Fab clean room hot exhaust air recovery processing emergency linkage system

Abstract

The utility model relates to a Fab clean room hot exhaust air recovery processing emergency linkage system, which belongs to the technical field of clean room gas circulation and comprises a fresh air inlet pipe, a fresh air supply outlet, a fan filter unit and an exhaust pipe communicated with the outside of a clean room. The recovery pipe is sequentially provided with a circulating fan capable of pumping away hot exhaust air, a cooling mechanism and an air return pipe, the cooling mechanism is a dry coil cooler or a gas-gas heat exchanger or a cold clean gas mixing type cooler, and the system further comprises an automatic control device. The clean air is conveniently recycled, the burden of supplementing fresh air in a clean room is reduced through the recycled clean air, the operation cost of humidity control of a heating ventilation air conditioner is reduced, the cost of cleaning treatment on air is also reduced, and then the production cost is greatly reduced.

Description

Technical Field

[0001] The utility model relates to a Fab clean room hot exhaust air recovery and processing emergency linkage system, belonging to the technical field of clean room gas circulation. Background Art

[0002] To ensure the quality of the products produced, semiconductor process equipment must be placed within a cleanroom during operation. Semiconductor process equipment is typically equipped with process exhaust ports based on the nature of the process. The exhaust characteristics vary depending on the process, broadly including acid exhaust, alkaline exhaust, organic exhaust, hydrogen and mercury exhaust, and general thermal exhaust. General thermal exhaust serves two purposes: to remove the significant sensible heat generated during process production and to maintain a negative pressure environment within the process equipment cavity.

[0003] When semiconductor process equipment discharges a large amount of general hot exhaust air into the clean room, the temperature in the clean room will rise. To ensure a constant temperature in the clean room, the usual practice is to discharge the air containing a large amount of sensible heat and then replenish it with fresh air that has been filtered and cooled. The clean air in the semiconductor Fab undergoes strict temperature, humidity and cleanliness treatment, which is very expensive. Therefore, after the clean gas containing sensible heat is directly discharged, the temperature, humidity and cleanliness of the fresh air entering needs to be treated. The process of treating the cleanliness and humidity of the air will lead to a significant increase in production costs. Utility Model Content

[0004] The utility model aims to solve the deficiencies in the prior art and provides an emergency linkage system for recycling and treating hot exhaust air in a Fab clean room.

[0005] The technical solution of the utility model for solving the above technical problems is as follows: a Fab clean room hot exhaust air recovery and processing emergency linkage system, including a clean room, a fresh air air-conditioning unit, a fresh air inlet pipe and an exhaust duct; one end of the fresh air inlet pipe is connected to the air outlet of the fresh air air-conditioning unit, and the other end of the fresh air inlet pipe is connected to the clean room, one end of the exhaust duct is connected to the clean room, and the other end of the exhaust duct leads to the outdoors; it also includes a recovery unit; the recovery unit includes a recovery pipe and a return air duct, and a circulating fan and a cooling mechanism arranged on the recovery pipe in sequence along the gas flow direction, the starting end of the recovery pipe is connected to the exhaust duct; one end of the return air duct is connected to the outlet of the cooling mechanism, and the other end of the return air duct is connected to the clean room.

[0006] On the basis of the above technical solution, the present invention can also be improved as follows:

[0007] Furthermore, the cooling mechanism is a heat exchange cooler or a hybrid cooler.

[0008] Furthermore, the cooling mechanism is a dry coil cooler, an air-to-air heat exchanger or a cold clean gas mixing cooler.

[0009] Furthermore, the exhaust duct includes a first pipe section and a second pipe section, the starting end of the first pipe section is connected to the exhaust port of the semiconductor process equipment in the clean room, the end of the second pipe section is connected to the outside world, and the end of the first pipe section, the starting end of the second pipe section and the starting end of the recovery pipe are connected through a tee.

[0010] Furthermore, it also includes air valve 1 and air valve 2; the air valve 1 is arranged on the second pipe section and is located between the first pipe section and the circulation fan; the air valve 2 is arranged on the second pipe section.

