support surface of the support assembly 2, the process gas will be exhausted before it is deposited on the workpiece surface. Therefore, the exhaust seat 11 is set to be lower than the support surface of the support assembly 2.

[0042] A plurality of exhaust holes 1111 are provided at intervals along the circumference of the upper side of the exhaust seat 11, and the exhaust seat 11 surrounds the outer circumference of the carrier assembly 2, so the exhaust holes 1111 are dispersed around the carrier assembly 2. It can be understood that after the process gas enters the reaction chamber through the air inlet pipe 4 and is deposited on the workpiece, the exhaust holes 1111 on the upper side of the exhaust seat 11 simultaneously discharge the excess process gas and gas reaction by-products from the reaction chamber, forming a cycle of intake and exhaust. If the exhaust hole 1111 is only provided at a certain position of the exhaust seat 11, the gas at other positions will not be discharged in time, resulting in uneven exhaust. Therefore, the exhaust holes 1111 are provided at intervals along the circumference of the upper side of the exhaust seat 11, and the exhaust holes 1111 are dispersed around the carrier assembly 2, so that the excess gas at any position around the carried workpiece can be discharged in a timely and effective manner, thereby improving the exhaust uniformity.

[0043] In addition, if Figure 4As shown, the exhaust assembly 1 also includes a filter 12 and a baffle 13. The filter 12 covers the exhaust hole 1111, and the baffle 13 is arranged across the exhaust hole 1111 and spaced apart from the filter 12. It is understandable that as the process gas continues to deposit, large particles will form in the reaction chamber. If the large particles enter the vacuum line 5 through the exhaust hole 1111, the exhaust hole 1111 or the vacuum line 5 will be blocked, affecting the normal exhaust process. In this embodiment, by providing the filter 12, the exhaust hole 1111 can be pre-filtered to prevent large particles from entering the exhaust chamber, thereby preventing large particles from entering the vacuum line 5 through the exhaust chamber and causing blockage. Furthermore, during the deposition process, it is inevitable that large particles will be adsorbed on the filter 12, causing the filter 12 to be blocked and the corresponding exhaust hole 1111 to be unable to exhaust normally. By installing a baffle 13 across the exhaust hole 1111, large particles can be effectively prevented from blocking the filter 12, thereby ensuring the normal operation of the exhaust hole 1111. In addition, the baffle 12 is installed across the exhaust hole 1111, which can prevent the reaction gas from directly entering the exhaust hole 1111 downward, but enters the exhaust hole 1111 from the side of the baffle 12, thereby further improving the exhaust uniformity and thereby improving the uniformity of gas distribution in the reaction chamber.

[0044] The reaction chamber assembly 3 includes a reaction chamber cover 31 and a reaction chamber base 32. The reaction chamber cover 31 is removably mounted on the upper side of the reaction chamber base 32. The reaction chamber cover 31 and the reaction chamber base 32 enclose the reaction chamber. This arrangement facilitates opening and closing the reaction chamber, and thus facilitates the removal and placement of workpieces, thereby improving deposition efficiency.

[0045] Optionally, the baffle 13 includes a baffle body 131 and a plurality of support columns 132, one side of the support columns 132 is connected to the baffle body 131 and the other side is connected to the upper side of the exhaust seat 11. This arrangement enables the baffle 13 to be arranged above the exhaust hole 1111 through the support columns 132, thereby improving the feasibility and rationality of the structure.

[0046] Optionally, the baffle body 131 includes a main plate portion 1311 and a plurality of wing portions 1312. The plurality of wing portions 1312 are spaced apart along the circumference of the main plate portion 1311. The wing portions 1312 correspond to the support posts 132 in a one-to-one manner, and the upper ends of the support posts 132 are connected to the wing portions 1312. This arrangement enables the baffle body 131 to be fixed from the periphery through the cooperation between the support posts 132 and the wing portions 1312, thereby improving the positioning stability of the baffle body 131 and reducing the overall size of the baffle body 131, thereby improving the spatial rationality of the reaction chamber.

[0047] The number of wing plate parts 1312 is preferably 2-4. 2-4 wing plate parts 1312 can not only ensure the positioning stability of the baffle 13, but also avoid too many support columns 132 connected to the wing plate parts 1312 when the gas enters the exhaust hole 1111, resulting in excessive gas resistance and thus reduced exhaust efficiency.

[0048] In this embodiment, two support columns 132 are provided, one on each side of the exhaust hole 1111 along the radial direction of the exhaust seat 11. The number of support columns 132 ensures the positioning stability of the baffle 13. The support columns 132 are arranged in the width direction of the exhaust hole 1111 and do not occupy the space at its ends in the length direction. This increases the number of exhaust holes 1111 on the exhaust seat 11 and optimizes space utilization.

[0049] Optionally, a plurality of positioning grooves are provided on the upper side of the exhaust seat 11 at intervals along the circumference of the exhaust hole 1111. The positioning grooves correspond one-to-one with the support posts 132, and the lower ends of the support posts 132 are inserted into the positioning grooves. The lower ends of the support posts 132 are inserted into the positioning grooves, which can align the positions of the baffle body 131 and the exhaust hole 1111, thereby achieving the installation and positioning of the baffle 13 on the exhaust seat 11.

