Plate turnover device and electroplating production line

Abstract

The utility model discloses a plate turnover device and an electroplating production line, and relates to the technical field of circuit board electroplating, the plate turnover device is used on the electroplating production line, the electroplating production line comprises two horizontal electroplating devices, and the plate turnover device is arranged between the two horizontal electroplating devices. The plate turnover device comprises a rack, a feeding mechanism and a turnover mechanism, the feeding mechanism and the turnover mechanism are arranged on the rack, the feeding mechanism is provided with a horizontal conveying face for horizontally placing a circuit board, the circuit board electroplated by one horizontal electroplating device enters the horizontal conveying face, the feeding mechanism conveys the circuit board to the other horizontal electroplating device in the horizontal direction, and the turnover mechanism turns over the circuit board. In the conveying process, the turnover mechanism turns over the circuit board on the horizontal conveying face, the positions of the two side edges of the opposite sides of the circuit board are changed, the electroplating conveying mechanisms of the two horizontal electroplating devices clamp the two opposite sides of the circuit board correspondingly, and therefore after the circuit board is electroplated twice through the two horizontal electroplating devices, a plating layer is more uniform; and the production quality of the circuit board is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board electroplating, in particular to a plate turning device and an electroplating production line. Background Art

[0002] The effect of one-time electroplating of existing PCB boards is not very ideal, and secondary and tertiary electroplating are required. The primary and secondary electroplating will produce a thinner coating, but the surface of the board must be plated very evenly. Therefore, the primary and secondary electroplating adopt horizontal electroplating methods. In order to achieve the best electroplating effect, the board will be turned over and the clamping edge will be replaced. Because the current near the clamping edge is large, the plating will generally be thicker. The flipping is because the chemical environment of the upper and lower board surfaces is different. However, the existing flipping device has low positioning accuracy after flipping, and the flipping steps are slow and cumbersome, which is inefficient and affects the electroplating quality of the circuit board. Utility Model Content

[0003] The main purpose of the utility model is to provide a plate turning device and an electroplating production line, aiming to solve the problem of poor electroplating quality of existing circuit boards.

[0004] To achieve the above-mentioned purpose, the flipping device proposed in the present invention is applied to an electroplating production line, which includes a horizontal electroplating device, which includes an electroplating conveying mechanism and an electroplating cylinder. The electroplating conveying mechanism is used to clamp the side of the circuit board and drive the circuit board to move in the electroplating cylinder for electroplating. The flipping device is used to be arranged between two horizontal electroplating devices, and the flipping device includes a frame and a feeding mechanism and a turning mechanism provided on the frame:

[0005] The feeding mechanism has a horizontal conveying surface for placing the circuit board horizontally, and the feeding mechanism conveys the circuit board after electroplating by one of the horizontal electroplating devices to the other horizontal electroplating device in a horizontal direction through the horizontal conveying surface;

[0006] The flipping mechanism is used to turn over the circuit board on the horizontal conveying surface so that the electroplating conveying mechanisms of the two horizontal electroplating equipment respectively clamp the opposite sides of the circuit board.

[0007] In one embodiment, the flipping mechanism includes a driving assembly, a rotating shaft and a clamping assembly. The clamping assembly is arranged on the rotating shaft, and the rotating shaft is driven and connected to the driving assembly. The clamping assembly is provided with a slot for inserting a circuit board. The driving assembly is used to drive the rotating shaft to rotate so that the clamping assembly drives the circuit board to flip.

[0008] In one embodiment, the clamping assembly includes a plurality of clamping blocks, which are arranged at intervals along the length direction of the rotating shaft. A clamping slot is defined on each of the clamping blocks, and the plurality of clamping slots are connected to form the slot.

[0009] In one embodiment, the clamping assembly further includes a plurality of first guide wheels, which are spaced apart on the rotating shaft and disposed at the bottom of the clamping slot to slide against the side of the circuit board;

[0010] And / or, a plurality of the clamping blocks and a plurality of the first guide wheels are respectively provided on opposite sides of the rotating shaft.

[0011] In one embodiment, the driving assembly includes a driving motor, a transmission belt and a transmission wheel. One end of the rotating shaft is connected to the transmission wheel. The transmission belt is sleeved on the transmission wheel and the motor. The motor drives the transmission wheel to rotate through the transmission belt to drive the rotating shaft to rotate.

[0012] In one embodiment, the feeding mechanism includes a first conveyor line and a second conveyor line arranged at intervals, the first conveyor line and the second conveyor line transport circuit boards along a first direction, and the flipping mechanism is arranged between the first conveyor line and the second conveyor line for flipping the circuit boards on the first conveyor line to the second conveyor line.

[0013] In one embodiment, the feeding mechanism further includes a first pushing assembly and a second pushing assembly, wherein the first pushing assembly is arranged on the first conveyor line to push the circuit board on the first conveyor line to the flipping mechanism, and the second pushing assembly is arranged on the second conveyor line to push the circuit board on the second conveyor line to move along the first direction.