[0011] Furthermore, it also includes an air duct silencer; the air duct silencer is arranged on the recovery pipe and is located between the circulation fan and the cooling mechanism.

[0012] Furthermore, the rear end of the recovery pipe is connected to an external air duct, and the external air duct is connected to an air supply port located in another clean room.

[0013] Furthermore, the fresh air inlet pipe is provided with a second air duct muffler; the second air duct muffler is provided on the fresh air inlet pipe and is located between the fresh air air conditioning unit and the clean room.

[0014] Furthermore, the recycling and processing system is also provided with an automatic control device; the automatic control device is electrically connected to the circulating fan, air valve 1 and air valve 2 respectively, and is used to control the opening and closing or operation of the circulating fan, air valve 1 and air valve 2.

[0015] Furthermore, the exhaust duct is further provided with an exhaust fan, and the exhaust fan is arranged at the end of the exhaust duct.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. The present application connects the exhaust duct to a recovery duct, and sequentially arranges a circulation fan, a cooling mechanism, and a return air duct on the recovery duct. After the circulation fan is started, the circulation fan can draw the hot exhaust air discharged from the semiconductor process equipment in the exhaust duct to the cooling mechanism through the recovery duct. The hot exhaust air containing a large amount of sensible heat can be cooled in the cooling mechanism. After the hot exhaust air is cooled to a suitable temperature, it is convenient to recycle the clean gas. The recycled clean gas reduces the burden of replenishing fresh air in the clean room, reduces the operating cost of HVAC humidity control, and also reduces the cost of air purification. In addition, the Fab clean room hot exhaust air recovery and treatment emergency linkage system can be batch configured according to the room's hot exhaust air volume demand, changing the traditional concept of the original Fab clean room that "heat generated by equipment is discharged outdoors", thereby significantly reducing production costs.

[0018] 2. This application places the recycling pipe, circulating fan, etc. in the technical mezzanine of the clean room, and installs a duct silencer on the recycling pipe, which can effectively eliminate the noise generated by the vibration of the circulating fan and the recycling duct, and reduce the impact of the noise on the semiconductor process equipment and operators in the clean room;

[0019] 3. The cooling mechanism in this application can be a dry coil cooler, an air-to-air heat exchanger, or a cold clean gas mixing cooler. When the cooling mechanism is a dry coil cooler, a variety of cooling media can be selected for cooling, which has strong applicability. When the cooling mechanism is an air-to-air heat exchanger, different gas cooling media can also be selected, which can further improve the applicability of the hot exhaust air recovery and treatment system. When the cooling mechanism is a cold clean gas mixing cooler, the cold clean gas mixing cooler can mix the clean gas at a lower temperature with the hot exhaust air to be cooled, thereby also achieving the purpose of cooling the hot exhaust air.

[0020] 4. This application sets an external air duct connected to the recovery pipe, and the external air duct is connected to the air supply outlets located in different clean rooms. In addition to cooling the recovered hot exhaust air through the cooling mechanism, the circulating air can also be introduced into the return air interlayer of other clean rooms through the external air duct and the air supply outlet, thereby realizing the reasonable arrangement of the air flow organization in each area;

[0021] 5. This application sets a second air valve and an exhaust fan in the exhaust duct. When the semiconductor process equipment leaks toxic gas, the second air valve and the exhaust fan are opened to discharge the toxic gas out of the clean room.

[0022] 6. This application can realize the overall control of the emergency linkage of the hot exhaust air recovery and treatment system and the emergency linkage system by setting up an automatic control device. Not only can the recovered circulating air be arranged flexibly, but when it is necessary to treat the toxic gas leaked from the equipment, the air valve 1, air valve 2 and exhaust fan electrically connected to the automatic control device can flexibly switch the exhaust system under the overall control of the automatic control device, and can control the air valve 1 to close, and the air valve 2 and the exhaust fan to open, thereby realizing automatic diversion of toxic gases. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural diagram of a Fab clean room hot exhaust recovery and processing emergency linkage system in an embodiment of the present application;

[0024] Figure 2 This is a schematic diagram of the structure of the clean room technology interlayer in the embodiment of this application;

[0025] Figure 3 This is a structural diagram highlighting the external air duct in the embodiment of the present application.

