Wafer box cover opening and wafer state detection device

Abstract

The utility model provides a wafer box uncovering and wafer state detection device, which belongs to the technical field of wafers and is suitable for a closed equipment front-end module, and the closed equipment front-end module comprises a wafer box transmission mechanism used for moving a front-opening type wafer box. Comprising a fixed frame provided with a bearing table; a notch is formed in the bearing table, and a mechanical arm of the wafer box transmission mechanism can penetrate through the notch; the wafer box opening and closing mechanism is arranged at the window of the fixed frame; the first wafer state detection mechanism is located above the wafer box opening and closing mechanism; the lifting mechanism is mounted on the fixed frame and drives the wafer box opening and closing mechanism and the first wafer state detection mechanism to synchronously lift; and the lifting mechanism is also provided with a second wafer state detection mechanism for detecting the position of the first wafer state detection mechanism. The device has the advantages that the notch is formed in the bearing table and is suitable for a closed equipment front-end module; meanwhile, a double-detection mechanism is adopted, and the accuracy of a detection result is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to a wafer box cover opening and wafer status detection device. Background Art

[0002] In the semiconductor manufacturing industry, wafer cassette opening and wafer status detection equipment are essential core components, crucial for ensuring efficient and safe wafer transfer between various process steps. Traditional cassette opening and closing mechanisms are typically deployed on the periphery of semiconductor equipment, with front-opening unified pods (FOUPs) being placed and retrieved via automated transport systems such as overhead hoist transports (OHTs).

[0003] Currently available wafer cassette opening and closing systems, such as the one disclosed in Chinese utility model patent CN215496650U, for a 12-inch front-opening wafer transfer cassette opening and closing system, utilize a motor-driven screw to drive the movable door up and down, which is then moved forward and backward by a door opening and closing cylinder. This system, in conjunction with a door suction cup and latch, enables the FOUP to open and close, and also features a synchronized wafer status detection function. Due to its design and operation, this system is not fully adapted to the specific requirements of the closed internal space of the Equipment Front End Module (EFEM) in tank-type cleaning machines, which requires autonomous FOUP placement and placement.

[0004] Given the unique characteristics of the B300 EFEM tank-type cleaning machine, its wafer cassette opening and wafer status detection mechanisms must be built into the equipment and work directly with the equipment's wafer handling unit (WTU), rather than relying on an external overhead crane (OHT) system. Therefore, it was urgent to develop a wafer cassette opening and wafer status detection device suitable for the B300 EFEM's internal operating environment. This would address the current issue of wafer cassettes being unable to be transported by the overhead crane (OHT) in an enclosed carrier environment, ensuring efficient and safe wafer transfer within the cassette-less tank-type cleaning machine. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a wafer box cover opening and wafer status detection device.

[0006] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0007] A wafer cassette cover opening and wafer status detection device is applicable to a front-end module of a closed equipment, wherein the front-end module of the closed equipment includes a wafer cassette conveying mechanism for moving a front-opening wafer cassette; the device comprises:

[0008] A fixed frame, wherein a carrier for loading the front-opening wafer box is installed on the front of the fixed frame; a notch is formed on the carrier for allowing a robot of the wafer box conveying mechanism to pass through;

[0009] A wafer box opening and closing mechanism is provided at a window on the upper back side of the fixed frame to open or close the cover of the front-opening wafer box;

[0010] a first wafer status detection mechanism, located above the wafer box opening and closing mechanism;

[0011] A lifting mechanism is fixedly mounted on the fixed frame and is located below the carrier platform. The lifting mechanism drives the wafer box opening and closing mechanism and the first wafer status detection mechanism to rise and fall synchronously through a connecting rod.

[0012] The lifting mechanism is further provided with a second wafer state detection mechanism for detecting the position of the first wafer state detection mechanism.

[0013] Preferably, the fixed frame is provided with:

[0014] a first through-beam sensor, wherein a transmitting end of the first through-beam sensor is disposed in the middle of the top of the window, and a receiving end of the first through-beam sensor is disposed on the supporting platform;

[0015] Two second through-beam sensors, wherein the transmitting ends of the two second through-beam sensors are respectively arranged at two ends of the top of the window, and the receiving ends of the two second through-beam sensors are respectively arranged at two sides of the supporting platform;

[0016] a third through-beam sensor, wherein a transmitting end and a receiving end of the third through-beam sensor are respectively located on the left and right sides of the window;

[0017] A fourth through-beam sensor, wherein the transmitting end and the receiving end of the fourth through-beam sensor are respectively located on the left and right sides or the upper and lower sides of the back side of the window.

[0018] Preferably, the wafer box opening and closing mechanism includes:

[0019] An opening panel, the opening panel being connected to the connecting rod via a opening panel connecting plate; an adjusting bolt being provided on the opening panel connecting plate, the adjusting bolt being connected to the fixing frame;

[0020] A suction cup and a cover lock are provided on the side of the cover opening panel facing the supporting platform, and a box cover positioning column is provided in the suction cup;

[0021] The cover opening cylinder is fixed to the side of the cover opening panel away from the supporting platform; the piston rod of the cover opening cylinder is fixedly connected to the connecting rod, and the two sides of the connecting rod are provided with bearing guide grooves for the movement of the first bearing;

[0022] One end of the first bearing is disposed in the bearing guide groove, and the first bearing is connected to the cover lock via a first rocker; a bearing pressure cover is provided on the first bearing;

[0023] A pneumatic joint is provided on a side of the cover opening panel away from the supporting platform, and the pneumatic joint is connected to the box cover positioning column;

[0024] A protective cover is provided to cover a side of the opening panel away from the supporting platform.

[0025] Preferably, the wafer box opening and closing mechanism further includes:

[0026] An adjusting eccentric wheel is arranged in the preset space and fixed on the cover opening panel, and a wedge-shaped surface of the adjusting eccentric wheel contacts the cover opening panel connecting plate.

[0027] Preferably, the wafer box opening and closing mechanism is further provided with:

[0028] The wafer box contact sensor is arranged in the preset space, and the sensing end of the wafer box contact sensor extends out of the preset space and is exposed on a side of the opening panel facing the supporting platform.