[0050] Optionally, the baffle 13 is parallel to the upper end surface of the exhaust seat 11, and the orthographic projection of the baffle 13 on the upper end surface of the exhaust seat 11 covers the exhaust hole 1111. This setting enables the baffle 13 to form sufficient shielding for the exhaust hole 1111, and the lateral gaps between the baffle 13 and the exhaust hole 1111 are consistent, ensuring the uniformity of lateral exhaust.

[0051] Optionally, the exhaust hole 1111 is an oblong hole extending along the circumference of the exhaust seat 11. The oblong hole extends along the circumference of the exhaust seat 11, that is, the major axis of the oblong hole corresponds to the circumference of the exhaust seat 11. This arrangement can increase the size of the exhaust hole 1111 while maintaining the inner and outer diameters of the exhaust seat 11, while saving the area occupied by the exhaust seat 11.

[0052] Optionally, the distance between the baffle 13 and the exhaust hole 1111 is 0.1 cm to 0.5 cm, preferably 0.2 cm to 0.4 cm. This range ensures that there is enough space for gas to pass from the baffle 13 to the exhaust hole 1111, while ensuring that large particles are unlikely to pass between the baffle 13 and the exhaust hole 1111 and block the filter 12.

[0053] Optionally, the exhaust holes 1111 are evenly spaced along the circumference of the exhaust seat 11. This arrangement can further improve the uniformity of the distribution of the exhaust holes 1111 in the reaction chamber, preventing uneven atomic film layers caused by localized gas exhaust being too fast or too slow. The number of exhaust holes 1111 is 10-20, preferably 8-12. This number ensures that gas is evenly discharged from the exhaust holes 1111, while also avoiding the risk of excessive exhaust holes 1111 causing gas to be extracted before it is completely deposited.

[0054] Furthermore, the shape and size of the main plate portion 1311 are consistent with the exhaust hole 1111. This arrangement saves the material for making the baffle 13 and saves overall cost while ensuring that large particles are blocked from entering the exhaust hole 1111.

[0055] like Figure 3-Figure 4 As shown, to improve the cleaning convenience of the exhaust chamber, the exhaust seat 11 includes an exhaust cover plate 111 and an exhaust base 112. The exhaust cover plate 111 is removably mounted on the upper side of the exhaust base 112 and encloses the exhaust chamber with the exhaust base 112. The exhaust cover plate 111 is provided with an exhaust hole 1111, and the exhaust base 112 is provided with a pipe connection hole 1121 on the lower side. The pipe connection hole 1121 is connected to the vacuum pipe 5. The removable connection between the exhaust cover plate 111 and the exhaust base 112 facilitates regular disassembly and cleaning of the exhaust seat 11, preventing varying degrees of blockage in the exhaust chamber, which would affect the exhaust effect.

[0056] Optionally, the projection of the pipe connection hole 1121 on the upper end surface of the exhaust seat 11 is offset from the exhaust hole 1111. If some of the exhaust holes 1111 are directly opposite the pipe connection hole 1121, gas entering through these exhaust holes 1111 will be directly drawn away by the vacuum pipe 5 directly below them, causing the exhaust speed of these exhaust holes 1111 to be too high and inconsistent with the exhaust speed of other exhaust holes 1111, ultimately affecting exhaust uniformity. Therefore, the projection of the pipe connection hole 1121 on the upper end surface of the exhaust seat 11 is offset from the exhaust hole 1111.

[0057] Optionally, the bottom surface of the exhaust seat 11 is spaced from the bottom surface of the reaction chamber by a preset distance, and the peripheral side of the exhaust seat 11 abuts against the peripheral side wall of the reaction chamber, so that the exhaust seat 11 is fixed at a preset height of the reaction chamber; the vacuum pipeline 5 passes through the space between the bottom surface of the exhaust seat 11 and the bottom surface of the reaction chamber, and then passes through the bottom surface of the reaction chamber.

[0058] like Figure 5As shown, the deposition apparatus further includes a sealing flange 6, a sealing ring groove 61 circumferentially defined on a first side of the sealing flange 6 for accommodating a sealing ring. The reaction chamber bottom surface includes sealing through-holes corresponding to the pipeline connection holes 1121. A sealing flange 6 is mounted on each side of the sealing through-holes in the reaction chamber bottom surface. The two sealing flanges 6 are circumferentially defined and connected by bolts. A through-hole for the bolts is defined at the circumferential connection between the two sealing flanges 6. The central through-hole of the sealing flange 6 communicates with the sealing through-hole. The first sides of the sealing flanges 6 face the bottom surface of the reaction chamber. A sealing ring is disposed in the sealing ring groove 61, which abuts the bottom surface of the reaction chamber. The vacuum line 5 passes through the central through-hole of the sealing flange 6. This arrangement improves the sealing performance of the vacuum line 5 at the point where it passes through the bottom surface of the reaction chamber, preventing gas in the reaction chamber from leaking from the junction between the vacuum line 5 and the bottom surface of the reaction chamber, thereby improving the overall airtightness of the deposition apparatus.

