Detection device of semiconductor cleaning equipment and semiconductor cleaning equipment

Abstract

The utility model discloses a detection device of a semiconductor cleaning device and the semiconductor cleaning device, the detection device of the semiconductor cleaning device comprises a detector, the detector comprises a signal emission part, the signal emission part is configured to emit a first optical signal to a wafer in real time when the semiconductor cleaning device cleans the wafer; and the signal receiving part is configured to receive a second optical signal obtained after the first optical signal is reflected by the surface of the wafer in real time when the wafer is cleaned by the semiconductor cleaning equipment. Therefore, the levelness of the wafer is detected in real time by arranging the detector and utilizing the optical triangulation measurement principle, so that the levelness of the wafer can be detected in real time in the wafer cleaning process, and the conditions of excessive etching, film falling and the like of the wafer in the cleaning stage are effectively prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a detection device for semiconductor cleaning equipment and semiconductor cleaning equipment. Background Art

[0002] With the continuous development of semiconductor technology, the wafer manufacturing process is also constantly improving. Wafer cleaning is a key process in semiconductor wafer manufacturing. Wafer cleaning can ensure the cleanliness of the wafer surface and improve the performance and stability of the device.

[0003] In the prior art, when a wafer is being cleaned on a single-wafer cleaning machine, it is difficult for the wafer to maintain a continuous horizontal state. This will result in the outflowing chemical liquid not being evenly spread as the wafer rotates to form a liquid film that infiltrates the front surface and the edge of the back, but instead being exposed to more chemicals in the direction of a lower height. At the same time, the back of the wafer will also cause the liquid to exceed the edge and flow to near the center of the circle as the wafer rotates. In this way, the back of the wafer will also be etched by the chemicals, which may cause the product film to fall off and contaminate the machine, and the pattern to not meet expectations. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a semiconductor cleaning device and a detection device thereof, wherein the detection device of the semiconductor cleaning device can detect the levelness of the wafer in real time during the wafer cleaning process, thereby effectively preventing the wafer from tilting during the cleaning stage and causing excessive etching.

[0005] The utility model further proposes a semiconductor cleaning device and a detection device thereof.

[0006] According to the detection device of the semiconductor cleaning equipment of the present invention, the detection device is used to perform real-time detection of the horizontality of the wafer when the semiconductor cleaning equipment is cleaning the wafer. The detection device includes: a detector, and the detector includes: a signal transmitting element, which is configured to transmit a first light signal to the wafer in real time when the semiconductor cleaning equipment is cleaning the wafer; and a signal receiving element, which is configured to receive a second light signal after the first light signal is reflected by the surface of the wafer in real time when the semiconductor cleaning equipment is cleaning the wafer.

[0007] Therefore, by setting up a detector and using the optical triangulation measurement principle to detect the levelness of the wafer, the levelness of the wafer can be detected in real time during the wafer cleaning process, so as to effectively prevent excessive etching and film shedding of the wafer during the cleaning stage.

[0008] In some examples of the present invention, the signal transmitter and the signal receiver are both one, and one signal transmitter corresponds to one signal receiver; or the signal transmitter is one, and the signal receiver is multiple, and one signal transmitter corresponds to multiple signal receivers; or the signal transmitter is multiple, and the signal receiver is one, and one signal receiver corresponds to multiple signal transmitters; or the signal transmitter and the signal receiver are both multiple, and multiple signal receivers correspond to multiple signal transmitters.

[0009] In some examples of the present invention, the detection device or the detector also includes a signal processing component, which is electrically connected to the signal receiving component. The signal processing component is configured to obtain the second optical signal from the signal receiving component and determine whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within a first deviation range. When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range, the wafer is in a horizontal state; when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds the first deviation range, the wafer is in a non-horizontal state.

[0010] In some examples of the present invention, the detection device or the detector also includes a control component, which is electrically connected to the signal processing component, and the control component is configured to: when the wafer is in a horizontal state, control the semiconductor cleaning equipment to clean the wafer normally; when the wafer is in a non-horizontal state, control the turntable component of the semiconductor cleaning equipment loaded with the wafer to stop rotating, and / or control the cleaning component of the semiconductor cleaning equipment to stop cleaning the wafer.

[0011] In some examples of the present invention, the detection device or the detector also includes an alarm prompt component, which is electrically connected to the control component. When the wafer is in a horizontal state, the control component controls the alarm prompt component to not work or to send a first status signal; when the wafer is in a non-horizontal state, the control component controls the alarm prompt component to send a second status signal.

[0012] In some examples of the present invention, the detection device or the detector further includes a signal processing component, which is electrically connected to the signal receiving component, and the signal processing component is configured to obtain the second optical signal from the signal receiving component, and determine whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within a second deviation range. When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the second deviation range, the wafer is in a horizontal state; when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds the second deviation range, the signal processing component determines whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within a first deviation range. When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range, the wafer is in a first tilted state; when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds the first deviation range, the wafer is in a second tilted state.

