Wafer conveying unit with wafer gap detecting and positioning function between modules

Abstract

The utility model belongs to the technical field of gluing and developing equipment, and particularly relates to a wafer conveying unit with wafer gap detection and positioning functions among modules, which comprises a mounting substrate and a plurality of groups of wafer conveying assemblies. Each wafer conveying assembly comprises a linear driving structure, a connecting support, a structure connecting plate, a wafer notch detection structure and a wafer rotation positioning structure. Wherein the wafer rotation positioning structure of each group of wafer conveying assembly is provided with a rotatable adsorption end which is used for adsorbing the wafer and can drive the wafer to rotate, and the wafer gap detection structure of each group of wafer conveying assembly is used for detecting the gap position of the wafer. According to the utility model, through the arrangement of the wafer gap detection structure and the wafer rotation positioning structure, the wafer gap can be detected and rotated to a preset position, and the position does not affect the wafer automatic centering of a subsequent mechanical arm, thereby effectively preventing the mechanical arm from generating eccentricity when taking and placing the wafer.

Description

Technical Field

[0001] The utility model belongs to the technical field of glue coating and developing equipment, in particular to a wafer conveying unit with wafer notch detection and positioning functions between modules. Background Art

[0002] Coating and developing equipment typically consists of multiple modules, each containing multiple process units. Interactions between process units within each module are handled by a robotic arm, while interactions between modules are handled by a wafer transfer unit. When the robotic arm interacts between process units and the wafer transfer unit, notches on the wafer can interfere with the robotic arm's automatic wafer alignment mechanism. This can cause the robotic arm to misalign the wafer when placing it at the wafer transfer unit, potentially affecting the proper functioning of subsequent process units.

[0003] Therefore, it is necessary to perform notch detection and positioning when the robot transfers the wafer to the wafer transfer unit, so that the wafer notch is rotated to a preset position, which does not affect the subsequent automatic centering of the wafer by the robot. Utility Model Content

[0004] In view of the above problems, the purpose of the present invention is to provide a wafer transfer unit with wafer notch detection and positioning functions between modules.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A wafer transfer unit with wafer notch detection and positioning functions between modules, comprising a mounting base and several groups of wafer transfer components;

[0007] Each set of the wafer transfer components includes a linear drive structure, a connecting bracket, a structural connecting plate, a wafer notch detection structure and a wafer rotation positioning structure;

[0008] The linear drive structure of each group of wafer conveying assemblies has a fixed end and a linear output end, the fixed end of the linear drive structure of each group of wafer conveying assemblies is respectively fixedly connected to the mounting base plate, the linear output end of the linear drive structure of each group of wafer conveying assemblies is respectively fixedly connected to the connecting bracket of the same group of wafer conveying assemblies, the structural connecting plate of each group of wafer conveying assemblies is respectively installed on the connecting bracket of the same group of wafer conveying assemblies, and the wafer notch detection structure and the wafer rotation positioning structure of each group of wafer conveying assemblies are respectively installed on the structural connecting plate of the same group of wafer conveying assemblies;

[0009] The wafer rotation positioning structure of each group of wafer transfer assemblies has a rotatable adsorption end for adsorbing the wafer and driving the wafer to rotate. The wafer notch detection structure of each group of wafer transfer assemblies is used to detect the notch position of the wafer on the rotatable adsorption end of the wafer rotation positioning structure of the same group of wafer transfer assemblies.

[0010] The moving directions of the linear output ends of the linear drive structures of each group of wafer transfer assemblies are parallel to each other.

[0011] The wafer transfer components are provided in two groups, wherein the structural connection plates of the wafer transfer components of one group are located above the structural connection plates of the wafer transfer components of the other group.

[0012] The linear drive structure of each group of wafer transfer assemblies includes a primary linear drive component, a linear drive component connecting plate, and a secondary linear drive component;

[0013] The outer shell of the first-level linear drive component of the linear drive structure of each group of wafer conveying components is respectively fixed to the mounting base as the fixed end of the linear drive structure of the wafer conveying components of the group; the driving end of the first-level linear drive component of the linear drive structure of each group of wafer conveying components is respectively fixed to the linear drive component connecting plate of the linear drive structure of the wafer conveying components of the same group; the outer shell of the second-level linear drive component of the linear drive structure of each group of wafer conveying components is respectively installed on the linear drive component connecting plate of the linear drive structure of the wafer conveying components of the same group; the driving end of the second-level linear drive component of the linear drive structure of each group of wafer conveying components is respectively fixed to the connecting bracket of the wafer conveying components of the same group as the linear output end of the linear drive structure of the wafer conveying components of the group.

