MEMS electronic product

Abstract

The utility model provides an MEMS electronic product. The MEMS electronic product comprises a complete machine circuit board, a groove arranged on the complete machine circuit board, and a chip arranged in the groove. Wherein a shell covering the groove is arranged on the complete machine circuit board; and the shell and the groove are matched to form a packaging cavity for accommodating the chip. According to the utility model, single cutting and single surface mounting processes of chip products can be saved, and the overall size of electronic products can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, and more specifically, to a MEMS electronic product. Background Art

[0002] With the advancement of society and technology, the size of MEMS electronic products such as mobile phones, computers, and wearable devices has continued to decrease in recent years. People's performance requirements for these portable MEMS electronic products are also becoming increasingly higher, which in turn requires the electronic components to be continuously reduced in size while improving performance and consistency. MEMS products integrated using MEMS (Micro-Electro-Mechanical-System) technology are beginning to be mass-produced in these MEMS electronic products. Their package size is smaller than that of traditional electronic devices, making them popular among most microphone manufacturers.

[0003] During the application process of existing MEMS microphones after packaging, the client needs to solder them to the client's complete circuit board through SMT, and connect the microphone's circuit board to the complete circuit board. It can be seen that this mounting method not only requires cutting the microphone unit, but also increases the size of the complete product due to the circuit board and shell of the MEMS electronic product itself, which is not conducive to the miniaturization of the product. Utility Model Content

[0004] In view of the above problems, the purpose of the present invention is to provide a MEMS electronic product to solve the problem that existing MEMS electronic products need to be cut and mounted as a single unit, and after mounting, the size of the whole machine becomes larger, which is not conducive to the development trend of product miniaturization.

[0005] The MEMS electronic product provided by the present invention includes a complete circuit board, a groove provided on the complete circuit board, and a chip arranged in the groove; wherein a shell covering the groove is provided on the complete circuit board; the shell and the groove cooperate to form a packaging cavity for accommodating the chip.

[0006] In addition, an optional structural feature is that a welding ring is provided on the complete circuit board and surrounds the groove; and the housing is fixed to the complete circuit board by welding the welding ring.

[0007] In addition, an optional structural feature is that the chip includes an ASIC chip connected and conductive with the whole machine circuit board and a MEMS chip connected and conductive with the ASIC chip; wherein the ASIC chip is arranged on the whole machine circuit board or on the MEMS chip.

[0008] In addition, an optional structural feature is that a first sound hole is provided at the bottom of the groove and passes through the entire circuit board; and the MEMS chip covers the first sound hole.

[0009] In addition, an optional structural feature is that an extension cavity is provided in the side wall of the whole circuit board; the extension cavity is connected to the packaging cavity and isolated from the first sound hole.

[0010] In addition, an optional structural feature is that the expansion cavity is provided at least in one place; and the expansion cavity is symmetrically distributed with respect to the packaging cavity.

[0011] In addition, an optional structural feature is that a second sound hole is provided on the housing; and a sealed back cavity is provided at the bottom of the groove and is connected to the MEMS chip.

[0012] In addition, an optional structural feature is that, in a direction perpendicular to the entire circuit board, the second sound holes and the MEMS chip are staggered in position.

[0013] In addition, an optional structural feature is that a test PAD is provided on the upper surface of the whole circuit board; the test PAD is connected to the chip and is used to connect to an external test to perform performance testing on the chip.

[0014] In addition, an optional structural feature is that the depth of the groove is not less than the thickness of the chip.

[0015] By using the above-mentioned MEMS electronic products, a groove is opened on the circuit board of the whole machine, and then the chip is set in the groove. The groove and the chip inside are isolated and protected by a shell set on the circuit board of the whole machine. The embedded chip installation method can reduce the height impact of the chip unit on the whole machine. It can not only save the single-unit cutting and separate mounting process of the chip product, but also reduce the overall size of the electronic product, which is conducive to the miniaturization of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more clear and easy to understand. In the accompanying drawings:

[0017] Figure 1 Schematic diagram of the structure of a MEMS electronic product according to the first embodiment of the present invention;

[0018] Figure 2 Schematic diagram of the structure of a MEMS electronic product according to the second embodiment of the present invention.

[0019] The reference numerals include: complete circuit board 1 , test PAD 2 , housing 3 , second sound hole 31 , MEMS chip 4 , first sound hole 5 , ASIC chip 6 , extended cavity 7 , and sealed back cavity 8 .

[0020] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0021] In the following description, for illustrative purposes, numerous specific details are set forth to provide a comprehensive understanding of one or more embodiments. However, it will be apparent that the embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form to facilitate description of one or more embodiments.

