Horizontal electroplating production line

Abstract

The utility model discloses a horizontal electroplating production line, which relates to the technical field of circuit board electroplating, and comprises a horizontal electroplating device and a circuit board feeding device, the horizontal electroplating device comprises a first rack, an electroplating cylinder and a horizontal electroplating conveying device, the electroplating cylinder and the horizontal electroplating conveying device are arranged on the first rack, and the electroplating cylinder extends along a first direction; the horizontal electroplating conveying device is used for clamping the circuit board to move in the electroplating cylinder and carrying out electroplating, the circuit board feeding device comprises a second rack and a feeding conveying mechanism arranged on the second rack, and the feeding conveying mechanism is a conveying line with a certain length; the feeding conveying mechanism is used for allowing the circuit board to be horizontally placed and conveying the circuit board to the horizontal electroplating conveying device of the electroplating equipment in the horizontal direction, in the whole conveying process, the circuit board is kept horizontal and does not need to be operated through a mechanical arm, the occupied space of the equipment is smaller than that of traditional electroplating equipment, and the manufacturing cost is lower; and the high-precision electroplating requirement is met.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board electroplating, in particular to a horizontal electroplating production line. Background Art

[0002] Traditional PCB electroplating, whether using a gantry line or VCP, utilizes a vertical plating method. During the plating process, the board is vertically clamped in a fixture and immersed in a solution. A shaking mechanism is used to shake the board, causing the solution to flow through the interconnecting holes, where the electroplating occurs due to the conductive effect of the solution. This horizontal plating system occupies a large space, requires robotic loading and unloading, and is both costly and inefficient, making it difficult to meet the demands of high-precision electroplating. Utility Model Content

[0003] The main purpose of the utility model is to propose a horizontal electroplating production line, aiming to solve the problems of high manufacturing cost and poor electroplating precision of traditional electroplating equipment.

[0004] To achieve the above-mentioned purpose, the horizontal electroplating production line proposed by the present invention includes:

[0005] A horizontal electroplating apparatus comprising a first frame, an electroplating cylinder disposed on the first frame, and a horizontal electroplating conveyor, wherein the electroplating cylinder is provided with an inlet and an outlet at each end, respectively, and the horizontal electroplating conveyor is configured to move a circuit board entering the electroplating cylinder from the inlet toward the outlet;

[0006] A circuit board loading device is provided at one end of the electroplating cylinder near the entrance. The circuit board loading device includes a second frame and a loading and conveying mechanism provided on the second frame. The loading and conveying mechanism has a first horizontal conveying surface for placing the circuit board horizontally and conveying the circuit board along a first direction so that the circuit board entering the electroplating cylinder remains horizontal and moves to the horizontal electroplating conveying device.

[0007] In one embodiment, the circuit board loading device further includes a first positioning mechanism and a first pushing mechanism, wherein the first positioning mechanism is used to position the circuit board on the loading and conveying mechanism to a preset position, and the first pushing mechanism is used to drive the circuit board on the loading and conveying mechanism to move along a first direction to adjust the distance between two adjacent circuit boards positioned by the first positioning mechanism and arranged along the first direction.

[0008] In one embodiment, the first pushing mechanism is used to push the circuit board positioned by the first positioning mechanism to move along the first direction, so that the distance between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism is a preset value L, and the actual distance value between the two circuit boards is D, and L and D satisfy: L-1.5mm≤D≤L+1.5mm.

[0009] In one embodiment, the horizontal electroplating production line includes a flipping device and two horizontal electroplating equipment. The flipping device is arranged between the two horizontal electroplating equipment to flip the circuit board after electroplating by one of the horizontal electroplating equipment and transport it to the other horizontal electroplating equipment, so that the horizontal electroplating conveying devices of the two horizontal electroplating equipment respectively clamp the opposite sides of the circuit board.

[0010] In one embodiment, the flipping device includes a third frame and a feeding mechanism and a flipping mechanism arranged on the third frame. The feeding mechanism has a second horizontal conveying surface for horizontally placing the circuit board, and the flipping mechanism is used to flip the circuit board on the second horizontal conveying surface.

[0011] In one embodiment, the flipping mechanism includes a driving assembly, a rotating shaft and a clamping assembly. The clamping assembly is arranged on the rotating shaft, and the rotating shaft is driven and connected to the driving assembly. The clamping assembly is provided with a slot for inserting a circuit board. The driving assembly is used to drive the rotating shaft to rotate so that the clamping assembly drives the circuit board to flip.

[0012] In one embodiment, the feeding mechanism includes a first conveyor line, a second conveyor line, a third conveyor line and a fourth conveyor line. The first conveyor line and the second conveyor line transport circuit boards along a first direction. The flipping mechanism is arranged between the first conveyor line and the second conveyor line for flipping the circuit boards on the first conveyor line to the second conveyor line. The fourth conveyor line extends along the conveying direction of the first conveyor line. The third conveyor line is arranged along the second direction for transporting the circuit boards on the second conveyor line to the fourth conveyor line. The first direction forms an angle with the second direction.

[0013] In one embodiment, the flipping device also includes a second pushing mechanism and a second positioning mechanism. The second positioning mechanism is provided on the fourth conveyor line to position the circuit board to a preset position. The second pushing mechanism is used to push the circuit board along the first conveyor line, the second conveyor line, the third conveyor line and the fourth conveyor line in sequence, and push the circuit board positioned by the second positioning mechanism to the horizontal electroplating equipment, and adjust the distance between two adjacent circuit boards positioned by the second positioning mechanism and arranged along the first direction.

[0014] In one embodiment, the horizontal electroplating conveying device also includes a clamping mechanism and an electroplating conveying mechanism. A guide rail is provided on the first frame in the horizontal direction. The clamping mechanism includes a sliding member and a clamping member connected to each other. The clamping member is provided on the electroplating conveying mechanism for clamping the circuit board. The sliding member is slidably connected to the guide rail. The electroplating conveying mechanism is used to drive the clamping mechanism to move along the guide rail for transmitting the circuit board.

[0015] In one embodiment, the clamping member comprises:

[0016] Retaining clip;

[0017] a movable clip, the movable clip being movably mounted on the fixed clip via a connecting assembly, the movable clip being used to cooperate with the fixed clip to clamp the circuit board; and

[0018] The lifting support wheel is arranged on the side of the movable clamp away from the fixed clamp. When the clamping mechanism moves through the electroplating conveying mechanism, the lifting support wheel rises or falls to open or close the movable clamp and the fixed clamp.

[0019] In one embodiment, the horizontal electroplating conveyor device further includes a guide assembly provided on the first frame, the guide assembly including a first guide member and a second guide member, the first guide member being located on a loading path of the clamping mechanism, the second guide member being located on a unloading path of the clamping mechanism, and both the first guide member and the second guide member having a guide slope;

[0020] On the feeding path of the clamping mechanism, when the guide slope is used to guide the movement of the clamping mechanism, it abuts against the lifting support wheel, so that the distance between the fixed clamp and the movable clamp is increased, so as to be used for clamping the circuit board;

[0021] On the unloading path of the clamping mechanism, the lifting support wheel abuts when the guide slope is used to guide the movement of the clamping mechanism, so that the distance between the fixed clamp and the movable clamp is increased, so that the circuit board can be dropped off.

[0022] In one embodiment, the electroplating conveying mechanism further comprises:

[0023] A conveyor steel belt, wherein the conveyor steel belt is slidably mounted on the first frame, and the clamping mechanism is mounted on the conveyor steel belt;

[0024] A driving mechanism, comprising a conveying driving wheel and a conveying driven wheel, wherein the conveying driving wheel and the conveying driven wheel are respectively arranged at two ends of the first frame, and the conveying driving wheel and the conveying driven wheel are connected by the conveying steel belt to form a closed-loop transmission to achieve continuous conveying;

[0025] A tensioning mechanism is elastically connected to the conveyor steel belt and the first frame. When the conveyor steel belt slides on the first frame, the tensioning mechanism undergoes elastic deformation to change the horizontal distance between the first frame and the conveyor steel belt to tension the conveyor steel belt.

[0026] In one embodiment, the horizontal electroplating equipment also includes a cathode conductive clamp reverse stripping device, and the cathode conductive clamp reverse stripping device includes a stripping cylinder and a stripping assembly. The stripping cylinder is arranged on the first frame, and the conveyor steel belt is used to convey the clamping mechanism into the stripping cylinder so that the clamping mechanism and the stripping assembly form a conductive loop to strip the electroplating material on the clamping mechanism.

[0027] In one embodiment, the horizontal electroplating apparatus further comprises a conductive device, wherein the conductive device comprises:

[0028] A conductive oil tank assembly, wherein the conductive oil tank assembly is provided with conductive oil;

[0029] a cathode assembly, the cathode assembly being used to connect to an anode member of a power source to generate current;

[0030] A conductive slider assembly is configured in the clamping mechanism, the conductive slider assembly is disposed in the conductive oil tank assembly and immersed in the conductive oil, the conductive slider assembly is electrically connected to the cathode assembly, and is used to transmit current to the horizontal electroplating fixture, so that the circuit board on the horizontal electroplating fixture is charged;

[0031] The reflux mechanism includes an oil collecting tank and a reflux component. The oil collecting tank is used to store conductive oil. The conductive oil tank component is connected to the oil collecting tank through the reflux component to form a circulation path for the conductive oil in the oil collecting tank and the conductive oil in the conductive oil tank component to circulate between each other.

