Carrier plate device for preventing particulate matter deposition and thin film deposition equipment thereof

Abstract

The utility model discloses a loading disc device for preventing particulate matter deposition and thin film deposition equipment thereof. The loading disc device comprises a heating disc and a plurality of ejector pins embedded in the heating disc, wherein the heating disc is provided with a plurality of through holes and air inlet channels communicated with the through holes, the ejector pins are arranged in the through holes in a penetrating mode, and when the carrying disc device is cleaned, air is input from the air inlet channels so that air curtains can be formed at the ends of the ejector pins. According to the loading disc device for preventing particulate matter deposition, the air inlet channel is arranged on the outer side of the ejector pin, the process chamber is cleaned, nitrogen and other gases are introduced, and an air curtain is formed at the end of the ejector pin, so that a coating is prevented from being attached to the end of the ejector pin, and the ejector pin cannot adhere to the surface of a wafer when making contact with the incoming wafer; and a large amount of particles at the end part of the ejector pin cannot be accumulated. According to the thin film deposition equipment adopting the carrying disc device for preventing particulate matter deposition, the influence of the ejector pin on a wafer can be reduced, and the thin film deposition quality is better.

Description

Technical Field

[0001] The utility model relates to the technical field of heating discs, in particular to a disc carrier device for preventing particle deposition and thin film deposition equipment thereof. Background Art

[0002] In semiconductor process equipment, such as the PECVD (plasma enhanced chemical vapor deposition) process, the process flow includes: transferring the wafer into the process chamber, depositing a thin film on the surface of the wafer, transferring the wafer out of the process chamber after the deposition is completed, and then cleaning the process chamber. During cleaning, the cleaning gas will form a layer of coating on the inner wall of the chamber, and finally the next wafer is transferred to repeat the above steps.

[0003] During the above process, after a thin film is deposited, a coating will grow when the chamber is cleaned. The coating will adhere to the end of the ejector pin. When the next wafer is transferred in, the back of the wafer will abut against the ejector pin, and the attached coating particles will stick to the wafer. Long-term use will also cause the particles to accumulate on the end of the ejector pin, affecting the quality of the thin film deposition on the wafer. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the existing technology and provide a carrier device and thin film deposition equipment for preventing particle deposition, so as to solve the technical problem that the coating deposition during the cleaning process of the existing ejector pin causes particle accumulation, which affects the quality of wafer thin film deposition.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present invention provides a disc carrier device for preventing particle deposition, comprising: a heating disc, and a plurality of ejector pins embedded in the heating disc; wherein the heating disc is provided with a plurality of through holes and an air inlet channel connected to the through holes, the ejector pins are passed through the through holes, and when the disc carrier device is cleaned, gas is input from the air inlet channel to form an air curtain at the end of the ejector pin.

[0007] Wherein, when the ejector pin is in a sunken state, the upper end surface of the ejector pin is lower than the top disk surface of the heating disk.

[0008] The gas outlet end of the air inlet channel is connected to the middle of the through hole, and the gas input from the air inlet channel is output through the air inlet channel and then output toward the end of the ejector pin.

[0009] Wherein, the top port of the through hole is an outward-expanding tapered hole.

[0010] The top end of the ejector pin is a conical head, the conical head is hung on the conical hole, and a reserved gap is provided between the conical head and the conical hole.

[0011] The heating plate has a loading surface, and a plurality of ejector pins are distributed on the same circumference of the loading surface.

[0012] Wherein, a plurality of the through holes are evenly arranged at equal central angles around the center of the loading surface.

[0013] Wherein, the ejector pin comprises: a rod body and a counterweight block connected to the lower end of the rod body, and the top end of the rod body is a conical head.

[0014] The heating plate includes a circular plate portion and a support column connected to the bottom center of the circular plate portion. The through hole and the air inlet channel are provided in the circular plate portion.

[0015] In a second aspect, an embodiment of the present invention further provides a thin film deposition device, which includes a disk carrier device for preventing particle deposition as described in any one of the above items.

[0016] This embodiment of the particle deposition prevention disk carrier device utilizes an air inlet channel positioned outside the ejector pins. During chamber cleaning, nitrogen or other gases are introduced, forming an air curtain at the ends of the ejector pins. This prevents coatings from adhering to the ends of incoming wafers, preventing adhesion to the wafer surface and preventing significant accumulation of particles at the ends of the ejector pins. Thin film deposition equipment employing this particle deposition prevention disk carrier device can reduce the impact of the ejector pins on the wafers, resulting in improved film deposition quality.

[0017] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 and Figure 2 Schematic diagram of the overall structure of the disk carrier device for preventing particle deposition according to an embodiment of the present invention from different perspectives.

[0019] Figure 3 1 is an exploded view of a disk carrier device for preventing particle deposition according to an embodiment of the present invention.

[0020] Figure 4 This is a side view of a disk carrier device for preventing particle deposition according to an embodiment of the present invention.

[0021] Figure 5 for Figure 4 The AA cross-sectional view.