[0022] In the following description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0023] In order to solve the problem that in the application of existing MEMS microphones and other similar monomers in the whole machine, it is necessary to cut and mount the monomers, which not only makes the process complicated, but the direct mounting method will also increase the height of the whole machine, which is not conducive to the miniaturization of the product, the utility model provides a MEMS electronic product, which opens a groove on the whole machine circuit board, and then sets the monomer chip in the groove and connects it. The embedded chip installation method can reduce the height impact of the chip monomer on the whole machine, which not only saves the monomer cutting and separate mounting process of the chip product, but also reduces the overall size of the electronic product, which is conducive to the miniaturization of the product.

[0024] To describe the MEMS electronic product of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0025] Figure 1 The figure shows the schematic structure of a MEMS electronic product according to the first embodiment of the present invention.

[0026] like Figure 1As shown, the MEMS electronic product implemented by the present invention includes a complete circuit board 1, a groove opened on the complete circuit board 1, and a chip arranged in the groove; wherein, a shell 3 covering the groove is also provided on the complete circuit board 1; the shell 3 and the groove cooperate to form a packaging cavity for accommodating the chip, and by embedding the single chip to be mounted in the complete circuit board 1, the single chip cutting and mounting process is saved, and the height of the whole machine can be effectively reduced, providing more assembly space for the client's whole machine assembly.

[0027] Among them, in order to realize the installation of the shell 3 and the complete circuit board 1, a soldering ring (welding machine ring) can be made on the surface of the complete circuit board 1, and the soldering machine ring is arranged around the groove area, and then the shell 3 is soft-soldered and fixed on the complete circuit board 1 through the soldering machine ring, and cooperates with the groove to form a packaging cavity structure; it can be seen that the shell 3 can be set as a flat-panel structure, and a limiting groove matching the thickness of the shell 3 is set on the complete circuit board 1, and the soldering machine ring is set in the limiting groove. After the shell 3 is welded and fixed in the limiting groove, the height of the shell 3 is consistent with the height of the complete circuit board 1, so that the overall height of the electronic product will not be greater than the thickness of the complete circuit board 1; in addition, the shell 3 can also be set as a rectangular structure with a welding end. When the shell 3 is welded and fixed to the complete circuit board 1, although the thickness of the electronic product will be slightly increased, the cavity where the chip is located will also be increased. The specific shell 3 structure or height can be adjusted accordingly according to the applicable scenario of the electronic product or the functional requirements of the chip.

[0028] In the MEMS electronic product of the present invention, the aforementioned chip further includes an ASIC chip 6 electrically connected to the overall circuit board 1, and a MEMS chip 4 electrically connected to the ASIC chip 6. The MEMS chip 4 is primarily used to sense external signals and convert the sensed external analog signals into electrical signals. The ASIC chip 6 is primarily used to perform signal modulation operations such as filtering on the electrical signals transmitted by the MEMS, converting the modulated signals into digital signals in a fixed format and transmitting them to external circuits for analysis and processing. The ASIC chip 6 can be disposed on the overall circuit board 1 or vertically stacked on the MEMS chip 4.

[0029] In the specific structure shown in the first embodiment of the present invention, the chip arranged in the whole circuit board 1 is an acoustic chip, and the sound hole is arranged on the whole circuit board 1, that is, a first sound hole 5 is arranged at the bottom of the groove and passes through the whole circuit board 1, and the MEMS chip 4 covers the first sound hole 5.

[0030] Furthermore, when the chip is a microphone chip, in order to increase the back cavity volume of the microphone, an extended cavity 7 can be set in the side wall of the whole circuit board 1; the extended cavity 7 is connected to the packaging cavity and is isolated from the first sound hole 5 by the MEMS chip 4. The extended cavity 7 can be set in the bottom or side wall of the whole circuit board 1 on both sides of the chip. Because the thickness of the whole circuit board 1 is obviously thicker than that of an ordinary microphone circuit board or substrate, a groove can be cut around the groove of the whole circuit board 1 to form an extended cavity 7, which can further expand the cavity volume. Without affecting the height of the electronic product, the back cavity volume of the microphone is increased, thereby improving the acoustic performance of the microphone.

[0031] Specifically, the extended cavity 7 can be set at least one place. When the extended cavity 7 is set at one place, it can be set as an integrated structure around the chip. When the extended cavity 7 is set at multiple places, the extended cavity 7 can be symmetrically or evenly distributed about the packaging cavity to stabilize the acoustic performance of the electronic product.

[0032] Figure 2 The schematic structure of a MEMS electronic product according to the second embodiment of the present utility model is shown.