[0032] In one embodiment, the conductive device further includes an oil supply mechanism, and the reflux mechanism further includes an overflow assembly. The oil supply mechanism is connected to the conductive oil tank assembly to provide conductive oil to the oil guide tank assembly. The overflow assembly has an overflow port, and the overflow assembly is connected to the oil guide tank assembly through the overflow port. The conductive oil tank assembly is connected to the oil collecting tank through the overflow assembly. The conductive oil tank assembly has a preset volume. When the liquid volume in the conductive oil tank assembly exceeds the preset volume, the conductive oil in the conductive oil tank assembly can flow into the oil collecting tank through the overflow assembly.

[0033] In one embodiment, the horizontal electroplating equipment further comprises an anode spray device disposed in the electroplating tank, the anode spray device comprising:

[0034] Anode mesh plate;

[0035] an anode mesh, detachably mounted on the anode mesh plate;

[0036] A spray assembly is installed on a side of the anode mesh away from the anode mesh plate;

[0037] A conductive component, through which the anode grid is connected to the rectifier.

[0038] In one embodiment, at least two groups of the anode spray devices are installed at intervals in the electroplating cylinder, and the spray sides of the two groups of the anode spray devices are arranged opposite to each other, and a plating cavity for accommodating circuit board electroplating is formed between any two oppositely arranged groups of the anode spray devices.

[0039] In one embodiment, the anode mesh plate comprises:

[0040] An orifice plate body is provided with a plurality of mesh holes and a plurality of first spray holes, each of the mesh holes is arranged in a hexagonal shape, the plurality of mesh holes are arranged in a honeycomb array on the body, the plurality of first spray holes are arranged at intervals on the orifice plate body, and the orifice plate body has a spray side facing the circuit board and spraying the circuit board; and

[0041] The guide wheel is installed on the spraying side of the orifice plate body and is used for abutting against the circuit board.

[0042] In one embodiment, the horizontal electroplating production line further includes a copper dissolving device, and the copper dissolving device includes:

[0043] A copper dissolving tank is provided with a partition plate therein, the partition plate dividing the copper dissolving tank into a first cylinder body and a second cylinder body, the first cylinder body having a liquid inlet for a reaction solution to enter and a copper pellet basket for placing pure copper; an overflow portion is provided on the upper portion of the partition plate to connect the first cylinder body and the second cylinder body; the second cylinder body has an overflow port for the discharge of the electroplating solution;

[0044] a delivery pipeline, connecting the second cylinder body with the first cylinder body, so that the first cylinder body, the overflow portion, the second cylinder body and the delivery pipeline are connected to form an internal circulation loop; and

[0045] An overflow mechanism is installed at the overflow port, and is used to deliver the liquid in the second cylinder to the electroplating cylinder.

[0046] In one embodiment, the horizontal electroplating production line further includes a plate washing device and a plate drying device, wherein the plate washing device is provided at the entrance of the electroplating tank and between the circuit board feeding device and the electroplating tank, and / or the plate washing device is provided at the exit of the electroplating tank;

[0047] The plate drying device is arranged at the outlet of the electroplating tank and is located on the side of the plate washing device away from the electroplating tank, so as to remove water from the circuit board after electroplating and cleaning by the plate washing device.

[0048] The technical solution of the present invention adopts a circuit board loading device in a horizontal electroplating production line to cooperate with the horizontal electroplating equipment for electroplating, so as to reduce the manufacturing cost of the equipment. Specifically, the horizontal electroplating production line includes horizontal electroplating equipment and a circuit board loading device. The horizontal electroplating equipment includes a first frame and a plating cylinder and a horizontal electroplating conveying device arranged on the first frame. The plating cylinder extends along a first direction. The horizontal electroplating conveying device is used to clamp the circuit board and move it in the plating cylinder for electroplating. The circuit board loading device includes a second frame and a loading and conveying mechanism arranged on the second frame. The loading and conveying mechanism is a conveying line with a certain length and forms a first horizontal conveying surface for horizontal placement of the circuit board. The loading and conveying mechanism conveys the circuit board in a horizontal direction to the horizontal electroplating conveying device of the electroplating equipment. It can be understood that during the entire conveying process, the circuit board maintains a horizontal posture and does not need to be operated by a robot. Therefore, the equipment occupies less space than traditional electroplating equipment, has lower manufacturing costs, and the horizontal board movement can meet the high-precision electroplating requirements, and the product quality is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0050] Figure 1 A schematic structural diagram of an embodiment of a horizontal electroplating production line provided by the present invention;

[0051] Figure 2 A top view of an embodiment of a horizontal electroplating production line provided by the present invention;

[0052] Figure 3 This is a schematic diagram of the connection structure between the circuit board feeding device and the horizontal electroplating equipment in one embodiment of the horizontal electroplating production line provided by the present invention;

[0053] Figure 4 This is a structural schematic diagram of a circuit board loading device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0054] Figure 5 This is a partial structural diagram of a circuit board loading device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0055] Figure 6 This is a schematic diagram of the connection structure between the turning device and two horizontal electroplating equipment in one embodiment of the horizontal electroplating production line provided by the present invention;

[0056] Figure 7 This is a structural diagram of a plate turning device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0057] Figure 8 A schematic diagram of a portion of the structure of a plate turning device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0058] Figure 9 A schematic diagram of the conveying route of the circuit board by the turning device in one embodiment of the horizontal electroplating production line provided by the present invention;

[0059] Figure 10 This is a structural diagram of the turning mechanism of the plate turning device in one embodiment of the horizontal electroplating production line provided by the present invention;

[0060] Figure 11 A schematic diagram of the internal structure of a horizontal electroplating device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0061] Figure 12 This is a structural schematic diagram of a horizontal electroplating conveyor device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0062] Figure 13 This is a structural diagram of the clamping mechanism and conveying steel plate in the horizontal electroplating conveying device in one embodiment of the horizontal electroplating production line provided by the present invention;

[0063] Figure 14 This is a schematic structural diagram of the clamping mechanism and the conveying steel plate in an embodiment of the horizontal electroplating production line provided by the present invention;

[0064] Figure 15 This is a schematic diagram of the assembly structure of the clamping mechanism and the guide rail in an embodiment of the horizontal electroplating production line provided by the present invention;

[0065] Figure 16 This is a schematic diagram of the matching structure of the clamping member and the guide assembly in an embodiment of the horizontal electroplating production line provided by the present invention;

[0066] Figure 17 This is a structural diagram of the electroplating conveying mechanism in one embodiment of the horizontal electroplating production line provided by the present invention;

[0067] Figure 18 This is a structural diagram of a conveying steel belt, a conveying driving wheel, and a conveying driven wheel in an embodiment of a horizontal electroplating production line provided by the present invention;

[0068] Figure 19 A schematic structural diagram of a clamping member, a stripping cylinder, and a cathode conductive clamp reverse stripping device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0069] Figure 20 This is a structural schematic diagram of a conductive device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0070] Figure 21 for Figure 20 Enlarged view of point A in the middle;

[0071] Figure 22 This is a structural diagram of a clamping mechanism, a circuit board, and an anode spraying device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0072] Figure 23 This is a structural diagram of an anode spray device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0073] Figure 24 This is a schematic diagram of the bottom structure of the anode spray device in one embodiment of the horizontal electroplating production line provided by the present invention;

[0074] Figure 25 A schematic structural diagram of an anode mesh plate in an embodiment of a horizontal electroplating production line provided by the present invention;

[0075] Figure 26 This is a structural schematic diagram of a copper dissolving device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0076] Figure 27 This is a side cross-sectional view of a copper dissolving device in one embodiment of a horizontal electroplating production line provided by the present invention.

[0077] Description of Figure Numbers:

[0078] 10. Horizontal electroplating production line; 20. Circuit board; 30. Channel;

[0079] 100. Horizontal electroplating equipment; 110. First frame; 111. Guide rail; 112. First guide member; 113. Second guide member; 120. Electroplating cylinder; 130. Horizontal electroplating conveying device; 131. Clamping mechanism; 1311. Sliding member; 1312. Clamping member; 13121. Fixed clamp; 13122. Movable clamp; 13123. Lifting support wheel; 1313. Conductive slider assembly; 13131. First conductive slider; 13132. Second conductive slider; 132. Electroplating conveying mechanism; 1321. Conveyor belt; 1322. Conveyor driving wheel; 1323. Conveyor driven wheel; 1324. Tensioning mechanism; 13241. Tensioning seat; 13242. Compression spring; 1325. Slide rail assembly ;140, cathode conductive clip reverse stripping device;141, stripping cylinder;142, stripping assembly;143, power supply system;150, conductive device;151, conductive oil tank assembly;1511, first conductive oil tank;1512, second conductive oil tank;152, cathode assembly;1521, first cathode component;1522, second cathode component;153, reflux mechanism;1531, oil collecting tank;1532, reflux assembly;154, oil supply mechanism;155, overflow assembly;160, anode spray device;161, anode mesh plate;1611, orifice plate body;1612, mesh;1613, first spray hole;1614, guide wheel;162, spray assembly;1621, nozzle;163, conductive assembly;

[0080] 200, circuit board loading device; 210, second frame; 220, loading and conveying mechanism; 221, roller; 222, friction wheel; 230, first positioning mechanism; 231, first positioning baffle; 232, second linear motor; 233, second pusher; 240, first pusher; 241, first linear motor; 242, first pusher; 250, transfer rail; 251, first lifting mechanism;

[0081] 300, flipping device; 310, third frame; 320, feeding mechanism; 321, first conveyor line; 322, second conveyor line; 323, third conveyor line; 3231, second lifting mechanism; 324, fourth conveyor line; 330, flipping mechanism; 331, driving assembly; 3311, driving motor; 3312, transmission belt; 3313, transmission wheel; 332, rotating shaft; 333, clamping assembly; 333a, slot; 340, second pushing mechanism; 341, third linear motor; 342, third pushing member; 350, second positioning mechanism; 351, second positioning baffle; 352, fourth linear motor;

[0082] 400, copper dissolving device; 410, copper dissolving cylinder; 410a, first cylinder body; 410b, second cylinder body; 411, partition plate; 412, copper pellet basket; 413, conveying pipeline; 414, overflow mechanism; 415, overflow hole; 416, guide assembly; 4161, first guide plate; 4162, second guide plate; 420, material lifting mechanism;

[0083] 500, plate washing device;

[0084] 600. Dry plate device.

