Semiconductor wafer cassette transfer device

Abstract

The utility model relates to a semiconductor wafer box transfer device which has high precision, high stability and high automation level and is suitable for wafer box transfer in the semiconductor production process. The device comprises a connection table arranged in a bottom area, the connection table is provided with a power assembly and a groove transmission structure which are used for lifting and transmitting a wafer box, and the periphery of the connection table is provided with an anti-vibration device made of a flexible material. And the crown block is positioned at the upper part of the device and moves along the guide system track so as to ensure smooth transfer of the wafer box among different areas. A manipulator is arranged on one side of the connection table, the tail end of the manipulator is provided with a grabbing device of an open type U-shaped structure, and a positioning column is arranged to be matched with a positioning hole in the bottom of the wafer box, so that the positioning accuracy of the wafer box is guaranteed. An automatic induction device is installed above the grabbing device and cooperates with an inductor to monitor the position of the wafer box in real time. The power assembly adopts a belt transmission system to ensure stable transmission of the wafer box.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a semiconductor wafer box transfer device. Background Art

[0002] With the continuous advancement of semiconductor manufacturing technology, production lines are increasingly demanding higher levels of equipment automation, production efficiency, and wafer protection. As core components in semiconductor manufacturing, wafers, due to their precision and fragility, require rigorous protection throughout the entire production process. Against this backdrop, wafer cassette transfer devices, as a crucial component of wafer transportation and storage, must effectively address the various challenges of the transfer process. Technical requirements for shock protection, automated placement, and in-place detection are becoming increasingly prominent.

[0003] Semiconductor wafers are typically made of brittle materials such as silicon, are highly fragile, and are extremely susceptible to mechanical vibration or shock. During the wafer transportation process, any unnecessary vibration or shock may cause microcracks or surface damage to the wafer, thereby affecting its ultimate production yield. Existing wafer box transfer devices are still insufficient in terms of shockproof design technology, especially during automated transportation, where vibration problems are often not effectively suppressed. For example, traditional manipulators or automatic handling systems may lack effective shock absorbers or anti-vibration designs, resulting in frequent positional displacement or minor collisions of wafers during transportation, thereby increasing the risk of wafer damage. Therefore, how to introduce more advanced shockproof technology to avoid unnecessary vibration during wafer transportation is an important issue in the current design of semiconductor production equipment. Designing a transfer device that can achieve effective shockproof protection for wafer boxes can not only ensure the integrity of the wafers, but also improve production efficiency and reduce production costs.

[0004] In addition, automation is key to modern semiconductor production, and the accuracy of automatic placement technology directly affects production efficiency and product quality. Traditional manual or semi-automatic placement devices often have problems such as inaccurate placement and slow speed due to limited positioning and operation accuracy. Especially in high-efficiency production lines, the frequency of manual intervention is high, which can easily lead to misoperation or waste of time. For example, the semiconductor wafer inspection equipment in patent publication number CN202166428U completes the wafer placement work by cooperating with a box opener and a robot. Although the device has made improvements in detecting the position of the rotating platform, its design focuses on the detection and safety of the rotating platform, and does not pay enough attention to the accuracy and stability during the automatic placement process. In order to improve production efficiency and reduce manual intervention, there is an urgent need for a device that can accurately identify the status of the wafer box and automatically place it. Such an automatic placement system not only requires the robot to accurately identify and grasp the wafer box, but also needs to be able to adjust and correct the placement angle and position in real time during the placement process to ensure that the wafer box can be stably and accurately placed in the predetermined position.

