Multi-layer heat dissipation structure of stainless steel tablet computer and stainless steel tablet computer

Abstract

The utility model discloses a multi-layer heat dissipation structure of stainless steel tablet personal computer and stainless steel tablet personal computer, the multi-layer heat dissipation structure includes thermal grease layer, metal heat dissipation block, heat dissipation silica gel sheet, graphite copper foil and stainless steel shell, thermal grease layer is smeared on the CPU surface of stainless steel tablet personal computer mainboard for improving heat dissipation efficiency and heat transfer performance; the metal heat dissipation block is tightly attached to the surface, coated with the heat dissipation paste layer, of the CPU and used for rapidly absorbing heat generated by the CPU; the heat dissipation silica gel sheet is positioned between the metal heat dissipation block and the graphite copper foil and is used for filling a gap between the metal heat dissipation block and the graphite copper foil and dispersing heat; the graphite copper foil is mounted on the inner side of the stainless steel shell and is used for diffusing heat; and the stainless steel shell covers the heat dissipation silica gel sheet and is used for assisting heat dissipation in a radiation and convection mode. According to the utility model, through optimized combination of multiple layers of heat dissipation materials, high-efficiency heat conduction and dissipation are realized, and the heat dissipation performance and stability of equipment are obviously improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, and in particular discloses a multi-layer heat dissipation structure of a stainless steel tablet computer and the stainless steel tablet computer. Background Art

[0002] With the increasing use of stainless steel tablets and the increasing demand for tablet performance, heat dissipation has become increasingly important. Because stainless steel's thermal conductivity (15-20W / m·K) is inferior to that of aluminum (205W / m·K) and copper (390W / m·K), heat dissipation design presents a greater challenge.

[0003] Although existing technologies employ thermal paste and heat sinks, the overall heat dissipation effect remains unsatisfactory and cannot meet the requirements of high-performance devices. Therefore, an efficient multi-layer heat dissipation structure is urgently needed to improve the heat dissipation performance of stainless steel tablets and ensure their stable operation under high loads. Summary of the Invention

[0004] The utility model provides a multi-layer heat dissipation structure of a stainless steel tablet computer and a stainless steel tablet computer, aiming to solve the technical problem that the overall heat dissipation effect of the existing stainless steel tablet computer is still unsatisfactory and it is difficult to meet the requirements of high-performance equipment.

[0005] According to one aspect of the utility model, a multi-layer heat dissipation structure of a stainless steel tablet computer is provided, comprising a heat dissipation grease layer, a metal heat dissipation block, a heat dissipation silicone sheet, a graphite copper foil and a stainless steel shell, wherein the heat dissipation grease layer is applied to the CPU surface of the stainless steel tablet computer motherboard to improve heat dissipation efficiency and heat transfer performance; the metal heat dissipation block is tightly fitted to the CPU surface coated with the heat dissipation grease layer to quickly absorb heat generated by the CPU; the heat dissipation silicone sheet is located between the metal heat dissipation block and the graphite copper foil to fill the gap between the metal heat dissipation block and the graphite copper foil and to disperse heat; the graphite copper foil is installed on the inner side of the stainless steel shell to diffuse heat; and the stainless steel shell covers the outside of the heat dissipation silicone sheet to assist heat dissipation through radiation and convection.

[0006] Furthermore, the metal heat sink is mounted on the mainboard bracket.

[0007] Furthermore, the mainboard bracket is provided with a mounting post and a mounting hole, and the metal heat sink block is correspondingly provided with a metal heat sink block body adapted to the size of the mounting hole, and a positioning hole matched with the mounting post.

[0008] Furthermore, the metal heat dissipation block is an aluminum heat dissipation block or a copper heat dissipation block.

[0009] Furthermore, the thermal conductivity of the metal heat dissipation block is approximately 230 W / (m·K), the surface area of ​​the metal heat dissipation block is 840 square millimeters, and the volume is 5460 cubic millimeters.

[0010] Furthermore, the thermal conductivity of the thermal paste layer is greater than 1.93 W / mK.

[0011] Furthermore, the material of the heat dissipation silicone sheet is GR-HM heat dissipation silicone, the thermal conductivity coefficient of the heat dissipation silicone sheet is 6W / m·K, and the size of the heat dissipation silicone sheet is 112 mm×220 mm×0.8 mm.

[0012] Furthermore, the thermal conductivity of the graphite copper foil is between 600 and 1500 W / (m·K), and the size is 112 mm × 220 mm × 0.8 mm.

[0013] Furthermore, the surface area of ​​the stainless steel housing is 24,640 square millimeters.