[0085] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0086] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0087] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0088] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0089] Traditional PCB electroplating, whether using a gantry line or VCP, utilizes a vertical plating method. During the plating process, the board is vertically clamped in a fixture and immersed in a solution. A shaking mechanism is used to shake the board, causing the solution to flow through the interconnecting holes, where the electroplating occurs due to the conductive effect of the solution. This horizontal plating system occupies a large space, requires robotic loading and unloading, and is both costly and inefficient, making it difficult to meet the demands of high-precision electroplating.

[0090] The utility model provides a horizontal electroplating production line.

[0091] See also Figures 1 to 5 In one embodiment of the present invention, the horizontal electroplating production line 10 includes a horizontal electroplating device 100 and a circuit board loading device 200. The horizontal electroplating device 100 includes a first frame 110 and a plating cylinder 120 provided on the first frame 110, and a horizontal electroplating conveying device 130. The plating cylinder 120 extends along a first direction and is filled with a plating solution. The horizontal electroplating conveying device 130 is used to clamp the circuit board 20 and move it in the plating cylinder 120 for electroplating. The circuit board loading device 200 includes a second frame 210 and a second frame 210 provided on the second frame 210. The loading and conveying mechanism 220 is a conveying line with a certain length and forms a first horizontal conveying surface for horizontal placement of the circuit board 20. The loading and conveying mechanism 220 conveys the circuit board 20 in a horizontal direction to the horizontal electroplating conveying device 130 of the electroplating equipment. It can be understood that during the entire conveying process, the circuit board 20 maintains a horizontal posture and does not need to be operated by a robot. Therefore, the equipment of this production line occupies less space and has lower manufacturing costs than traditional electroplating equipment. In addition, the horizontal board movement can meet the high-precision electroplating requirements and the product quality is higher.

[0092] It should be noted that the loading and conveying mechanism 220 includes a plurality of rollers 221. Specifically, the plurality of rollers 221 are arranged side by side along the first direction on the second frame 210 to form a conveyor line. A plurality of friction wheels 222 are provided on each roller 221 to form a first horizontal conveying surface. The frame is also provided with a drive motor. The ends of any two adjacent rollers 221 are provided with meshing gears. The drive motor drives the plurality of rollers 221 to rotate at the same speed through the gears. The friction wheel 222 contacts the bottom of the board surface to drive the circuit board 20 to move. The position where the friction wheel 222 contacts the circuit board 20 can adopt a structure such as soft rubber to prevent scratches.

[0093] Further, such as Figure 4 and Figure 5As shown, the circuit board loading device 200 also includes a first positioning mechanism 230 and a first pushing mechanism 240 provided on the second frame 210. The first positioning mechanism 230 is used to position the circuit board 20 on the loading conveyor mechanism 220 to a predetermined position so that the edge of the circuit board 20 is aligned with the horizontal electroplating conveyor 130. After the positioning is completed, the circuit board 20 is moved along the first direction into the electroplating cylinder 120. The first pushing mechanism 240 includes a set of first linear motors 241 and a first pushing member 242 arranged along the first direction. The first pushing member 242 is driven by the first linear motor 241. The first linear motor 241 is used to drive the first pushing member 242 to move back and forth along the first direction and drive the circuit board 20 to move. The first positioning mechanism 230 includes a second linear motor 232 and a second pushing member 233 arranged along the second direction. The loading conveyor mechanism 220 is also provided with a first positioning baffle 231. The second linear motor 232 drives the second pushing member 233 to push the circuit board 20 to the first positioning baffle 231 for positioning. During production loading, operators generally place multiple circuit boards 20 on the loading and conveying mechanism 220 in sequence. The first pushing mechanism 240 is used to adjust the distance between two adjacent circuit boards 20 positioned by the first positioning mechanism 230 and arranged along the first direction.

[0094] During positioning, the first positioning mechanism 230 pushes the circuit board 20 laterally, which may cause the friction wheel 222 to scrape against the surface of the circuit board 20. Therefore, a transfer track 250 can be set along the second direction below the loading and conveying mechanism 220. The upper end of the transfer track 250 is provided with multiple driven wheels spaced along the second direction, and the lower end is provided with a first lifting mechanism 251 for lifting. When the circuit board 20 enters the positioning position, the first lifting mechanism 251 drives the transfer track 250 to rise and lift the circuit board 20. The first positioning mechanism 230 pushes the circuit board 20 to move along the second direction, and the surface of the circuit board 20 slides and abuts against the driven wheel to avoid scratches. When the positioning is completed, the first lifting mechanism 251 drives the transfer track 250 to descend and puts the circuit board 20 back to the first conveying level to complete the subsequent transmission steps.

[0095] Since multiple circuit boards 20 need to enter the electroplating tank 120 in sequence, the uneven spacing of the circuit boards 20 may cause uneven flow of the electroplating solution, resulting in excessively thick or thin coating in some areas, affecting the overall performance. However, the existing equipment uses a roller conveying structure, and the spacing control accuracy is not high. Figure 5As shown, in one embodiment of the present invention, a first pushing member 242 is provided on the first linear motor 241 of the first pushing mechanism 240, and the first pushing member 242 is used to push the circuit board 20 positioned by the first positioning mechanism 230 toward the electroplating cylinder 120 and catch up with the previous circuit board 20. The operating gap and the transportation distance are calculated by the controller, and the first positioning mechanism 230 and the first pushing mechanism 240 are controlled to cooperate with each other so that the spacing value between two adjacent circuit boards 20 is greater than or equal to 1 mm and less than or equal to 3 mm, that is, the spacing value between two adjacent circuit boards 20 is controlled to be within a preset value L. For example, the preset value L of the board spacing can be set to 5 mm. m, 10mm or 15mm, etc. However, due to the influence of the control accuracy of the mechanical equipment, there is a discrepancy between the actual spacing value D and the preset value L. By controlling the linear motor, the error between the spacing value D and the preset value L can be further reduced compared to conventional roller conveying. Specifically, L and D satisfy: L-1.5mm≤D≤L+1.5mm, that is, the error can be controlled within the range of 1.5mm. For example, if the preset value L of the plate spacing is set to 10mm, then the minimum value of the actual spacing value D can be 8.5mm, the maximum value can be 11.5mm, the spacing value D can also be 9.5mm, or any value within the aforementioned range. Compared with the traditional roller conveying structure, the control is more precise, and the electroplating effect is better.

[0096] The effect of one-time electroplating of existing PCB boards is not very ideal, and usually two and three electroplatings are required. The one and two electroplatings will be plated thinner, but the surface of the board must be plated very evenly, so the one-time electroplating and the two-time electroplating adopt horizontal electroplating. In order to achieve the best electroplating effect, the board will be turned over and the clamping edge will be replaced. Therefore, in the horizontal electroplating production line 10, in order to improve the electroplating efficiency, at least two horizontal electroplating equipment 100 are usually set up to be connected front and back, and a flip device 300 is set in the middle to flip the circuit board 20 and transport it. The flip device 300 receives the circuit board 20 after the electroplating of the previous horizontal electroplating equipment 100 is completed, and the circuit board 20 is flipped over, the clamping edge is replaced, and then transported to the next horizontal electroplating equipment 100 to improve the plating uniformity of the circuit board 20.

[0097] like Figures 6 to 10As shown, the flipping device 300 includes a third frame 310 and a feeding mechanism 320 and a flipping mechanism 330 arranged on the third frame 310. The feeding mechanism 320 has a conveying track, which has a second horizontal conveying surface for horizontally placing the circuit board 20. The second horizontal conveying surface can be arranged flush with the first horizontal conveying surface. The circuit board 20 after electroplating by one of the horizontal electroplating equipment 100 enters the horizontal conveying surface, and the feeding mechanism 320 conveys it to the other horizontal electroplating equipment 100 in the horizontal direction. During the conveying process, the flipping mechanism 330 flips the circuit board 20 on the horizontal conveying surface and exchanges the two side edges of the opposite sides of the circuit board 20, so that the horizontal electroplating conveying devices 130 of the two horizontal electroplating equipment 100 respectively clamp the opposite sides of the circuit board 20.

[0098] It should be noted that the horizontal electroplating equipment 100 generally energizes the clamps of the horizontal electroplating conveyor 130 to electroplate the circuit board 20. The current is large at the clamping point edge of the circuit board 20 close to the horizontal electroplating conveyor 130, so the plating is relatively thicker. The farther the position of the circuit board 20 is from the horizontal electroplating conveyor 130, the smaller the current is, and the plating is relatively thinner. Obviously, a single electroplating cannot achieve a uniform plating effect, and the upper and lower surfaces of the circuit board 20 in the electroplating cylinder 120 are in different liquid environment, so the electroplating effects on both sides are also different. This solution sets a flip device 300 to flip the upper and lower surfaces of the circuit board 20 and switch the clamping point edge to the opposite side, so that the circuit board 20 is more uniformly plated after being electroplated twice by two horizontal electroplating equipment 100, thereby effectively improving the production quality of the circuit board 20.