[0014] In one embodiment, the feeding mechanism further includes a third conveyor line and a fourth conveyor line, the fourth conveyor line extending along the conveying direction of the first conveyor line, the second pushing assembly being used to push the circuit boards on the second conveyor line to the third conveyor line, the third conveyor line being provided along the second direction for transporting the circuit boards on the second conveyor line to the fourth conveyor line, and the first direction and the second direction forming an angle;

[0015] And / or, the third conveyor line is connected to the second conveyor line and the fourth conveyor line and can be raised and lowered along the third direction to lift the circuit board on the second conveyor line or lower to place the circuit board on the third conveyor line to the fourth conveyor line.

[0016] In one embodiment, the feeding mechanism further includes a third pushing assembly and a fourth pushing assembly, wherein the third pushing assembly is provided on the third conveyor line for pushing the circuit boards on the third conveyor line to the fourth conveyor line along the second direction, and the fourth pushing assembly is used to push the circuit boards on the fourth conveyor line along the first direction and adjust the distance between two adjacent circuit boards;

[0017] And / or, the feeding mechanism further includes a positioning assembly, the positioning assembly is provided on the fourth conveyor line, and the third pushing assembly pushes the circuit board on the third conveyor line to move along the second direction and abut against the positioning assembly.

[0018] The present invention also proposes an electroplating production line, comprising two horizontal electroplating devices and the flipping device of any of the aforementioned embodiments, wherein the flipping device is arranged between the two horizontal electroplating devices.

[0019] The technical solution of the present invention connects two horizontal electroplating equipment through the use of a flip device to improve the electroplating quality and production efficiency of circuit boards. Specifically, the flip device is used in an electroplating production line, and the electroplating production line includes two horizontal electroplating equipment. The horizontal electroplating equipment includes an electroplating conveying mechanism and an electroplating cylinder. The electroplating conveying mechanism is used to clamp one side of the circuit board and drive the circuit board to move in the electroplating cylinder for electroplating. The flip device is arranged between the two horizontal electroplating equipment, and the flip device includes a frame and a feeding mechanism and a flipping mechanism arranged on the frame. The feeding mechanism has a conveying track, which has a horizontal conveying surface for horizontal placement of the circuit board. After electroplating is completed by one of the horizontal electroplating equipment, the circuit board enters the horizontal conveying surface, and the feeding mechanism sends it to the other horizontal electroplating equipment in a horizontal direction. During the conveying process, the flipping mechanism flips the circuit board on the horizontal conveying surface and exchanges the two side edges on the opposite sides of the circuit board, so that the electroplating conveying mechanisms of the two horizontal electroplating equipment respectively clamp the opposite sides of the circuit board.

[0020] It should be noted that horizontal electroplating equipment generally energizes the clamps of the electroplating conveyor mechanism to electroplate the circuit board. The current is large at the clamping point edge of the electroplating conveyor mechanism clamp, so the plating layer is relatively thicker. The farther the position on the circuit board is from the electroplating conveyor mechanism clamp, the smaller the current is, and the plating layer is relatively thinner. Obviously, a single electroplating cannot achieve a uniform plating effect, and the upper and lower surfaces of the circuit board in the electroplating tank are in a different solution environment, so the electroplating effects on both sides are also different. This solution sets a flip device to flip the upper and lower surfaces of the circuit board and switch the clamping point edge to the opposite side, so that the circuit board is more evenly plated after being electroplated twice by two horizontal electroplating equipment, effectively improving the production quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0022] Figure 1 A schematic structural diagram of an embodiment of a flap device provided by the present utility model;

[0023] Figure 2 A schematic diagram of the internal structure of an embodiment of the flap device provided by the utility model;

[0024] Figure 3 This is a schematic diagram of the assembly structure of the feeding mechanism and the turning mechanism in one embodiment of the flipping device provided by the utility model;

[0025] Figure 4 A partial structural diagram of a feeding mechanism and a turning mechanism in an embodiment of a plate turning device provided by the present invention;

[0026] Figure 5 A schematic diagram of a feeding mechanism transporting a circuit board in an embodiment of a flipping device provided by the present invention;

[0027] Figure 6 This is a structural diagram of the flipping mechanism in one embodiment of the flipping device provided by the present utility model;

[0028] Figure 7 This is a structural diagram of the rotating shaft and the clamping assembly in one embodiment of the flap device provided by the utility model;

[0029] Figure 8 This is a structural diagram of the first pushing assembly in an embodiment of the flap device provided by the present utility model;

[0030] Figure 9 This is a partial structural schematic diagram of an embodiment of an electroplating production line provided by the utility model.