[0005] At the same time, wafer cassette placement detection technology directly impacts the automation level of the production line and the stability of the production process. In existing automated transfer equipment, traditional placement detection methods, such as limit switches and manual monitoring, suffer from low monitoring accuracy and delayed response. The wafer adsorption and placement detection device proposed in Patent Publication No. CN209544285U uses detection units on both sides to detect whether the wafer is adsorbed and in place. While this ensures accurate wafer placement to a certain extent, it still suffers from detection lag and misjudgment. This, particularly in high-speed automated production lines, cannot meet the requirements of high efficiency and high precision. Similarly, the wafer position detection device in Patent Publication No. CN218498021U uses an optical transmitter and receiver to detect the precise position of the wafer. While this improves positioning accuracy, detection deviation or delayed response can still occur in wafer cassette transfer applications due to equipment accuracy, environmental factors, and sensor configuration. This complicates real-time feedback and automatic adjustments and can affect the accuracy and safety of subsequent operations. Therefore, a more efficient and accurate in-place detection technology is urgently needed. It can monitor in real time whether the wafer cassette is accurately in place and quickly provide feedback to the control system to trigger subsequent operations. This technology should be highly responsive and accurate to avoid wafer damage, equipment failure, or production accidents caused by detection errors.

[0006] In summary, existing semiconductor wafer cassette transfer devices still have shortcomings in terms of shock absorption, automatic placement, and in-place detection, failing to fully meet the high automation, precision, and safety requirements of modern semiconductor production. To improve the automation level and production efficiency of semiconductor production lines, an innovative wafer cassette transfer device is needed that comprehensively addresses these issues. Such a device should feature advanced shock absorption to protect wafers from vibration; precise automatic placement technology to ensure accurate placement of the wafer cassettes; and efficient and accurate in-place detection technology to provide real-time feedback on the wafer cassette's status, thereby improving production stability and automation. Utility Model Content

[0007] The purpose of the utility model is to provide a semiconductor wafer box transfer device to solve the shortcomings of existing wafer box transfer devices in terms of shock resistance, automatic placement accuracy and in-place detection accuracy, and to improve the safety, stability and automation level during the transfer process.

[0008] To achieve the above purpose, the present invention provides the following technical solutions:

[0009] A semiconductor wafer cassette transfer device comprises: a docking platform provided in a bottom area, a power assembly for lifting and transferring the wafer cassette provided on a surface of the docking platform, the power assembly being installed in an upper area of ​​the docking platform for driving the movement of the wafer cassette;

[0010] The docking platform is surrounded by shock-absorbing devices made of flexible materials. A robot is installed on one side of the docking platform. The robot includes a horizontal movement mechanism and a vertical lifting mechanism. An open "U"-shaped gripping device is installed at the end of the vertical lifting mechanism. A sensor for detecting the position of the wafer box is installed on the surface of the docking platform.

[0011] An automatic sensing device is installed above or on the side of the grasping device to cover the working range of the grasping device;

[0012] The overhead crane located at the top of the device moves along the track above the docking platform through a guide system.

[0013] Furthermore, a slider is provided on the crossbeam of the overhead crane, and the slider can slide on the crossbeam and is connected to the manipulator through a fixed connecting piece at the bottom of the slider.

[0014] Furthermore, the power assembly is installed on both sides of the upper part of the docking platform, and includes at least two belt drive wheels and a transmission belt, and the transmission belt is wound between the drive wheels.

[0015] Furthermore, the shock-proof device includes a plurality of shock-absorbing pads evenly distributed around the docking platform. The shock-absorbing pads are made of rubber or polyurethane material and are fixedly connected to the docking platform through flexible connectors.

[0016] Furthermore, the automatic sensing device includes a high-precision sensor for monitoring the position information of the wafer box in real time and transmitting the monitoring data to the control system to control the gripping and placement of the wafer box by the gripping device.

[0017] Furthermore, the overhead crane is equipped with a servo motor and an encoder, and the overhead crane is driven to move by the servo motor.

[0018] The semiconductor wafer box transfer device provided by the present invention significantly improves the automation level of the semiconductor production line, the stability of the transfer process, and the protection effect of the wafer by optimizing shockproofing, automatic placement accuracy, and in-place detection technology. First, the device uses multiple shock-absorbing components and elastically suspended shockproof devices to effectively reduce the impact of vibration and impact on the wafer during the transfer process, preventing the wafer from generating microcracks or surface damage due to vibration, thereby ensuring the integrity of the wafer and significantly improving the yield of the product. By providing a shock-absorbing pad at the bottom of the docking station and combining it with the shockproof device, the device can effectively reduce the vibration from external equipment, ensuring that it is always in a stable state during the wafer box transfer process.