[0026] In the figure, 1. Clean room; 11. Raised floor; 12. Return air wall; 13. Upper plywood; 14. Semiconductor clean room; 15. Return air gap; 16. Clean room technical mezzanine; 21. Fresh air inlet duct; 22. Fresh air supply outlet; 23. Fresh air air conditioning unit; 24. Fan filter; 25. Duct silencer 2; 3. Exhaust duct; 31. Semiconductor process equipment; 4. Recovery duct; 41. Circulating fan; 42. Air valve 1; 43. Duct silencer 1; 5. Cooling mechanism; 51. Return air duct; 61. External air duct; 62. Air supply outlet; 71. Air valve 2; 72. Exhaust fan; 81. Air flow direction in the duct; 82. Air flow direction in the clean room; 9. Outdoors. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] The air duct silencers used in this application were purchased from Shandong Ruide Shengjing Engineering Technology Co., Ltd.; the dry coil cooler and air-to-air heat exchanger were also commercially available. Both air valves 1 and 2 in the examples of this application are electric air valves. The starting end of the pipeline is defined as the end near where the gas enters, and the end of the pipeline is defined as the end near where the gas exits. Gas flows within the pipeline from the starting end to the end.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0030] Please combine Figure 1 、 Figure 2 and Figure 3 The core of this utility model is to provide a Fab clean room hot exhaust recovery and processing emergency linkage system, which can cool the hot exhaust clean gas in the clean room by setting a recovery unit, thereby realizing the recycling of clean gas and greatly reducing production costs.

[0031] The embodiment of the utility model provides a Fab clean room hot exhaust recovery and treatment emergency linkage system, including a clean room 1, a fresh air mechanism, a fan filter unit, an exhaust pipe 3 and a recovery unit, the recovery unit including a recovery pipe 4 and a return air pipe 51, and a circulating fan 41 and a cooling mechanism 5 sequentially arranged on the recovery pipe 4 along the gas flow direction; the fresh air mechanism is connected to the upper end of the clean room 1, and clean gas with a suitable temperature is easily introduced into the clean room 1 through the fresh air mechanism; the fan filter unit is also arranged at the upper end of the clean room 1, and the gas in the clean room 1 can be filtered through the fan filter unit; the exhaust pipe 3 is connected to the exhaust port of the semiconductor process equipment 31 in the clean room 1, and the semiconductor process equipment 3 can be filtered through the exhaust pipe 3 1. The hot exhaust air of the product is discharged; the starting end of the recovery pipe 4 is connected to the exhaust pipe 3, and the cooling mechanism 5 is connected to the end of the recovery pipe 4 away from the exhaust pipe 3. The hot exhaust air in the exhaust pipe 3 can be drawn to the cooling mechanism 5 through the recovery pipe 4. The clean gas containing a large amount of sensible heat can be cooled after passing through the cooling mechanism 5. One end of the return air pipe 51 is connected to the outlet of the cooling mechanism 5, and the other end of the return air pipe 51 is connected to the clean room 1. The clean gas cooled by the cooling mechanism 5 can be discharged back to the clean room 1, so that the cooled clean gas can be reused. The recovered clean gas reduces the burden of replenishing fresh air in the clean room 1 and reduces the cost of air purification, thereby greatly reducing production costs.

[0032] The clean room 1 is provided with an elevated floor 11, a return air sandwich wall 12 and an upper plywood 13. A semiconductor clean workshop 14 is formed between the elevated floor 11, the return air sandwich wall 12 and the upper plywood 13. Semiconductor process equipment 31 is placed on the elevated floor 11. A return air gap 15 is formed between the elevated floor 11 and the clean room 1, and between the return air sandwich wall 12 and the clean room 1. A clean room technical interlayer 16 is formed between the upper plywood 13 and the clean room 1. The air flow direction 82 in the clean room shows the flow direction of the gas in the clean room 1.