[0013] In some examples of the present invention, the detection device or the detector also includes a control component, which is electrically connected to the signal processing component, and the control component is configured to: when the wafer is in a horizontal state, control the semiconductor cleaning equipment to clean the wafer normally; when the wafer is in a first tilted state, control the semiconductor cleaning equipment to clean the wafer normally; when the wafer is in a second tilted state, control the turntable of the semiconductor cleaning equipment loaded with the wafer to stop rotating, and / or control the cleaning component of the semiconductor cleaning equipment to stop cleaning the wafer.

[0014] In some examples of the present invention, the detection device or the detector also includes an alarm prompt component, which is electrically connected to the control component. When the wafer is in a horizontal state, the control component controls the alarm prompt component to not work or to send a third state signal; when the wafer is in a first tilted state, the control component controls the alarm prompt component to send a fourth state signal; when the wafer is in a second tilted state, the control component controls the alarm prompt component to send a fifth state signal.

[0015] In some examples of the present invention, the first optical signal emitted by the signal emitting component to the wafer on the turntable component of the semiconductor cleaning equipment at least partially covers the surface of the wafer facing the detector.

[0016] According to the semiconductor cleaning equipment of the present invention, it includes: the detection device mentioned above; a turntable member, on which a wafer fixing area is provided, the wafer fixing area is suitable for placing wafers, the turntable member can drive the wafer to rotate, and the detection device can perform real-time detection of the horizontality of the wafer on the turntable member; a cleaning member, the cleaning member is arranged at intervals above the turntable member, and the cleaning member is suitable for cleaning the wafer when the turntable member drives the wafer to rotate.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 It is a partial schematic diagram of a semiconductor cleaning device according to an embodiment of the present invention;

[0020] Figure 2 It is a schematic diagram of another part of the semiconductor cleaning equipment according to an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of the principle of detecting wafer levelness by a detection device of a semiconductor cleaning device according to an embodiment of the present utility model;

[0022] Figure 4 This is a schematic diagram of the principle of detecting wafer levelness by a detection device of a semiconductor cleaning device according to an embodiment of the present utility model;

[0023] Figure 5 This is a schematic diagram of the principle of detecting wafer levelness by a detection device of a semiconductor cleaning device according to an embodiment of the present utility model;

[0024] Figure 6 This is a schematic diagram of the principle of detecting wafer levelness by a detection device of a semiconductor cleaning device according to an embodiment of the present utility model;

[0025] Figure 7 This is a schematic diagram of the principle of detecting wafer levelness by a detection device of a semiconductor cleaning device according to an embodiment of the present utility model;

[0026] Figure 8 This is a schematic diagram of the principle of detecting wafer levelness by a detection device of a semiconductor cleaning device according to an embodiment of the present utility model;

[0027] Figure 9 This is a flow chart of a method for controlling a detection device of a semiconductor cleaning device according to an embodiment of the present invention;

[0028] Figure 10 It is a flow chart of a control method for a detection device of a semiconductor cleaning equipment according to another embodiment of the present invention.

[0029] Reference numerals:

[0030] 1000. Semiconductor cleaning equipment; 100. Detection device;

[0031] 10. Turntable; 101. Wafer fixing area; 102. Card pin;

[0032] 20. Cleaning parts;

[0033] 30. Detector; 301. Signal transmitter; 302. Signal receiver; 303. First optical signal; 304. Second optical signal;

[0034] 40. Wafer. DETAILED DESCRIPTION

[0035] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0036] Reference below Figures 1-10 The detection device 100 of the semiconductor cleaning equipment 1000 according to an embodiment of the present invention is described. The detection device 100 can be used to perform real-time detection of the levelness of the wafer 40 when the semiconductor cleaning equipment 1000 is cleaning the wafer 40 .

[0037] Combine Figures 1-10 As shown, the detection device 100 of the semiconductor cleaning equipment 1000 according to the present invention can mainly include: a detector 30. The detector 30 can transmit and receive signals, and by analyzing the received signals, it can obtain relevant parameters of the wafer 40 levelness, thereby realizing real-time monitoring and quality control of the wafer 40 levelness.

[0038] Furthermore, the detector 30 may mainly include: a signal transmitting component 301 and a signal receiving component 302 .

[0039] The signal transmitter 301 is configured to transmit a first optical signal 303 to the wafer 40 in real time when the semiconductor cleaning equipment 1000 cleans the wafer 40 . Specifically, after the light source of the signal transmitter 301 is activated, an optical signal corresponding to the electrical signal, namely the first optical signal 303 , is generated.

[0040] The signal receiving element 302 is configured to receive in real time the second optical signal 304 after the first optical signal 303 is reflected by the surface of the wafer 40 when the semiconductor cleaning equipment 1000 cleans the wafer 40. Specifically, after the first optical signal 303 reaches the surface of the wafer 40, it is reflected by the surface of the wafer 40 to form the second optical signal 304. The second optical signal 304 is received by the signal receiving element 302 after propagating a certain distance.