[0099] The second horizontal conveying surface of the feeding mechanism 320 can be formed by structures such as a belt conveyor line, a roller conveyor line, and a roller friction wheel conveyor line. The circuit board 20 moves horizontally from the previous horizontal electroplating equipment 100 to the electroplating cylinder 120 of the next horizontal electroplating equipment 100 on the second horizontal conveying surface, so that the horizontal electroplating conveying device 130 can accurately clamp the circuit board 20 to ensure the stability of the docking and transportation process.

[0100] Please refer to Figure 9 and Figure 10In one embodiment of the present invention, the flip mechanism 330 includes a driving assembly 331, a rotating shaft 332, and a clamping assembly 333. The feeding mechanism 320 transports the circuit board 20 along the first direction. The rotating shaft 332 is also extended along the first direction. The clamping assembly 333 is provided on the rotating shaft 332. The driving assembly 331 is used to drive the rotating shaft 332 and the clamping assembly 333 to rotate. The clamping assembly 333 is provided with a slot 333a. The slot 333a extends along the axis direction of the rotating shaft 332 and can be aligned with the horizontal conveying surface of the feeding mechanism 320. When the feeding mechanism 320 transports the circuit board 20 to the flipping mechanism 330, the side of the circuit board 20 is inserted into the slot 333a, the driving component 331 drives the rotating shaft 332 to rotate, and the clamping component 333 flips the circuit board 20 180° and puts it back on the second horizontal conveying surface of the feeding mechanism 320. At this time, the circuit board 20 is flipped over, and the two side edges of the circuit board 20 along the first direction are swapped so that the sides of the circuit board 20 clamped by the electroplating conveying mechanism 132 in the two horizontal electroplating equipment 100 are located on opposite sides to ensure uniform plating.

[0101] Furthermore, the drive assembly 331 includes a drive motor 3311, a transmission belt 3312, and a transmission wheel 3313. Specifically, one end of the rotating shaft 332 is connected to the transmission wheel 3313. The drive motor 3311 is arranged on a bracket and is connected to the transmission wheel 3313 via the transmission belt 3312. The drive motor 3311 drives the transmission wheel 3313 to rotate via the transmission belt 3312, so that the transmission wheel 3313 drives the rotating shaft 332 to rotate about a first direction and drives the clamping assembly 333 to flip the circuit board 20. The cost of the drive motor 3311 and the transmission belt 3312 is lower than that of gears, and the transmission belt 3312 structure can absorb vibration, reduce noise, is quieter than gears, and is more convenient and simple to maintain. Of course, in some other embodiments of the utility model, the drive assembly 331 can also adopt a structure such as a worm gear set, without specific limitation.

[0102] Furthermore, the feeding mechanism 320 includes a first conveyor line 321, a second conveyor line 322, a third conveyor line 323 and a fourth conveyor line 324. The first conveyor line 321, the second conveyor line 322 and the fourth conveyor line 324 all use friction wheels set on rollers to form a horizontal conveying surface. The rotation of the roller drives the friction wheels to rotate, and the friction wheels drive the circuit board 20 to move along the first direction. The first conveyor line 321, the second conveyor line 322 and the fourth conveyor line 324 are arranged at intervals and all extend along the first direction. The flip mechanism 330 is arranged between the first conveyor line 321 and the second conveyor line 322. The third conveyor line 323 is arranged along the second direction and its two ends are respectively connected to the second conveyor line 322 and the fourth conveyor line 324. The third conveyor line 323 is connected to the second conveyor line 322 and the fourth conveyor line 324 through The cylinder mechanism is raised and lowered to lift the circuit board 20 located on the second conveyor line 322. Specifically, when the circuit board 20 moves from the first conveyor line 321 to the slot 333a of the clamping assembly 333, the flip device 300 flips the circuit board 20 180° to the second conveyor line 322. The circuit board 20 continues to move along the first direction on the second conveyor line 322 to above the third conveyor line 323. The second lifting mechanism 3231 raises the third conveyor line 323 to lift the circuit board 20. The circuit board 20 moves along the second direction on the third conveyor line 323 to above the fourth conveyor line 324. The cylinder lowers the third conveyor line 323, and then the circuit board 20 falls on the fourth conveyor line 324 and moves along the first direction toward the electroplating cylinder 120.

[0103] The flipping device 300 also includes a second pushing mechanism 340 and a second positioning mechanism 350. The second pushing mechanism 340 includes four third linear motors 341, each linear motor is provided with a third pushing piece 342, and the four third linear motors 341 and the four third pushing pieces 342 are respectively arranged on four conveyor lines to push the circuit boards 20 on the corresponding conveyor lines to move along the conveying direction of the conveyor lines. Furthermore, a second positioning mechanism 350 is also provided on the fourth conveyor line 324, including a second positioning baffle 351. When the third pushing piece 342 located on the third conveyor line 323 pushes the circuit board 20 along the second direction to the fourth conveyor line 324, the circuit board 20 abuts against the second positioning baffle 351 of the second positioning mechanism 350, so that the side of the circuit board 20 is aligned with the horizontal electroplating conveying device 130 of the next horizontal electroplating equipment 100, ensuring that the clamping point position is consistent. In this embodiment, the second positioning baffle 351 is further connected to a fourth linear motor 352 for adjusting the position of the second positioning baffle 351 on the fourth conveyor line 324 to accommodate circuit boards 20 of different specifications.

[0104] In addition, the third linear motor 341 and the third pusher 342 on the fourth conveyor line 324 push the positioned circuit board 20 toward the electroplating cylinder 120. During the pushing process, the control mechanism calculates the distance moved by the previously positioned circuit board 20 and pushes the circuit board 20 on the second positioning mechanism 350 until it catches up with the previous circuit board 20 to control the spacing between them. It should be noted that, in order to ensure uniform electroplating quality, the second pusher mechanism 340 of the flipping device 300 also uses a linear motor, which can control the spacing error between the two adjacent positioned circuit boards 20 to within 1.5mm, that is, the actual spacing value D and the preset value L of the circuit boards meet the following conditions: L-1.5mm≤D≤L+1.5mm. For example, if the preset value L of the board spacing is set to 10mm, then the minimum value of the actual spacing value D can be 8.5mm, the maximum value can be 11.5mm, the spacing value D can also be 9.5mm, or any value within the aforementioned range, to ensure that the spacing between the circuit boards 20 entering the two horizontal electroplating equipment 100 is kept within the same range, thereby reducing the impact of the spacing on the secondary electroplating.

[0105] As shown in Figure 11 to Figure 15 As shown, in one embodiment of the present invention, the horizontal electroplating conveying device 130 also includes a clamping mechanism 131 and a plating conveying mechanism 132. The first frame 110 provides overall structural support for the horizontal electroplating equipment 100. The first frame 110 is provided with a guide rail 111 to guide the sliding member 1311 to perform linear motion. Among them, the main purpose of providing the guide rail 111 on the first frame 110 is to ensure that the clamping mechanism 131 can move smoothly and accurately along the predetermined path, which is crucial to ensure that the circuit board 20 is not damaged or positionally shifted during the electroplating process. The guide rail 111 can help the clamping mechanism 131 stay on the correct track and prevent processing errors caused by offset. Reduce the vibration or shaking of the sliding member 1311 during movement to ensure that the circuit board 20 is stable during transmission. The guide rail 111 can reduce the friction between the clamping mechanism 131 and other components and extend the life of the equipment.

[0106] The clamping mechanism 131 includes multiple sliding members 1311 and clamping members 1312. The sliding members 1311 are slidably connected to the guide rails 111 on the first frame 110, while the clamping members 1312 secure the circuit boards 20. The electroplating conveyor mechanism 132 drives the clamping mechanism 131, causing the sliding members 1311 to move along the guide rails 111, thereby transporting the circuit boards 20 along the production line. Specifically, the clamping mechanism 131 first clamps the circuit boards 20 to be processed using the clamping members 1312. Once the electroplating conveyor mechanism 132 is activated, it drives the sliding members 1311 to move along the guide rails 111. The movement of the sliding members 1311 causes the clamping members 1312 and the circuit boards 20 thereon to move accordingly, completing the process of transporting the circuit boards 20 between electroplating tanks. The primary purpose of this design is to achieve automated transport of circuit boards 20 within the electroplating production line, reducing manual labor and improving production efficiency and safety. This design also allows the equipment to accommodate various circuit board 20 sizes and shapes, providing excellent versatility and flexibility.

[0107] It is understood that the guide rail 111 is usually a long strip structure made of metal, which can be an open T-slot or a closed V-slot, etc., and the sliding member 1311 has a corresponding slider to match it. Alternatively, rollers or balls can be used to reduce friction, which is suitable for applications that require frequent reciprocating motion. Alternatively, it can be composed of a guide rail 111 and a slider, and the slider has balls or needles inside, which can move smoothly on the guide rail 111. It is understood that the structural design of the slider 1311 usually needs to take into account the way it cooperates with the guide rail 111. It can be a metal or plastic slider that cooperates with the guide rail 111 or the guide groove, and the slider may contain balls or needles inside to reduce friction. Alternatively, it can be a roller, a sliding member 1311 with wheels that can roll on the surface of the guide rail 111, reducing friction and providing smooth movement. Alternatively, it can be a suspended type, with the sliding member 1311 connected to the guide rail 111 above by suspension, which is suitable for movement in vertical or inclined directions. This solution allows for precise and stable transport of circuit boards 20 during the electroplating process. As part of the guide system, the slider 1311, in conjunction with the guide rail 111, ensures that the circuit board 20 does not deflect or vibrate during movement, thereby ensuring electroplating quality and production efficiency. Stable mechanical transmission reduces product damage and uneven electroplating caused by improper manual operation. Automated transport reduces manual handling time, increases production speed, improves efficiency, and enhances product quality, while reducing production costs and safety risks.