[0022] Figure 6This is a side view from another angle of the disk carrier device for preventing particle deposition according to an embodiment of the present invention.

[0023] Figure 7 This is a cross-sectional view taken along line BB of a disk carrier device for preventing particle deposition according to an embodiment of the present invention.

[0024] Figure 8 for Figure 5 The enlarged structural diagram of local A is shown.

[0025] Description of reference numerals:

[0026] A disc loading device 100 for preventing particle deposition, a heating disc 1, a loading surface 10, a disc portion 11, a through hole 12, an air intake channel 13, a ejector pin 2, a rod portion 21, a counterweight 22, an end portion 23, and an air intake pipe 121. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0031] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can mean connected, detachably connected, or integrated; they can mean mechanically connected or electrically connected; they can mean directly connected or indirectly connected through an intermediate medium; they can mean internal communication between two components or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0032] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0033] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. Throughout this specification, the schematic representations of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0034] In semiconductor process equipment, such as the PECVD (plasma enhanced chemical vapor deposition) process, the process flow includes: transferring the wafer into the process chamber, depositing a thin film on the surface of the wafer, transferring the wafer out of the process chamber after the deposition is completed, and then cleaning the process chamber. During the cleaning, a layer of coating will be formed on the inner wall of the chamber, and finally the next wafer is transferred to repeat the above steps. In the above process, after a thin film is deposited, the coating grown during the chamber cleaning will adhere to the end of the ejector pin. When the next wafer is transferred in, the back of the wafer will abut against the ejector pin, and the attached coating particles will stick to the wafer, causing the particles to accumulate on the end of the ejector pin, affecting the quality of the thin film deposition on the wafer. Based on the above requirements, this embodiment proposes a carrier device 100 for preventing the deposition of particles.

[0035] See also Figures 1 to 8This embodiment discloses a disk carrier device 100 for preventing particle deposition. The disk carrier device 100 includes a heating disk 1 and a plurality of ejector pins 2 embedded in the heating disk 1. The heating disk 1 is provided with a plurality of through-holes 12 and an air inlet channel 13 connected to the through-holes 12. The ejector pins 2 are inserted through the through-holes 12. When the disk carrier device 100 is cleaning, gas is introduced through the air inlet channel 13 to form an air curtain at the ends 23 of the ejector pins 2. The introduced gas cannot react with the cleaning gas and only serves to form an air curtain to prevent the cleaning gas from coming into contact with the ejector pins 2.

[0036] After the wafer is transferred into the process chamber (the process chamber refers to the process chamber used for semiconductor thin film deposition equipment), the wafer is placed on the ejector pin 2, which lifts the wafer and outputs the heated process gas at the bottom to the process chamber, so that a thin film is deposited on the back of the wafer.

[0037] Because ejector pins need to circulate and contact the wafer, the cleanliness of their ends significantly affects the quality of thin film deposition. Particles contaminating the ends of ejector pin 2 are primarily coatings formed on their surfaces during process chamber cleaning. The disk carrier 100 of this embodiment prevents particle deposition by injecting gas around the outer periphery of ejector pin 2. During chamber cleaning, the gas is introduced, forming an air curtain around the ends of ejector pin 2. This significantly reduces the formation of coatings on these ends, thereby preventing the surface of the wafer from being affected during thin film deposition.

[0038] When the ejector pin 2 is in the sunken state, the upper end surface of the ejector pin 2 is lower than the top surface of the heating plate 1. In other words, when the ejector pin 2 is in the retracted state, its end is slightly lower than the top surface of the heating plate 1, thereby minimizing the exposed area of ​​the end surface of the ejector pin 2 and reducing the formation of a coating.

[0039] Please refer again Figure 8 The outlet end of the air inlet channel 13 is connected to the middle portion of the through hole 12, and the gas input from the air inlet channel 13 is output through the air inlet channel 13 and then output toward the end 23 of the ejector pin 2. The purpose of connecting the outlet end of the air inlet channel 13 to the through hole 12 is to ensure that externally input gas is first input through the air inlet channel 13 and then output upward along the through hole 12. The ejector pin 2 is inserted into the through hole 12, thus forming an annular cavity between the ejector pin 2 and the through hole 12. An annular airflow is formed before the gas is output from the upper end of the through hole 12, and a tubular air curtain is formed when the gas is output from the upper opening of the through hole 12. This reduces contact between the cleaning gas and the end 23 of the ejector pin 2, thereby reducing the possibility of coating formation.

[0040] The top end of the through hole 12 is an outward-expanding tapered hole. The gas flowing out of the tapered hole forms an outward-expanding tapered air curtain, which can more effectively prevent the cleaning gas from contacting the end 23 of the ejector pin 2.

[0041] like Figure 8 As shown, the top end of the ejector pin 2 is a conical head, which is hung on the conical hole, and a reserved gap is provided between the conical head and the conical hole. The reserved gap is used to allow the gas input from the outside through the air inlet channel to be output from the gap when the chamber is cleaned.

