Conveying vibration device for PCB electroplating and PCB processing system

Abstract

The utility model discloses a conveying vibration device for PCB electroplating and a PCB processing system, and relates to the technical field of PCB processing. The conveying vibration device comprises a rail assembly and a vibration assembly, the rail assembly is used for bearing the electroplating hanging frame, and the electroplating hanging frame can move to an electroplating station along the rail assembly so that the PCB can be electroplated; the vibration assembly is connected with the track assembly; and the vibration assembly is used for driving the track assembly to vibrate, so that the electroplating hanger and the PCB are driven to vibrate along with the track assembly. According to the technical scheme provided by the utility model, bubbles attached to the surface of the PCB in the electroplating operation of the PCB can be effectively separated and eliminated, so that the quality of finished products is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, in particular to a conveying vibration device for PCB board electroplating and a PCB board processing system. Background Art

[0002] In PCB processing systems, one of the processes involves clamping the PCB on a plating rack and then moving it along a track into a plating tank filled with plating solution for electroplating. In existing technology, this process is prone to bubbles. These bubbles adhere to the board surface, resulting in uneven plating and affecting the quality of the finished product.

[0003] It should be noted that the above content is only used to assist in understanding the technical solution of the present utility model, and does not mean that the above content is admitted to be prior art. Utility Model Content

[0004] The main purpose of the utility model is to provide a conveying vibration device for PCB board electroplating and a PCB board processing system, which aims to effectively separate and remove bubbles attached to the board surface during the PCB board electroplating operation to ensure the quality of the finished product.

[0005] To achieve the above-mentioned object, the present invention proposes a conveying and vibrating device for PCB electroplating, which is applied to an electroplating rack on which a PCB is mounted. Specifically, the conveying and vibrating device comprises:

[0006] A track assembly, the track assembly is used to carry the electroplating rack, and the electroplating rack can move along the track assembly to the electroplating station to perform electroplating on the PCB board;

[0007] A vibration assembly is connected to the track assembly; the vibration assembly is used to drive the track assembly to vibrate, thereby driving the electroplating rack and the PCB board to vibrate.

[0008] In one embodiment, the electroplating station includes two symmetrically arranged electroplating cylinders, and the track assembly is arranged between the two electroplating cylinders; the two electroplating cylinders are connected to each other through a plurality of connecting rods, and the track assembly is installed on the plurality of connecting rods, wherein shock-absorbing rubber is arranged between the track assembly and the connecting rods.

[0009] In one embodiment, the track assembly includes two rows of guide rails arranged parallel to each other, and the two rows of guide rails are respectively located on the left and right sides of the electroplating rack along its running path; the electroplating rack is supported on the two rows of guide rails.

[0010] In one embodiment, the track assembly further includes a chain guide groove, which is arranged parallel to the guide track; the electroplating rack is provided with a one-way wheel assembly, which is connected to the chain guide groove; the one-way wheel assembly and the chain guide groove are combined to enable the electroplating rack to move unidirectionally along the running path.

[0011] In one embodiment, the vibration assembly is disposed between the two rows of guide rails, and the transmission ends of the vibration assembly are respectively connected to the two rows of guide rails, so that the two rows of guide rails can vibrate synchronously.

[0012] In one embodiment, the vibration assembly includes a vibration element, a mounting plate and a transmission plate, the vibration element is mounted on the mounting plate, the mounting plate is mounted at the middle position of the transmission plate, and the opposite end portions of the transmission plate are respectively connected to the two rows of guide rails.

[0013] In one embodiment, the vibration element includes a vibration motor.

[0014] In one embodiment, the end of the transmission plate is provided with at least two threaded holes, and the side of the guide rail is provided with a mounting hole, and the threaded hole is coaxially aligned with the mounting hole for a fixing bolt to pass through, so that the end of the transmission plate is fixedly connected to the guide rail.

[0015] In one embodiment, the vibrating element is wrapped with a protective cover, and the protective cover is fixedly connected to the mounting plate.

[0016] To achieve the above-mentioned object, the present invention provides a PCB board processing system, comprising any one of the above-mentioned conveying and vibration devices for PCB board electroplating.