[0014] The wafer rotation positioning structure of each set of the wafer transfer assembly includes a structural mounting plate, a drive motor, a driving pulley, a synchronous belt, a hollow driven pulley, a hollow bearing support, and a vacuum adsorption table;

[0015] The structural mounting plate of the wafer rotation positioning structure of each group of wafer conveying assemblies is fixedly connected to the structural connecting plate of the same group of wafer conveying assemblies, the driving motor of the wafer rotation positioning structure of each group of wafer conveying assemblies is arranged on the structural mounting plate of the wafer rotation positioning structure of the same group of wafer conveying assemblies, the driving shaft of the driving motor of the wafer rotation positioning structure of each group of wafer conveying assemblies is connected to the active pulley of the wafer rotation positioning structure of the same group of wafer conveying assemblies, the hollow bearing support of the wafer rotation positioning structure of each group of wafer conveying assemblies is installed on the structural mounting plate of the wafer rotation positioning structure of the same group of wafer conveying assemblies, and the vacuum adsorption table of the wafer rotation positioning structure of each group of wafer conveying assemblies serves as the wafer conveying assembly of the group. The rotatable adsorption end of the wafer rotation positioning structure of the wafer conveying assembly, the top surface of the vacuum adsorption table of the wafer rotation positioning structure of each group of the wafer conveying assembly is used for directly adsorbing the wafer, the inner circumferential surface of the lower part of the vacuum adsorption table of the wafer rotation positioning structure of each group of the wafer conveying assembly is rotatably connected to the outer circumferential surface of the hollow bearing support of the wafer rotation positioning structure of the same group of wafer conveying assembly, the hollow driven pulley of the wafer rotation positioning structure of each group of the wafer conveying assembly is respectively sleeved and fixedly connected to the outer circumferential surface of the lower part of the vacuum adsorption table of the wafer rotation positioning structure of the same group of wafer conveying assembly, and is connected to the active pulley of the wafer rotation positioning structure of the same group of wafer conveying assembly through the synchronous belt of the wafer rotation positioning structure of the same group of wafer conveying assembly.

[0016] The structural mounting plate of the wafer rotation positioning structure of each group of wafer conveying assemblies is fixed to the structural connecting plate of the same group of wafer conveying assemblies by screws. The structural mounting plate of the wafer rotation positioning structure of each group of wafer conveying assemblies is also evenly provided with a number of leveling screws for leveling on the structural connecting plate of the same group of wafer conveying assemblies.

[0017] The wafer rotation positioning structure of each set of the wafer transfer assembly further includes a motor mounting seat, a translation tensioning seat, a tensioning screw, and a tensioning screw positioning seat;

[0018] The outer shell of the driving motor of the wafer rotation positioning structure of each group of the wafer conveying assemblies is respectively fixed on the motor mounting seat of the wafer rotation positioning structure of the same group of wafer conveying assemblies, and the motor mounting seat of the wafer rotation positioning structure of each group of the wafer conveying assemblies is respectively mounted on the translation tensioning seat of the wafer rotation positioning structure of the same group of wafer conveying assemblies, and the translation tensioning seat of the wafer rotation positioning structure of each group of the wafer conveying assemblies is respectively placed on the structure mounting plate of the wafer rotation positioning structure of the same group of wafer conveying assemblies and fixed to the corresponding structure mounting plate through positioning screws, and a long hole for the positioning screw to pass through is respectively opened on the translation tensioning seat of the wafer rotation positioning structure of each group of the wafer conveying assemblies, and the tensioning screw positioning seat of the wafer rotation positioning structure of each group of the wafer conveying assemblies is respectively fixed to the wafer rotation positioning structure of the same group of wafer conveying assemblies. On the structural mounting plate of the positioning structure, the tensioning screw positioning seat of the wafer rotation positioning structure of each group of wafer conveying assemblies is located on the side of the motor mounting seat of the wafer rotation positioning structure of the same group of wafer conveying assemblies away from the hollow bearing support of the same group of wafer conveying assemblies, one end of the tensioning screw of the wafer rotation positioning structure of each group of wafer conveying assemblies is rotatably set on the tensioning screw positioning seat of the wafer rotation positioning structure of the same group of wafer conveying assemblies, and the other end of the tensioning screw of the wafer rotation positioning structure of each group of wafer conveying assemblies is connected to the translation tensioning seat of the wafer rotation positioning structure of the same group of wafer conveying assemblies through a thread, and the direction of the axial center line of the tensioning screw of the wafer rotation positioning structure of each group of wafer conveying assemblies is parallel to the length direction of the synchronous belt of the wafer rotation positioning structure of the same group of wafer conveying assemblies.