[0031] Description of Figure Numbers:

[0032] 100, flip device; 110, frame; 120, feeding mechanism; 121, first conveyor line; 122, second conveyor line; 123, first pusher assembly; 1231, first linear motor; 1232, first lifting mechanism; 1233, first pusher member; 1234, second guide wheel; 124, second pusher assembly; 1241, second linear motor; 1242, second pusher member; 125, third conveyor line; 1251, second lifting mechanism; 126, fourth conveyor line; 127, third pusher assembly; 1271, third linear motor ; 1272, third push plate member; 128, fourth pusher assembly; 1281, fourth linear motor; 1282, fourth pusher member; 129, positioning assembly; 1291, fifth linear motor; 1292, stopper; 130, flip mechanism; 131, drive assembly; 1311, drive motor; 1312, transmission belt; 1313, transmission wheel; 132, rotating shaft; 133, clamping assembly; 133a, slot; 1331, clamping block; 1332, clamping slot; 1333, first guide wheel; 140, limit member; 141, third guide wheel;

[0033] 200, horizontal electroplating equipment; 210, electroplating conveying mechanism; 220, electroplating tank;

[0034] 300. Circuit board.

[0035] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0037] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0038] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0039] The effect of one-time electroplating of existing PCB boards is not very ideal, and secondary and tertiary electroplating are required. The primary and secondary electroplating will produce a thinner coating, but the surface of the board must be plated very evenly. Therefore, the primary and secondary electroplating adopt horizontal electroplating. In order to achieve the best electroplating effect, the board will be turned over and the clamping edge will be replaced. Because the current near the clamping edge is large, the coating will generally be thicker. The flipping is because the chemical environment of the upper and lower board surfaces is different. However, the existing flipping device has low positioning accuracy after flipping, and the flipping steps are slow and cumbersome, which is inefficient and affects the electroplating quality of the circuit board.

[0040] The utility model provides a flap device.

[0041] See also Figure 1 、 Figure 2 as well as Figure 9In one embodiment of the present invention, the flipping device 100 is used in an electroplating production line, and the electroplating production line includes two horizontal electroplating equipment 200. The horizontal electroplating equipment 200 includes an electroplating conveying mechanism 210 and an electroplating cylinder 220. The electroplating conveying mechanism 210 is used to clamp one side of the circuit board 300 and drive the circuit board 300 to move in the electroplating cylinder 220 for electroplating. The flipping device 100 is arranged between the two horizontal electroplating equipment 200. The flipping device 100 includes a frame 110 and a feeding mechanism 120 and a turning mechanism 130 arranged on the frame 110. The feeding mechanism 120 has a conveying track, which has a horizontal conveying surface for horizontally placing the circuit board 300. The circuit board 300 after electroplating in one horizontal electroplating equipment 200 enters the horizontal conveying surface, and the feeding mechanism 120 conveys it horizontally to another horizontal electroplating equipment 200. During the conveying process, the flipping mechanism 130 turns over the circuit board 300 on the horizontal conveying surface, and exchanges the positions of the two side edges of the opposite sides of the circuit board 300, so that the electroplating conveying mechanisms 210 of the two horizontal electroplating equipment 200 respectively clamp the opposite sides of the circuit board 300.

[0042] It should be noted that the horizontal electroplating equipment 200 generally energizes the clamp of the electroplating conveying mechanism 210 to electroplate the circuit board 300. The current is large at the clamping point edge of the clamp of the electroplating conveying mechanism 210 of the circuit board 300, so the plating is relatively thicker. The farther the position on the circuit board 300 is from the clamp of the electroplating conveying mechanism 210, the smaller the current is, and the plating is relatively thinner. Obviously, a single electroplating cannot achieve a uniform plating effect, and the upper and lower surfaces of the circuit board 300 in the electroplating cylinder 220 are in different liquid environment, so the electroplating effects on both sides are also different. This solution sets a flip device 100 to flip the upper and lower surfaces of the circuit board 300 and switch the clamping point edge to the opposite side, so that the circuit board 300 is more uniformly plated after being electroplated twice by two horizontal electroplating equipment 200, effectively improving the production quality of the circuit board 300.

[0043] The horizontal conveying surface of the feeding mechanism 120 can be formed by structures such as a belt conveyor line, a roller conveyor line, and a roller friction wheel conveyor line. The circuit board 300 moves horizontally from the previous horizontal electroplating equipment 200 to the electroplating conveying mechanism 210 of the next horizontal electroplating equipment 200 on the horizontal conveying surface, so that the electroplating conveying mechanism 210 can accurately clamp the circuit board 300 to ensure the stability of the docking and transportation process. The number of conveying lines can be multiple or single, and there is no specific limit on the number and structure, as long as the circuit board 300 can be conveyed horizontally.

[0044] In one embodiment, the flipping mechanism 130 includes a driving component 131, a rotating shaft 132 and a clamping component 133. The clamping component 133 is arranged on the rotating shaft 132, and the rotating shaft 132 is driven and connected to the driving component 131. The clamping component 133 is provided with a slot 133a for inserting the circuit board 300. The driving component 131 is used to drive the rotating shaft 132 to rotate so that the clamping component 133 drives the circuit board 300 to flip.