[0014] According to another aspect of the present invention, a stainless steel tablet computer is provided, comprising the multi-layer heat dissipation structure of the stainless steel tablet computer and a front frame display screen, wherein the stainless steel housing covers the front frame display screen.

[0015] The beneficial effects achieved by the utility model are:

[0016] The utility model provides a multi-layer heat dissipation structure for a stainless steel tablet computer and a stainless steel tablet computer. The multi-layer heat dissipation structure comprises a heat dissipation paste layer, a metal heat dissipation block, a heat dissipation silicone sheet, a graphite copper foil, and a stainless steel shell. The heat dissipation paste layer is applied to the CPU surface of the stainless steel tablet computer's motherboard to improve heat dissipation efficiency and heat transfer performance. The metal heat dissipation block is tightly attached to the CPU surface coated with the heat dissipation paste layer to quickly absorb heat generated by the CPU. The heat dissipation silicone sheet is located between the metal heat dissipation block and the graphite copper foil to fill the gap between the metal heat dissipation block and the graphite copper foil and to disperse heat. The graphite copper foil is installed on the inside of the stainless steel shell to diffuse heat. The stainless steel shell covers the outside of the heat dissipation silicone sheet to assist in heat dissipation through radiation and convection. The multi-layer heat dissipation structure for a stainless steel tablet computer and the stainless steel tablet computer provided by the utility model achieve efficient heat conduction and dissipation through the optimized combination of multiple layers of heat dissipation materials, significantly improving the heat dissipation performance and stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is an exploded view of the multi-layer heat dissipation structure of the stainless steel tablet computer of the present invention; Figure 2 This is an exploded view of the rust-steel tablet computer of the utility model; Figure 3 This is a schematic diagram of the installation of the motherboard bracket and the metal heat sink in the present invention.

[0018] Explanation of the accompanying figures: 10, thermal paste layer; 20, metal heat sink; 30, heat dissipation silicone sheet; 40, graphite copper foil; 50, stainless steel shell; 60, motherboard bracket; 61, mounting column; 62, mounting hole; 21, metal heat sink body; 22, positioning hole; 70, front frame display screen; 80, motherboard. DETAILED DESCRIPTION

[0019] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] like Figure 1 and Figure 2 As shown, the first embodiment of the present invention proposes a multi-layer heat dissipation structure for a stainless steel tablet computer, comprising a thermal paste layer 10, a metal heat sink block 20, a heat dissipation silicone sheet 30, a graphite copper foil 40, and a stainless steel housing 50. The thermal paste layer 10 is applied to the CPU surface of the stainless steel tablet computer motherboard 80 to improve heat dissipation efficiency and heat transfer performance. The metal heat sink block 20 is tightly attached to the CPU surface coated with the thermal paste layer 10 to quickly absorb heat generated by the CPU. The heat dissipation silicone sheet 30 is located between the metal heat sink block 20 and the graphite copper foil 40 to fill the gap between the metal heat sink block 20 and the graphite copper foil 40 and disperse heat. The graphite copper foil 40 is mounted on the inside of the stainless steel housing 50 to diffuse heat. The stainless steel housing 50 covers the heat dissipation silicone sheet 30 and assists in heat dissipation through radiation and convection. In this embodiment, the high-performance thermal paste layer 10 is evenly applied to the CPU surface to improve heat dissipation efficiency and heat transfer performance. The metal heat sink 20 fits tightly against the CPU surface coated with thermal paste 10. It has a high thermal conductivity and is designed to quickly absorb heat generated by the CPU. The heat dissipation silicone sheet 30, covering the metal heat sink 20, offers excellent thermal conductivity and flexibility. It fills the gap between the metal heat sink 20 and the next layer of material and further disperses heat. The graphite copper foil 40, covering the inside of the stainless steel housing 50, offers excellent thermal conductivity and is designed to quickly dissipate heat. The stainless steel housing 50, covering the outside of the graphite copper foil 40, provides mechanical strength and protection, and assists in heat dissipation through radiation and convection.

[0021] Further, see Figures 1 to 3In the multi-layer heat dissipation structure of the stainless steel tablet computer proposed in this embodiment, the metal heat dissipation block 20 is mounted on the motherboard bracket 60. The motherboard bracket 60 is provided with a mounting post 61 and a mounting hole 62. The metal heat dissipation block 20 is correspondingly provided with a metal heat dissipation block body 21 that is sized to fit the mounting hole 62, and a positioning hole 22 that cooperates with the mounting post 61. The multi-layer heat dissipation structure of the stainless steel tablet computer proposed in this embodiment uses the motherboard bracket 60 to mount the motherboard 80, and the metal heat dissipation block 20 is fixed by the mounting post 61 and mounting hole 62 provided on the motherboard bracket 60; the metal heat dissipation block 20 passes through the mounting hole 62 and tightly fits the CPU surface coated with the thermal paste layer 10, which is used to quickly absorb the heat generated by the CPU, achieving efficient heat conduction and dissipation, and significantly improving the heat dissipation performance and stability of the device.