[0042] For details, please refer to Figure 2 The heating plate 1 has a loading surface 10, and a plurality of ejector pins 2 are distributed on the same circumference of the loading surface 10. Figure 5 As shown, a plurality of ejector pins 2 are arranged perpendicular to the loading surface 10 and pass through the through hole 12 . The plurality of ejector pins 2 are located on the same cylindrical surface and are arranged parallel to each other.

[0043] Please refer again Figure 7 The plurality of through holes 12 are evenly arranged at equal central angles around the center of the loading surface 10. In this embodiment, taking three ejector pins 2 and three through holes 12 as an example, they are distributed at a central angle of 120 degrees within the heating plate 1.

[0044] It is understandable that in other embodiments, the number and distribution shape of the ejector pins 2 may also be other shapes, as long as they can lift and support the wafer introduced into the process chamber.

[0045] The ejector pin 2 comprises a rod portion 21 and a counterweight 22 connected to the lower end of the rod portion 21. The top end 23 of the rod portion 21 is tapered. The counterweight 22 is used to allow the ejector pin 2 to descend and return to its original position under its own weight after being lifted by an external mechanism and then disengaged or stopped.

[0046] Please refer again Figure 2 and Figure 5 The heating plate 1 includes a circular plate portion 11 and a support column 12 connected to the bottom center of the circular plate portion 11 . The through hole 12 and the air inlet channel 13 are formed in the circular plate portion 11 .

[0047] It should be noted that the air inlet channel 13 can be provided in any shape and orientation within the disc portion 11, and is used to guide external air to the through hole 12. In this embodiment, the outer end of the air inlet channel 13 is also connected to the air inlet duct 121, which is provided within the support column 12. This air path design not only simplifies the processing of the heating plate 1, but also simplifies its connection to the external air supply device.

[0048] Please refer again Figures 1 to 8 In the disk loading device 100 for preventing particle deposition of this embodiment, the disk portion 11 of the heating disk 1 is disk-shaped, and the support column 12 is cylindrical, and the entire device has a central stack symmetrical structure.

[0049] In a second aspect, an embodiment of the present invention further provides a thin film deposition device, which includes a disk carrier 100 for preventing particle deposition as described in any one of the above items, and the disk carrier 100 for preventing particle deposition is arranged in a process chamber.

[0050] This embodiment of the particle deposition prevention disk carrier device utilizes an air inlet channel positioned outside the ejector pins. During chamber cleaning, nitrogen or other gases are introduced, forming an air curtain at the ends of the ejector pins. This prevents coatings from adhering to the ends of incoming wafers, preventing adhesion to the wafer surface and preventing significant accumulation of particles at the ends of the ejector pins. Thin film deposition equipment employing this particle deposition prevention disk carrier device can reduce the impact of the ejector pins on the wafers, resulting in improved film deposition quality.

[0051] The above examples are merely used to further illustrate the technical content of the present invention for easier understanding by the reader. However, they do not limit the implementation of the present invention to these examples. Any technical extension or reinvention based on the present invention is protected by the present invention. The scope of protection of the present invention shall be determined by the claims.

Claims

1. A disk carrier device for preventing particle deposition, characterized in that: include: A heating plate and a plurality of ejector pins embedded in the heating plate; wherein the heating plate is provided with a plurality of through holes and an air inlet channel connected to the through holes, the ejector pins are passed through the through holes, and when the plate carrier device is cleaned, gas is input from the air inlet channel to form an air curtain at the end of the ejector pin.

2. The disk carrier device for preventing particle deposition according to claim 1, characterized in that: When the ejector pin is in a sunken state, the upper end surface of the ejector pin is lower than the top surface of the heating plate.

3. The disk carrier device for preventing particle deposition according to claim 2, characterized in that: The gas outlet end of the air inlet channel is connected to the middle of the through hole, and the gas input from the air inlet channel is output through the air inlet channel and then output toward the end of the ejector pin.

4. The disk carrier device for preventing particle deposition according to claim 1, characterized in that: The top end of the through hole is an outward-expanding tapered hole.

5. The disk carrier device for preventing particle deposition according to claim 4, characterized in that: The top end of the ejector pin is a conical head, which is hooked on the conical hole, and a reserved gap is provided between the conical head and the conical hole.

6. The disk carrier device for preventing particle deposition according to any one of claims 1 to 5, characterized in that: The heating plate has a loading surface, and a plurality of ejector pins are distributed on the same circumference of the loading surface.

7. The disk carrier device for preventing particle deposition according to claim 6, characterized in that: The plurality of through holes are evenly arranged at equal central angles around the center of the loading surface.

8. The disk carrier device for preventing particle deposition according to claim 6, characterized in that: The ejector pin comprises a rod body and a counterweight connected to the lower end of the rod body, and the top end of the rod body is a conical head.

9. The disk carrier device for preventing particle deposition according to claim 8, characterized in that: The heating plate includes a circular plate portion and a support column connected to the bottom center of the circular plate portion. The through hole and the air inlet channel are provided in the circular plate portion.

10. A thin film deposition device, characterized in that: The thin film deposition equipment includes the disk carrier device for preventing particle deposition according to any one of claims 1 to 9.

Images