[0029] Preferably, the carrying platform includes:

[0030] The carrier plate is fixed to the fixed frame through the first guide rail slider assembly; the carrier plate is provided with a wafer box positioning column, a wafer box locking block, a second positioning column, and a pressure-sensitive sensor; the wafer box locking block is fixedly connected to the wafer box locking cylinder;

[0031] a wafer box docking cylinder, wherein the wafer box docking cylinder is fixed to the fixed frame through the cylinder fixing plate;

[0032] A flexible joint is respectively fixed to the head of the piston rod of the wafer box docking cylinder and the cylinder push plate, the cylinder push plate is fixed to the slider, and the slider is fixed to the carrying plate;

[0033] a wafer box docking position sensor, disposed on the fixed frame and located at an edge of the carrier plate;

[0034] A limiting block is provided on the fixed frame and is located at the end of the piston rod of the wafer box docking cylinder.

[0035] Preferably, the first wafer status detection mechanism includes:

[0036] A frame, the frame being arranged on the periphery of the wafer box opening and closing mechanism, and the bottom of the frame being mounted on the lifting mechanism;

[0037] A transmitting end and a receiving end of a through-beam optical fiber sensor are symmetrically mounted on the frame through an optical fiber sensor fixing block.

[0038] Preferably, the lifting mechanism comprises:

[0039] A single-axis robot is fixed on the fixed frame; a screw-nut assembly is provided in the single-axis robot, and a screw of the screw-nut assembly is connected to a servo motor;

[0040] A lifting plate, fixedly arranged on the screw nut of the screw nut assembly;

[0041] a first slider, disposed on the lifting plate via a second guide rail slider assembly, the first slider being connected to the connecting rod;

[0042] a first oscillating cylinder fixed to the lifting plate via a first oscillating cylinder fixing block, wherein the first oscillating cylinder is connected to a second bearing in the guide groove of the first slider via a second rocker;

[0043] a second slider, disposed on the lifting plate via a third guide rail slider assembly, the second slider being connected to the first wafer status detection mechanism;

[0044] The second oscillating cylinder is fixed to the lifting plate via a second oscillating cylinder fixing block. The second oscillating cylinder is connected to the third bearing in the guide groove of the second sliding block via a third rocker.

[0045] Preferably, the lifting mechanism is further provided with:

[0046] A first position sensor is provided on the lifting plate;

[0047] The first slider is provided with a first stopper corresponding to the front and rear position sensor of the door panel;

[0048] A second position sensor is provided on the lifting plate;

[0049] The second slider is provided with a second stopper corresponding to the second position sensor;

[0050] The sensor fixing plate is fixed on the fixing frame, and a plurality of lifting position sensors are provided on the sensor fixing plate along the lifting direction; the lifting position sensors correspond to the induction sheets, and the induction sheets are fixed on the lifting plate through the sensor fixing blocks.

[0051] Preferably, the second wafer status detection mechanism includes:

[0052] A comb tooth bar is installed on the sensor fixing plate along the lifting direction;

[0053] The wafer status sensor is mounted on the lifting plate through the sensor fixing block.

[0054] The advantages or beneficial effects of the technical solution of the utility model are:

[0055] The utility model is suitable for opening the cover of the wafer box in the front-end module of the closed equipment and transporting the front-opening wafer box on the wafer status detection device by providing a gap on the carrier table for the robot arm of the wafer box transmission mechanism to pass through; at the same time, the dual detection mechanism of the first wafer status detection mechanism and the second wafer status detection mechanism is adopted to offset the influence of the slight shaking of the first wafer status detection mechanism on the detection result, thereby improving the accuracy of the detection result. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 This is a diagram of the internal layout of the front-end module of a closed device in a preferred embodiment of the present utility model;

[0057] Figure 2 This is a front structural diagram of a wafer box cover opening and wafer status detection device in a preferred embodiment of the present invention;

[0058] Figure 3 This is a schematic diagram of the back structure of the wafer box cover opening and wafer status detection device in a preferred embodiment of the present invention;

[0059] Figure 4 This is a schematic diagram of the robot passing through the gap in a preferred embodiment of the present utility model;

[0060] Figure 5 This is a schematic diagram of the front structure of the fixed frame in a preferred embodiment of the present utility model;

[0061] Figure 6 This is a schematic diagram of the back structure of the fixed frame in a preferred embodiment of the present utility model;

[0062] Figure 7 This is a front structural diagram of the wafer box opening and closing mechanism in a preferred embodiment of the present invention;

[0063] Figure 8 This is a schematic diagram of the back structure of the wafer box opening and closing mechanism in a preferred embodiment of the present invention;

[0064] Figure 9 This is a structural diagram of a supporting platform in a preferred embodiment of the present invention;

[0065] Figure 10 This is a structural diagram of a supporting platform in a preferred embodiment of the present invention;

[0066] Figure 11 This is a structural diagram of the lifting mechanism in a preferred embodiment of the present utility model;

[0067] Figure 12 This is a schematic structural diagram of the pneumatic mechanism in a preferred embodiment of the present utility model;

[0068] Figure 13 This is a structural diagram of a first wafer status detection mechanism in a preferred embodiment of the present utility model;

[0069] Figure 14 In the preferred embodiment of the present invention, Figure 13 Enlarged view of J in the middle;

[0070] Figure 15 In the preferred embodiment of the present invention, Figure 13 Enlarged view of point k in the middle. DETAILED DESCRIPTION

[0071] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0072] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0073] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0074] The wafer box cover opening and wafer status detection device 100 (FIMS) of the present invention is applicable to the front-end module 10 of the closed equipment, such as B300 EFEM. The internal layout of the front-end module 10 of the closed equipment is as follows: Figure 1 As shown, it mainly includes:

[0075] The wafer cassette lid opening and wafer status detection device 100 is used to open or close the lid of a front-opening wafer cassette and detect the status of wafers in the front-opening wafer cassette. The wafer status includes empty wafers, normal wafers, overlapped wafers, and crossed wafers.

[0076] The load port 300 (Loadport) is used to receive and load wafer boxes (such as FOUPs or SMIF pods) and is the first process for wafers to enter the equipment front-end module (EFEM);

[0077] The cassette transfer unit 200 (FTU) is located near the load port 300 and is used to receive front-opening cassettes (FOUPs) from the load port and move them to the buffer 400 (Buffer) or directly transfer them to the cassette opening and wafer status inspection device 100;

[0078] The wafer transfer unit 500 (WTU) is located near the wafer box opening and wafer status detection device 100. It is used to remove wafers from the FOUP after the cover is opened and the wafer status detection is completed, and transport them to the corresponding process chamber for processing. After completion, the wafers are returned to the FOUP;

[0079] Wafer gripping and flipping mechanism 600 (Pick-and-Place or Pick-Off-Sidearm, POS), a precision mechanical device used to grab, place, and flip wafers to ensure that the wafers are not damaged during the transfer process;

[0080] The load pusher 700 (Loadpusher) is used to receive the wafer on the POS mechanism and return to the set position. The robot transfers the wafer on the load pusher 700 (Loadpusher) to the subsequent process;

[0081] The unloading pusher 800 (Unloadpusher), corresponding to the Loadpusher, is used to return the processed wafers to the POS mechanism after the wafer processing is completed.