[0019] A structural protection cover is also provided on the structural mounting plate of the wafer rotation positioning structure of each group of the wafer transfer components, and the middle of the vacuum adsorption table of the wafer rotation positioning structure of each group of the wafer transfer components passes through the corresponding structural protection cover.

[0020] An air path connection joint for evacuating the vacuum adsorption table is connected to the lower center of the vacuum adsorption table of the wafer rotation positioning structure of each group of the wafer transfer components. The air path connection joints of the vacuum adsorption table of the wafer rotation positioning structure of each group of the wafer transfer components are connected to one end of a corresponding filter through a pipeline. The other end of each of the filters is connected to a solenoid valve through a pipeline. Each solenoid valve is connected to an external vacuum source through a pipeline. All the filters and all the solenoid valves are arranged on an air path element mounting seat, and the air path element mounting seat is mounted below the mounting substrate.

[0021] The wafer notch detection structure of each set of the wafer transfer assembly includes two sensor mounting brackets and two sets of notch detection sensors that are arranged in a coordinated manner;

[0022] The two sensor mounting brackets of the wafer notch detection structure of each group of wafer conveying components are respectively installed on the structural connecting plate of the same group of wafer conveying components, and the two sensor mounting brackets of the wafer notch detection structure of each group of wafer conveying components are respectively located on the left and right sides of the structural mounting plate of the wafer rotation positioning structure of the same group of wafer conveying components, and the sensor mounting brackets of the wafer notch detection structure of each group of wafer conveying components are respectively installed with a corresponding group of notch detection sensors.

[0023] The advantages and positive effects of this utility model are:

[0024] 1. The utility model can detect the wafer notch and rotate the wafer notch to a preset position through the setting of the wafer notch detection structure and the wafer rotation positioning structure. This position does not affect the subsequent automatic centering of the wafer by the robot, and effectively prevents eccentricity when the robot takes and places the wafer.

[0025] 2. Each group of wafer transfer components of the utility model can operate independently, occupying a small space, and the wafer transfer speed between modules is fast, which improves production and assembly efficiency, increases equipment production capacity, is easy to install as a whole, and reduces production and assembly costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0027] Figure 2 This is a schematic diagram of the configuration of the linear drive structure of the present utility model;

[0028] Figure 3 This is a schematic diagram of the wafer notch detection structure and wafer rotation positioning structure of the present invention;

[0029] Figure 4 This is a schematic diagram of the external structure of the wafer rotation and positioning structure of the present invention;

[0030] Figure 5 It is a schematic cross-sectional structure diagram of the wafer rotation positioning structure of the present invention;

[0031] Figure 6 This is a schematic diagram of the internal structure of the wafer rotation and positioning structure of the present invention;

[0032] Figure 7 This is a schematic diagram of the arrangement structure of each gas path component on the gas path component mounting base of the utility model;

[0033] Figure 8 This is a schematic diagram of the connection principle of each gas path component of the present utility model.

[0034] In the figure: 1 is the mounting base plate, 2 is the connecting bracket, 3 is the structural connecting plate, 4 is the primary linear drive component, 5 is the linear drive component connecting plate, 6 is the secondary linear drive component, 7 is the structural mounting plate, 8 is the drive motor, 9 is the active pulley, 10 is the synchronous belt, 11 is the hollow driven pulley, 12 is the hollow bearing support, 13 is the vacuum adsorption table, 14 is the motor mounting seat, 15 is the translation tensioning seat, 16 is the tensioning screw, 17 is the tensioning screw positioning seat, 18 is the structural protective cover, 19 is the sensor mounting bracket, 20 is the notch detection sensor, 21 is the air path connecting joint, 22 is the filter, 23 is the solenoid valve, 24 is the air path component mounting seat, and 25 is the vacuum gauge. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-8 The utility model is further described in detail.

[0036] A wafer transfer unit with wafer gap detection and positioning function between modules, such as Figure 1-8 As shown, this embodiment includes a mounting substrate 1 and two sets of wafer transfer assemblies. The mounting substrate 1 is generally installed on one of two adjacent modules and located at the junction of the two modules to facilitate wafer transfer between the two modules. The number of wafer transfer assemblies installed can also be adjusted according to usage requirements.

[0037] Each wafer transfer assembly includes a linear drive structure, a connecting bracket 2, a structural connecting plate 3, a wafer notch detection mechanism, and a wafer rotation and positioning mechanism. The linear drive structures of the two wafer transfer assemblies operate independently to transfer wafers without interfering with each other, meeting wafer transfer scheduling requirements.