[0045] like Figures 3 to 7 As shown, in one embodiment of the present invention, the flip mechanism 130 includes a driving assembly 131, a rotating shaft 132 and a clamping assembly 133. The feeding mechanism 120 transports the circuit board 300 along the first direction. The rotating shaft 132 is also extended along the first direction. The clamping assembly 133 is provided on the rotating shaft 132. The driving assembly 131 is used to drive the rotating shaft 132 and the clamping assembly 133 to rotate. The clamping assembly 133 is provided with a slot 133a. The slot 133a extends along the axis direction of the rotating shaft 132 and can be aligned with the horizontal conveying surface of the feeding mechanism 120. When the feeding mechanism 120 transports the circuit board 300 to the flipping mechanism 130, the side of the circuit board 300 is inserted into the slot 133a, the driving component 131 drives the rotating shaft 132 to rotate, and the clamping component 133 flips the circuit board 300 180° and puts it back on the horizontal conveying surface of the feeding mechanism 120. At this time, the circuit board 300 is flipped over, and the two side edges of the circuit board 300 along the first direction are swapped so that the sides of the circuit board 300 clamped by the electroplating conveying mechanism 210 in the two horizontal electroplating equipment 200 are located on opposite sides to ensure uniform plating.

[0046] In one embodiment, the clamping assembly 133 includes a plurality of blocks 1331 , which are spaced apart along the length of the shaft 132 . Each block 1331 is provided with a slot 1332 , and the plurality of slots 1332 are connected to form a slot 133 a .

[0047] like Figure 6 and Figure 7As shown, in one embodiment of the present invention, the clamping assembly 133 includes a plurality of card blocks 1331. Specifically, the plurality of card blocks 1331 are arranged at intervals along the axial direction of the rotating shaft 132. A card slot 1332 is provided on each card block 1331. The card slot 1332 is open in the direction away from the rotating shaft 132. The plurality of card slots 1332 are connected to form a slot 133a. When the circuit board 300 moves from the horizontal conveying surface, one side edge of the circuit board 300 passes through the card slots 1332 of the plurality of card blocks 1331 in sequence. When the preset position is reached, the driving assembly 131 drives the rotating shaft 132 to rotate. The card block 1331 clamps the circuit board 300 and rotates 180° around the rotating shaft 132 above the horizontal conveying surface. When the slot 133a is aligned with the horizontal conveying surface again, the feeding mechanism 120 conveys the circuit board 300 to the next horizontal electroplating equipment 200 in the horizontal direction. It can be understood that multiple card blocks 1331 are set to form a slot 133a. When corresponding to circuit boards 300 of different sizes, the length of the slot 133a can be adjusted by adjusting the number of card blocks 1331 or the spacing between adjacent card blocks 1331, so that circuit boards 300 of different specifications can be flipped, which is highly practical.

[0048] In one embodiment, the clamping assembly 133 further includes a plurality of first guide wheels 1333 , which are spaced apart on the rotating shaft 132 and disposed at the bottom of the clamping slot 1332 for sliding against the side of the circuit board 300 ;

[0049] And / or, a plurality of blocks 1331 and a plurality of first guide wheels 1333 are respectively disposed on two opposite sides of the rotating shaft 132 .

[0050] like Figure 6 and Figure 7As shown, in one embodiment of the present invention, the clamping assembly 133 further includes a plurality of first guide wheels 1333. Specifically, the plurality of first guide wheels 1333 are arranged at intervals along the axial direction of the rotating shaft 132, and a first guide wheel 1333 is provided between two adjacent clamping blocks 1331. The side walls of the first guide wheels 1333 are higher than the bottom walls of the clamping slots 1332. When the circuit board 300 is moved along the first direction and inserted into the slot 133a, the edge of the circuit board 300 can slide and abut against the side walls of the first guide wheels 1333 to reduce friction. During the flipping process, due to the action of gravity, the side edges of the circuit board 300 abut against the side walls of the plurality of first guide wheels 1333. When the flipping is completed, the feeding mechanism 120 conveys the circuit board 300 along the horizontal conveying surface, and the side edges of the circuit board 300 slide and abut against the plurality of first guide wheels 1333 to reduce friction and avoid wear of the circuit board 300. Of course, in addition to the arrangement of the first guide wheel 1333 in this embodiment, there are other structures, such as setting a first guide wheel 1333 every two or three blocks 1331 to prevent the circuit board 300 from getting stuck or wearing out. No specific limitation is made here.