[0082] In a preferred embodiment of the present invention, based on the above problems existing in the prior art, a wafer box opening and wafer status detection device (FIMS) is provided. Figure 2 and Figure 3 As shown, the device includes:

[0083] A fixed frame 1 is provided with a carrier 3 for loading a front-opening wafer pod (FOUP) on the front of the fixed frame 1; a notch is provided on the carrier 3 for a robot 201 of a wafer pod transfer mechanism 200 to pass through;

[0084] The wafer box opening and closing mechanism 2 is provided at the window on the upper back side of the fixed frame 1 to open or close the cover of the front-opening wafer box;

[0085] A first wafer status detection (Mapping) mechanism 6 is located above the wafer box opening and closing mechanism 2;

[0086] The lifting mechanism 4 is fixedly mounted on the fixed frame 1 and is located below the carrier 3. The lifting mechanism 4 drives the wafer box opening and closing mechanism 2 and the first wafer status detection mechanism 6 to rise and fall synchronously through the connecting rod 7.

[0087] The lifting mechanism 4 is further provided with a second wafer status detection mechanism for detecting the position of the first wafer status detection mechanism 6 .

[0088] Specifically, in this embodiment, Figure 4 As shown, a notch is provided on the carrier table so that the manipulator 201 of the wafer box transport mechanism 200 can pass through the notch of the carrier table 3 of the FIMS, thereby realizing the loading and unloading operations of the wafer box. When it is necessary to put the FOUP into the FIMS for opening the cover and wafer status detection, the manipulator 201 approaches the carrier table 3 from above, and slowly lowers the FOUP to the predetermined position of the carrier table 3 through the notch, ensuring that the FOUP can be stably placed on the carrier table, and returns to the initial standby position from the bottom of the carrier table 3. After completing the wafer processing in the wafer box (operations such as opening the cover, status detection, and subsequent process processing), the manipulator 201 extends forward to the bottom of the notch of the carrier table 3, and slowly rises through the notch, lifts the FOUP, and returns to the initial standby position, so that the device of the utility model can be seamlessly integrated into the wafer box handling process inside the front-end module of the closed device.

[0089] Furthermore, the wafer box opening and closing mechanism 2 and the first wafer state detection mechanism 6 are synchronously driven by the lifting mechanism 4 to perform rising and falling movements. During the wafer state detection process, the first wafer detection mechanism 6 extends from the front of the window to the front-opening wafer box with the lid opened. During the downward movement from top to bottom, the state of the wafer in the front-opening wafer box is detected. The distance moved during the light-shielding time is calculated by the time the optical fiber sensor is shielded by the WAFER, the speed of the servo motor and the lead of the ball screw in the single-axis robot to determine whether the wafer has empty wafers, normal wafers, overlapping wafers or cross wafers. At the same time, the second wafer state detection mechanism attached to the lifting mechanism 4 is compared with the signal of the first wafer state detection mechanism 6 to perform signal superposition and discrimination, forming a double detection mechanism (Double Check), thereby offsetting the detection error caused by possible slight vibration or movement of the first detection mechanism, thereby greatly improving the accuracy and reliability of wafer state detection.

[0090] Further, such as Figure 5 As shown, the fixed frame 1 includes: a fixed plate 1-1, an eccentric adjustment wheel 1-5 is provided on the fixed plate 1-1, two side plates, the two side plates are arranged in parallel, and the two side plates are connected by support columns 1-7 to form a stable triangular or rectangular support structure.

[0091] Furthermore, the bottoms of the two side panels contact the wedge-shaped surfaces of the eccentric adjustment wheel 1-5. When the eccentric adjustment wheel 1-5 rotates, the inclined surface effect of the wedge-shaped surfaces drives the two side panels to rise or fall synchronously. The tops of the two side panels are connected to the support platform 3, which can also be finely adjusted in height along with the side panels using the eccentric adjustment wheel 1-5.

[0092] Furthermore, the wafer box opening and closing mechanism 2 and the first wafer detection mechanism 6 are located on the same side of the fixed plate 1 - 1 of the fixed frame, and are located on a different side of the fixed frame from the carrier platform.

[0093] As a preferred embodiment, wherein Figure 5 As shown, the fixed frame 1 is provided with:

[0094] The first through-type sensor 1-2, the transmitting end of the first through-type sensor 1-2 is set in the middle of the top of the window, and the receiving end of the first through-type sensor 1-2 is set on the carrier, which is used to detect whether the FOUP is placed on the carrier 3, that is, to detect the presence or absence of the FOUP, to ensure that the wafer box has been correctly placed before the next operation.

[0095] As a preferred embodiment, wherein Figure 5 As shown, the fixed frame 1 is provided with:

[0096] Two second through-type sensors 1-3, the transmitting ends of the two second through-type sensors 1-3 are respectively arranged at the top two ends of the front side of the window, and the receiving ends of the two second through-type sensors 1-3 are respectively arranged on both sides of the carrier. The transmitting end and the receiving end of each sensor are located on the same side, which are used to detect whether the FOUP is centered on the carrier, ensuring that the wafer box is accurately placed in the set position, so that subsequent opening of the cover and other operations can be carried out smoothly.

[0097] As a preferred embodiment, wherein Figure 5 As shown, the fixed frame 1 is provided with:

[0098] The third through-beam sensor 1-4, the transmitting end and the receiving end of the third through-beam sensor 1-4 are respectively located on the left and right sides of the window, and are used to detect whether the FOUP is accurately docked (DOCKING) in place, that is, whether the wafer box is tightly attached to the docking position of the carrier, so as to facilitate the smooth progress of the subsequent opening operation.

[0099] As a preferred embodiment, wherein Figure 6 As shown, the fixed frame 1 is provided with:

[0100] The fourth through-beam sensor 1-6, the transmitting end and the receiving end of the fourth through-beam sensor 1-6 are respectively located on the left and right sides or the upper and lower sides of the back of the window, and are used to detect whether the opening mechanism has completed the opening operation of the FOUP, ensuring that after the opening is completed, the system can continue to the next step of wafer status detection or other operation processes.