[0019] Secondly, the precision of the automated placement system has been further improved. The device achieves precise automated placement through the coordinated operation of the robotic arm and power assembly, reducing manual intervention and improving production efficiency. Especially on high-speed production lines, automated placement technology precisely controls the placement of wafer cassettes, avoiding the errors and time delays associated with traditional manual placement, ensuring accurate and efficient placement.

[0020] Furthermore, this device is equipped with precise in-place detection technology, enabling real-time monitoring of the wafer cassette's status. Sensors and automatic sensing devices installed on the docking station provide timely feedback on the wafer cassette's placement, ensuring accurate positioning. Compared to traditional limit switches or manual detection methods, this technology offers faster response times and higher detection accuracy, effectively avoiding misjudgments and delays, thereby improving the stability and safety of the production line.

[0021] This device integrates an overhead crane, a manipulator, a vibration damper, and a gripper, creating a highly automated and integrated wafer cassette transfer system. This system not only simplifies the operational process and reduces the complexity of manual operations, but also enhances the interoperability of the equipment, ensuring efficient and stable cassette transfer. Furthermore, an automatic sensing device enables the system to adjust based on real-time feedback, further improving the accuracy and reliability of the equipment's operation.

[0022] In summary, this utility model, through its innovative shockproof design, precise automatic placement technology, and efficient in-placement detection system, successfully addresses the problems of vibration, inaccurate placement, and delayed detection that plague existing wafer cassette transfer devices. This significantly improves the automation level, production efficiency, and product quality of semiconductor production lines. This device has high application value and can meet the high-precision, high-efficiency, and high-stability requirements of modern semiconductor production. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Attachment Figure 1 : Schematic diagram of the overall structure of the semiconductor wafer box transfer device of the present invention;

[0024] Attachment Figure 2 :for Figure 1 A partial enlarged view of part A;

[0025] Attachment Figure 3 : A schematic structural diagram of the docking station of the present invention;

[0026] Attachment Figure 4 : A schematic structural diagram of the manipulator of the present invention;

[0027] Attachment Figure 5 :for Figure 4 A partial enlarged view of part B.

[0028] 1-Wafer cassette 2-Connection platform 3-Crane 4-Robot 5-Power assembly 6-Isolation device 7-Sensor 8-Automatic sensing device 9-Grabbing device 10-Horizontal moving mechanism 11-Vertical moving mechanism DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "several" means two or more, unless otherwise specifically defined.

[0032] See also Figure 1-Figure 5 This utility model provides a high-precision, high-stability, and highly automated semiconductor wafer cassette transfer device designed to address vibration damage, operational accuracy, and automation issues during wafer cassette transfer during semiconductor production. The device's design focuses on stable support, vibration reduction, and shockproofing for the cassettes, as well as precise automated operation and in-place detection, meeting the high-precision, high-stability, and high-automation requirements of semiconductor production.

[0033] Wafer cassette 1 is constructed of a durable, anti-static composite material, ensuring both material robustness and effectively preventing potential threats to wafers from static electricity accumulation and external contamination. Its carefully designed base structure aligns with the support components of docking station 2, forming a stable load-bearing foundation. The top surface of docking station 2 features a grooved structure from which a drive belt partially protrudes to lift and drive the wafer cassette placed atop it. This design enhances load stability, prevents cassette shifting due to movement or vibration, and ensures precise movement of the cassette during transport.