[0033] The fresh air mechanism includes a fresh air inlet pipe 21, a fresh air supply port 22, a fresh air air conditioning unit 23 and a fan filter unit. The fresh air inlet pipe 21 is connected to the upper end of the clean room 1. The fresh air conditioning unit 23 is connected to the end of the fresh air inlet pipe 21 located outside the clean room 1. The fresh air supply port 22 is connected to the end of the fresh air inlet pipe 21 located inside the clean room 1. The fresh air conditioning unit 23 can filter the air and treat the temperature and humidity. The treated fresh air can pass through the fresh air inlet pipe 21 and the fresh air supply port 22 and be discharged into the clean room technical interlayer 16 at the upper end of the clean room 1, thereby replenishing the clean air in the clean room 1. Since the fresh air conditioning unit 23 is a relatively mature existing technology in this field, it will not be described in detail in this application. A duct muffler 25 is provided on the fresh air inlet pipe 21 to eliminate the vibration and noise of the fresh air inlet pipe 21.

[0034] The fan filter unit is a fan filter 24, also known as FFU. The fan filter 24 is arranged on the upper clamping plate 13. The fan filter 24 can send the fresh air from the fresh air supply port 22 into the clean room technical interlayer 16 to the semiconductor clean room 14, and can also extract the gas from the semiconductor clean room 14 to the clean room technical interlayer 16. The fan filter 24 is a relatively mature existing technology in this field, so it will not be described in detail in this application; the elevated floor 11 is a honeycomb perforated plate. Under the action of the fan filter 24, the air in the clean room 1 The gas can flow from the pores of the raised floor 11 into the return air gap 15 at the lower end of the raised floor 11, then flow into the return air gap 15 between the return air sandwich wall 12 and the clean room 1, and finally flow to the clean room technical interlayer 16, and then flow back into the semiconductor clean workshop 14 under the action of the fan filter 24, thereby realizing the air circulation in the clean room 1; the fan filter 24 can also filter the gas while circulating the gas, thereby reducing the dust content of the gas in the clean room 1 and ensuring the cleanliness of the clean room 1.

[0035] The recovery pipe 4 is arranged in the clean room technical interlayer 16. The recovery pipe 4 is provided with a circulation fan 41. The circulation fan 41 can be an ordinary fan, a variable frequency fan or other types of gas circulation equipment. When selecting the circulation fan 41, the recovered process exhaust volume and the pipeline resistance problem must also be considered. If a variable frequency fan is selected, the daily operating load is controlled within 40-48Hz to ensure that the circulation fan 41 has a high output efficiency; the circulation fan 41 provides power for the semiconductor process equipment 31 in the recovery pipe 4, and can draw the clean gas containing sensible heat in the recovery pipe 4 to the cooling mechanism 5. After the cooling mechanism 5 cools the gas containing sensible heat, the treated clean gas can be discharged into the clean room 1 from the return air duct 51 connected to the cooling mechanism 5.

[0036] In some embodiments, cooling mechanism 5 is a heat exchange cooler, which can be a dry coil cooler. After clean air containing a large amount of sensible heat is passed into the cooling chamber of the dry coil cooler, it can exchange heat with the cooling medium in the dry coil cooler, thereby achieving the purpose of cooling. Since the heat emitted by the process equipment is sensible heat, according to the thermodynamic properties of moist air, the cooling process of the exhausted hot air is a constant moisture content cooling process. Therefore, using a dry coil cooler can reduce the problem of introducing water vapor into the clean air. When cooling clean air containing a large amount of sensible heat, the cooling medium in the dry coil cooler can be selected from a variety of cooling media according to actual conditions, ensuring the applicability of the hot exhaust air recovery and treatment emergency linkage system.

[0037] In some embodiments, the heat exchange cooler may be an air-to-air heat exchanger, which can also cool clean gas containing a large amount of sensible heat without changing the humidity of the clean gas. The cooling gas fluid of the air-to-air heat exchanger can also select different types of gas media according to actual conditions.