[0101] Furthermore, the side closest to the carrier is the front of the window, and the side away from the carrier is the back of the window. By placing a series of through-beam sensors near the window of fixed frame 1, they provide real-time sensing and feedback on the FOUP status at each stage, ensuring the accurate and efficient execution of the entire automated process of the wafer cassette opening and wafer status monitoring system (FIMS).

[0102] As a preferred embodiment, wherein Figure 7 and Figure 8 As shown, the wafer box opening and closing mechanism 2 includes:

[0103] The cover opening panel 2-1 is connected to the connecting rod 7 through the cover opening panel connecting plate 2-16;

[0104] The suction cup 2-2 and the cover lock 2-4 are arranged on the side of the cover panel 2-1 facing the supporting platform, and the cover positioning column 2-3 is arranged in the suction cup 2-2;

[0105] The cover opening cylinder 2-8 is fixed to the side of the cover opening panel 2-1 away from the bearing platform; the piston rod of the cover opening cylinder 2-8 is fixedly connected to the connecting rod 2-12, and bearing guide grooves for the movement of the first bearing 2-11 are provided on both sides of the connecting rod 2-12;

[0106] One end of the first bearing 2-11 is disposed in the bearing guide groove, and the first bearing 2-11 is connected to the cover opening lock 2-4 through the first rocker 2-10;

[0107] The pneumatic joint 2-14 is provided on the side of the cover opening panel 2-1 away from the supporting platform, and the pneumatic joint 2-14 is connected to the box cover positioning column 2-3;

[0108] Specifically, the cover opening panel 2 - 1 is connected to the connecting rod 7 via the cover opening panel connecting plate 2 - 16 , so that the lifting mechanism 4 drives the wafer box opening and closing mechanism 2 to achieve lifting action via the connecting rod 7 .

[0109] A suction cup 2-2 and a cover opening lock 2-4 are arranged on the side of the cover opening panel 2-1 facing the supporting platform. The suction cup 2-2 has a built-in box cover positioning column 2-3, and the box cover positioning column 2-3 is connected to the pneumatic connector 2-14. The pneumatic connector 2-14 provides an air source for the suction cup to ensure that the suction cup 2-2 can firmly adsorb and accurately position the box cover of the FOUP.

[0110] The cover opening cylinder 2-8 is fixed on the back of the cover opening panel 2-1 and is connected to the connecting rod 2-12 through a piston rod. The telescopic movement of the piston rod will drive the connecting rod 2-12 fixed on the piston rod to move left and right; the first bearing 2-11 is installed in the bearing guide groove. As the connecting rod 2-12 moves left and right, the first bearing 2-11 performs reciprocating linear motion in the bearing guide groove, driving the left and right first rocking arms 2-10 to rotate. The rotation of the first rocking arm 2-10 drives the cover opening lock 2-4 to rotate, thereby realizing the opening and locking of the FOUP box cover.

[0111] As a preferred embodiment, a bearing cover 2-9 is provided on the first bearing 2-11. The bearing cover 2-9 is used to fix and protect the first bearing 2-11.

[0112] As a preferred embodiment, wherein Figure 7 As shown, the wafer box opening and closing mechanism 2 also includes:

[0113] The protective cover 2-5 covers the side of the opening cover panel 2-1 away from the supporting platform 3 and forms a preset space with the opening cover panel (2-1).

[0114] Specifically, a protective cover 2 - 5 is installed on a side of the opening panel 2 - 1 away from the supporting platform 3 to protect the components inside the opening mechanism from interference from external factors such as dust and debris.

[0115] As a preferred embodiment, wherein Figure 8 As shown, an adjusting bolt 2-17 is provided on the cover plate connecting plate 2-16, and the adjusting bolt 2-17 is connected to the fixed frame 1.

[0116] Specifically, an adjusting bolt 2-17 is provided on the cover opening plate connecting plate 2-16, and the horizontal position of the cover opening door panel unit 2 relative to the fixed frame 1 can be fine-tuned by screwing the adjusting bolt 2-17 to ensure accurate docking between the cover opening mechanism and the bearing platform.

[0117] As a preferred embodiment, wherein Figure 8 As shown, the wafer box opening and closing mechanism 2 also includes:

[0118] The adjusting eccentric wheel 2-13 is fixed on the cover opening panel 2-1, and the wedge-shaped surface of the adjusting eccentric wheel 2-13 contacts the cover opening panel connecting plate 2-16.

[0119] Specifically, an adjusting eccentric wheel 2-13 is fixedly provided on the cover opening panel 2-1, and the wedge surface of the adjusting eccentric wheel 2-13 contacts the cover opening plate connecting plate 2-16. The inclined surface effect of the wedge surface is used to drive the cover opening plate connecting plate 2-16 to move left and right, thereby achieving fine adjustment of the left and right position of the cover opening panel 2-1.

[0120] As a preferred embodiment, wherein Figure 7 and Figure 8 As shown, the wafer box opening and closing mechanism 2 is also provided with:

[0121] The wafer box contact sensor 2-15 is arranged in the preset space, and the sensing end of the wafer box contact sensor 2-15 extends out of the preset space and is exposed on the side of the opening panel 2-1 facing the carrier platform.

[0122] Specifically, the wafer box contact sensor 2-15 includes a sensor sensing rod 2-6 and a sensor protective cover 2-7, which are arranged in a preset space. The sensing end extends to the side of the opening panel facing the carrier platform, and is used to detect whether the FOUP contacts the opening panel or has left the opening panel, thereby ensuring precise control of the opening process.

[0123] As a preferred embodiment, wherein Figure 9 and Figure 10 As shown, the carrying platform 3 includes:

[0124] The carrier plate 3-1 is fixed to the fixed frame 1 through the first guide rail slider assembly 3-7; the carrier plate 3-1 is provided with a wafer box positioning column 3-2, a wafer box locking block 3-3, a second positioning column 3-5, and a pressure-sensitive sensor 3-6; the wafer box locking block 3-3 and the wafer box locking cylinder 3-4 are fixedly connected;

[0125] Wafer box docking cylinder 3-15, the wafer box docking cylinder 3-15 is fixed on the fixed frame 1 through the cylinder fixing plate 3-16;

[0126] The flexible joint 3-11 is fixed to the head of the piston rod of the wafer box docking cylinder 3-15 and the cylinder push plate 3-13 respectively. The cylinder push plate 3-13 is fixed to the slider 3-14, and the slider 3-14 is fixed to the carrier plate 3-1.

[0127] The wafer box docking position sensor 3-9 is provided on the fixed frame 1 and is located at the edge of the carrier plate 3-1;

[0128] The limit block 3-12 is provided on the fixed frame 1 and is located at the end of the piston rod of the wafer box docking cylinder 3-15, and is used to limit the stroke of the cylinder to prevent equipment damage or malfunction caused by overstroke.