[0038] The linear drive structure of each group of wafer transfer assemblies has a fixed end and a linear output end. The fixed end of the linear drive structure of each group of wafer transfer assemblies is respectively fixed to the mounting substrate 1, and the linear output end of the linear drive structure of each group of wafer transfer assemblies is respectively fixed to the connecting bracket 2 of the same group of wafer transfer assemblies. The structural connecting plate 3 of each group of wafer transfer assemblies is respectively installed on the connecting bracket 2 of the same group of wafer transfer assemblies. The wafer notch detection structure and the wafer rotation positioning structure of each group of wafer transfer assemblies are respectively installed on the structural connecting plate 3 of the same group of wafer transfer assemblies. In this embodiment, the moving directions of the linear output ends of the linear drive structures of each group of wafer transfer assemblies are parallel to each other, and the structural connecting plate 3 of one group of wafer transfer assemblies is located above the structural connecting plate 3 of another group of wafer transfer assemblies. The shape and setting structure of each connecting bracket 2 can be arbitrarily set according to needs, and the overall structure is more compact and saves space. The linear drive structure is used to drive the wafer notch detection structure and the wafer rotation positioning structure to move to two modules respectively.

[0039] The wafer rotation positioning structure of each group of wafer transfer components has a rotatable adsorption end for adsorbing the wafer and driving the wafer to rotate. The wafer notch detection structure of each group of wafer transfer components is used to detect and determine the notch position of the wafer on the rotatable adsorption end of the wafer rotation positioning structure of the same group of wafer transfer components.

[0040] Specifically, if Figure 2 As shown, the linear drive structure of each wafer transfer assembly in this embodiment includes a primary linear drive 4, a linear drive connecting plate 5, and a secondary linear drive 6. In this embodiment, all primary linear drives 4 and secondary linear drives 6 are commercially available servo cylinders, controlled by an external controller. This allows for fast wafer transfer between modules, high repeatability, and a low failure rate.

[0041] The outer shell of the primary linear drive member 4 of the linear drive structure of each group of wafer conveying assemblies is respectively fixed to the mounting base plate 1 as the fixed end of the linear drive structure of the group of wafer conveying assemblies. The driving end of the primary linear drive member 4 of the linear drive structure of each group of wafer conveying assemblies is respectively fixed to the linear drive member connecting plate 5 of the linear drive structure of the same group of wafer conveying assemblies. The outer shell of the secondary linear drive member 6 of the linear drive structure of each group of wafer conveying assemblies is respectively installed on the linear drive member connecting plate 5 of the linear drive structure of the same group of wafer conveying assemblies. The driving end of the secondary linear drive member 6 of the linear drive structure of each group of wafer conveying assemblies is respectively fixed to the connecting bracket 2 of the same group of wafer conveying assemblies as the linear output end of the linear drive structure of the same group of wafer conveying assemblies. The driving end of the primary linear drive member 4 and the driving end of the secondary linear drive member 6 are respectively controlled to realize the extension and retraction of the entire linear drive structure. The number of linear drive members of the linear drive structure of each group of wafer conveying assemblies arranged in series can also be adjusted according to usage requirements.

[0042] Specifically, if Figure 3-6 As shown, the wafer rotation and positioning structure of each wafer transfer assembly in this embodiment includes a structural mounting plate 7, a drive motor 8, a driving pulley 9, a timing belt 10, a hollow driven pulley 11, a hollow bearing support 12, and a vacuum adsorption table 13. In this embodiment, each drive motor 8 is a commercially available product and is controlled by an external controller.

[0043] The structural mounting plate 7 of the wafer rotation positioning structure of each group of wafer conveying components is fixed to the structural connecting plate 3 of the same group of wafer conveying components by screws, the driving motor 8 of the wafer rotation positioning structure of each group of wafer conveying components is arranged on the structural mounting plate 7 of the wafer rotation positioning structure of the same group of wafer conveying components, the driving shaft of the driving motor 8 of the wafer rotation positioning structure of each group of wafer conveying components is connected to the active pulley 9 of the wafer rotation positioning structure of the same group of wafer conveying components, and the hollow bearing support 12 of the wafer rotation positioning structure of each group of wafer conveying components is installed on the structural mounting plate 7 of the wafer rotation positioning structure of the same group of wafer conveying components. The vacuum adsorption table 13 of the wafer rotation positioning structure of each wafer transfer assembly serves as a rotatable adsorption end of the wafer rotation positioning structure of the wafer transfer assembly. The top surface of the vacuum adsorption table 13 of the wafer rotation positioning structure of each wafer transfer assembly is used to directly adsorb wafers. The inner circumference of the lower portion of the vacuum adsorption table 13 of the wafer rotation positioning structure of each wafer transfer assembly is rotatably connected to the outer circumference of the hollow bearing support 12 of the wafer rotation positioning structure of the same wafer transfer assembly via a bearing. The hollow driven pulley 11 of the wafer rotation positioning structure of each wafer transfer assembly is respectively mounted and fixed on the outer circumference of the lower portion of the vacuum adsorption table 13 of the wafer rotation positioning structure of the same wafer transfer assembly, and is connected to the driving pulley 9 of the wafer rotation positioning structure of the same wafer transfer assembly via the synchronous belt 10 of the wafer rotation positioning structure of the same wafer transfer assembly. The structure of the vacuum adsorption table 13 itself in this embodiment adopts the existing technology. Its top surface is provided with an adsorption groove for vacuum adsorption of wafers, and its interior is provided with a vacuum duct connected to each adsorption groove. According to the situation measured by the wafer notch detection structure, the external controller controls the rotation of the drive shaft of the drive motor 8, so that the vacuum adsorption table 13 can be driven to rotate through the active pulley 9, the synchronous belt 10, and the hollow driven pulley 11, and then the wafer notch can be rotated to the preset position. After that, the drive motor 8 stops moving to keep the wafer position fixed.