[0017] The technical solution of the present invention is to provide a track assembly to support the electroplating rack, wherein the electroplating rack can move along the track assembly to the electroplating station so that the PCB board can be electroplated; at the same time, a vibration assembly is provided, which drives the track assembly to vibrate, thereby driving the electroplating rack supported by the track assembly to vibrate; it can be understood that when the electroplating rack vibrates, the PCB board will also vibrate, and the vibration is used to separate and remove bubbles attached to the surface of the PCB board, thereby ensuring the quality of the finished product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a structural diagram of an embodiment of a conveying vibration device provided by the present utility model;

[0020] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;

[0021] Figure 3 This is a structural diagram of an electroplating rack in an embodiment of a conveying vibration device provided by the present invention;

[0022] Figure 4 This is a schematic structural diagram of a vibration element in an embodiment of a conveying vibration device provided by the present invention;

[0023] Figure 5 This is a schematic diagram of the internal structure of the vibration element in one embodiment of the conveying vibration device provided by the present invention.

[0024] Description of reference numerals:

[0025] 100, electroplating rack; 110, slider; 120, one-way wheel assembly; 130, clamping assembly; 200, PCB board; 300, track assembly; 310, guide track; 320, chain guide; 400, vibration assembly; 410, vibration element; 420, mounting plate; 430, transmission plate; 431, threaded hole; 440, protective cover; 500, electroplating cylinder; 510, connecting rod;

[0026] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following is a clear and complete description of the technical solutions of the present invention in conjunction with the accompanying drawings. Obviously, the description is only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0028] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0029] In addition, it should be noted that the descriptions of "first", "second", etc. in this utility model are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0030] In PCB processing systems, one of the processes involves clamping the PCB on a plating rack and then moving it along a track into a plating tank filled with plating solution for electroplating. In existing technology, this process is prone to bubbles. These bubbles adhere to the board surface, resulting in uneven plating and affecting the quality of the finished product.

[0031] In order to solve the above technical problems, the present invention provides a conveying vibration device for PCB board electroplating and a PCB board processing system.

[0032] See also Figure 1-5 In one embodiment of the present invention, the conveying vibration device for PCB electroplating is applied to an electroplating rack 100, on which a PCB board 200 is mounted. Specifically, the PCB board 200 is clamped and fixed by a clamping assembly 130 on the electroplating rack 100, thereby driving the PCB board 200 to move.

[0033] Specifically, the conveying vibration device includes:

[0034] The track assembly 300 is used to carry the electroplating rack 100. The electroplating rack 100 can move along the track assembly 300 to the electroplating station to perform electroplating on the PCB board 200.

[0035] The vibration assembly 400 is connected to the track assembly 300; the vibration assembly 400 is used to drive the track assembly 300 to vibrate, thereby driving the electroplating rack 100 and the PCB board 200 to vibrate.

[0036] The technical solution of the present invention is to support the electroplating rack 100 by setting a track component 300, wherein the electroplating rack 100 can be moved along the track component 300 to the electroplating station so that the PCB board 200 can be electroplated; at the same time, a vibration component 400 is provided, and the vibration component 400 is used to drive the track component 300 to vibrate, thereby driving the electroplating rack 100 supported on the track component 300 to vibrate; it can be understood that when the electroplating rack 100 vibrates, the PCB board 200 will also vibrate, and the vibration is used to separate and remove bubbles attached to the surface of the PCB board 200, thereby ensuring the quality of the finished product.

[0037] As a preferred embodiment of the above embodiment, the electroplating station includes two symmetrically arranged electroplating cylinders 500, with the track assembly 300 positioned between the two electroplating cylinders 500. The two electroplating cylinders 500 are connected by a plurality of connecting rods 510, and the track assembly 300 is mounted on these connecting rods 510. Shock-absorbing rubber (not shown in the drawings) is interposed between the track assembly 300 and the connecting rods 510. This arrangement, with the connecting rods 510 positioned between the two electroplating cylinders 500 and the track assembly 300 mounted on these connecting rods 510, eliminates the need for an additional frame to mount the track assembly 300, thus reducing manufacturing costs. At the same time, since the vibration assembly 400 can drive the track assembly 300 to vibrate, in order to prevent the vibration from being transmitted to the electroplating cylinder 500 and causing damage to the electroplating cylinder 500 due to vibration, this embodiment provides a shock-absorbing rubber between the track assembly 300 and the connecting rod 510. The shock-absorbing rubber is used to absorb the vibration force, so that the vibration element can only cause the track assembly 300 to vibrate, while the electroplating cylinder 500 does not vibrate.