[0129] Specifically, the supporting plate 3-1 is fixedly connected to the slider of the first guide rail slider assembly 3-7, and the guide rail of the first guide rail slider assembly 3-7 is fixedly connected to the side plate of the fixed frame 1. Through the sliding connection between the slider and the guide rail of the first guide rail slider assembly 3-7, the supporting platform 3 is able to slide in the horizontal direction, thereby enabling the supporting platform 3 as a whole to move away from or close to the wafer box opening and closing mechanism 2.

[0130] The carrier plate 3-1 is equipped with several key components, including a wafer cassette positioning column 3-2, a wafer cassette locking block 3-3, a second positioning column 3-5, and a pressure-sensitive sensor 3-6. Three wafer cassette positioning columns 3-2 are provided to precisely position and support the FOUP, ensuring its accurate placement on the carrier. The wafer cassette locking block 3-3 is connected to the fixed carrier plate 3-1 via a wafer cassette locking cylinder 3-4. When the locking cylinder is activated, the FOUP can be locked or released, ensuring the stable fixation of the FOUP during the opening and inspection process. Three pressure-sensitive sensors 3-6 are provided to detect whether the FOUP has been stably placed on the carrier plate.

[0131] The FOUP docking cylinder 3-15 is secured to the side panels of the fixed frame 1 via a cylinder fixing plate 3-16. It is connected to the cylinder push plate 3-13 via a flexible joint 3-11. The cylinder push plate 3-13 is secured to a slider 3-14, which is connected to the carrier plate 3-1. When the FOUP docking cylinder 3-15 is activated, the FOUP can be docked and undocked. A FOUP docking position sensor 3-9 is mounted on the fixed frame to detect the correct position of the FOUP during docking and undocking.

[0132] Furthermore, a support plate 3-8 is provided on the carrier plate 3-1. The support plate 3-8 is used to provide additional structural support for the carrier 3, especially when carrying a heavy FOUP (front-opening wafer pod). It can ensure that the carrier plate still maintains sufficient rigidity and stability under heavy loads, and prevent the carrier from being deformed or damaged due to excessive load.

[0133] Furthermore, a retaining ring 3-10 is provided on the carrier plate 3-1 to prevent FOUPs or operators from colliding with the edge of the carrier plate due to improper operation or other unexpected circumstances during the carrier plate movement, FOUP docking, or removal process. The retaining ring is typically made of wear-resistant and impact-resistant materials, protecting the equipment from damage while also ensuring the safety of the operator.

[0134] As a preferred embodiment, wherein Figure 11 As shown, the lifting mechanism 4 includes:

[0135] The single-axis robot 4-2 is fixed on the fixed frame 1; the single-axis robot 4-2 is provided with a screw-nut assembly, and the screw of the screw-nut assembly is connected to the servo motor 4-1;

[0136] The lifting plate 4-26 is fixedly arranged on the screw nut of the screw nut assembly.

[0137] Furthermore, the single-axis robot 4-2 is fixed on the fixed frame 1 as a precision transmission mechanism. Specifically, the single-axis robot 4-2 is fixed on the single-axis robot fixed block 4-25, and the single-axis robot fixed block 4-25 is fixed on the fixed plate 1-1 of the fixed frame 1 through the single-axis robot fixed block support plate 4-24, ensuring its stable installation in the vertical direction.

[0138] The lead screw and nut assembly is built into the single-axis robot 4-2. The lead screw is connected to the servo motor 4-1, and the lead screw nut is fixedly connected to the lifting plate 4-26. The servo motor 4-1 drives the lead screw inside the single-axis robot 4-2 to rotate. As the lead screw rotates, the lead screw nut moves up and down linearly on the lead screw, thereby driving the lifting plate 4-26 up and down.

[0139] As a preferred embodiment, wherein Figure 11 As shown, the lifting mechanism 4 also includes:

[0140] The first slider 4-4 is arranged on the lifting plate 4-26 through the second guide rail slider assembly 4-3, and the first slider 4-4 is connected to the connecting rod 7;

[0141] The first swing cylinder 4-7 is fixed on the lifting plate 4-26 through the first swing cylinder fixing block 4-8, and the first swing cylinder 4-7 is connected to the second bearing 4-6 in the guide groove of the first slider 4-4 through the second rocker 4-5.

[0142] Specifically, the guide rails of the second guide rail slider assembly 4-3 are horizontally mounted on the lifting plate 4-26, and the first slider 4-4 is mounted on the guide rails of the second guide rail slider assembly 4-3, enabling horizontal movement of the first slider 4-4 relative to the lifting plate 4-26. The first slider 4-4 is connected to a connecting rod 7, which is in turn connected to the wafer cassette opening and closing mechanism 2. Thus, the first slider 4-4 drives the wafer cassette opening and closing mechanism 2 to move horizontally left and right via the connecting rod 7.

[0143] At the same time, when the lifting plate 4-26 is lifted and lowered by the screw nut assembly driven by the servo motor 4-1, the first slider 4-4 also moves in the vertical direction, and then drives the wafer box opening and closing mechanism 2 to move up and down in the vertical direction through the connecting rod 7.

[0144] Furthermore, the first oscillating cylinder 4-7 is connected to the second bearing 4-6 in the guide groove of the first slider 4-4 via the second rocker 4-5. When the first oscillating cylinder 4-7 is in operation, the rotational motion it outputs rotates the second rocker 4-5, which in turn drives the first slider 4-4 to move back and forth horizontally, thereby moving the wafer cassette opening and closing mechanism 2 away from or closer to the fixed frame 1.

[0145] As a preferred embodiment, wherein Figure 11 As shown, the lifting mechanism 4 is also provided with:

[0146] A first position sensor 4-16 is provided on the lifting plate 4-26;

[0147] The first slider 4 - 4 is provided with a first stopper corresponding to the first position sensor 4 - 16 .

[0148] Specifically, the first stopper on the first slider 4 - 4 cooperates with the first position sensor 4 - 16 to detect whether the front and rear positions of the cover panel 2 - 1 of the wafer box opening and closing mechanism 2 are in place.

[0149] As a preferred embodiment, wherein Figure 11 As shown, the lifting mechanism 4 also includes:

[0150] The second slider 4-9 is arranged on the lifting plate 4-26 through the third guide rail slider assembly 4-15, and the second slider 4-9 is connected to the first wafer state detection mechanism 6;

[0151] The second swing cylinder 4-11 is fixed on the lifting plate 4-26 through the second swing cylinder fixing block 4-14, and the second swing cylinder 4-11 is connected to the third bearing 4-12 in the guide groove of the second slider 4-4 through the third rocker 4-13.