[0044] In this embodiment, the structural mounting plate 7 of the wafer rotation and positioning structure of each wafer transfer assembly is screwed to the structural connecting plate 3 of the same wafer transfer assembly. Each wafer transfer assembly's structural mounting plate 7 is also uniformly provided with a plurality of leveling screws for leveling the structural connecting plate 3 of the same wafer transfer assembly. The placement of these leveling screws can be based on existing technology. By rotating the leveling screws, the levelness of the structural mounting plate 7 on the structural connecting plate 3 can be ensured.

[0045] In this embodiment, the wafer rotation positioning structure of each wafer transfer assembly further includes a motor mounting seat 14 , a translation tensioning seat 15 , a tensioning screw 16 , and a tensioning screw positioning seat 17 .

[0046] The outer shell of the driving motor 8 of the wafer rotation positioning structure of each group of wafer conveying components is respectively fixed on the motor mounting seat 14 of the wafer rotation positioning structure of the same group of wafer conveying components, the motor mounting seat 14 of the wafer rotation positioning structure of each group of wafer conveying components is respectively mounted on the translation tensioning seat 15 of the wafer rotation positioning structure of the same group of wafer conveying components, the translation tensioning seat 15 of the wafer rotation positioning structure of each group of wafer conveying components is respectively placed on the structure mounting plate 7 of the wafer rotation positioning structure of the same group of wafer conveying components and is fixed to the corresponding structure mounting plate 7 through positioning screws, the translation tensioning seat 15 of the wafer rotation positioning structure of each group of wafer conveying components is respectively provided with a long hole for the positioning screw to pass through, the tensioning screw positioning seat 17 of the wafer rotation positioning structure of each group of wafer conveying components is respectively fixed to the wafer rotation positioning structure of the same group of wafer conveying components On the structural mounting plate 7 of the structure, the tensioning screw positioning seat 17 of the wafer rotation positioning structure of each group of wafer conveying components is located on the side of the motor mounting seat 14 of the wafer rotation positioning structure of the same group of wafer conveying components, which is away from the hollow bearing support 12 of the wafer conveying components of the same group. One end of the tensioning screw 16 of the wafer rotation positioning structure of each group of wafer conveying components is respectively rotatably set on the tensioning screw positioning seat 17 of the wafer rotation positioning structure of the same group of wafer conveying components. The other end of the tensioning screw 16 of the wafer rotation positioning structure of each group of wafer conveying components is connected to the translation tensioning seat 15 of the wafer rotation positioning structure of the same group of wafer conveying components through a thread. The direction of the axial center line of the tensioning screw 16 of the wafer rotation positioning structure of each group of wafer conveying components is parallel to the length direction of the synchronous belt 10 of the wafer rotation positioning structure of the same group of wafer conveying components. By coordinating the motor mounting base 14, the translation tensioning base 15, the tensioning screw 16, and the tensioning screw positioning base 17, the horizontal position of the translation tensioning base 15 on the structural mounting plate 7 can be adjusted, thereby tensioning the synchronous belt 10, making the rotation of the vacuum adsorption table 13 more stable and reliable, and improving the position accuracy of the wafer notch. When the position of the translation tensioning base 15 on the structural mounting plate 7 needs to be adjusted, the positioning screw is loosened and the tensioning screw 16 is rotated, thereby driving the translation tensioning base 15 to move horizontally on the structural mounting plate 7 through the thread. When the translation tensioning base 15 moves toward the side of the hollow bearing support 12 away from the same group of wafer transfer components, it can tension the synchronous belt 10. After determining the position of the translation tensioning base 15 and ensuring that the synchronous belt 10 is tightened, the positioning screw is re-tightened to keep the translation tensioning base 15 in a fixed position.