[0041] Furthermore, the incident angle of the optical signal is equal to the reflection angle. The second optical signal 304 formed by the same beam of first optical signal 303 after being reflected by the wafer 40 in different horizontal states has a different angle with the same horizontal plane. The signal receiving element 302 can realize real-time monitoring of the horizontality of the wafer 40 by reflecting the angle between the second optical signal 304 and the horizontal plane.

[0042] Therefore, by setting up a detector 30 and using the optical triangulation measurement principle to detect the levelness of the wafer 40, the levelness of the wafer 40 can be detected in real time during the cleaning process of the wafer 40, so as to effectively prevent the wafer 40 from being over-etched and the film from falling off during the cleaning stage.

[0043] Combine Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, there is one signal transmitter 301 and one signal receiver 302, and one signal transmitter 301 corresponds to one signal receiver 302; or there is one signal transmitter 301 and multiple signal receivers 302, and one signal transmitter 301 corresponds to multiple signal receivers 302; or there are multiple signal transmitters 301 and one signal receiver 302, and one signal receiver 302 corresponds to multiple signal transmitters 301; or there are multiple signal transmitters 301 and multiple signal receivers 302, and multiple signal receivers 302 correspond to multiple signal transmitters 301.

[0044] Specifically, the setting of the signal transmitting element 301 and the signal receiving element 302 needs to ensure that not only the second optical signal 304 formed by the first optical signal 303 emitted by the signal transmitting element 301 and transmitted through the surface of the wafer 40 can fully and accurately reflect the horizontal state of the wafer 40, but also the second optical signal 304 received by the signal receiving element 302 can fully and accurately reflect the horizontal state of the wafer 40.

[0045] When there is only one signal emitting element 301, the area of ​​the emission region of the first optical signal 303 can be set to be larger, and / or the signal emitting element 301 can be set to be a multi-angle optical signal emitter to control the overall incident angle and incident range of the first optical signal 303 to ensure that the coverage area of ​​the first optical signal 303 on the surface of the wafer 40 is large enough or comprehensive enough.

[0046] When there is only one signal receiving element 302 , the optical signal receiving area of ​​the signal receiving element 302 can be set larger to ensure that the second optical signal 304 received by the signal receiving element 302 can accurately and comprehensively reflect the horizontal state of the wafer 40 .

[0047] When there are multiple signal emitting elements 301, the signal emitting elements 301 can be dispersedly arranged and / or placed at different angles to control the overall incident angle and incident range of the first optical signal 303, so as to ensure that the coverage area of ​​the first optical signal 303 on the surface of the wafer 40 is large enough or comprehensive enough.

[0048] When there are multiple signal receiving elements 302, the signal receiving elements 302 can be dispersed and / or placed at different angles to ensure that the overall situation of the second optical signal 304 can be detected, so as to ensure that the second optical signal 304 received by the multiple signal receiving elements 302 as a whole can accurately and comprehensively reflect the horizontal state of the wafer 40.

[0049] With this arrangement, by adjusting the number and layout of the signal emitting elements 301 and the signal receiving elements 302, not only can the overall incident angle and incident range of the first optical signal 303 be controlled, and the light can be guided to a specific position or direction to ensure the coverage area of ​​the first optical signal 303 on the surface of the wafer 40, but it can also ensure that the second optical signal 304 received by the signal receiving element 302 can fully and accurately reflect the horizontal state of the wafer 40. Furthermore, such an arrangement can ensure the rationality of the structural arrangement of the semiconductor cleaning equipment 1000 and improve the reliability of the semiconductor cleaning equipment 1000.

[0050] In some embodiments of the present invention, the specific number of signal transmitters 301 and signal receivers 302 depends on specific application scenarios and specific requirements.

[0051] In one embodiment of the present invention, Figure 1 、 Figure 3 、 Figure 4 and Figure 9 As shown, the detection device 100 or the detector 30 further includes a signal processing component, which is electrically connected to the signal receiving component 302. The signal processing component is configured to obtain a second optical signal 304 from the signal receiving component 302 and determine whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within a first deviation range. When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range, the wafer 40 is in a horizontal state; when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds the first deviation range, the wafer 40 is in a non-horizontal state.

[0052] The second optical signal angle is the angle between the second optical signal 304 actually received by the signal receiving element 302 and the horizontal plane when the wafer 40 is in a cleaning and / or rotating state; the preset optical signal angle is the angle between the preset second optical signal 304 received by the signal receiving element 302 and the wafer 40 when the wafer 40 is completely horizontal. Figure 3 As shown, the second light signal angle is α2, the preset light signal angle is α1, α2 can be smaller than or larger than α1, and the first deviation range is the angle range A.

[0053] In the above embodiment, the angle range A can be 0.5°, that is, when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is less than 0.5°, the wafer 40 is in a horizontal state; when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is greater than 0.5°, the wafer 40 is in a non-horizontal state.