[0152] Specifically, the guide rails of the third guide rail slider assembly 4-15 are horizontally arranged on the lifting plate 4-26, and the second slider 4-9 is installed on the guide rails of the third guide rail slider assembly 4-15, so that the second slider 4-9 can move horizontally relative to the lifting plate 4-26. The second slider 4-9 is connected to the first wafer status detection mechanism 6, so that the second slider 4-9 drives the first wafer status detection mechanism 6 to move horizontally left and right.

[0153] At the same time, when the lifting plate 4-26 is lifted and lowered by the screw nut assembly driven by the servo motor 4-1, the second slider 4-9 also moves in the vertical direction, thereby driving the first wafer status detection mechanism 6 to move up and down in the vertical direction.

[0154] Furthermore, the second oscillating cylinder 4-11 is connected to the third bearing 4-12 in the guide groove of the second slider 4-9 via the third rocker 4-13. When the second oscillating cylinder 4-11 is in operation, the rotational motion outputted by it rotates the third rocker 4-13, which in turn drives the second slider 4-9 to move back and forth in the horizontal direction, thereby moving the first wafer status detection mechanism 6 away from or closer to the fixed frame 1.

[0155] As a preferred embodiment, wherein Figure 11As shown, the lifting mechanism 4 is also provided with:

[0156] A second position sensor 4-17 is provided on the lifting plate 4-26;

[0157] The second slider 4-9 is provided with a second stopper corresponding to the second position sensor 4-17.

[0158] Specifically, the second stopper on the second slider 4 - 9 cooperates with the second position sensor 4 - 17 to detect whether the front and rear positions of the first wafer status detection mechanism 6 are in place.

[0159] As a preferred embodiment, wherein Figure 11 As shown, the lifting mechanism 4 is also provided with:

[0160] The sensor fixing plate 4-19 is fixed on the fixed frame 1, and a plurality of lifting position sensors 4-20 are provided on the sensor fixing plate 4-19 along the lifting direction; the lifting position sensors 4-20 correspond to the induction sheets 4-23, and the induction sheets 4-23 are fixed on the lifting plate 4-26 through the sensor fixing block 4-22.

[0161] Furthermore, multiple lifting position sensors 4-20 are provided, and the specific number of such sensors can be determined based on actual needs. In this embodiment, seven lifting position sensors 4-20 are provided as an example. These sensors are sequentially installed on the sensor fixing plate 4-19 along the lifting direction, corresponding to the sensing pieces 4-23 on the lifting plate 4-26, and are used to detect various preset positions of the lifting plate during its upward and downward movement, including, from top to bottom, the upper limit position, the upper in-position position, the mapping starting point, the origin, the mapping end point, the lower in-position position, and the lower limit position.

[0162] As a preferred embodiment, wherein Figure 11 As shown, the second wafer status detection mechanism includes:

[0163] The comb teeth 4-27 are mounted on the sensor fixing plate 4-19 along the lifting direction;

[0164] The wafer status sensor 4-21 is mounted on the lifting plate 4-26 through the sensor fixing block 4-22.

[0165] Furthermore, the comb tooth bar 4-27 includes a plurality of comb teeth, each of which is provided with three tooth grooves. The number of comb teeth provided is the same as the number of wafers from top to bottom in the wafer box. Generally, there are 25 wafers, that is, there are also 25 comb teeth provided.

[0166] Specifically, the three tooth grooves in each comb tooth are respectively recorded as tooth groove A, tooth groove B and tooth groove C from top to bottom. Taking the case where the center position of the wafer corresponds to tooth groove B, when the lifting mechanism 4 drives the first wafer state detection mechanism 6 to move up and down, the wafer state sensor 4-21 outputs a sensing signal through the tooth grooves of the comb teeth. After the first wafer state detection mechanism 6 completes the detection from top to bottom, it will generate a first detection signal. At the same time, the wafer state sensor 4-21 will also generate a second detection signal. By superimposing the second detection signal with the first detection signal output by the first wafer state detection mechanism 6, a superimposed signal is obtained. The superimposed signal can be used to further determine the state of the wafer.

[0167] Specifically, when the corresponding slot B is detected in the superimposed signal, it indicates a normal wafer; when the corresponding slot C and the next comb tooth slot A are detected in the superimposed signal, it indicates a crossed wafer; when the corresponding slots A and B are detected in the superimposed signal, it indicates an overlapped wafer or a bent wafer (bent upward); when the corresponding slots B and C are detected in the superimposed signal, it indicates a bent wafer (bent downward); when the corresponding slots A, B, and C are not detected in the superimposed signal, it indicates a blank wafer. The second wafer status detection is implemented by the wafer status sensor 4-21, the comb tooth bar 4-27, and the through-beam optical fiber sensor 6-2 to determine whether the wafer is blank, normal, overlapped, or crossed.

[0168] Furthermore, the lifting mechanism 4 also includes a drag chain 4-18, which provides safe and reliable traction and protection for the built-in cables, air pipes and other soft pipelines involved in the lifting mechanism 4 during the up and down movement.

[0169] Further, such as Figure 12 As shown, it also includes: a pneumatic mechanism 5, which is fixedly installed at the bottom of the fixed frame 1, and the output ends of the pneumatic mechanism 5 are respectively connected to the wafer box opening and closing mechanism 2 and the lifting mechanism 4.

[0170] The pneumatic mechanism 5 includes: a fixed plate 5-1, which is fixedly installed on the bottom of the fixed frame 1. The fixed plate 5-1 is provided with a valve island 5-2, a vacuum solenoid valve 5-3, a negative pressure gauge 5-4 and a pressure reducing valve 5-5; the valve island 5-2 is used to control the cover opening cylinder 2-8, the wafer box locking cylinder 3-4, the wafer box docking cylinder 3-15, the first swing cylinder 4-7, and the second swing cylinder 4-11; the vacuum solenoid valve 5-3 is used to control the opening and closing of the negative pressure; the negative pressure gauge 5-4 is used to display the specific pressure of the negative pressure; the pressure reducing valve 5-5 is used to control the air pressure of the factory service end.