[0051] In order to improve the flipping efficiency, multiple blocks 1331 and multiple first guide wheels 1333 are respectively set on the opposite sides of the rotating shaft 132. Specifically, multiple blocks 1331 and multiple first guide wheels 1333 are mirror-imaged on the opposite sides of the rotating shaft 132 to form two slots 133a. When the first circuit board 300 enters one of the slots 133a and completes the flipping, the second circuit board 300 can enter the second slot 133a and wait for flipping. When the first circuit board 300 moves out of the slot 133a along the first direction, the second circuit board 300 can be flipped, and then the third circuit board 300 enters the slot 133a and waits. The cycle continues like this. The rotating shaft 132 only needs to flip half a circle each time. By utilizing the interval time of transportation after the flipping of the circuit board 300, the transportation efficiency of the entire flipping device 100 can be greatly improved.

[0052] In one embodiment, the driving assembly 131 includes a driving motor 1311, a transmission belt 1312 and a transmission wheel 1313. One end of the rotating shaft 132 is connected to the transmission wheel 1313. The transmission belt 1312 is sleeved on the transmission wheel 1313 and the driving motor 1311. The driving motor 1311 drives the transmission wheel 1313 to rotate through the transmission belt 1312 to drive the rotating shaft 132 to rotate.

[0053] like Figure 6As shown, in one embodiment of the present invention, the drive assembly 131 includes a drive motor 1311, a transmission belt 1312, and a transmission wheel 1313. Specifically, one end of the rotating shaft 132 is connected to the transmission wheel 1313. The drive motor 1311 is mounted on a bracket and connected to the transmission wheel 1313 via the transmission belt 1312. The drive motor 1311 drives the transmission wheel 1313 to rotate via the transmission belt 1312, so that the transmission wheel 1313 drives the rotating shaft 132 to rotate in a first direction and drives the clamping assembly 133 to flip the circuit board 300. The cost of the drive motor 1311 and the transmission belt 1312 is lower than that of gears, and the transmission belt 1312 structure can absorb vibration, reduce noise, and is quieter than gears, and is more convenient and simple to maintain. Of course, in some other embodiments of the present invention, the structure of the drive assembly 131 is not specifically limited.

[0054] In one embodiment, the feeding mechanism 120 includes a first conveyor line 121 and a second conveyor line 122 arranged at intervals, and the first conveyor line 121 and the second conveyor line 122 transport the circuit board 300 along a first direction. The flipping mechanism 130 is arranged between the first conveyor line 121 and the second conveyor line 122 for flipping the circuit board 300 on the first conveyor line 121 to the second conveyor line 122.

[0055] like Figures 3 to 5 As shown, in one embodiment of the present invention, the feeding mechanism 120 includes a first conveyor line 121 and a second conveyor line 122. Specifically, the first conveyor line 121 and the second conveyor line 122 are spaced apart and both extend along the first direction. The flipping mechanism 130 is arranged between the first conveyor line 121 and the second conveyor line 122. It should be noted that in this embodiment, the first conveyor line 121 and the second conveyor line 122 use friction wheels arranged on rollers to form a horizontal conveying surface. The rotation of the roller drives the friction wheel to rotate, and the friction wheel drives the circuit board 300 to move along the first direction. The clamping block 1331 of the clamping assembly 133 is set in the gap between the rollers. The circuit board 300 moves along the first direction on the first conveyor line 121 and is inserted into the slot 133a. The flipping mechanism 130 drives the circuit board 300 to rotate and flips the circuit board 300 onto the second conveyor line 122. When the slot 133a is aligned with the horizontal conveying surface of the second conveyor line 122, the second conveyor line 122 drives the circuit board 300 to continue moving along the first direction and disengage from the flipping mechanism 130. At this time, the rotating shaft 132 can flip the next circuit board 300 again.

[0056] It can be understood that the end of the first conveyor line 121 away from the flip mechanism 130 can be connected to the board outlet end of one of the horizontal electroplating equipment 200, and the end of the second conveyor line 122 away from the flip mechanism 130 can be connected to the board inlet end of another horizontal electroplating equipment 200. At this time, the two horizontal electroplating equipment 200 are not on the same horizontal line, or as shown in FIG. Figure 9As shown, when two horizontal electroplating equipment 200 are aligned, an additional conveying structure needs to be connected to the second conveyor line 122 to convey the flipped circuit board 300 to the next horizontal electroplating equipment 200. This structure is explained in detail below.

[0057] In one embodiment, the feeding mechanism 120 also includes a first pushing assembly 123 and a second pushing assembly 124. The first pushing assembly 123 is arranged on the first conveyor line 121 to push the circuit board 300 on the first conveyor line 121 to the flipping mechanism 130. The second pushing assembly 124 is arranged on the second conveyor line 122 to push the circuit board 300 on the second conveyor line 122 to move along the first direction.