[0054] Specifically, the signal processing element is electrically connected to the signal receiving element 302. The signal processing element can analyze and process the second optical signal 304 received by the signal receiving element 302 to determine the deviation of the second optical signal 304. Based on the deviation, the horizontal state of the wafer 40 can be determined. This configuration can effectively reflect the horizontal state or tilt condition of the wafer 40 and enable real-time monitoring of the horizontality of the wafer 40, thereby helping to ensure the horizontality of the wafer 40 during the cleaning process, thereby helping to improve the cleaning effect of the wafer 40 and ensuring the quality or performance of the wafer 40 after cleaning.

[0055] It should be noted that the signal processing component can be a concept at the same level as the detector 30, that is, the detector 30 and the signal processing component can both be part of the detection device 100; in addition, the signal processing component can also be a lower-level concept of the detector 30, that is, the signal processing component can be a part of the detector 30.

[0056] Combine Figure 1 、 Figure 3 、 Figure 4 and Figure 9 As shown, the detection device 100 or the detector 30 further includes a control component, which is electrically connected to the signal processing component and is configured as follows:

[0057] When the wafer 40 is in a horizontal state, the semiconductor cleaning equipment 1000 is controlled to clean the wafer 40 normally;

[0058] When the wafer 40 is in a non-horizontal state, the turntable 10 loaded with the wafer 40 in the semiconductor cleaning equipment 1000 is controlled to stop rotating, and / or the cleaning unit 20 of the semiconductor cleaning equipment 1000 is controlled to stop cleaning the wafer 40 .

[0059] Specifically, the control component is electrically connected to the signal processing component, and the signal processing component realizes real-time monitoring of the horizontality of the wafer 40. When the signal processing component detects that the wafer 40 is in a horizontal state, the control component controls the semiconductor cleaning equipment 1000 to clean the wafer 40 normally. When the signal processing component detects that the wafer 40 is in a non-horizontal state, the signal processing component feeds back an electric signal to the control component. After receiving the electric signal fed back by the signal processing component, the control component sends a control electric signal to the semiconductor cleaning equipment 1000 to control the turntable component 10 of the semiconductor cleaning equipment 1000 loaded with the wafer 40 to stop rotating, and / or control the cleaning component 20 of the semiconductor cleaning equipment 1000 to stop cleaning the wafer 40.

[0060] Such a setting can not only ensure the normal operation of the semiconductor cleaning equipment 1000 when the wafer 40 is in a horizontal state, but also stop the cleaning work of the semiconductor cleaning equipment 1000 in time when it is detected that the wafer 40 is in a non-horizontal state, thereby avoiding excessive etching and film shedding of the wafer 40 caused by the tilt of the wafer 40, and improving the reliability of the semiconductor cleaning equipment 1000.

[0061] It should be noted that the control component can be a concept at the same level as the detector 30, that is, the detector 30 and the control component can both be part of the detection device 100; in addition, the control component can also be a lower-level concept of the detector 30, that is, the control component can be a part of the detector 30.

[0062] Combine Figure 1 、 Figure 3 、 Figure 4 and Figure 9 As shown, the detection device 100 or the detector 30 also includes an alarm prompt component, which is electrically connected to the control component. When the wafer 40 is in a horizontal state, the control component controls the alarm prompt component to not work or to send a first state signal; when the wafer 40 is in a non-horizontal state, the control component controls the alarm prompt component to send a second state signal.

[0063] Specifically, the alarm prompt member is electrically connected to the control member. When the wafer 40 is in a horizontal state, the alarm prompt member may not work, and the control member controls the semiconductor cleaning equipment 1000 to clean the wafer 40 normally. Alternatively, when the wafer 40 is in a horizontal state, the control member may also send a control electrical signal to the alarm prompt member to control the alarm prompt member to send a first status signal.

[0064] When the wafer 40 is in a non-horizontal state, the control component sends a control electrical signal to the alarm prompt component to control the alarm prompt component to send a second state signal. This can promptly attract the attention of people within a certain range and enable relevant personnel to respond in time, thereby not only reducing the losses caused by equipment failure, but also promptly troubleshooting and repairing the equipment failure.

[0065] It should be noted that the first status signal and the second status signal may be in the form of a lighted color of a signal light, and / or a flashing mode of a signal light, and / or a sound signal mode.

[0066] In some embodiments of the present invention, the first status signal may be a green light on, and / or a signal light flashing at a low frequency, and / or an alarm sound volume at a low level, and / or a voice announcement that the wafer 40 is in a horizontal state at this time;

[0067] The second status signal may be a red light that turns on, and / or a signal light that flashes at a faster frequency, and / or a loud alarm sound, and / or a voice announcement that the wafer 40 is in a non-horizontal state.

[0068] It should be noted that the alarm prompt member can be a concept of the same level as the detector 30, that is, the detector 30 and the alarm prompt member can both be part of the detection device 100; in addition, the alarm prompt member can also be a lower-level concept of the detector 30, that is, the alarm prompt member can be a part of the detector 30.

[0069] In another embodiment of the present invention, Figure 1 、 Figure 3 、 Figure 4 and Figure 10 As shown, the detection device 100 or the detector 30 further includes a signal processing component, which is electrically connected to the signal receiving component 302. The signal processing component is configured to obtain a second optical signal 304 from the signal receiving component 302 and determine whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within a second deviation range. When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the second deviation range, the wafer 40 is in a horizontal state.