[0108] Further references Figures 14 to 16The clamping member 1312 includes a fixed clamp 13121, a movable clamp 13122, and a lifting support wheel 13123. The movable clamp 13122 is movably mounted on the fixed clamp 13121 via a connecting assembly. The movable clamp 13122 is used to cooperate with the fixed clamp 13121 to clamp the circuit board 20. The lifting support wheel 13123 is provided on the side of the movable clamp 13122 away from the fixed clamp 13121, and is used to drive the movable clamp 13122 to rise or fall. The first frame 110 is provided with a guide assembly along the first direction. The guide assembly includes a first guide member 112 and a second guide member 113. The upper surfaces of the first guide member 112 and the second guide member 113 respectively form a slope and extend obliquely upward along the conveying direction. When the lifting support wheel 13123 reaches the slope, the lifting support wheel 13123 moves upward along the slope. The fixed clamp 13121 is fixedly installed on the electroplating conveying mechanism 132, so that the electroplating conveying mechanism 132 drives the entire device to move in the horizontal direction through the fixed clamp 13121. When the lifting support wheel 13123 moves to the lowest point of the slope, it begins to climb upward along the slope. Since the fixed clamp 13121 is fixedly connected to the electroplating conveying mechanism 132 and always maintains the same horizontal height, the movable clamp 13122 moves upward under the drive of the lifting support wheel 13123, thereby causing the movable clamp 13122 and the fixed clamp 13121 to slide relative to each other, and the movable clamp 13122 and the fixed clamp 13121 are therefore opened.

[0109] like Figure 16As shown, when the clamping mechanism 131 moves along the guide slope of the first guide member 112 toward the loading direction, the lifting support wheel 13123 rises, and the distance between the fixed clamp 13121 and the movable clamp 13122 increases, allowing the circuit board 20 to be clamped smoothly. When the clamping mechanism 131 moves in the opposite direction (i.e., the unloading direction) along the guide slope of the second guide member 113, the distance between the fixed clamp 13121 and the movable clamp 13122 also increases, this time to release the circuit board 20 from the clamped state. Specifically, the clamping mechanism 131 is in its initial position, at which point the distance between the fixed clamp 13121 and the movable clamp 13122 is suitable for clamping the circuit board 20. During the loading phase, the circuit board 20 is placed in the position of the clamping mechanism 131. The clamping mechanism 131 begins to move, sliding along the guide rail 111 to the first guide member 112. Under the action of the guiding slope of the first guide member 112, the distance between the fixed clamp 13121 and the movable clamp 13122 gradually increases. This increased distance allows the circuit board 20 to smoothly enter between the two clamping assemblies 333. When the clamping mechanism 131 has completely passed through the first guide member 112, the distance between the fixed clamp 13121 and the movable clamp 13122 is restored, and the circuit board 20 is securely clamped. The clamping mechanism 131 continues to move along the guide rail 111 and enters the plating tank or other processing area. During this stage, the circuit board 20 undergoes electroplating or other surface treatment. In the unloading stage, after the treatment is completed, the clamping mechanism 131 begins to return, sliding along the guide rail 111 to the second guide member 113. Under the action of the guiding slope of the second guide member 113, the distance between the fixed clamp 13121 and the movable clamp 13122 gradually increases again. The increased distance allows the circuit board 20 to be released from the clamping state. Once the clamping mechanism 131 has completely passed through the second guide 113, the circuit board 20 is lowered or transferred to the next process step. The clamping mechanism 131 returns to its initial position, ready for the next cycle. This process ensures that the circuit board 20 can be securely clamped and released during the electroplating process, while also ensuring the continuity and automation of the entire process.

[0110] like Figure 17 and Figure 18As shown, the electroplating conveyor mechanism 132 also includes a conveyor belt 1321, a drive mechanism, and a tensioning mechanism 1324. The conveyor belt 1321 is mounted on the first frame 110 and can slide on the first frame 110. The drive mechanism consists of a conveyor driving wheel 1322 and a conveyor driven wheel 1323, respectively located at both ends of the first frame 110, forming a closed-loop transmission through the conveyor belt 1321. The outer surface of the conveyor belt 1321 is provided with a clamping mechanism 131 to achieve continuous conveying. The tensioning mechanism 1324 is elastically connected to the conveyor belt 1321 and the first frame 110. It adjusts the horizontal distance between the first frame 110 and the conveyor belt 1321 through elastic deformation, thereby ensuring the tension of the belt. Specifically, before the device is started, the conveyor belt 1321 is in an initial position, and the tensioning mechanism 1324 maintains a certain pre-tension to ensure that the conveyor belt 1321 is properly tensioned on the first frame 110. When the system starts, the driving wheel 1322 in the drive mechanism begins to rotate. Because the driving wheel 1322 and the driven wheel 1323 form a closed-loop transmission via the conveyor belt 1321, the driven wheel 1323 also rotates. Driven by the drive mechanism, the conveyor belt 1321 slides along the first frame 110, clamping the circuit board 20 to be electroplated via the clamping mechanism 131 and pulling it into the next process step. The circuit board 20 advances as the conveyor belt 1321 moves.

[0111] Furthermore, the tensioning mechanism 1324 includes a tensioning seat 13241 and a compression spring 13242. The compression spring 13242 is mounted on the tensioning seat 13241. The tensioning seat 13241 is slidably mounted on the first frame 110 via a slide rail assembly 1325. One end of the compression spring 13242 abuts the tensioning seat 13241, and the other end abuts the first frame 110, thereby providing tension. This design, through the elasticity of the compression spring 13242, automatically adjusts the position of the conveyor driven wheel 1323 relative to the first frame 110, thereby maintaining the tension of the conveyor belt 1321, ensuring smooth conveyance of the multiple clamping members 1312 on the outer side of the belt and preventing them from falling or deviating.

[0112] The existing clamp copper stripping process usually uses nitric acid or sulfuric acid combined with chemical agents such as hydrogen peroxide to strip the copper layer, and the clamp uses a closed clamping part to strip the copper. The contact area of ​​the chemical solution is small, the copper stripping effect is not very good, and copper residue is easily left.

[0113] like Figure 19As shown, this solution proposes a cathode conductive clamp reverse stripping device 140, including a stripping cylinder 141 and a stripping assembly 142 arranged on the first frame 110. The first frame 110 has a stripping station and a conveying station, as well as a conveying track connecting the stripping station and the conveying station. The stripping cylinder 141 and the electroplating cylinder 120 are arranged on opposite sides of the conveying steel belt 1321 along the first direction. The stripping station is arranged in the stripping cylinder 141, and the conveying station is arranged in the electroplating cylinder 120. The conveying track is formed by the conveying steel belt 1321. The clamping member 1312 is movably arranged on the conveying track. When the clamping member 1312 is transferred from the conveying station to the stripping station, the lifting support wheel 13123 of the clamping member 1312 passes through the first After the second guide member 113 rises, the movable clamp 13122 is held in place by the latch block on the fixed clamp 13121, keeping the fixed clamp 13121 and the movable clamp 13122 in the open position. The stripping assembly 142 is inserted into the stripping cylinder 141, which contains a stripping solution. The clamping member 1312 and the stripping assembly 142 are each electrically connected to the power supply system 143, so that the stripping assembly 142 forms the negative electrode and the clamping member 1312 forms the positive electrode. The stripping solution forms a conductive circuit between the two, thereby stripping the electroplated material from the clamping member 1312. The stripping solution can be an iron-based copper plating solution, thereby replacing the existing solution of nitric acid or sulfuric acid with hydrogen peroxide for stripping.

[0114] When the clamp 1312 and the stripping assembly 142 are simultaneously energized, the iron-based copper plating solution forms a conductive circuit with the charged clamp 1312 and stripping assembly 142, thereby causing an electrolytic reaction on the copper on the clamp 1312. The copper ions stripped from the clamp 1312 enter the solution, some of which are deposited on the surface of the stripping assembly 142 to form a copper layer, while some remain in the solution. The stripping process strips the copper from the clamp 1312 and transfers it to the stripping assembly 142. It also promotes the balance of ionic composition within the stripping solution. This ensures that if the clamp 1312 accidentally carries the stripping solution into the next electroplating process, the stripping solution will not corrode the electroplating tank 120, nor will the stripping solution carried by the clamp 1312 contaminate the electroplating solution within the electroplating tank 120.