[0059] Optionally, the bottom surface of the exhaust seat 11 abuts the sealing flange 6 on the upper side of the reaction chamber bottom surface, and the vacuum line 5 passes directly through the central through-hole of the sealing flange 6 abutting the bottom surface of the exhaust seat 11. This arrangement allows the exhaust seat 11 to be supported by the sealing flange 6, improving the positioning stability of the exhaust seat 11 in the reaction chamber. Of course, the exhaust seat 11 can be supported on the sealing flange 6 or on other supporting structures provided at the bottom of the reaction chamber, and this is not limited here.

[0060] In other embodiments, the sealing flange 6 may not be provided but other vacuum sealing components may be provided, as long as the overall sealing of the deposition device can be ensured, and no excessive restrictions are imposed here.

[0061] The working process of this embodiment is as follows:

[0062] Open the reaction chamber cover 31 and place the workpiece on the supporting assembly 2, then re-cover the reaction chamber cover 31 on the reaction chamber base 32; connect the upper end of the reaction chamber with the air inlet pipe 4, connect the pipe connecting hole 1121 with the vacuum pipe 5, then introduce the process gas into the reaction chamber and turn on the exhaust equipment at the same time to perform atomic film deposition on the workpiece. After the deposition is completed, close the air inlet and exhaust equipment, open the reaction chamber cover 31 to remove the workpiece, and repeat the above process to deposit the next workpiece.

[0063] The above embodiments merely illustrate the basic principles and features of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications are possible without departing from the spirit and scope of the present invention. Such changes and modifications are within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. An exhaust assembly, characterized in that: The exhaust assembly comprises an exhaust seat (11), the exhaust seat (11) is annular and has an exhaust chamber, a plurality of exhaust holes (1111) are arranged at intervals along the circumference of the exhaust seat (11) on the upper side, and a pipeline connection hole (1121) is opened on the lower side of the exhaust seat (11); The exhaust assembly further comprises a filter (12) and a baffle (13), wherein the filter (12) covers the exhaust hole (1111), and the baffle (13) is arranged across the exhaust hole (1111) and spaced apart from the filter (12).

2. The exhaust assembly according to claim 1, wherein: The baffle (13) comprises a baffle body (131) and a plurality of support columns (132), one end of the plurality of support columns (132) is connected to the baffle body (131) and the other end is connected to the upper side of the exhaust seat (11).

3. The exhaust assembly according to claim 2, wherein: The baffle body (131) includes a main plate portion (1311) and a plurality of wing plate portions (1312), wherein the plurality of wing plate portions (1312) are arranged at intervals along the circumference of the main plate portion (1311), the wing plate portions (1312) are arranged in a one-to-one correspondence with the support columns (132), and the upper ends of the support columns (132) are connected to the wing plate portions (1312).

4. The exhaust assembly according to claim 2, wherein: The upper side of the exhaust seat (11) is provided with a plurality of positioning grooves at intervals along the circumference of the exhaust hole (1111), the positioning grooves corresponding to the support columns (132) one by one, and the lower ends of the support columns (132) are inserted into the positioning grooves.

5. The exhaust assembly according to claim 2, wherein: The baffle (13) is parallel to the upper end surface of the exhaust seat (11), and the orthographic projection of the baffle (13) on the upper end surface of the exhaust seat (11) covers the exhaust hole (1111).

6. The exhaust assembly according to claim 1, wherein: The exhaust hole (1111) is an oblong hole extending along the circumference of the exhaust seat (11).

7. The exhaust assembly according to claim 1, wherein: The distance between the baffle (13) and the exhaust hole (1111) is 0.1 cm to 0.5 cm.

8. The exhaust assembly according to claim 1, wherein: The projection of the pipeline connection hole (1121) on the upper end surface of the exhaust seat (11) is offset from the exhaust hole (1111).

9. The exhaust assembly according to any one of claims 1 to 8, characterized in that: The exhaust seat (11) comprises an exhaust cover plate (111) and an exhaust base (112); the exhaust cover plate (111) is detachably mounted on the upper side of the exhaust base (112) and is enclosed with the exhaust base (112) to form the exhaust chamber; the exhaust cover plate (111) is provided with the exhaust hole (1111); the exhaust base (112) is provided with the pipeline connection hole (1121); the pipeline connection hole (1121) is used to communicate with the vacuum pipeline (5).

10. A deposition device comprising a carrier assembly (2) and a reaction chamber assembly (3) having a reaction chamber, wherein an air inlet pipe (4) is provided at the upper end of the reaction chamber and a vacuum pumping pipe (5) is provided at the lower end of the reaction chamber, characterized in that: The deposition device further comprises an exhaust assembly according to any one of claims 1 to 9, wherein the exhaust assembly and the carrier assembly (2) are both located in the reaction chamber; The exhaust seat (11) is arranged around the outer periphery of the bearing assembly (2), the exhaust seat (11) is lower than the bearing surface of the bearing assembly (2), and the vacuum pumping pipeline (5) is connected to the pipeline connecting hole (1121).

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