[0058] like Figure 3 and Figure 4 As shown, in one embodiment of the present invention, the feeding mechanism 120 further includes a first pushing assembly 123 and a second pushing assembly 124. Specifically, the first pushing assembly 123 includes a first linear motor 1231 and a first push plate 1233 disposed above the first conveyor line 121. The first linear motor 1231 is disposed along a first direction. The first push plate 1233 and the first linear motor 1231 are driven and connected to each other to push the circuit board 300 on the first conveyor line 121 along the first direction and insert its side into the slot 133a of the flipping mechanism 130. The second pushing assembly 124 includes a second linear motor 1241 and a second push plate 1242 disposed above the second conveyor line 122. The second linear motor 1241 is disposed along the first direction. The second push plate 1242 and the second linear motor 1241 are driven and connected to each other to push the flipped circuit board 300 on the second conveyor line 122 out of the slot 133a of the flipping mechanism 130 along the first direction.

[0059] The first pushing assembly 123 and the second pushing assembly 124 can improve the conveying efficiency of the circuit board 300. It should be noted that, if Figure 8As shown, the first pushing assembly 123 also includes a first lifting mechanism 1232 and a second guide wheel 1234. The first push plate 1233 is connected to the first linear motor 1231 through the first lifting mechanism 1232. The first lifting mechanism 1232 adopts a cylinder, which can drive the first push plate 1233 to move up and down along the third direction. The first push plate 1233 is provided with a plurality of second guide wheels 1234 on one side facing the first conveyor line 121. The plurality of second guide wheels 1234 are arranged at intervals along the second direction and are rotatably provided on the first push plate 1233. When the electroplated circuit board 300 of the horizontal electroplating equipment 200 is removed from the first push plate 1233, The board exits the first conveyor line 121, and the first lifting mechanism 1232 drives the first push plate member 1233 away from the first conveyor line 121. The first linear motor 1231 drives the first push plate member 1233 to move away from the flipping device 100. After reaching the predetermined position, the first lifting mechanism 1232 drives the first push plate member 1233 to move downward in the third direction so that the side wall of the second guide wheel 1234 can abut against the circuit board 300. At this time, the first linear motor 1231 drives the first push plate member 1233 to move in the first direction, thereby driving the circuit board 300 to move and insert it into the slot 133a of the flipping mechanism 130. As can be seen from the above, the provision of the first lifting mechanism 1232 can prevent the first push plate member 1233 from interfering with the circuit board 300 during its back-and-forth movement.

[0060] In one embodiment, the feeding mechanism 120 further includes a third conveyor line 125 and a fourth conveyor line 126. The fourth conveyor line 126 extends along the conveying direction of the first conveyor line 121. The second pushing assembly 124 is used to push the circuit board 300 on the second conveyor line 122 to the third conveyor line 125. The third conveyor line 125 is arranged along the second direction to transport the circuit board 300 on the second conveyor line 122 to the fourth conveyor line 126. The first direction and the second direction form an angle.

[0061] And / or, the third conveyor line 125 is connected to the second conveyor line 122 and the fourth conveyor line 126 and can be raised and lowered along the third direction to lift the circuit board 300 on the second conveyor line 122 or lower the circuit board 300 on the third conveyor line 125 to the fourth conveyor line 126.

[0062] like Figure 3 and Figure 4As shown, in one embodiment of the present invention, the feeding mechanism 120 further includes a third conveyor line 125 and a fourth conveyor line 126. Specifically, the fourth conveyor line 126 is arranged on the extension line of the first conveyor line 121, and the third conveyor line 125 is arranged along the second direction and its two ends are respectively connected to the second conveyor line 122 and the fourth conveyor line 126. When the second pushing component 124 pushes the circuit board 300 on the second conveyor line 122 to the third conveyor line 125, the circuit board 300 can be moved on the third conveyor line 125 in the opposite direction of the second direction to the fourth conveyor line 126, and finally the circuit board 300 is transported along the first direction to the target horizontal electroplating equipment 200 through the fourth conveyor line 126. Please refer to Figure 5 and Figure 9 , two horizontal electroplating equipment 200 are aligned and arranged. This solution sets a third conveyor line 125 and a fourth conveyor line 126 so that the flipped circuit board 300 can be accurately conveyed to the corresponding horizontal electroplating equipment 200.

[0063] Furthermore, the fourth conveyor line 126 also adopts a structure in which a friction wheel is set on a rotating roller, while the third conveyor line 125 adopts a bracket and a plurality of rollers are arranged on the bracket. The plurality of rollers are arranged at intervals along the second direction. A second lifting mechanism 1251 is provided under the bracket. The second lifting mechanism 1251 is used to drive the bracket and the rollers on the bracket to rise or fall along the third direction. Specifically, when the circuit board 300 on the second conveyor line 122 is transported to the position of the third conveyor line 125, the second lifting mechanism 1251 drives the bracket to rise and lift the circuit board 300 located on the second conveyor line 122. The circuit board 300 slides in contact with the rollers on the third conveyor line 125, and when the circuit board 300 moves in the opposite direction of the second direction to the position of the fourth conveyor line 126, the second lifting mechanism 1251 drives the bracket to move downward along the third direction to place the circuit board 300 on the fourth conveyor line 126. The fourth conveyor line 126 is used to transport the circuit board 300 to the corresponding horizontal electroplating equipment 200.