[0034] In order to protect the integrity of the wafers during transportation, a shockproof device 6 is set around the docking station 2. This part is made of flexible materials, such as rubber pads or polyurethane materials, and is in close contact with the bottom of the equipment, which can effectively absorb and alleviate initial vibrations. Through this flexible contact structure, the support part can reduce the vibrations transmitted from the outside world, thereby reducing the impact of the vibration directly transmitted to the main body of the equipment, and reducing the interference of instantaneous vibrations or small impacts on the internal components of the equipment. This flexible material also has wear resistance and pressure resistance, ensuring that its shock absorption effect can be maintained under long-term use, providing continuous and stable protection for the main body of the equipment. Provide stronger vibration protection for the wafer box 1. This multi-layer shockproof design is particularly important in a high-speed production environment, which can effectively reduce the potential impact of vibration on the wafer and avoid damage or performance degradation of the wafer caused by vibration.

[0035] Sensors 7 mounted on the docking station 2 monitor the position of the wafer cassette in real time, ensuring precise positioning during movement and positioning to avoid collisions or displacement errors. Utilizing high-precision detection technology, these sensors provide rapid and accurate feedback on the cassette's actual position and transmit this signal to the control system. When the cassette approaches its intended position, the sensors automatically trigger a stop or deceleration command, allowing the cassette to reach its target position smoothly and avoid collisions.

[0036] Overhead Crane 3 moves on tracks above the production area via a non-contact guidance system. Its position and movement are monitored and adjusted in real time by a sophisticated control system. The movement path and speed of Overhead Crane 3 are precisely calculated to ensure accurate positioning above the wafer cassette 1 during transport. To enhance operational stability, its motion mechanism utilizes high-precision servo motors and encoders, combined with advanced control algorithms, ensuring smooth and precise movement. Furthermore, Overhead Crane 3's structural materials are constructed from high-strength, lightweight alloys, reducing its weight and improving its efficiency.

[0037] As an independent operating unit, the robot 4 is arranged near the docking station 2 and completes the picking and placing operations of the wafer box 1 through its own motion mechanism. It has multi-axis motion capability and can flexibly move and position in space. It is mainly composed of a horizontal moving mechanism 10, a vertical lifting mechanism 11 and a gripping device 9. The gripping device 9 adopts an open "U"-shaped structure and is designed for efficient clamping and releasing of wafer boxes. Its U-shaped structure has a spacious opening, which facilitates the entry and stable clamping of wafer boxes of different specifications, avoiding slippage during operation. The main frame is made of high-strength material, has strong durability and stability, and can adapt to frequent clamping actions. The surface of the gripping device 9 is provided with a positioning column 12, which is compatible with the positioning hole at the bottom of the wafer box. By inserting into the positioning hole, the wafer box is accurately positioned during the clamping process. The setting of the positioning column makes the position of the wafer box on the gripping device more stable, effectively preventing displacement or rotation during clamping or movement, thereby improving the position accuracy and safety during transportation.

[0038] The automatic sensing device 8, which works closely with the gripping device, is installed above or on the side of the gripping device, covering the working area of ​​the gripping device. The automatic sensing device 8 uses high-precision sensors to monitor the position and status of the wafer box in real time, ensuring that the gripping device has accurate positioning information when performing the clamping operation. Information exchange is achieved between the two through the signal line of the control system. When the wafer box approaches the clamping area, the automatic sensing device 8 detects its position and feeds back the position signal to the control system in real time. Based on this, the control system instructs the gripping arm of the gripping device to prepare in advance. When the wafer box reaches the specified position and stabilizes, the control system instructs the gripping arm of the gripping device to accurately perform the clamping action. Throughout the process, the automatic sensing device continuously monitors the position of the wafer box to ensure the stability of the clamping and placement process, and provides data support for subsequent operations.

[0039] The power assembly 5 adopts a belt drive system and is installed on both sides of the docking station 2. The belt drive system is composed of high-strength synchronous belts and precision pulleys, and has the advantages of high transmission efficiency, smooth operation, and low noise. Driven by a servo motor, the power assembly 5 can accurately control the movement speed and direction of the wafer box 1. The design of the belt drive system takes into account the high-speed operation requirements of the production line. The specifications of the pulleys and belts have been precisely calculated and can withstand long-term high-speed operation without fatigue or damage. The synchronization and stability of the belt drive ensure the stability of the wafer box 1 during movement, avoiding shaking or inaccurate positioning of the wafer box due to fluctuations in the power transmission.