[0022] Preferably, see Figures 1 to 3 In the multi-layer heat dissipation structure for a stainless steel tablet computer proposed in this embodiment, the metal heat dissipation block 20 is made of aluminum or copper. The thermal conductivity of the metal heat dissipation block 20 is approximately 230 W / (m·K), with a surface area of ​​840 square millimeters and a volume of 5460 cubic millimeters. Its primary function is to quickly absorb and dissipate heat generated by the CPU. This heat dissipation block has excellent thermal conductivity and fits tightly against the CPU surface coated with thermal paste 10, effectively conducting heat away from the CPU and dissipating it further through other materials in the heat dissipation structure, thereby improving the device's heat dissipation performance and stability.

[0023] Further, see Figures 1 to 3 In the multi-layer heat dissipation structure of the stainless steel tablet computer proposed in this embodiment, the thermal conductivity of the thermal paste layer 10 is greater than 1.93 W / mK. The thermal paste layer 10 primarily fills the tiny gap between the CPU surface and the heat sink, ensuring a tight contact surface. This effectively reduces heat loss caused by poor contact and enhances the heat sink's ability to absorb and dissipate CPU heat.

[0024] Preferably, see Figures 1 to 3 In this embodiment, the multi-layer heat dissipation structure for a stainless steel tablet computer is constructed using GR-HM heat dissipation silicone sheet 30, which has a thermal conductivity of 6 W / m·K and dimensions of 112 mm x 220 mm x 0.8 mm. The silicone sheet 30 serves as a gap filler: the silicone material's flexibility allows it to fill small gaps and air spaces on uneven surfaces, reducing overall thermal resistance and ensuring good contact, allowing heat to flow more smoothly from the heat sink to the graphite copper foil 40.

[0025] Further, see Figures 1 to 3In this embodiment, the multi-layer heat dissipation structure for a stainless steel tablet computer features graphite copper foil 40 with a thermal conductivity between 600 and 1500 W / (m·K) and dimensions of 112 mm x 220 mm x 0.8 mm. The graphite copper foil 40 effectively and evenly distributes heat across the entire surface of the stainless steel, preventing localized overheating and improving overall heat dissipation.

[0026] Preferably, see Figures 1 to 3 In the multi-layer heat dissipation structure of the stainless steel tablet computer proposed in this embodiment, the surface area of ​​the stainless steel housing 50 is 24640 square millimeters. In addition to providing mechanical strength and protection, the stainless steel housing 50 also assists in heat dissipation through radiation and convection.

[0027] This embodiment also provides a stainless steel tablet computer, comprising the multi-layer heat dissipation structure of the stainless steel tablet computer and a front frame display screen 70, wherein the stainless steel housing 50 covers the front frame display screen 70. The front frame display screen 70 is provided with a touch screen and an LCD screen.

[0028] As shown in Figure 1 to Figure 3 As shown, this embodiment also provides a method for optimizing the multi-layer heat dissipation structure of a stainless steel tablet computer, comprising the following steps:

[0029] Step S100: evenly apply a high-performance thermal paste layer 10 on the CPU surface to ensure that the contact surface is completely covered.

[0030] Step S200: The metal heat dissipation block 20 is tightly attached to the CPU surface coated with the heat dissipation grease layer 10 and fixed in position.

[0031] Step S300 : Cover the metal heat dissipation block 20 with a heat dissipation silicone sheet 30 to ensure that the metal heat dissipation block 20 is completely adhered to the silicone sheet.

[0032] Step S400 : Cover the inner side of the stainless steel housing 50 with the graphite copper foil 40 , which is in close contact with the heat dissipation silicone sheet 30 .

[0033] Step S500: Finally, the stainless steel housing 50 is tightly covered on the outside of the graphite copper foil 40 to ensure that there is no gap between the materials in the entire heat dissipation structure.

[0034] The following is a detailed description of the embodiment, as shown in Table 1:

[0035]

[0036] For J6412 (low-power processor): You can choose the 6W / m·K heat dissipation film (silicone film) in the first or second solution, because it can provide good and uniform heat dissipation effect and is low in cost.

[0037] For 1235U (medium-to-high power processors): We recommend using the first or second solution, 13W / m·K heatsink film (hexagonal boron nitride), to ensure that it can effectively cope with higher heat demands and provide better heat dissipation performance.