[0038] In some embodiments, the cooling mechanism 5 is a hybrid cooler, which can be a cold clean gas mixing cooler, which consists of a refrigeration and air-conditioning unit, a flow valve and a mixing box. The air inlet of the refrigeration and air-conditioning unit is connected to the fresh air inlet pipe 21, which can further reduce the temperature of the treated clean gas. The amount of low-temperature clean gas entering the mixing box can be controlled by the flow valve, and the clean gas to be cooled and the low-temperature clean gas are both passed into the mixing box. The clean gas with a lower temperature is mixed with the hot exhaust air to be cooled, thereby also achieving the purpose of cooling the hot exhaust air.

[0039] In some embodiments, the exhaust duct 3 includes a first pipe section 32 and a second pipe section 33. The starting end of the first pipe section 32 is connected to the exhaust port of the semiconductor process equipment 31 in the clean room 1, and the end of the second pipe section 33 is connected to the outside world. The end of the first pipe section 32, the starting end of the second pipe section 33 and the starting end of the recovery pipe 4 are connected through a tee. The flow direction of the gas in the pipeline can be seen through the wind flow direction 81 in the pipeline.

[0040] In some embodiments, the recovery pipe 4 is further provided with an air valve 1 42 and an air valve 2 71. The air valve 1 42 is arranged on the second pipe section 33 and is located between the first pipe section 32 and the circulating fan 41. When it is necessary to stop the supply of the gas to be cooled to the cooling system, the air valve 1 42 can be closed. When it is necessary to start supplying the gas to be cooled to the cooling system, the air valve 1 42 can be opened. The air valve 2 71 is arranged on the second pipe section. When it is necessary to discharge the gas in the semiconductor process equipment 31, the air valve 1 42 can be closed and the air valve 2 71 can be opened.

[0041] In some embodiments, the recovery pipe 4 is provided with a duct muffler 43. The fan operation noise has a greater impact on the Fab. By providing the duct muffler 43 in the recovery pipe 4, the operating noise of the circulation fan 41 is reduced, and the vibration and noise of the recovery pipe 4 can be reduced, thereby avoiding affecting the quality of the process product.

[0042] In some embodiments, the recycling and processing emergency linkage system is also provided with an automatic control device (not shown in the figure), which is a PLC. The circulating fan 41, air valve 1 42 and air valve 2 71 in the recycling and processing emergency linkage system are all associated with the automatic control device. The circulating fan 41 can be remotely controlled, locally controlled, and automatically controlled through the automatic control device, and communicate with the upper system of the central control room to perform screen configuration. Remote control can control the system operation status, and local control and remote control can be switched.

[0043] The local control has the functions of on-site potentiometer frequency regulation and operation status indication.

[0044] The remote control has the functions of remote monitoring and control. The screen display during remote control includes the operating status of the circulating fan 41, frequency, manual and automatic selection buttons, static pressure of the air supply main pipe, air valve opening, recovered air humidity, etc. At the same time, each parameter has a time curve, which is convenient for calculating and analyzing the energy of the system.

[0045] In some embodiments, the arrangement of the recovery pipe 4 and the interface of the recovery pipe 4 needs to comprehensively consider the uniformity of the airflow and the processing capacity of the cooling mechanism 5. By calculating the sensible heat load of the semiconductor process equipment 31 and the cooling mechanism 5, the number of interfaces of the recovery pipe 4 is reasonably allocated to ensure that the cooling mechanism 5 can handle the increased sensible heat load.

[0046] In some embodiments, the recycling and processing emergency linkage system also includes an exhaust fan 72 arranged on the exhaust pipe 3, and the exhaust fan 72 is arranged at the end of the second pipe section 33. If the semiconductor process equipment 31 leaks toxic gas, the air valve 1 42 is closed, and the air valve 2 71 and the exhaust fan 72 are opened to divert the toxic gas leaked from the semiconductor process equipment 31.