[0033] like Figure 2 As shown, in this second embodiment, the sound hole can be set on the shell 3, that is, a second sound hole 31 is set on the shell 3. In order to prevent the airflow from impacting the sensitive membrane of the MEMS chip 4, the second sound hole 31 can be staggered with the position of the MEMS chip 4 in the direction perpendicular to the whole machine circuit board 1.

[0034] In this second embodiment, a sealed back cavity 8 connected to the MEMS chip 4 can be further provided at the bottom of the groove. The sealed back cavity 8 can be a cavity larger than the MEMS chip 4, but the size of the vent of the sealed back cavity 8 connected to the MEMS chip 4 is smaller than the size of the MEMS chip 4, thereby increasing the back cavity volume of the microphone and improving the acoustic performance of the product.

[0035] Since the chip does not need to form a single body but is directly set in the complete circuit board 1, in order to facilitate the detection of the chip, in the above two embodiments, a test PAD 2 can also be set on the upper surface of the complete circuit board 1; the test PAD 2 is connected to the chip and is used to connect to the external test to perform performance testing on the chip; during the production process, the manufacturer of the electronic equipment can use the test PAD 2 to perform pre-shipment performance testing on the chip therein. After obtaining the complete circuit board 1 with an embedded microphone chip or other type of single chip, the user can directly assemble other components of the electronic product, reducing the mounting operation of single units such as microphones.

[0036] It should be noted that for different electronic products, when the thickness of the entire circuit board 1 is sufficient, the depth of the groove can be set to be no less than the thickness of the chip, thereby providing storage-type protection for various chips; and when the thickness of the entire circuit board 1 is thinner, the depth of the groove can be reduced accordingly. At this time, the groove can be used to embed the entire or partial structure of the chip. In this case, the size of the housing 3 can be adjusted, which can also reduce the overall height of the electronic device compared to the traditional method of mounting the chip circuit board on the entire circuit board 1.

[0037] According to the above-mentioned MEMS electronic product of the present invention, a groove is opened on the whole circuit board, and then the chip is set in the groove, and the groove and the chip therein are isolated and protected by a shell set on the whole circuit board. The embedded chip installation method can reduce the impact of traditional microphones or other types of single-body mounting on the height of the electronic product. It not only saves the cutting and mounting process of the microphone unit, but also provides more assembly space for the whole circuit board, reduces the overall size of the electronic product, and is conducive to the miniaturization of the product.

[0038] The MEMS electronic product according to the present invention has been described above by way of example with reference to the accompanying drawings. However, those skilled in the art will appreciate that various improvements may be made to the MEMS electronic product described above without departing from the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A MEMS electronic product, characterized in that: It includes a complete circuit board, a groove on the complete circuit board, and a chip arranged in the groove; wherein, A shell covering the groove is provided on the complete circuit board; The housing and the groove cooperate to form a packaging cavity for accommodating the chip.

2. The MEMS electronic product according to claim 1, characterized in that: A welding ring is provided on the complete circuit board and surrounds the groove; The shell is fixed on the complete circuit board by welding through the welding ring.

3. The MEMS electronic product according to claim 1, characterized in that: The chip includes an ASIC chip connected to the whole machine circuit board and a MEMS chip connected to the ASIC chip; wherein, The ASIC chip is arranged on the whole machine circuit board or the MEMS chip.

4. The MEMS electronic product according to claim 3, characterized in that: A first sound hole penetrating the entire circuit board is provided at the bottom of the groove; The MEMS chip covers the first acoustic hole.

5. The MEMS electronic product according to claim 4, characterized in that: An expansion cavity is provided in the side wall of the complete circuit board; The expansion cavity is connected to the packaging cavity and isolated from the first sound hole.

6. The MEMS electronic product according to claim 5, characterized in that: The expansion cavity is provided at least in one place; and the expansion cavity is symmetrically distributed with respect to the packaging cavity.

7. The MEMS electronic product according to claim 3, characterized in that: A second sound hole is provided on the housing; A sealed back cavity connected to the MEMS chip is provided at the bottom of the groove.

8. The MEMS electronic product according to claim 7, characterized in that: In a direction perpendicular to the entire circuit board, the second sound holes and the MEMS chip are staggered in position.

9. The MEMS electronic product according to claim 1, characterized in that: A test PAD is provided on the upper surface of the complete circuit board; The test PAD is connected to the chip and is used to connect to an external tester to perform a performance test on the chip.

10. The MEMS electronic product according to claim 1, characterized in that: The depth of the groove is not less than the thickness of the chip.

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