[0038] The above stainless steel tablet computer can be used in special environments that require high durability, corrosion resistance, and protection of the equipment. For example, it can be used in industrial environments, medical fields, food processing industries, outdoor operations and other fields.

[0039] In this embodiment, the size of the tablet computer can be 15 inches, or 10 inches. Tablet computers of 12 inches, 18.5 inches, and 21.5 inches are all within the scope of protection of this patent.

[0040] Compared with the prior art, the multi-layer heat dissipation structure of the stainless steel tablet computer and the stainless steel tablet computer provided in this embodiment utilize a heat dissipation grease layer, a metal heat dissipation block, a heat dissipation silicone sheet, a graphite copper foil, and a stainless steel shell. The heat dissipation grease layer is applied to the CPU surface of the stainless steel tablet computer's motherboard to improve heat dissipation efficiency and heat transfer performance; the metal heat dissipation block is tightly attached to the CPU surface coated with the heat dissipation grease layer to quickly absorb heat generated by the CPU; the heat dissipation silicone sheet is located between the metal heat dissipation block and the graphite copper foil to fill the gap between the metal heat dissipation block and the graphite copper foil and to disperse heat; the graphite copper foil is installed on the inside of the stainless steel shell to diffuse heat; and the stainless steel shell covers the outside of the heat dissipation silicone sheet to assist in heat dissipation through radiation and convection. The multi-layer heat dissipation structure of the stainless steel tablet computer and the stainless steel tablet computer provided in this embodiment achieve efficient heat conduction and dissipation through the optimized combination of multiple layers of heat dissipation materials, significantly improving the heat dissipation performance and stability of the device.

[0041] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Clearly, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, to the extent such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to encompass such changes and modifications.

Claims

1. A multi-layer heat dissipation structure for a stainless steel tablet computer, characterized in that: It comprises a heat dissipation paste layer (10), a metal heat dissipation block (20), a heat dissipation silicone sheet (30), a graphite copper foil (40) and a stainless steel shell (50), wherein: The heat dissipation paste layer (10) is applied to the CPU surface of the stainless steel tablet computer motherboard to improve heat dissipation efficiency and heat transfer performance; The metal heat dissipation block (20) is tightly attached to the surface of the CPU coated with the heat dissipation paste layer (10) and is used to quickly absorb the heat generated by the CPU; The heat dissipation silicone sheet (30) is located between the metal heat dissipation block (20) and the graphite copper foil (40), and is used to fill the gap between the metal heat dissipation block (20) and the graphite copper foil (40) and to disperse heat; The graphite copper foil (40) is installed inside the stainless steel housing (50) to diffuse heat; The stainless steel housing (50) covers the outside of the heat dissipation silicone sheet (30) and is used to assist in heat dissipation through radiation and convection.

2. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 1, characterized in that: The metal heat dissipation block (20) is mounted on the mainboard bracket (60).

3. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 2, characterized in that: The mainboard bracket (60) is provided with a mounting column (61) and a mounting hole (62), and the metal heat dissipation block (20) is correspondingly provided with a metal heat dissipation block body (21) having a size adapted to the mounting hole (62), and a positioning hole (22) matched with the mounting column (61).

4. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 1, characterized in that: The metal heat dissipation block (20) is an aluminum heat dissipation block or a copper heat dissipation block.

5. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 1, characterized in that: The thermal conductivity of the metal heat dissipation block (20) is 230 W / (m·K), the surface area of ​​the metal heat dissipation block (20) is 840 square millimeters, and the volume is 5460 cubic millimeters.

6. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 1, characterized in that: The thermal conductivity coefficient of the heat dissipation paste layer (10) is greater than 1.93 W / mK.

7. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 1, characterized in that: The heat dissipation silicone sheet (30) is made of GR-HM heat dissipation silicone, the heat conduction coefficient of the heat dissipation silicone sheet (30) is 6W / m·K, and the size of the heat dissipation silicone sheet (30) is 112 mm×220 mm×0.8 mm.

8. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 1, characterized in that: The thermal conductivity of the graphite copper foil (40) is between 600 and 1500 W / (m·K), and the size is 112 mm×220 mm×0.8 mm.

9. The multi-layer heat dissipation structure of a stainless steel tablet computer according to claim 1, characterized in that: The surface area of ​​the stainless steel housing (50) is 24640 square millimeters.

10. A stainless steel tablet computer, characterized in that: It comprises a multi-layer heat dissipation structure of a stainless steel tablet computer according to any one of claims 1 to 9, and a front frame display screen (70), wherein the stainless steel housing (50) covers the front frame display screen (70).

Images