[0038] Furthermore, the track assembly 300 includes two parallel rows of guide rails 310, one located on the left and one on the right side of the electroplating rack 100's path. The electroplating rack 100 is supported on the two rows of guide rails 310. This arrangement designates the guide rails 310 as a two-row structure, with the electroplating rack 100 mounted on the two rows of guide rails 310. The two rows of guide rails 310 support opposite sides of the electroplating rack 100, thereby improving the stability of the electroplating rack 100 as it slides relative to the track assembly 300. The electroplating rack 100 includes symmetrically arranged sliders 110, which are slidably connected to the guide rails 310, thereby improving the stability of the electroplating rack 100 as it slides along the guide rails 310.

[0039] Furthermore, the track assembly 300 also includes a chain guide groove 320, which is arranged parallel to the guide track 310. The electroplating rack 100 is provided with a one-way wheel assembly 120, which is connected to the chain guide groove 320. The one-way wheel assembly 120 and the chain guide groove 320 cooperate to enable the electroplating rack 100 to move unidirectionally along the operating path. In this arrangement, the cooperation between the one-way wheel assembly 120 and the chain guide groove 320 ensures that the electroplating rack 100 moves along the track assembly 300 according to the operating path, preventing it from moving backwards. Among them, the one-way wheel assembly 120 and the chain guide groove 320 belong to the existing technology, so this application will not go into details about their structure; the general principle is that the one-way wheel assembly 120 has a ratchet structure, and the ratchet structure can only rotate in one direction on the chain guide groove 320 and cannot rotate in the reverse direction, so that the ratchet structure ensures that the electroplating rack 100 can only move in the specified direction.

[0040] As a preferred embodiment of the above-mentioned embodiment, the vibration assembly 400 is disposed between the two rows of guide rails 310, and the transmission end of the vibration assembly 400 is connected to the two rows of guide rails 310, respectively, so that the two rows of guide rails 310 can vibrate synchronously. With this arrangement, since the electroplating rack 100 is supported on the two rows of guide rails 310 as mentioned above, this embodiment allows the two rows of guide rails 310 to vibrate synchronously, thereby preventing the electroplating rack 100 from offsetting with the guide rails 310 due to inconsistent vibration amplitudes on the left and right sides, thereby preventing the electroplating rack 100 from subsequently moving along the guide rails 310 according to the operating path.

[0041] There are many different specific structures for the vibration assembly 400. In this embodiment, the vibration assembly 400 includes a vibration element 410, a mounting plate 420, and a transmission plate 430. The vibration element 410 is mounted on the mounting plate 420, which is mounted in the middle of the transmission plate 430. The opposite ends of the transmission plate 430 are respectively connected to the two rows of guide rails 310. This arrangement allows the mounting plate 420, on which the vibration element 410 is mounted, to be mounted in the middle of the transmission plate 430. This means that the mounting plate 420 is approximately equidistant from the opposite ends of the transmission plate 430. This allows the vibration force generated by the vibration element 410 to be symmetrically transmitted to the guide rails 310 at the opposite ends of the transmission plate 430, thereby achieving synchronous vibration of the two rows of guide rails 310.

[0042] The vibration element 410 can be a common vibration motor on the market. This vibration motor is a brushed DC motor with an eccentric wheel on the motor shaft. When the motor rotates, the center of the eccentric wheel is not at the center of rotation of the motor, causing the motor to be constantly out of balance. Due to inertia, it vibrates, thereby generating vibrations on the guide rail 310.