[0064] It can be understood that by setting the third conveyor line 125 to rise and fall, and correspondingly setting rollers spaced apart from the second conveyor line 122 and the fourth conveyor line 126, scratches on the circuit board 300 during movement can be avoided, thereby ensuring the electroplating quality of the circuit board 300.

[0065] In one embodiment, the feeding mechanism 120 further includes a third pushing assembly 127 and a fourth pushing assembly 128. The third pushing assembly 127 is disposed on the third conveyor line 125 to push the circuit boards 300 on the third conveyor line 125 along the second direction to the fourth conveyor line 126. The fourth pushing assembly 128 is used to push the circuit boards 300 on the fourth conveyor line 126 along the first direction and adjust the distance between two adjacent circuit boards 300.

[0066] And / or, the feeding mechanism 120 further includes a positioning assembly 129 , which is disposed on the fourth conveyor line 126 , and the third pushing assembly 127 pushes the circuit board 300 on the third conveyor line 125 to move along the second direction and abut against the positioning assembly 129 .

[0067] like Figure 3 and Figure 4 As shown, in one embodiment of the present invention, the feeding mechanism 120 further includes a third pushing assembly 127 and a fourth pushing assembly 128. Specifically, the third pushing assembly 127 includes a third linear motor 1271 arranged along the second direction and a third pushing plate 1272 driven by the third linear motor 1271. When the third conveyor line 125 lifts the circuit board 300 on the second conveyor line 122, the third linear motor 1271 is used to drive the third pushing plate 1272 to push the circuit board 300 in the opposite direction of the second direction to above the fourth conveyor line 126. The fourth pushing assembly 128 includes a fourth linear motor 1281 arranged along the first direction and a fourth pushing plate 1282 driven by the fourth linear motor 1281. When the third conveyor line 125 places the circuit board 300 on the fourth conveyor line 126, the fourth linear motor 1281 drives the fourth pushing plate 1282 to push the circuit board 300 along the first direction to the horizontal electroplating equipment 200.

[0068] It should be noted that a plurality of second guide wheels 1234 are provided below the second push plate 1242 , the third push plate 1272 and the fourth push plate 1282 at intervals corresponding to the edges of the circuit board 300 for pushing the circuit board 300 to move.

[0069] Furthermore, the feeding mechanism 120 also includes a positioning assembly 129. Specifically, the positioning assembly 129 includes a fifth linear motor 1291 arranged above the fourth conveyor line 126 and a stopper 1292 driven and connected to the fifth linear motor 1291. When the third linear motor 1271 pushes the circuit board 300 on the third conveyor line 125 to reach above the fourth conveyor line 126, it abuts against the stopper 1292 for positioning, so that the edge of the circuit board 300 is aligned with the electroplating conveying mechanism 210 of the horizontal electroplating equipment 200 to ensure the stability of the plate clamping. The fifth linear motor 1291 is used to drive the stopper 1292 to move to adjust the position of the stopper 1292 to ensure the position accuracy of the circuit board 300.

[0070] It should be noted that, in addition to the stopper 1292, the feeding mechanism 120 also includes a limiting member 140, such as Figure 5As shown, a position limiter 140 is provided on the first conveyor line 121 near the flip mechanism 130 and a position limiter 140 is provided on the second conveyor line 122 near the third conveyor line 125, respectively, for positioning the circuit boards 300 on the first conveyor line 121 and the second conveyor line 122. A third guide wheel 141 is provided on the position limiter 140 and / or the stopper 1292. The third guide wheel 141 has the same structure as the first guide wheel 1333 and the second guide wheel 1234 mentioned above. Both position limiters 140 are provided along the second direction, and the multiple third guide wheels 141 on the position limiter 140 are also arranged at intervals along the second direction, guiding the circuit boards 300. Of course, the side of the stopper 1292 facing the fourth conveyor line 126 is also provided with multiple third guide wheels 141, which are arranged at intervals along the first direction, for abutting and positioning the circuit boards 300 and guiding the circuit boards 300 when they move along the first direction.

[0071] Furthermore, since the fourth linear motor 1281 and the fourth push plate 1282 push the circuit board 300 to move, the spacing of the positioned circuit boards 300 can be adjusted by the fourth linear motor 1281, and the spacing between two adjacent circuit boards 300 entering the horizontal electroplating equipment 200 is made to be the preset value L. However, due to the influence of the mechanical transmission control accuracy, there is a discrepancy between the actual spacing value D and the preset value L of the two adjacent circuit boards. By setting the linear motor so that L and D satisfy: L-1.5mm≤D≤L+1.5mm, that is, the error can be controlled within the range of 1.5mm. For example, if the preset value L between the boards is set to 10mm, then the minimum value of the actual spacing value D can be 8.5mm, and the maximum value can be 11.5mm. The spacing value D can also be 9.5mm, or any value within the aforementioned range. Accurate control of the board spacing can improve the electroplating quality.