[0070] When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds the second deviation range, the signal processing component determines whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range. When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range, the wafer 40 is in the first tilt state.

[0071] When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds the first deviation range, the wafer 40 is in the second tilt state.

[0072] Specifically, when the absolute value of the difference between the second optical signal angle and the preset optical signal angle is within the second deviation range, the wafer 40 is in a horizontal state. In this state, the wafer 40 that has been cleaned can meet the process requirements and there is no need to adjust the wafer position; when the absolute value of the difference between the second optical signal angle and the preset optical signal angle exceeds the second deviation range but is within the first deviation range, the wafer 40 is in a first tilted state, and the inclination of the wafer 40 is small. In this state, the wafer 40 that has been cleaned may or may not meet the process requirements. At this time, the surrounding operators need to pay attention and observe the state of the wafer; when the absolute value of the difference between the second optical signal angle and the preset optical signal angle exceeds the first deviation range, the wafer 40 is in a second tilted state, and the inclination of the wafer 40 is large. Cleaning the wafer 40 in this state will cause excessive etching and film shedding of the wafer 40, which will seriously affect the quality and performance of the wafer 40, and the operator needs to immediately adjust the position of the wafer 40.

[0073] The second optical signal angle is the angle between the second optical signal 304 actually received by the signal receiving element 302 and the horizontal plane when the wafer 40 is in a cleaning and / or rotating state; the preset optical signal angle is the angle between the preset second optical signal 304 received by the signal receiving element 302 and the wafer 40 when the wafer 40 is completely horizontal. Figure 3 As shown, the second optical signal angle is α2, the preset optical signal angle is α1, α2 can be smaller or larger than α1, combined with Figure 4 As shown, the second light signal angle is α2, the preset light signal angle is α1, α2 can be smaller than or larger than α1, and the second deviation range is angle range B.

[0074] In the above embodiment, the angle range A can be 0.5°, and the angle range B can be 0.3°, that is, when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is less than 0.3°, the wafer 40 is in a horizontal state; when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is greater than 0.3° and less than 0.5°, the wafer 40 is in a first tilted state; when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is greater than 0.5°, the wafer 40 is in a second tilted state.

[0075] Combine Figure 1 、 Figure 3 、 Figure 4 and Figure 10 As shown, the detection device 100 or the detector 30 further includes a control component, which is electrically connected to the signal processing component and is configured as follows:

[0076] When the wafer 40 is in a horizontal state, the semiconductor cleaning equipment 1000 is controlled to clean the wafer 40 normally;

[0077] When the wafer 40 is in the first tilted state, the semiconductor cleaning equipment 1000 is controlled to clean the wafer 40 normally;

[0078] When the wafer 40 is in the second tilted state, the turntable 10 loaded with the wafer 40 in the semiconductor cleaning equipment 1000 is controlled to stop rotating, and / or the cleaning unit 20 of the semiconductor cleaning equipment 1000 is controlled to stop cleaning the wafer 40 .

[0079] Specifically, the control component is electrically connected to the signal processing component, and the signal processing component realizes real-time monitoring of the horizontality of the wafer 40. When the signal processing component detects that the wafer 40 is in a horizontal state, the position of the wafer 40 does not need to be adjusted, and the control component controls the semiconductor cleaning equipment 1000 to clean the wafer 40 normally; when the signal processing component detects that the wafer 40 is in a first tilted state, the tilt degree of the wafer 40 is small, and the wafer 40 will not be over-etched during the cleaning stage. Therefore, the control component can control the semiconductor cleaning equipment 1000 to clean the wafer 40 normally; when the signal processing component detects that the wafer 40 is in a second tilted state, due to the large tilt degree of the wafer 40, the wafer 40 is prone to over-etching during the cleaning stage. Therefore, the control component can control the turntable component 10 of the semiconductor cleaning equipment 1000 loaded with the wafer 40 to stop rotating, and / or control the cleaning component 20 of the semiconductor cleaning equipment 1000 to stop cleaning the wafer 40, thereby facilitating the operator to adjust the position of the wafer 40.

[0080] With such a setting, the wafer 40 can be allowed to tilt slightly during the cleaning process without affecting the quality and performance of the wafer 40. Furthermore, not only can the normal operation of the semiconductor cleaning equipment 1000 be guaranteed when the wafer 40 is in a horizontal state and a first tilted state, but the cleaning work of the semiconductor cleaning equipment 1000 can also be stopped in time when it is detected that the wafer 40 is in the second tilted state, thereby avoiding excessive etching of the wafer 40 and film shedding caused by the tilt of the wafer 40, and improving the reliability of the semiconductor cleaning equipment 1000.

[0081] Combine Figure 1 、 Figure 3 、 Figure 4 and Figure 10 As shown, the detection device 100 or the detector 30 further includes an alarm prompting member, which is electrically connected to the control member. When the wafer 40 is in a horizontal state, the control member controls the alarm prompting member to not work or to light up a third state signal light.