[0047] In some embodiments, the automatic control device is also associated with the exhaust fan 72, and in the local control mode of the automatic control device, the local control also has an emergency stop button. After the emergency stop button is activated, the circulation fan 41 is shut down and the air valve 1 42 of the pipeline is closed, and the air valve 2 71 and the exhaust fan 72 on the exhaust duct 3 are opened, so that harmful gases can be discharged from the clean room 1; after the emergency stop button is restored, the circulation fan 41 is started and the air valve 1 42 of the pipeline is opened, and the air valve 2 71 and the exhaust fan 72 on the exhaust duct 3 are closed.

[0048] In some embodiments, the recovery pipe 4 is connected to an external air duct 61, and the external air duct 61 is connected to an air supply port 62 located in different clean rooms. The clean air containing a large amount of sensible heat recovered in the recovery pipe 4 can not only be transported to the cooling mechanism 5 for cooling, but also be discharged into other clean rooms (not shown in the figure) through the external air duct 61 and the air supply port 62.

[0049] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A Fab clean room hot exhaust recovery and treatment emergency linkage system, comprising a clean room (1), a fresh air air conditioning unit (23), a fresh air inlet pipe (21) and an exhaust pipe (3); one end of the fresh air inlet pipe (21) is connected to the air outlet of the fresh air air conditioning unit (23), the other end of the fresh air inlet pipe (21) is connected to the clean room (1), one end of the exhaust pipe (3) is connected to the clean room (1), and the other end of the exhaust pipe (3) leads to the outside (9); Its characteristics are: The invention also includes a recovery unit; the recovery unit includes a recovery pipe (4) and a return air pipe (51), and a circulation fan (41) and a cooling mechanism (5) sequentially arranged on the recovery pipe (4) along the gas flow direction, the starting end of the recovery pipe (4) is connected to the exhaust pipe (3); one end of the return air pipe (51) is connected to the outlet of the cooling mechanism (5), and the other end of the return air pipe (51) is connected to the clean room (1).

2. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 1, characterized in that: The cooling mechanism (5) is a heat exchange cooler or a hybrid cooler.

3. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 1, characterized in that: The cooling mechanism (5) is a dry coil cooler, an air-to-air heat exchanger or a cold clean gas mixing cooler.

4. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 1, characterized in that: The exhaust pipe (3) comprises a first pipe section (32) and a second pipe section (33); the starting end of the first pipe section (32) is connected to the exhaust port of the semiconductor process equipment (31) in the clean room (1); the end of the second pipe section (33) is connected to the outside world; the end of the first pipe section (32), the starting end of the second pipe section (33) and the starting end of the recovery pipe (4) are connected through a tee.

5. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 4, characterized in that: Also includes air valve 1 (42) and air valve 2 (71); The air valve 1 (42) is provided on the second pipe section (33) and is located between the first pipe section (32) and the circulating fan (41); the air valve 2 (71) is provided on the second pipe section (33).

6. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 1, characterized in that: Also included is an air duct silencer (43); The air duct silencer (43) is provided on the recovery pipe (4) and is located between the circulation fan (41) and the cooling mechanism (5).

7. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 1, characterized in that: The tail end of the recovery pipe (4) is connected to an external air duct (61), and the external air duct (61) is connected to an air supply port (62) located in another clean room.

8. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 1, characterized in that: The fresh air inlet pipe (21) is provided with a second air duct muffler (25); the second air duct muffler (25) is provided on the fresh air inlet pipe (21) and is located between the fresh air air conditioning unit (23) and the clean room (1).

9. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 5, characterized in that: The recycling and treatment emergency linkage system is also provided with an automatic control device; the automatic control device is electrically connected to the circulation fan (41), the air valve 1 (42) and the air valve 2 (71) respectively, and is used to control the opening and closing or operation of the circulation fan (41), the air valve 1 (42) and the air valve 2 (71).

10. The Fab clean room hot exhaust air recovery and treatment emergency linkage system according to claim 1, characterized in that: The exhaust pipe (3) is further provided with an exhaust fan (72), and the exhaust fan (72) is arranged at the end of the exhaust pipe (3).

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