[0043] Specifically, at least two threaded holes 431 are provided at the end of the transmission plate 430. A mounting hole (not shown) is provided on the side of the guide rail 310. The threaded holes 431 are coaxially aligned with the mounting holes for passage of fixing bolts (not shown) to securely connect the end of the transmission plate 430 to the guide rail 310. This arrangement, in which the fixing bolts pass through the mounting holes and threadably engage with the threaded holes 431, securely connects the end of the transmission plate 430 to the guide rail 310. This structure is simple and highly practical.

[0044] Furthermore, the vibrating element 410 is wrapped with a protective cover 440, which is fixedly connected to the mounting plate 420. This configuration protects the vibrating element 410 from damage caused by dust or debris, thereby extending the service life of the vibrating element 410.

[0045] This embodiment also discloses a PCB processing system, including a conveyor and vibration device for PCB electroplating according to any of the aforementioned embodiments. The specific structure of the conveyor and vibration device can be found in the aforementioned embodiments. Because this PCB processing system utilizes all of the technical solutions of all of the aforementioned embodiments, it possesses at least all of the beneficial effects brought about by the technical solutions of the aforementioned embodiments, and therefore will not be further elaborated upon here.

[0046] It should be noted that the conveying vibration device for PCB electroplating and other contents of the PCB processing system disclosed in the present invention are prior art and will not be described in detail here.

[0047] The above are only optional embodiments of the present invention and do not limit the patent scope of the present invention. Any direct / indirect application of the present invention in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A conveying vibration device for PCB electroplating, applied to an electroplating rack, on which a PCB is mounted; characterized in that: The conveying vibration device comprises: A track assembly, the track assembly is used to carry the electroplating rack, and the electroplating rack can move along the track assembly to the electroplating station to perform electroplating on the PCB board; A vibration assembly is connected to the track assembly; the vibration assembly is used to drive the track assembly to vibrate, thereby driving the electroplating rack and the PCB board to vibrate.

2. The conveying vibration device according to claim 1, characterized in that: The electroplating station includes two symmetrically arranged electroplating cylinders, and the track assembly is arranged between the two electroplating cylinders; the two electroplating cylinders are connected to each other through a plurality of connecting rods, and the track assembly is installed on the plurality of connecting rods, wherein shock-absorbing rubber is arranged between the track assembly and the connecting rods.

3. The conveying vibration device according to claim 1, characterized in that: The track assembly includes two rows of guide tracks arranged parallel to each other, and the two rows of guide tracks are respectively located on the left and right sides of the electroplating rack along its running path; the electroplating rack is supported on the two rows of guide tracks.

4. The conveying vibration device according to claim 3, characterized in that: The track assembly also includes a chain guide groove, which is arranged parallel to the guide track; the electroplating rack is provided with a one-way wheel assembly, which is connected to the chain guide groove; the one-way wheel assembly and the chain guide groove are combined to enable the electroplating rack to move unidirectionally along the running path.

5. The conveying vibration device according to claim 3, characterized in that: The vibration component is arranged between the two rows of guide rails, and the transmission ends of the vibration component are respectively connected to the two rows of guide rails, so that the two rows of guide rails can vibrate synchronously.

6. The conveying vibration device according to claim 5, characterized in that: The vibration assembly includes a vibration element, a mounting plate and a transmission plate. The vibration element is mounted on the mounting plate. The mounting plate is mounted in the middle of the transmission plate. The opposite ends of the transmission plate are respectively connected to the two rows of guide rails.

7. The conveying vibration device according to claim 6, characterized in that: The vibration element includes a vibration motor.

8. The conveying vibration device according to claim 6, characterized in that: The end of the transmission plate is provided with at least two threaded holes, and the side of the guide rail is provided with a mounting hole. The threaded hole is coaxially aligned with the mounting hole for a fixing bolt to pass through, so that the end of the transmission plate is fixedly connected to the guide rail.

9. The conveying vibration device according to claim 6, characterized in that: The outside of the vibration element is wrapped with a protective cover, and the protective cover is fixedly connected to the mounting plate.

10. A PCB board processing system, characterized by: It comprises a conveying vibration device for PCB board electroplating as described in any one of claims 1 to 9.

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