[0047] In this embodiment, a structural protection cover 18 is further provided on the structural mounting plate 7 of the wafer rotation and positioning structure of each wafer transfer assembly. The structural protection cover 18 covers the outside of the wafer rotation and positioning structure and seals and protects the wafer rotation and positioning structure. The middle of the vacuum adsorption table 13 of the wafer rotation and positioning structure of each wafer transfer assembly passes through the corresponding structural protection cover 18. The configuration of the structural protection cover 18 can be arbitrarily adjusted according to usage requirements.

[0048] Specifically, if Figure 5 、 Figure 7 and Figure 8 As shown, in this embodiment, the lower center of the vacuum adsorption table 13 of the wafer rotation positioning structure of each group of wafer transfer components is provided with an air path connection joint 21 for connecting the vacuum air path. The air path connection joint 21 is connected to the vacuum channel inside the vacuum adsorption table 13, and the setting structure of the connection between the air path connection joint 21 and the vacuum adsorption table 13 also adopts the existing technology. The air path connection joint 21 of the vacuum adsorption table 13 of the wafer rotation positioning structure of each group of wafer transfer components is connected to one end of a corresponding filter 22 through a pipeline, and the other end of each filter 22 is connected to a solenoid valve 23 through a pipeline. Each solenoid valve 23 is connected to an external vacuum source through a pipeline. All filters 22 and all solenoid valves 23 are arranged on an air path component mounting seat 24, and the air path component mounting seat 24 is installed below the mounting substrate 1. The other end of each filter 22 is connected to the corresponding solenoid valve 23 on the pipeline, which is also connected to a vacuum gauge 25. Each vacuum gauge 25 is also installed on the gas circuit component mounting seat 24 to detect the vacuum value during wafer adsorption, so as to check whether the pipeline is normal. The gas circuit component mounting seat 24 is also provided with a number of aviation plugs, quick-connect connectors, etc. for pipeline connection. In this embodiment, the filter 22 is a commercially available product. The filter 22 is used to filter the extracted gas to protect the subsequent gas circuit components; each solenoid valve 23 is a commercially available electromagnetic three-way valve, which is connected to an external controller to control the on and off of each location, so as to control whether the vacuum adsorption platform 13 at each location is adsorbing.

[0049] Specifically, if Figure 3 As shown, the wafer notch detection structure of each wafer transfer assembly in this embodiment includes two sensor mounting brackets 19 and two groups of notch detection sensors 20 that are arranged in a coordinated manner.

[0050] The two sensor mounting brackets 19 of the wafer notch detection structure of each group of wafer conveying assemblies are respectively mounted on the structural connecting plate 3 of the same group of wafer conveying assemblies, and the two sensor mounting brackets 19 of the wafer notch detection structure of each group of wafer conveying assemblies are respectively located on the left and right sides of the structural mounting plate 7 of the wafer rotation positioning structure of the same group of wafer conveying assemblies. The sensor mounting brackets 19 of the wafer notch detection structure of each group of wafer conveying assemblies are respectively installed with a corresponding group of notch detection sensors 20, and the installation method of the notch detection sensors 20 adopts the existing technology. In this embodiment, the sensor mounting brackets 19 are all C-shaped frames; the two groups of notch detection sensors 20 are both commercially available laser area type reflection sensors divided into upper and lower parts, which are respectively connected to the external controller. The rotation plane of the wafer is located between the upper and lower parts of each group of notch detection sensors 20, and the detection performance is good. By setting up two groups of notch detection sensors 20, they can be used for notch detection of wafers of two different sizes, respectively, and have better applicability.

[0051] Working principle:

[0052] When the wafer transfer unit is working, the external controller controls the linear drive structure of the wafer transfer assembly to move the wafer notch detection structure and the wafer rotation positioning structure to the wafer pickup position at one end of the wafer transfer unit; the robot places the wafer on the vacuum adsorption table 13 and is adsorbed by the vacuum adsorption table 13, and the notch detection sensor 20 of the corresponding size detects the position of the wafer notch. When the wafer notch is detected, it is fed back to the external controller, and the external controller controls the drive motor 8 to drive the vacuum adsorption table 13 to rotate, so that the wafer notch stops at a preset position and remains fixed. This position is a position that does not affect the subsequent automatic centering of the wafer by the robot; after completing the wafer notch detection and wafer centering, the linear drive structure moves the wafer notch detection structure and the wafer rotation positioning structure to the wafer pickup position at the other end of the wafer transfer unit.