[0115] like Figure 20 and Figure 21As shown, in one embodiment of the present invention, the horizontal electroplating apparatus 100 further includes a cathode conductive conductive device 150, whose main components include a conductive oil tank assembly 151, a cathode assembly 152, a conductive slider assembly 1313, and a return mechanism 153. The conductive oil tank assembly 151 is filled with conductive oil, creating a conductive medium environment. The cathode assembly 152 is connected to the anode of the power supply, forming part of the current loop. The conductive slider assembly 1313 is mounted on the clamping mechanism 131 and immersed in the conductive oil within the conductive oil tank assembly 151. The conductive slider assembly 1313 is electrically connected to the cathode assembly 152 and is responsible for conducting current from the cathode assembly 152 to the clamping mechanism 131, thereby charging the circuit board 20. The return mechanism 153 includes an oil collection tank 1531 and a return assembly 1532. The oil collection tank 1531 is used to store the conductive oil. The conductive oil tank assembly 151 is connected to the oil collection tank 1531 via the return assembly 1532, forming a circulation path for the conductive oil. Specifically, the anode of the power supply forms a current loop with the cathode assembly 152. The conductive slider assembly 1313 is immersed in the conductive oil within the conductive oil tank assembly 151 and is electrically connected to the cathode assembly 152. Current is transmitted through the conductive slider assembly 1313 to the clamping mechanism 131, charging the circuit board 20.

[0116] During operation, the conductive oil in the conductive oil tank assembly 151 may need to be replaced or replenished due to temperature fluctuations or other factors. The return assembly 1532 creates a circulation path between the conductive oil tank assembly 151 and the oil collection tank 1531. When the conductive oil needs to be replaced or replenished, the conductive oil in the oil collection tank 1531 flows through the return assembly 1532 into the conductive oil tank assembly 151, and vice versa, thus enabling the recycling of the conductive oil. This solution uses conductive oil as a medium to transmit current, while utilizing the return mechanism 153 to recycle the conductive oil. This ensures stable current transmission and effective management of the conductive oil during the horizontal electroplating process. This approach not only improves electroplating efficiency but also reduces resource waste, enhancing equipment reliability and maintenance efficiency. The core of the entire solution is the use of conductive oil as a medium during the electroplating process and the recycling of the conductive oil through the return mechanism 153. This helps maintain current stability and conductivity during the electroplating process, while reducing resource consumption and costs by recycling the conductive oil. Furthermore, this design reduces mechanical wear, improving system reliability and service life.

[0117] In addition to the conductive oil tank assembly 151, cathode assembly 152, conductive slider assembly 1313, and reflux mechanism 153, the conductive device 150 also includes an oil supply mechanism 154. The primary function of the oil supply mechanism 154 is to supply fresh conductive oil to the conductive oil tank assembly 151 from an external source, ensuring a continuous supply of conductive oil and the proper operation of the system. When the conductive oil in the conductive oil tank assembly 151 needs to be replenished or replaced, the oil supply mechanism 154 provides fresh conductive oil to the conductive oil tank assembly 151. The presence of the oil supply mechanism 154 ensures that the conductive oil tank assembly 151 always has an adequate supply of conductive oil, maintaining normal system operation even during long periods of operation or high consumption. This replenishment of conductive oil maintains its purity, thereby improving the quality and efficiency of electroplating. Automatic oil replenishment through the oil supply mechanism 154 reduces the frequency of manual oil addition, simplifies maintenance, and improves equipment reliability and ease of operation.

[0118] The reflux mechanism 153 includes an oil sump 1531, a reflux assembly 1532, and an overflow assembly 155. The overflow assembly 155 has an overflow port, which communicates with the oil guide sump assembly through the overflow port. The conductive oil sump assembly 151 communicates with the oil sump 1531 through the overflow assembly 155. The conductive oil sump assembly 151 has a preset volume. When the liquid volume within the conductive oil sump assembly 151 exceeds the preset volume, the conductive oil within the conductive oil sump assembly 151 can flow through the overflow assembly 155 into the oil sump 1531. The overflow assembly 155 enables automatic overflow and circulation of the conductive oil, ensuring that the liquid volume within the conductive oil sump assembly 151 does not exceed the preset volume limit. It is understood that the overflow assembly 155 can be connected to the conductive oil sump assembly 151 and the oil sump 1531 via a pipe. The pipe between the overflow port and the conductive oil sump assembly 151 ensures that the conductive oil can flow smoothly into the overflow assembly 155. The pipe between the overflow assembly 155 and the oil collecting tank 1531 ensures that the conductive oil can flow into the oil collecting tank 1531.

[0119] like Figures 22 to 25 As shown, the horizontal electroplating equipment 100 also includes an anode spray device 160 arranged in the electroplating cylinder 120, including an anode mesh plate 161, a spray component 162 and a conductive component 163. The anode mesh is used to be immersed in an electrolyte containing plating metal ions together with the circuit board 20. The anode mesh is connected to a power supply to form a potential difference with the circuit board 20, thereby triggering an electrolytic reaction and plating a metal coating on the outer surface of the circuit board 20. The spray component 162 is used to spray the reaction solution toward the circuit board 20. The spray component 162 has a plurality of spray pipes, and the spray pipes are provided with a plurality of nozzles 1621. The spray pipes are connected to the reaction solution and spray the reaction solution through the nozzles 1621. One end of the conductive component 163 is connected to the rectifier, and the other end is connected to the anode mesh to power the anode mesh so that it can be electroplated.

[0120] In an embodiment of the present invention, at least two groups of anode spray devices 160 are spaced apart along the height direction within the electroplating cylinder 120. The anode spray devices 160 have spray surfaces. The spray surfaces of the two groups of anode spray devices 160 are arranged opposite each other with a gap between them to form an electroplating chamber for the circuit board 20 to be moved and electroplated. The multiple anode spray devices 160 are arranged in sequence above and below the moving path of the circuit board 20. When the circuit board 20 moves in the electroplating chamber, the anode spray devices 160 on the upper and lower sides spray the reaction solution so that the upper and lower sides of the circuit board 20 located therein can be evenly electroplated. In this embodiment, multiple groups of anode spray devices 160 are spaced apart along the horizontal direction, and each group of anode spray devices 160 is closely arranged at the same height to reduce the gap between the device groups, so that the circuit board 20 can be continuously electroplated uninterruptedly during the movement process until the electroplating is completed.

[0121] It should be noted that the anode spray device 160 is the anode conductive portion of the equipment. After assembly, it is fixed to the electroplating tank 120. Then, a reaction solution is added to the electroplating tank 120, and the anode spray device 160 is immersed in the reaction solution. The circuit board 20 is placed between the anode spray device 160 via a horizontal electroplating fixture. Then, power is applied to the anode spray device 160 to conduct electricity and electroplate the circuit board 20. Among them, the anode mesh plate 161 is an auxiliary device in the horizontal electroplating equipment 100 used to assist the electroplating process. Its function is to provide a uniform current density distribution for the workpiece during the electroplating process, and to decompose elemental particles in the reaction solution and attach them to the circuit board 20.

[0122] See also Figure 25 In one embodiment of the present invention, the anode mesh plate 161 includes: a mesh plate body 1611 and a guide wheel 1614; the mesh plate body 1611 is provided with a plurality of meshes 1612 and a plurality of first spray holes 1613, each mesh 1612 is arranged in a hexagonal shape, and the plurality of meshes 1612 are arranged in a honeycomb array on the mesh plate body 1611, and the plurality of first spray holes 1613 are arranged at intervals on the mesh plate body 1611, and the mesh plate body 1611 has a spray side facing the circuit board 20 and spraying the circuit board 20; the guide wheel 1614 is installed on the spray side of the mesh plate body 1611 for contacting the circuit board 20.

[0123] In this embodiment, the plate body 1611 of the anode mesh plate 161 is arranged in a horizontal direction to be parallel to the circuit board 20, so that the circuit board 20 can slide between the multiple anode mesh plates 161 along a preset direction. The mesh 1612 is used to increase the light transmittance when the circuit board 20 is electroplated. The electroplating anode with good light transmittance can improve the efficiency and quality of the electroplating process; the electroplating anode plays a catalytic role in the electroplating process, and a thin layer of metal or alloy is plated on the metal surface through electrolysis; the light transmittance provided by the mesh 1612 on the anode mesh plate 161 can help the uniform deposition of the metal during the electroplating process; a regular hexagonal mesh 1612 is set on the anode mesh plate 161, and the angular characteristics of the regular hexagon are utilized to enable three adjacent meshes 1612 to be closely arranged, so that the meshes 1612 can be closely arranged in a honeycomb array on the plate body 1611, so as to reduce the obstruction area between adjacent meshes 1612, which helps to evenly illuminate the electroplating surface, ensure uniform deposition of the coating, and avoid the problem of local excessive thickness or thinness.

[0124] In addition, compared with other shapes that can be tightly arranged, the hexagonal shape has more sides, is closer to a circle, and has greater light transmittance. Compared with an equilateral triangle or a square, it is easier to ensure the light transmittance of each section. The good light transmittance of the mesh 1612 can also reduce the shadow area during the electroplating process, avoid the production of rough or uneven surfaces, and improve the quality of electroplating. The first spray hole 1613 is used to spray the reaction solution. During electroplating, the outlet of the pipeline through which the reaction solution flows is connected to the first spray hole 1613 to spray the reaction solution through the first spray hole 1613 onto the surface of the circuit board 20. The setting of the first spray hole 1613 can make the spraying range of the reaction solution wider, thereby spraying the solution more evenly on the surface of the circuit board 20, so that the metal ions can be more evenly attached to the surface of the circuit board 20, and then react to generate a more uniform coating. In addition, a plurality of guide wheels 1614 are provided on the anode mesh plate 161 at intervals to prevent the circuit board 20 from rubbing against the surface of the anode mesh plate 161 when the circuit board 20 falls due to factors such as gravity, thereby causing scratches on the circuit board 20.