[0171] As a preferred embodiment, wherein Figure 13 、 Figure 14 and Figure 15 As shown, the first wafer status detection mechanism 6 includes:

[0172] Frame 6-1, frame 6-1 is arranged on the periphery of the wafer box opening and closing mechanism 2, and the bottom of frame 6-1 is installed on the lifting mechanism 4;

[0173] The transmitting end and receiving end of the through-beam optical fiber sensor 6-2 are symmetrically mounted on the frame 6-1 through the optical fiber sensor fixing block 6-3.

[0174] Specifically, in the process of the servo motor 4-1 controlling the single-axis robot 4-2 to drive the first wafer status detection mechanism 6 to move up and down, the through-beam optical fiber sensor 6-2 on the first wafer status detection mechanism 6 detects each wafer in the FOUP from top to bottom, and estimates the thickness of the wafer through the ON and OFF time (that is, the light is blocked by the wafer) of the sensor signal, and the rotation speed of the servo motor 4-1 and the lead of the single-axis robot 4-2, so as to judge whether it is a blank wafer, a normal wafer, a stacked wafer, or a cross wafer.

[0175] Furthermore, the lifting mechanism 4 is also provided with an optical fiber amplifier 4-10, which is electrically connected to the above-mentioned reflected optical fiber sensor 6-2, and is used to receive the weak first detection signal output by the reflected optical fiber sensor 6-2, and enhance it through the process of photoelectric conversion and signal amplification. Through the amplified signal, any detailed changes of the wafer during the transmission process can be captured more sensitively.

[0176] The wafer box opening and wafer status detection process of the utility model is as follows:

[0177] A1: The overhead crane (OHT) places the FOUP on the loadport. A2: The FTU removes the FOUP from the loadport and places it on the buffer. A3: The FTU removes the FOUP from the buffer and places it on the carrier 3 on the FIMS. A4: The wafer cassette locking cylinder 3-4 on the FIMS drives the wafer cassette locking block 3-3 to clamp the FOUP.

[0178] A5, the wafer box docking cylinder 3-15 on the FIMS drives the carrier 3 to dock with the FOUP and attach the FOUP to the cover opening panel 2-1 on the FIMS; A6, the vacuum solenoid valve 5-3 on the FIMS is actuated to open the negative pressure and suck the FOUP through the suction cup 2-2 (the vacuum pump is always in working state during the operation of the equipment) (Vacuum on); A7, the cover opening cylinder 2-8 on the FIMS drives the cover opening latch 2-4 to open the FOUP (Latch); A8, the first swing cylinder 4-7 on the FIMS drives the first rocker 4-5 to move the first slider 4-4 and the connecting rod 7 fixed thereon, the wafer box opening and closing mechanism 2 and the FOUP box cover adsorbed thereon back to complete the door opening (Door open); A9, the lifting mechanism 4 on the FIMS brings the wafer box opening and closing mechanism 2 and the first wafer status detection mechanism 6 down to the Mapping starting position; A10, the second swing cylinder 4-11 on the FIMS drives the second rocker 4-13 with the second slider 4-9 and the first wafer status detection mechanism 6 fixed thereon to extend into the FOUP; A11, the lifting mechanism 4 on the FIMS brings the wafer box opening and closing mechanism 2 and the first wafer status detection mechanism 6 down to the Mapping end position, and detects the wafers in the FOUP from top to bottom; wherein, the wafer status detection adopts a dual detection mechanism of the first wafer status detection mechanism and the second wafer status detection mechanism. The detection process is shown above and will not be repeated here. A12, the second swing cylinder 4-11 on FIMS drives the second rocker 4-13 with the second slider 4-9 and the first wafer status detection mechanism 6 fixed thereon to retreat to the standby position; A13, the lifting mechanism 4 on FIMS brings the wafer box opening and closing mechanism 2 and the first wafer status detection mechanism 6 down to the set lower position, and the wafer box opening and wafer status detection are completed; A14, WTU takes out 25 wafers from the opened FOUP and transmits them to the cleaning area for cleaning through subsequent processes; A15, WTU places the 25 cleaned wafers in the opened FOUP; A16, FIMS completes the wafer status detection and closing of the FOUP according to the reverse steps of the above steps A4-A15; A17, FTU takes the FOUP on the FOUP carrier and sends it to the Loadport end; A18, overhead crane (OHT) takes the FOUP at the Loadport end and sends it to the subsequent process machine.

[0179] The advantages or beneficial effects of adopting the above technical solution are: the utility model is suitable for opening the wafer box cover in the front-end module of the closed equipment and transporting the front-opening wafer box on the wafer status detection device by providing a gap on the carrier table for the robot arm of the wafer box transmission mechanism to pass through; at the same time, the dual detection mechanism of the first wafer status detection mechanism and the second wafer status detection mechanism can offset the influence of slight shaking of the first wafer status detection mechanism on the detection result, thereby improving the accuracy of the detection result.

[0180] The above are only preferred embodiments of the present invention and do not limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the contents of this specification and illustrations should be included in the protection scope of the present invention.

Claims

1. A wafer box cover opening and wafer status detection device, characterized in that: Applicable to a front-end module of a closed equipment, the front-end module of the closed equipment including a wafer box transport mechanism for moving a front-opening wafer box; the device includes: A fixed frame (1), wherein a carrier platform (3) for loading the front-opening wafer box is installed on the front of the fixed frame (1); a notch is provided on the carrier platform (3) for a robot arm of the wafer box transmission mechanism to pass through; A wafer box opening and closing mechanism (2) is arranged at a window on the upper back side of the fixed frame (1) to open or close the cover of the front-opening wafer box; A first wafer state detection mechanism (6) is located above the wafer box opening and closing mechanism (2); A lifting mechanism (4) is fixedly mounted on the fixed frame (1), and the lifting mechanism (4) is located below the carrier platform (3). The lifting mechanism (4) drives the wafer box opening and closing mechanism (2) and the first wafer status detection mechanism (6) to rise and fall synchronously via a connecting rod (7); The lifting mechanism (4) is also provided with a second wafer state detection mechanism for detecting the position of the first wafer state detection mechanism (6).

2. The wafer box cover opening and wafer status detection device according to claim 1, characterized in that: The fixed frame (1) is provided with: a first through-beam sensor (1-2), wherein a transmitting end of the first through-beam sensor (1-2) is arranged in the middle of the top of the window, and a receiving end of the first through-beam sensor (1-2) is arranged on the supporting platform; Two second beam-type sensors (1-3), wherein the transmitting ends of the two second beam-type sensors (1-3) are respectively arranged at the two ends of the top of the window, and the receiving ends of the two second beam-type sensors (1-3) are respectively arranged at both sides of the supporting platform; a third through-beam sensor (1-4), wherein a transmitting end and a receiving end of the third through-beam sensor (1-4) are respectively located on the left and right sides of the window; A fourth through-beam sensor (1-6), wherein the transmitting end and the receiving end of the fourth through-beam sensor (1-6) are respectively located on the left and right sides or the upper and lower sides of the back side of the window.