Claims

1. A wafer transfer unit with wafer notch detection and positioning functions between modules, characterized in that: It comprises a mounting base plate (1) and a plurality of wafer transfer components; Each group of wafer transfer components comprises a linear drive structure, a connecting bracket (2), a structural connecting plate (3), a wafer notch detection structure, and a wafer rotation positioning structure; The linear drive structure of each group of wafer transfer assemblies has a fixed end and a linear output end, the fixed end of the linear drive structure of each group of wafer transfer assemblies is respectively fixed to the mounting base plate (1), the linear output end of the linear drive structure of each group of wafer transfer assemblies is respectively fixed to the connecting bracket (2) of the same group of wafer transfer assemblies, the structural connecting plate (3) of each group of wafer transfer assemblies is respectively mounted on the connecting bracket (2) of the same group of wafer transfer assemblies, and the wafer notch detection structure and wafer rotation positioning structure of each group of wafer transfer assemblies are respectively mounted on the structural connecting plate (3) of the same group of wafer transfer assemblies; The wafer rotation positioning structure of each group of wafer transfer assemblies has a rotatable adsorption end for adsorbing the wafer and driving the wafer to rotate. The wafer notch detection structure of each group of wafer transfer assemblies is used to detect the notch position of the wafer on the rotatable adsorption end of the wafer rotation positioning structure of the same group of wafer transfer assemblies.

2. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 1, characterized in that: The moving directions of the linear output ends of the linear drive structures of each group of wafer transfer assemblies are parallel to each other.

3. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 1, characterized in that: The wafer transfer components are provided in two groups, wherein the structural connection plate (3) of the wafer transfer components of one group is located above the structural connection plate (3) of the wafer transfer components of the other group.

4. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 1, characterized in that: The linear drive structure of each group of wafer transfer components includes a primary linear drive component (4), a linear drive component connecting plate (5), and a secondary linear drive component (6); The outer shell of the first-level linear drive member (4) of the linear drive structure of each group of wafer transfer assemblies is respectively fixed to the mounting base plate (1) as the fixed end of the linear drive structure of the wafer transfer assemblies of the group, the driving end of the first-level linear drive member (4) of the linear drive structure of each group of wafer transfer assemblies is respectively fixed to the linear drive member connecting plate (5) of the linear drive structure of the same group of wafer transfer assemblies, the outer shell of the second-level linear drive member (6) of the linear drive structure of each group of wafer transfer assemblies is respectively installed on the linear drive member connecting plate (5) of the linear drive structure of the same group of wafer transfer assemblies, and the driving end of the second-level linear drive member (6) of the linear drive structure of each group of wafer transfer assemblies is respectively fixed to the connecting bracket (2) of the same group of wafer transfer assemblies as the linear output end of the linear drive structure of the wafer transfer assemblies of the group.

5. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 1, characterized in that: The wafer rotation positioning structure of each set of the wafer transfer assembly comprises a structural mounting plate (7), a drive motor (8), a driving pulley (9), a synchronous belt (10), a hollow driven pulley (11), a hollow bearing support (12), and a vacuum adsorption platform (13); The structural mounting plate (7) of the wafer rotation positioning structure of each group of wafer conveying assemblies is fixedly connected to the structural connecting plate (3) of the same group of wafer conveying assemblies, the driving motor (8) of the wafer rotation positioning structure of each group of wafer conveying assemblies is arranged on the structural mounting plate (7) of the wafer rotation positioning structure of the same group of wafer conveying assemblies, the driving shaft of the driving motor (8) of the wafer rotation positioning structure of each group of wafer conveying assemblies is connected to the active pulley (9) of the wafer rotation positioning structure of the same group of wafer conveying assemblies, the hollow bearing support (12) of the wafer rotation positioning structure of each group of wafer conveying assemblies is installed on the structural mounting plate (7) of the wafer rotation positioning structure of the same group of wafer conveying assemblies, and the vacuum adsorption table (13) of the wafer rotation positioning structure of each group of wafer conveying assemblies serves as the wafer of the group. The wafer rotation positioning structure of the conveying assembly has a rotatable adsorption end, and the top surface of the vacuum adsorption table (13) of the wafer rotation positioning structure of each group of the wafer conveying assembly is used for directly adsorbing the wafer, and the inner peripheral surface of the lower part of the vacuum adsorption table (13) of the wafer rotation positioning structure of each group of the wafer conveying assembly is rotatably connected to the outer peripheral surface of the hollow bearing support (12) of the wafer rotation positioning structure of the same group of wafer conveying assembly, and the hollow driven pulley (11) of the wafer rotation positioning structure of each group of the wafer conveying assembly is respectively sleeved and fixed on the outer peripheral surface of the lower part of the vacuum adsorption table (13) of the wafer rotation positioning structure of the same group of wafer conveying assembly, and is connected to the driving pulley (9) of the wafer rotation positioning structure of the same group of wafer conveying assembly through the synchronous belt (10) of the wafer rotation positioning structure of the same group of wafer conveying assembly.

6. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 5, characterized in that: The structural mounting plate (7) of the wafer rotation positioning structure of each group of wafer conveying assemblies is fixed to the structural connecting plate (3) of the same group of wafer conveying assemblies by screws, and a plurality of leveling screws for leveling on the structural connecting plate (3) of the same group of wafer conveying assemblies are also uniformly provided on the structural mounting plate (7) of the wafer rotation positioning structure of each group of wafer conveying assemblies.

7. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 5, characterized in that: The wafer rotation positioning structure of each group of the wafer transfer components further includes a motor mounting seat (14), a translation tensioning seat (15), a tensioning screw (16), and a tensioning screw positioning seat (17); The housing of the driving motor (8) of the wafer rotation positioning structure of each group of wafer conveying assemblies is respectively fixed on the motor mounting seat (14) of the wafer rotation positioning structure of the same group of wafer conveying assemblies, the motor mounting seat (14) of the wafer rotation positioning structure of each group of wafer conveying assemblies is respectively mounted on the translation tensioning seat (15) of the wafer rotation positioning structure of the same group of wafer conveying assemblies, the translation tensioning seat (15) of the wafer rotation positioning structure of each group of wafer conveying assemblies is respectively placed on the structure mounting plate (7) of the wafer rotation positioning structure of the same group of wafer conveying assemblies and fixed to the corresponding structure mounting plate (7) through positioning screws, the translation tensioning seat (15) of the wafer rotation positioning structure of each group of wafer conveying assemblies is respectively provided with a long hole for the positioning screw to pass through, the tensioning screw positioning seat (17) of the wafer rotation positioning structure of each group of wafer conveying assemblies is respectively fixed to the wafer rotation positioning structure of the same group of wafer conveying assemblies. On the structural mounting plate (7) of the structure, the tensioning screw positioning seat (17) of the wafer rotation positioning structure of each group of wafer conveying assemblies is located on the side of the motor mounting seat (14) of the wafer rotation positioning structure of the same group of wafer conveying assemblies away from the hollow bearing support (12) of the wafer conveying assemblies of the same group, one end of the tensioning screw (16) of the wafer rotation positioning structure of each group of wafer conveying assemblies is respectively rotatably set on the tensioning screw positioning seat (17) of the wafer rotation positioning structure of the same group of wafer conveying assemblies, the other end of the tensioning screw (16) of the wafer rotation positioning structure of each group of wafer conveying assemblies is connected to the translation tensioning seat (15) of the wafer rotation positioning structure of the same group of wafer conveying assemblies through a thread, and the direction of the axial center line of the tensioning screw (16) of the wafer rotation positioning structure of each group of wafer conveying assemblies is parallel to the length direction of the synchronous belt (10) of the wafer rotation positioning structure of the same group of wafer conveying assemblies.

8. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 5, characterized in that: A structural protection cover (18) is also provided on the structural mounting plate (7) of the wafer rotation positioning structure of each group of the wafer transfer components, and the middle of the vacuum adsorption table (13) of the wafer rotation positioning structure of each group of the wafer transfer components passes through the corresponding structural protection cover (18).

9. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 5, characterized in that: The lower center of the vacuum adsorption platform (13) of the wafer rotation positioning structure of each group of wafer transfer components is connected with an air path connection joint (21) for evacuating the vacuum adsorption platform (13). The air path connection joint (21) of the vacuum adsorption platform (13) of the wafer rotation positioning structure of each group of wafer transfer components is connected to one end of a corresponding filter (22) through a pipeline. The other end of each filter (22) is connected to a corresponding solenoid valve (23) through a pipeline. Each solenoid valve (23) is connected to an external vacuum source through a pipeline. All the filters (22) and all the solenoid valves (23) are arranged on an air path component mounting seat (24), and the air path component mounting seat (24) is mounted below the mounting substrate (1).

10. The wafer transfer unit with wafer notch detection and positioning function between modules according to claim 5, characterized in that: The wafer notch detection structure of each set of wafer transfer assemblies includes two sensor mounting brackets (19) and two sets of notch detection sensors (20) that are arranged in a coordinated manner; The two sensor mounting brackets (19) of the wafer notch detection structure of each group of wafer conveying components are respectively mounted on the structural connecting plate (3) of the same group of wafer conveying components, and the two sensor mounting brackets (19) of the wafer notch detection structure of each group of wafer conveying components are respectively located on the left and right sides of the structural mounting plate (7) of the wafer rotation positioning structure of the same group of wafer conveying components, and the sensor mounting brackets (19) of the wafer notch detection structure of each group of wafer conveying components are respectively mounted with a corresponding group of notch detection sensors (20).

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