[0040] The central controller is responsible for the logical control and scheduling of the entire system. It directs the coordinated operation of the overhead crane 3, manipulator 4, and power assembly 5 based on the production plan and real-time status information. The motion controller accurately plans the trajectory and controls the speed of each motion mechanism, ensuring that each component executes according to the predetermined path and time.

[0041] A network of sensors on the overhead crane 3, manipulator 4, and docking platform 2 collects real-time status information, such as position, velocity, and acceleration, and transmits it to the central controller via a high-speed communications network. By comprehensively analyzing this information, the control system can promptly adjust the operation of each component, ensuring the coordinated and efficient operation of the entire system.

[0042] The design of this device not only improves production line automation and productivity, but also provides a stable and reliable transfer solution for semiconductor manufacturers. Its key advantages include high-precision operation, smooth operation, and a high degree of automation. The high-precision mechanical structure and advanced control algorithms ensure precise positioning and operation of the wafer cassette during transfer. The multi-layer shockproof design and efficient transmission system ensure the stability of the wafer cassette during high-speed operation, preventing the impact of vibration and shock on the wafers. The integrated control system and intelligent sensor network enable fully automated operation of the transfer process, reducing manual intervention and improving production efficiency.

[0043] Furthermore, the connection between overhead crane 3, docking platform 2, and robot 4 allows for a more flexible system layout, facilitating adjustment and expansion based on production line needs. This device is suitable for modern semiconductor production lines, meeting the demands for high precision, high efficiency, and high stability. Its innovative design and advanced technology provide strong support for wafer cassette transport during semiconductor production, improving product quality and production efficiency, and possesses broad application prospects and market value.

[0044] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer box transfer device, characterized in that: include: A docking platform is provided in the bottom area, wherein a power assembly for lifting and moving the wafer box is provided on the upper surface of the docking platform, and the power assembly is installed in the upper area of ​​the docking platform for driving the movement of the wafer box; The docking platform is surrounded by shock-absorbing devices made of flexible materials. A robot is installed on one side of the docking platform. The robot includes a horizontal movement mechanism and a vertical lifting mechanism. An open "U"-shaped gripping device is installed at the end of the vertical lifting mechanism. A sensor for detecting the position of the wafer box is installed on the surface of the docking platform. An automatic sensing device is installed above or on the side of the grasping device to cover the working range of the grasping device; The overhead crane located at the top of the device moves along the track above the docking platform through a guide system.

2. The semiconductor wafer box transfer device according to claim 1, wherein: A slider is provided on the crossbeam of the overhead crane. The slider can slide on the crossbeam and is connected to the manipulator via a fixed connecting piece at the bottom of the slider.

3. The semiconductor wafer box transfer device according to claim 1, wherein: The power assembly is installed on both sides of the upper part of the docking platform, and includes at least two belt drive wheels and a transmission belt, and the transmission belt is wound between the drive wheels.

4. The semiconductor wafer box transfer device according to claim 1, wherein: The anti-vibration device includes a plurality of shock-absorbing pads evenly distributed around the docking platform. The shock-absorbing pads are made of rubber or polyurethane material and are fixedly connected to the docking platform through flexible connectors.

5. The semiconductor wafer box transfer device according to claim 1, wherein: The automatic sensing device includes a high-precision sensor for monitoring the position information of the wafer box in real time and transmitting the monitoring data to the control system to control the gripping and placement of the wafer box by the gripping device.

6. The semiconductor wafer box transfer device according to claim 1, wherein: The overhead crane is equipped with a servo motor and an encoder, and the overhead crane is driven to move by the servo motor.

7. The semiconductor wafer box transfer device according to claim 1, wherein: A positioning column is provided on the surface of the grasping device.

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