[0082] When the wafer 40 is in the first tilt state, the control component controls the alarm prompt component to send a fourth state signal;

[0083] When the wafer 40 is in the second tilted state, the control component controls the alarm prompt component to send a fifth state signal.

[0084] Specifically, the alarm prompt member is electrically connected to the control member. When the wafer 40 is in a horizontal state, the alarm prompt member may not work, and the control member controls the semiconductor cleaning equipment 1000 to clean the wafer 40 normally. Alternatively, when the wafer 40 is in a horizontal state, the control member may also send a control electrical signal to the alarm prompt member to control the alarm prompt member to send a third state signal, thereby causing the alarm prompt member to send a third state signal.

[0085] When the wafer 40 is in the first tilted state, the control component sends a control electrical signal to the alarm prompt component to control the alarm prompt component to send a fourth state signal. This can promptly attract the attention of people within a certain range, so that relevant personnel can pay attention to the state of the wafer 40 and perform corresponding operations in real time according to the state of the wafer 40.

[0086] When the wafer 40 is in the second tilt state, the control component sends a control electrical signal to the alarm prompt component to control the alarm prompt component to send a fifth state signal. This can promptly attract the attention of people within a certain range, so that relevant personnel can respond in time to directly adjust the position of the wafer 40, or inspect and repair related components. This can not only reduce the losses caused by equipment failure or other unexpected situations, but also promptly detect and repair equipment failures.

[0087] In some embodiments of the present invention, the third state signal may be a green light on, and / or a signal light flashing at a low frequency, and / or an alarm sound volume at a low level, and / or a voice announcement that the wafer 40 is in a horizontal state at this time;

[0088] The fourth state signal may be a yellow light on, and / or a signal light flashing at a medium frequency, and / or an alarm sound volume at a medium volume, and / or a voice announcement that the wafer 40 is in the first tilt state at this time;

[0089] The fifth state signal may be a red light that turns on, and / or a signal light that flashes at a higher frequency, and / or an alarm sound that is louder, and / or a voice announcement that the wafer 40 is in the second tilt state.

[0090] In some embodiments of the present invention, there may be one or more status signal lights.

[0091] Combine Figure 1 、 Figure 3 and Figure 4As shown, the first light signal 303 emitted by the signal emitting component 301 toward the wafer 40 on the turntable component 10 of the semiconductor cleaning apparatus 1000 at least partially covers the surface of the wafer 40 facing the detector 30. Specifically, by ensuring that the first light signal 303 at least partially covers the surface of the wafer 40 facing the detector 30, the integrity of the horizontality information collected about the wafer 40 is ensured. This ensures that the second light signal 304, formed after the first light signal 303 is reflected from the surface of the wafer 40, accurately and comprehensively reflects the horizontal and tilted state of the wafer 40, thereby improving the accuracy and reliability of the detection apparatus 100.

[0092] In some embodiments of the present invention, the first optical signal 303 completely covers the surface of the wafer 40 facing the detector 30 .

[0093] In other embodiments of the present invention, the first optical signal 303 covers multiple points on the surface of the wafer 40 facing the detector 30 .

[0094] In some further embodiments of the present invention, the first optical signal 303 covers multiple areas of the surface of the wafer 40 facing the detector 30 .

[0095] The first optical signal 303 can be selectively set to cover the surface of the wafer 40 facing the detector 30 according to the needs of the semiconductor cleaning equipment. This can reduce the testing difficulty and testing cost of the detection device 100 while ensuring the detection accuracy of the detection device 100.

[0096] Combine Figure 1 and Figure 2 As shown, the semiconductor cleaning equipment 1000 according to the present invention includes: the above-mentioned detection device 100, a turntable component 10 and a cleaning component 20.

[0097] Specifically, the semiconductor cleaning equipment 1000 is composed of the detection device 100, the turntable component 10 and the cleaning component 20, which can ensure the basic functions of the semiconductor cleaning equipment 1000 and form the basic framework of the semiconductor cleaning equipment 1000.

[0098] Furthermore, the turntable 10 is provided with a wafer securing area 101 suitable for placing a wafer 40. The turntable 10 can drive the wafer 40 to rotate, and the detection device 100 can perform real-time detection of the levelness of the wafer 40 on the turntable 10. Specifically, by mounting the wafer 40 on the wafer securing area 101 of the turntable 10, the turntable 10 rotates while driving the wafer 40 to rotate together. This facilitates the semiconductor cleaning apparatus 1000 in cleaning the wafer 40, thereby improving the cleaning effect of the semiconductor cleaning apparatus 1000 on the wafer 40.

[0099] Furthermore, at least two circumferentially spaced clamping pins 102 are provided on the turntable 10, and the inner circles of at least two clamping pins 102 define a wafer fixing area 101, and the clamping pins 102 are suitable for clamping and fixing with the circumferential edge of the wafer 40 in the wafer fixing area 101. This not only helps to achieve horizontal placement of the wafer 40, but also makes the fixation of the wafer 40 by the wafer fixing area 101 more stable and reliable, and can avoid the movement or offset of the wafer 40 after fixation, and can help maintain the horizontality of the wafer 40 during the cleaning process, and can improve the stability and reliability of the semiconductor cleaning equipment 1000.