[0125] See also Figure 26 and Figure 27In one embodiment of the present invention, the horizontal electroplating production line 10 further includes a copper dissolving device 400, which is used to dissolve pure copper through a reaction solution and react to produce an electroplating solution. The copper dissolving device 400 includes: a copper dissolving tank 410, a delivery pipeline 413 and an overflow mechanism 414; a partition plate 411 is provided in the copper dissolving tank 410, and the partition plate 411 divides the copper dissolving tank 410 into a first cylinder 410a and a second cylinder 410b. The first cylinder 410a has a liquid inlet for the reaction solution to enter, and a liquid inlet for placing pure copper. The copper particle basket 412 is made of copper; the upper part of the partition plate 411 has an overflow portion connecting the first cylinder 410a and the second cylinder 410b; the second cylinder 410b is provided with an overflow port for the electroplating solution to flow out; the delivery pipeline 413 connects the second cylinder 410b with the first cylinder 410a, so that the first cylinder 410a, the overflow portion, the second cylinder 410b and the delivery pipeline 413 are connected to form an internal circulation loop; the overflow mechanism 414 is installed at the overflow port, and the overflow mechanism 414 is used to deliver the liquid in the second cylinder 410b to the electroplating tank 120.

[0126] In this embodiment, the copper-dissolving tank 410 is used to hold a reaction solution and perform a chemical reaction. The reaction solution and pure copper react in the copper-dissolving tank 410 to produce an electroplating solution that can be used for electroplating. The delivery pipeline 413 is used to extract the liquid in the second cylinder 410b to the first cylinder 410a. The liquid in the first cylinder 410a flows into the second cylinder 410b through the overflow portion provided at the top of the partition plate 411. The delivery pipeline 413 and the overflow portion at the top of the partition plate 411 cooperate to realize the internal circulation of the liquid in the copper-dissolving tank 410. The reaction stock solution enters the first cylinder 410a through the liquid inlet of the first cylinder 410a. When the solution level in the first cylinder 410a reaches the overflow portion, it flows through the overflow portion to the second cylinder 410b. A delivery pipe is connected to the bottom of the second cylinder 410b. The liquid overflowing from the first cylinder 410a to the second cylinder 410b flows back to the first cylinder 410a through the delivery pipe, thus forming an internal circulation within the copper dissolving tank 410. The overflow mechanism 414 is used to circulate the electroplating solution formed by the reaction into the electroplating tank 120 by overflow.

[0127] In this embodiment, the entire electroplating circulation system includes a copper dissolving device 400 and an electroplating tank 120. The copper dissolving device 400 consumes the reaction solution containing Fe+ from the main tank into the first cylinder body 410a. The reaction solution dissolves pure copper to generate Fe+ and Cu+. An internal circulation system is set in the copper dissolving tank 410 to keep the ion concentration of the solution in the copper dissolving tank 410 balanced, thereby controlling the ion concentration of the reaction solution transported to the electroplating tank 120 to reach a preset standard; the copper dissolving device 400 and the electroplating tank 120 continuously transport the reaction solution containing a large amount of Fe+ and the electroplating solution containing a large amount of Cu+ and Fe+ by transporting the solution back and forth, so that the copper ions required for electroplating are obtained in the electroplating tank 120.

[0128] The copper dissolving device 400 has a copper particle basket 412. Pure copper is added to the copper particle basket 412. After the reaction solution containing Fe+ reacts with the pure copper in the first cylinder 410a, an electroplating solution containing Fe+ and Cu+ is formed. The electroplating solution then flows from the first cylinder 410a into the second cylinder 410b of the copper dissolving cylinder. The first cylinder 410a and the second cylinder 410b realize internal circulation through an internal circulation mechanism. In this embodiment, pure copper is placed in the copper particle basket 412. Then, the liquid inlet of the first cylinder 410a draws the Fe+ solution through a power device and injects it into the first cylinder 410a. The pure copper in the first cylinder 410a reacts with the Fe+ in the reaction solution. The Fe+ continuously corrodes the pure copper, forming a large amount of solution containing Fe+ and Cu+ that can be used for electroplating. The solution containing Fe+ and Cu+ is then discharged through the overflow mechanism 414 in the second cylinder 410b. The electroplating solution overflows and is transported to the electroplating tank 120. The overflow method for flowing out the reaction solution can reduce the copper mud from entering the electroplating tank 120 and contaminating the electroplating tank 120. The internal circulation system realized by the internal circulation mechanism of the copper-dissolving tank 410 can make the reaction more complete, thereby saving costs, and can balance the ion concentrations in the first cylinder 410a and the second cylinder 410b. The electroplating solution containing Fe+ and Cu+ in the second cylinder 410b is then transported to the electroplating tank 120 by overflow. The Cu+ contained in the electroplating solution formed in the copper-dissolving tank 410 is the medium required for electroplating the circuit board 20. This cycle is set up until the copper plating of the circuit board 20 is completed.

[0129] The technical solution of the present invention is to separate the copper-melting cylinder 410 into a first cylinder 410a and a second cylinder 410b by providing a partition plate 411 in the copper-melting cylinder 410. The partition plate 411 is provided with an overflow portion, so that the liquid in the first cylinder 410a can flow into the second cylinder 410b through the overflow portion. A delivery pipeline 413 is further provided to connect the first cylinder 410a and the second cylinder 410b, so that the liquid in the second cylinder 410b can flow into the first cylinder 410a through the delivery pipeline 413, thereby realizing internal circulation flow of the liquid in the first cylinder 410a and the second cylinder 410b, so that the liquid in the copper-melting cylinder 410 reacts more fully with the pure copper. It is only necessary to provide a copper particle basket 412 in the first cylinder 410a to place the pure copper, without the need to widely arrange a large number of titanium baskets, thereby improving production efficiency and reducing maintenance costs.

[0130] In one embodiment, the copper dissolving apparatus 400 further includes a material lifting mechanism 420, which is mounted on the outside of the cylinder and is used to transport pure copper. Because the copper dissolving apparatus 400 is relatively tall and contains a relatively high liquid level of reaction solution in the cylinder, to prevent leakage, relatively large nozzles or openings are typically located at the top of the apparatus. Pure copper is typically added to the first cylinder 410a through the top opening of the apparatus. The material lifting mechanism 420 mechanically lifts relatively large pure copper blocks or balls to the opening. When additional pure copper is needed, an operator at a higher location can directly move the copper blocks from the lifting mechanism to the opening, thereby facilitating their addition to the copper pellet basket 412.

[0131] like Figure 1 and Figure 2 As shown, the horizontal electroplating production line 10 also includes a plate washing device 500 and a plate drying device 600. The number of the plate washing devices 500 can be set to multiple, and can be set at the entrance of the electroplating cylinder 120 of the horizontal electroplating equipment 100, and docked with the circuit board loading device 200, for removing impurities on the circuit board 20 in advance, so as to avoid affecting the electroplating quality when the circuit board 20 enters the electroplating cylinder 120 for electroplating; and / or, the plate washing device 500 can also be set at the outlet of the electroplating cylinder 120. After the circuit board 20 is electroplated and discharged, it is necessary to pickle the circuit board 20 to prevent oxidation of the circuit board 20, clean the acid solution remaining on the board surface, and remove the residual light agent on the circuit board 20. It should be noted that the number and location of the plate washing devices 500 are not specifically limited and can be set according to the needs of plate washing.

[0132] The dry plate device 600 is arranged on the side of the plate washing device 500 away from the outlet of the electroplating cylinder 120, and is used to dry the circuit board 20 after electroplating and pickling, and remove the water on the circuit board 20. At this time, the circuit board 20 needs to be cooled and slowly cooled to prevent the temperature difference from being too large to affect the copper surface or even cause stress changes. It can be understood that the dry plate device 600 can be connected to the flipping device 300. If secondary electroplating is required, the cooled circuit board 20 can be directly transported from the dry plate device 600 to the flipping device 300. After the circuit board 20 is turned over, it can be transported to the next horizontal electroplating equipment 100 for secondary electroplating. Further, if Figure 1 As shown, the copper dissolving device 400 is spaced apart from the horizontal electroplating equipment 100, and a passage 30 is provided in the middle for operators to pass through, so as to facilitate the inspection or operation of the equipment on both sides. In addition, conventional equipment such as a photoadditive tank, a fire block and an oil tank cooling tank, and a pump device are also provided on the side of the passage 30 away from the horizontal electroplating equipment 100, which will not be elaborated here.

[0133] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A horizontal electroplating production line, characterized in that: include: A horizontal electroplating apparatus comprising a first frame, an electroplating cylinder disposed on the first frame, and a horizontal electroplating conveyor, wherein the electroplating cylinder is provided with an inlet and an outlet at each end, respectively, and the horizontal electroplating conveyor is configured to move a circuit board entering the electroplating cylinder from the inlet toward the outlet; A circuit board loading device is provided at one end of the electroplating cylinder near the entrance. The circuit board loading device includes a second frame and a loading and conveying mechanism provided on the second frame. The loading and conveying mechanism has a first horizontal conveying surface for placing the circuit board horizontally and conveying the circuit board along a first direction so that the circuit board entering the electroplating cylinder remains horizontal and moves to the horizontal electroplating conveying device.

2. The horizontal electroplating production line according to claim 1, characterized in that: The circuit board loading device also includes a first positioning mechanism and a first pushing mechanism. The first positioning mechanism is used to position the circuit board on the loading and conveying mechanism to a preset position. The first pushing mechanism is used to drive the circuit board on the loading and conveying mechanism to move along the first direction to adjust the distance between two adjacent circuit boards positioned by the first positioning mechanism and arranged along the first direction.