[0072] The present invention also proposes an electroplating production line, wherein the horizontal electroplating equipment 200 includes two horizontal electroplating equipment 200 and a flip device 100. The flip device 100 is arranged between the two horizontal electroplating equipment 200. The specific structure of the flip device 100 refers to the above embodiment. Since the horizontal electroplating equipment 200 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0073] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A plate turning device, used in an electroplating production line, characterized in that: The electroplating production line includes a horizontal electroplating device, which includes an electroplating conveying mechanism and an electroplating cylinder. The electroplating conveying mechanism is used to clamp the side of the circuit board and drive the circuit board to move in the electroplating cylinder for electroplating. The flipping device is used to be arranged between two horizontal electroplating devices. The flipping device includes a frame and a feeding mechanism and a turning mechanism provided on the frame: The feeding mechanism has a horizontal conveying surface for placing the circuit board horizontally, and the feeding mechanism conveys the circuit board after electroplating by one of the horizontal electroplating devices to the other horizontal electroplating device in a horizontal direction through the horizontal conveying surface; The flipping mechanism is used to turn over the circuit board on the horizontal conveying surface so that the electroplating conveying mechanisms of the two horizontal electroplating equipment respectively clamp the opposite sides of the circuit board.

2. The flap device according to claim 1, characterized in that: The flipping mechanism includes a driving assembly, a rotating shaft and a clamping assembly. The clamping assembly is arranged on the rotating shaft, and the rotating shaft is driven and connected to the driving assembly. The clamping assembly is provided with a slot for inserting a circuit board. The driving assembly is used to drive the rotating shaft to rotate so that the clamping assembly drives the circuit board to flip.

3. The flap device according to claim 2, characterized in that: The clamping assembly includes a plurality of card blocks, which are arranged at intervals along the length direction of the rotating shaft. A card slot is formed on each card block, and the plurality of card slots are connected to form the slot.

4. The flap device according to claim 3, characterized in that: The clamping assembly further includes a plurality of first guide wheels, which are spaced apart on the rotating shaft and disposed at the bottom of the clamping slot for sliding against the side of the circuit board; And / or, a plurality of the clamping blocks and a plurality of the first guide wheels are respectively provided on opposite sides of the rotating shaft.

5. The flap device according to claim 2, characterized in that: The driving assembly includes a driving motor, a transmission belt and a transmission wheel. One end of the rotating shaft is connected to the transmission wheel. The transmission belt is sleeved on the transmission wheel and the motor. The motor drives the transmission wheel to rotate through the transmission belt to drive the rotating shaft to rotate.

6. The flap device according to any one of claims 1 to 5, characterized in that: The feeding mechanism includes a first conveyor line and a second conveyor line arranged at intervals, the first conveyor line and the second conveyor line transport circuit boards along a first direction, and the flipping mechanism is arranged between the first conveyor line and the second conveyor line for flipping the circuit boards on the first conveyor line to the second conveyor line.

7. The flap device according to claim 6, characterized in that: The feeding mechanism also includes a first pushing assembly and a second pushing assembly. The first pushing assembly is arranged on the first conveyor line to push the circuit board on the first conveyor line to the flipping mechanism. The second pushing assembly is arranged on the second conveyor line to push the circuit board on the second conveyor line to move along the first direction.

8. The flap device according to claim 7, characterized in that: The feeding mechanism further includes a third conveyor line and a fourth conveyor line, the fourth conveyor line extending along the conveying direction of the first conveyor line, the second pushing assembly being used to push the circuit boards on the second conveyor line to the third conveyor line, the third conveyor line being provided along the second direction for transporting the circuit boards on the second conveyor line to the fourth conveyor line, and the first direction and the second direction forming an angle; And / or, the third conveyor line is connected to the second conveyor line and the fourth conveyor line and can be raised and lowered along the third direction to lift the circuit board on the second conveyor line or lower to place the circuit board on the third conveyor line to the fourth conveyor line.

9. The flap device according to claim 8, characterized in that: The feeding mechanism further includes a third pushing assembly and a fourth pushing assembly, wherein the third pushing assembly is provided on the third conveyor line for pushing the circuit boards on the third conveyor line to the fourth conveyor line along the second direction, and the fourth pushing assembly is used to push the circuit boards on the fourth conveyor line along the first direction and adjust the distance between two adjacent circuit boards; And / or, the feeding mechanism further includes a positioning assembly, the positioning assembly is provided on the fourth conveyor line, and the third pushing assembly pushes the circuit board on the third conveyor line to move along the second direction and abut against the positioning assembly.

10. An electroplating production line, characterized in that: The invention comprises two horizontal electroplating devices and a turning device according to any one of claims 1 to 9, wherein the turning device is arranged between the two horizontal electroplating devices.

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