[0100] Furthermore, the turntable member 10 is provided with a first through-hole, and the engaging pin 102 is provided with a second through-hole. The first and second through-holes are arranged opposite each other and are connected and fixed by a fastener. Specifically, the turntable member 10 is provided with a first through-hole, and the engaging pin 102 is provided with a second through-hole. The first and second through-holes correspond in structure and position. The fasteners are used to sequentially penetrate the first and second through-holes to connect the engaging pin 102 to the turntable member 10. This not only makes the connection between the engaging pin 102 and the turntable member 10 simple, direct, stable and reliable, but also facilitates the installation and removal of the engaging pin 102, and facilitates subsequent replacement or adjustment of the engaging pin 102.

[0101] In some embodiments of the present invention, the fasteners may be bolts, studs, rivets, etc.

[0102] The cleaning part 20 is arranged at intervals above the turntable part 10. The cleaning part 20 is suitable for cleaning the wafer 40 when the turntable part 10 drives the wafer 40 to rotate. In this way, the cleaning liquid can flow or spray directly from above to the surface of the wafer 40 when cleaning the wafer 40, which can ensure that the cleaning liquid can evenly cover the surface of the wafer 40 facing the detector 30, which can help to ensure the cleaning effect of the semiconductor cleaning equipment 1000 on the wafer 40.

[0103] It should be noted that the substance in the cleaning element 20 for cleaning the wafer 40 may be not only liquid but also gas.

[0104] In some embodiments of the present invention, the detection device 100 may not only be disposed on the cleaning element 20 , but may also be disposed spaced apart from the cleaning element 20 .

[0105] Furthermore, before cleaning the wafer 40, the semiconductor cleaning equipment 1000 needs to be inspected. First, the position of the cleaning component 20 and the direction of the outflow or spraying of the cleaning liquid are checked to see if they meet the preset effect. Secondly, an inspection auxiliary component with a structure similar to the wafer 40 is horizontally installed in the wafer fixing area 101, so that the turntable component 10 drives the inspection auxiliary component to rotate at a certain speed. At the same time, the cleaning component 20 flows out or sprays the cleaning liquid, and the cleaning liquid is evenly covered on the surface of the inspection auxiliary component. During the cleaning process, the signal processing component analyzes the deviation range of the second optical signal 304 received by the detection signal receiving component 302 in real time. The control component controls the semiconductor cleaning equipment 1000 and the alarm prompt component to respond accordingly based on the deviation range signal or deviation range-related signal fed back by the signal processing component. Relevant personnel check the semiconductor cleaning equipment 1000 based on the alarm status of the alarm prompt component. If there is a fault, the fault is repaired and the semiconductor cleaning equipment 1000 is inspected again. Only after the semiconductor cleaning equipment 1000 is operating normally can the wafer 40 be cleaned.

[0106] Such a setting can not only ensure that the wafer 40 is cleaned in a horizontal state, but also prevent the wafer 40 from tilting due to equipment failure during the rotation cleaning process, thereby ensuring that the cleaning liquid is evenly covered on the surface of the wafer 40, and can avoid the cleaning liquid covering other positions of the wafer 40, causing excessive etching of the wafer 40 and film shedding, etc., which can improve the cleaning effect of the semiconductor cleaning equipment 1000 on the wafer 40.

[0107] Furthermore, after the inspection work of the semiconductor cleaning equipment 1000 is completed with the aid of the inspection auxiliary parts, the inspection auxiliary parts are removed, and the wafer 40 is mounted on the wafer fixing area 101 of the turntable part 10 to carry out the normal cleaning process. During the cleaning process, the relevant staff pays attention to the status signal of the alarm prompt part in real time. When the alarm prompt part presents the fourth status signal and / or the alarm prompt part presents the fifth status signal, the relevant staff should promptly conduct troubleshooting and fault repair work on the semiconductor cleaning equipment 1000. With such a configuration, if the semiconductor cleaning equipment 1000 fails during the cleaning process of the wafer 40, the problem can be discovered in time and the cleaning process of the wafer 40 can be stopped. This can prevent the wafer 40 from tilting due to equipment failure, thereby causing the cleaning liquid to cover other positions of the wafer 40 and cause excessive etching and film shedding, etc., thus avoiding or reducing unnecessary losses, further improving the reliability of the semiconductor cleaning equipment 1000, and improving the quality and performance of the wafer 40 after cleaning.

[0108] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0109] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0110] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A detection device suitable for semiconductor cleaning equipment, characterized in that: The detection device is used to perform real-time detection of the levelness of the wafer when the semiconductor cleaning equipment is cleaning the wafer, and the detection device includes: A detector (30), the detector (30) comprising: A signal transmitting element (301) is configured to transmit a first optical signal (303) to the wafer (40) in real time when the semiconductor cleaning equipment is cleaning the wafer (40); The signal receiving element (302) is configured to receive in real time a second optical signal (304) after the first optical signal (303) is reflected by the surface of the wafer (40) when the semiconductor cleaning equipment cleans the wafer (40).