3. The horizontal electroplating production line according to claim 2, characterized in that: The first pushing mechanism is used to push the circuit board positioned by the first positioning mechanism to move along the first direction, so that the distance between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism is a preset value L, and the actual distance value between the two circuit boards is D, and L and D satisfy: L-1.5mm≤D≤L+1.5mm.

4. The horizontal electroplating production line according to any one of claims 1 to 3, characterized in that: The horizontal electroplating production line includes a flipping device and two horizontal electroplating equipment. The flipping device is arranged between the two horizontal electroplating equipment to flip the circuit board after electroplating by one of the horizontal electroplating equipment and transport it to the other horizontal electroplating equipment, so that the horizontal electroplating conveying devices of the two horizontal electroplating equipment can clamp the opposite sides of the circuit board respectively.

5. The horizontal electroplating production line according to claim 4, characterized in that: The flipping device includes a third frame and a feeding mechanism and a flipping mechanism arranged on the third frame. The feeding mechanism has a second horizontal conveying surface for horizontally placing the circuit board, and the flipping mechanism is used to flip the circuit board on the second horizontal conveying surface.

6. The horizontal electroplating production line according to claim 5, characterized in that: The flipping mechanism includes a driving assembly, a rotating shaft and a clamping assembly. The clamping assembly is arranged on the rotating shaft, and the rotating shaft is driven and connected to the driving assembly. The clamping assembly is provided with a slot for inserting a circuit board. The driving assembly is used to drive the rotating shaft to rotate so that the clamping assembly drives the circuit board to flip.

7. The horizontal electroplating production line according to claim 6, characterized in that: The feeding mechanism includes a first conveyor line, a second conveyor line, a third conveyor line and a fourth conveyor line. The first conveyor line and the second conveyor line transport circuit boards along a first direction. The flipping mechanism is arranged between the first conveyor line and the second conveyor line to flip the circuit boards on the first conveyor line to the second conveyor line. The fourth conveyor line extends along the conveying direction of the first conveyor line. The third conveyor line is arranged along the second direction to transport the circuit boards on the second conveyor line to the fourth conveyor line. The first direction and the second direction form an angle.

8. The horizontal electroplating production line according to claim 7, characterized in that: The flipping device also includes a second pushing mechanism and a second positioning mechanism. The second positioning mechanism is arranged on the fourth conveyor line to position the circuit board to a preset position. The second pushing mechanism is used to push the circuit board along the first conveyor line, the second conveyor line, the third conveyor line and the fourth conveyor line in sequence, and push the circuit board positioned by the second positioning mechanism to the horizontal electroplating equipment, and adjust the distance between two adjacent circuit boards positioned by the second positioning mechanism and arranged along the first direction.

9. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating conveying device also includes a clamping mechanism and an electroplating conveying mechanism. A guide rail is arranged on the first frame in the horizontal direction. The clamping mechanism includes a sliding member and a clamping member connected to each other. The clamping member is arranged on the electroplating conveying mechanism for clamping the circuit board. The sliding member is slidably connected to the guide rail. The electroplating conveying mechanism is used to drive the clamping mechanism to move along the guide rail for transmitting the circuit board.

10. The horizontal electroplating production line according to claim 9, characterized in that: The clamping member comprises: Retaining clip; a movable clip, the movable clip being movably mounted on the fixed clip via a connecting assembly, the movable clip being used to cooperate with the fixed clip to clamp the circuit board; and The lifting support wheel is arranged on the side of the movable clamp away from the fixed clamp. When the clamping mechanism moves through the electroplating conveying mechanism, the lifting support wheel rises or falls to open or close the movable clamp and the fixed clamp.

11. The horizontal electroplating production line according to claim 10, characterized in that: The horizontal electroplating conveyor device further includes a guide assembly provided on the first frame, the guide assembly including a first guide member and a second guide member, the first guide member being located on a loading path of the clamping mechanism, the second guide member being located on a unloading path of the clamping mechanism, and both the first guide member and the second guide member having a guide slope; On the feeding path of the clamping mechanism, when the guide slope is used to guide the movement of the clamping mechanism, it abuts against the lifting support wheel, so that the distance between the fixed clamp and the movable clamp is increased, so as to be used for clamping the circuit board; On the unloading path of the clamping mechanism, the lifting support wheel abuts when the guide slope is used to guide the movement of the clamping mechanism, so that the distance between the fixed clamp and the movable clamp is increased, so that the circuit board can be dropped off.

12. The horizontal electroplating production line according to claim 9, characterized in that: The electroplating conveying mechanism comprises: A conveyor steel belt, wherein the conveyor steel belt is slidably mounted on the first frame, and the clamping mechanism is mounted on the conveyor steel belt; A driving mechanism, comprising a conveying driving wheel and a conveying driven wheel, wherein the conveying driving wheel and the conveying driven wheel are respectively arranged at two ends of the first frame, and the conveying driving wheel and the conveying driven wheel are connected by the conveying steel belt to form a closed-loop transmission to achieve continuous conveying; A tensioning mechanism is elastically connected to the conveyor steel belt and the first frame. When the conveyor steel belt slides on the first frame, the tensioning mechanism undergoes elastic deformation to change the horizontal distance between the first frame and the conveyor steel belt to tension the conveyor steel belt.

13. The horizontal electroplating production line according to claim 12, characterized in that: The horizontal electroplating equipment also includes a cathode conductive clamp reverse stripping device, which includes a stripping cylinder and a stripping assembly. The stripping cylinder is arranged on the first frame, and the conveyor steel belt is used to transport the clamping mechanism into the stripping cylinder so that the clamping mechanism and the stripping assembly form a conductive loop to strip the electroplating material on the clamping mechanism.

14. The horizontal electroplating production line according to claim 9, characterized in that: The horizontal electroplating equipment further includes a conductive device, wherein the conductive device includes: A conductive oil tank assembly, wherein the conductive oil tank assembly is provided with conductive oil; a cathode assembly, the cathode assembly being used to connect to an anode member of a power source to generate current; A conductive slider assembly is configured in the clamping mechanism, the conductive slider assembly is disposed in the conductive oil tank assembly and immersed in the conductive oil, the conductive slider assembly is electrically connected to the cathode assembly, and is used to transmit current to the horizontal electroplating fixture, so that the circuit board on the horizontal electroplating fixture is charged; The reflux mechanism includes an oil collecting tank and a reflux component. The oil collecting tank is used to store conductive oil. The conductive oil tank component is connected to the oil collecting tank through the reflux component to form a circulation path for the conductive oil in the oil collecting tank and the conductive oil in the conductive oil tank component to circulate between each other.

15. The horizontal electroplating production line according to claim 14, characterized in that: The conductive device also includes an oil supply mechanism, and the reflux mechanism also includes an overflow assembly. The oil supply mechanism is connected to the conductive oil tank assembly to provide conductive oil to the oil guide tank assembly. The overflow assembly has an overflow port, and the overflow assembly is connected to the oil guide tank assembly through the overflow port. The conductive oil tank assembly is connected to the oil collecting tank through the overflow assembly. The conductive oil tank assembly has a preset volume. When the liquid volume in the conductive oil tank assembly exceeds the preset volume, the conductive oil in the conductive oil tank assembly can flow into the oil collecting tank through the overflow assembly.

16. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating equipment further includes an anode spray device disposed in the electroplating tank, the anode spray device comprising: Anode mesh plate; an anode mesh, detachably mounted on the anode mesh plate; A spray assembly is installed on a side of the anode mesh away from the anode mesh plate; A conductive component, through which the anode grid is connected to the rectifier.

17. The horizontal electroplating production line according to claim 16, characterized in that: At least two groups of the anode spray devices are installed at intervals in the electroplating cylinder, and the spray sides of the two groups of the anode spray devices are arranged opposite to each other. A plating cavity for accommodating circuit board electroplating is formed between any two groups of the anode spray devices arranged opposite to each other.

18. The horizontal electroplating production line according to claim 17, characterized in that: The anode mesh plate comprises: An orifice plate body is provided with a plurality of mesh holes and a plurality of first spray holes, each of the mesh holes is arranged in a hexagonal shape, the plurality of mesh holes are arranged in a honeycomb array on the body, the plurality of first spray holes are arranged at intervals on the orifice plate body, and the orifice plate body has a spray side facing the circuit board and spraying the circuit board; and The guide wheel is installed on the spraying side of the orifice plate body and is used for abutting against the circuit board.

19. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating production line further includes a copper dissolving device, which includes: A copper dissolving tank is provided with a partition plate therein, the partition plate dividing the copper dissolving tank into a first cylinder body and a second cylinder body, the first cylinder body having a liquid inlet for a reaction solution to enter and a copper pellet basket for placing pure copper; an overflow portion is provided on the upper portion of the partition plate to connect the first cylinder body and the second cylinder body; the second cylinder body has an overflow port for the discharge of the electroplating solution; a delivery pipeline, connecting the second cylinder body with the first cylinder body, so that the first cylinder body, the overflow portion, the second cylinder body and the delivery pipeline are connected to form an internal circulation loop; and An overflow mechanism is installed at the overflow port, and is used to deliver the liquid in the second cylinder to the electroplating cylinder.

20. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating production line further includes a plate washing device and a plate drying device, wherein the plate washing device is provided at the entrance of the electroplating tank and between the circuit board feeding device and the electroplating tank, and / or the plate washing device is provided at the exit of the electroplating tank; The plate drying device is arranged at the outlet of the electroplating tank and is located on the side of the plate washing device away from the electroplating tank, so as to remove water from the circuit board after electroplating and cleaning by the plate washing device.

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