3. The wafer box cover opening and wafer status detection device according to claim 1, characterized in that: The wafer box opening and closing mechanism (2) comprises: An opening panel (2-1), the opening panel (2-1) being connected to the connecting rod (7) via an opening panel connecting plate (2-16); an adjusting bolt (2-17) being provided on the opening panel connecting plate (2-16), and the adjusting bolt (2-17) being connected to the fixing frame (1); A suction cup (2-2) and a cover opening lock (2-4) are arranged on a side of the cover opening panel (2-1) facing the supporting platform, and a box cover positioning column (2-3) is provided in the suction cup (2-2); The cover opening cylinder (2-8) is fixed to a side of the cover opening panel (2-1) away from the supporting platform; the piston rod of the cover opening cylinder (2-8) is fixedly connected to the connecting rod (2-12), and bearing guide grooves for the movement of the first bearing (2-11) are provided on both sides of the connecting rod (2-12); One end of the first bearing (2-11) is arranged in the bearing guide groove, and the first bearing (2-11) is connected to the cover opening lock (2-4) via a first rocker (2-10); a bearing pressure cover (2-9) is provided on the first bearing (2-11); A pneumatic joint (2-14) is provided on a side of the cover opening panel (2-1) away from the bearing platform, and the pneumatic joint (2-14) is connected to the box cover positioning column (2-3); A protective cover (2-5) covers a side of the cover opening panel (2-1) away from the supporting platform (3) and forms a preset space with the cover opening panel (2-1).

4. The wafer box cover opening and wafer status detection device according to claim 3, characterized in that: The wafer box opening and closing mechanism (2) further comprises: The adjusting eccentric wheel (2-13) is fixed on the cover opening panel (2-1), and the wedge-shaped surface of the adjusting eccentric wheel (2-13) is in contact with the cover opening panel connecting plate (2-16).

5. The wafer box cover opening and wafer status detection device according to claim 3, characterized in that: The wafer box opening and closing mechanism (2) is further provided with: A wafer box contact sensor (2-15) is arranged in the preset space, and a sensing end of the wafer box contact sensor (2-15) extends out of the preset space and is exposed on a side of the opening panel (2-1) facing the supporting platform.

6. The wafer box cover opening and wafer status detection device according to claim 1, characterized in that: The carrying platform (3) comprises: A carrier plate (3-1) is fixed to the fixed frame (1) via a first guide rail slider assembly (3-7); a wafer box positioning column (3-2), a wafer box locking block (3-3), a second positioning column (3-5), and a pressure-sensitive sensor (3-6) are provided on the carrier plate (3-1); the wafer box locking block (3-3) is fixedly connected to the wafer box locking cylinder (3-4); a wafer box docking cylinder (3-15), wherein the wafer box docking cylinder (3-15) is fixed to the fixed frame (1) via the cylinder fixing plate (3-16); A flexible joint (3-11) is respectively fixed to the head of the piston rod of the wafer box docking cylinder (3-15) and the cylinder push plate (3-13); the cylinder push plate (3-13) is fixed to the slider (3-14); and the slider (3-14) is fixed to the carrier plate (3-1); A wafer box docking position sensor (3-9) is arranged on the fixed frame (1) and located at the edge of the carrier plate (3-1); A limit block (3-12) is arranged on the fixed frame (1) and is located at the end of the piston rod of the wafer box docking cylinder (3-15).

7. The wafer box cover opening and wafer status detection device according to claim 1, characterized in that: The first wafer status detection mechanism includes: A frame (6-1), the frame (6-1) being arranged on the periphery of the wafer box opening and closing mechanism (2), and the bottom of the frame (6-1) being mounted on the lifting mechanism (4); A counter-radiation optical fiber sensor (6-2), wherein the transmitting end and the receiving end of the counter-radiation optical fiber sensor (6-2) are symmetrically mounted on the frame (6-1) via an optical fiber sensor fixing block (6-3).

8. The wafer box cover opening and wafer status detection device according to claim 1, characterized in that: The lifting mechanism (4) comprises: A single-axis robot (4-2) is fixed on the fixed frame (1); a screw-nut assembly is provided in the single-axis robot (4-2), and a screw of the screw-nut assembly is connected to the servo motor (4-1); A lifting plate (4-26) is fixedly arranged on the screw nut of the screw nut assembly; A first slider (4-4) is arranged on the lifting plate (4-26) via a second guide rail slider assembly (4-3), and the first slider (4-4) is connected to the connecting rod (7); A first swing cylinder (4-7) is fixed on the lifting plate (4-26) via a first swing cylinder fixing block (4-8), and the first swing cylinder (4-7) is connected to a second bearing (4-6) in the guide groove of the first slider (4-4) via a second rocker (4-5); A second slider (4-9) is arranged on the lifting plate (4-26) via a third guide rail slider assembly (4-15), and the second slider (4-9) is connected to the first wafer state detection mechanism (6); The second swing cylinder (4-11) is fixed on the lifting plate (4-26) via a second swing cylinder fixing block (4-14), and the second swing cylinder (4-11) is connected to a third bearing (4-12) in a guide groove of the second slider (4-4) via a third rocker (4-13).

9. The wafer box cover opening and wafer status detection device according to claim 8, characterized in that: The lifting mechanism (4) is further provided with: A first position sensor (4-16) is provided on the lifting plate (4-26); The first slider (4-4) is provided with a first stopper corresponding to the first position sensor (4-16); A second position sensor (4-17) is provided on the lifting plate (4-26); The second slider (4-9) is provided with a second stopper corresponding to the second position sensor (4-17); A sensor fixing plate (4-19) is fixed on the fixing frame (1), and a plurality of lifting position sensors (4-20) are provided on the sensor fixing plate (4-19) along the lifting direction; the lifting position sensors (4-20) correspond to the induction sheets (4-23), and the induction sheets (4-23) are fixed on the lifting plate (4-26) via a sensor fixing block (4-22).

10. The wafer box cover opening and wafer status detection device according to claim 8, characterized in that: The second wafer status detection mechanism includes: A comb tooth bar (4-27) is mounted on the sensor fixing plate (4-19) along a lifting direction; A wafer status sensor (4-21) is mounted on the lifting plate (4-26) via the sensor fixing block (4-22).

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