2. The detection device according to claim 1, characterized in that There is one signal transmitter (301) and one signal receiver (302), and one signal transmitter (301) corresponds to one signal receiver (302); or There is one signal transmitting element (301), there are multiple signal receiving elements (302), and one signal transmitting element (301) corresponds to multiple signal receiving elements (302); or There are multiple signal emitting components (301), there is one signal receiving component (302), and one signal receiving component (302) corresponds to multiple signal emitting components (301); or There are multiple signal emitting components (301) and multiple signal receiving components (302), and multiple signal receiving components (302) correspond to multiple signal emitting components (301).

3. The detection device according to claim 2, characterized in that The detection device (100) or the detector (30) further includes a signal processing component, the signal processing component being electrically connected to the signal receiving component (302), the signal processing component being configured to obtain the second optical signal (304) from the signal receiving component (302), and determine whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within a first deviation range, and when the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range, the wafer (40) is in a horizontal state; When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds a first deviation range, the wafer (40) is in a non-horizontal state.

4. The detection device according to claim 3, characterized in that The detection device (100) or the detector (30) further comprises a control component, the control component being electrically connected to the signal processing component, and the control component being configured to: When the wafer (40) is in a horizontal state, controlling the semiconductor cleaning device (1000) to clean the wafer (40) normally; When the wafer (40) is in a non-horizontal state, the turntable (10) of the semiconductor cleaning equipment (1000) loaded with the wafer (40) is controlled to stop rotating, and / or the cleaning component (20) of the semiconductor cleaning equipment (1000) is controlled to stop cleaning the wafer (40).

5. The detection device according to claim 4, characterized in that The detection device (100) or the detector (30) further includes an alarm prompting member, which is electrically connected to the control member. When the wafer (40) is in a horizontal state, the control member controls the alarm prompting member to not work or to send a first state signal; when the wafer (40) is in a non-horizontal state, the control member controls the alarm prompting member to send a second state signal.

6. The detection device according to claim 2, characterized in that The detection device (100) or the detector (30) further includes a signal processing component, the signal processing component being electrically connected to the signal receiving component (302), the signal processing component being configured to obtain the second optical signal (304) from the signal receiving component (302), and determine whether the absolute value of the difference between the received angle of the second optical signal and the preset angle of the optical signal is within a second deviation range, and when the absolute value of the difference between the received angle of the second optical signal (304) and the preset angle of the optical signal is within the second deviation range, the wafer (40) is in a horizontal state; When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds the second deviation range, the signal processing component determines whether the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range. When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle is within the first deviation range, the wafer (40) is in a first tilt state; When the absolute value of the difference between the received second optical signal angle and the preset optical signal angle exceeds a first deviation range, the wafer (40) is in a second tilt state.

7. The detection device according to claim 6, characterized in that The detection device (100) or the detector (30) further comprises a control component, the control component being electrically connected to the signal processing component, and the control component being configured to: When the wafer (40) is in a horizontal state, controlling the semiconductor cleaning device (1000) to clean the wafer (40) normally; When the wafer (40) is in the first tilted state, controlling the semiconductor cleaning device (1000) to clean the wafer (40) normally; When the wafer (40) is in the second tilted state, the turntable (10) loaded with the wafer of the semiconductor cleaning equipment (1000) is controlled to stop rotating, and / or the cleaning component (20) of the semiconductor cleaning equipment (1000) is controlled to stop cleaning the wafer.

8. The detection device according to claim 7, characterized in that The detection device (100) or the detector (30) further includes an alarm prompting member, the alarm prompting member being electrically connected to the control member, and when the wafer (40) is in a horizontal state, the control member controls the alarm prompting member to not operate or to emit a third state signal; When the wafer (40) is in a first tilted state, the control component controls the alarm prompt component to emit a fourth state signal; When the wafer (40) is in the second tilt state, the control component controls the alarm prompt component to send a fifth state signal.

9. The detection device according to any one of claims 1 to 8, characterized in that: The first optical signal (303) emitted by the signal emitting component to the wafer (40) on the turntable component (10) of the semiconductor cleaning equipment at least partially covers the surface of one side of the wafer (40) facing the detector (30).

10. A semiconductor cleaning device, characterized in that: include: The detection device according to any one of claims 1 to 9; A turntable member (10), wherein a wafer fixing area (101) is provided on the turntable member (10), the wafer fixing area (101) is suitable for placing a wafer (40), the turntable member (10) is capable of driving the wafer (40) to rotate, and the detection device (100) is capable of performing real-time detection of the levelness of the wafer on the turntable member (10); A cleaning member (20) is provided above the turntable member (10) at intervals, and the cleaning member (20) is suitable for cleaning the wafer (40) when the turntable member (10) drives the wafer (40) to rotate.

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