Ultra-long flexible circuit board base material

Abstract

The utility model discloses a super-long flexible circuit board substrate, and relates to the technical field of flexible circuit boards. The positioning device comprises reference holes which are used for positioning and drilling identification and symmetrically formed in the two sides of the head end of the coil stock base material. The first exposure punching positioning holes are used for positioning and drilling identification, are positioned at the rear part of the reference hole and are symmetrically formed in two sides of the coil stock base material; the second exposure punching positioning holes are used for positioning and drilling identification, are positioned at the rear part of the first exposure punching positioning hole and are symmetrically formed in two sides of the coil stock base material; the Nth exposure punching positioning hole is used for positioning and drilling identification, is positioned at the rear part of the (N-1) th exposure punching positioning hole, and is symmetrically arranged on two sides of the roll material base material; the circuit is formed through dry film pressing and film exposure operation and is etched on the coil stock base material; according to the coil stock base material, lines of any length can be manufactured according to specific requirements of customers, so that the coil stock base material can be conveniently matched with an automatic processing machine, and the production convenience and efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit boards, in particular to an ultra-long flexible circuit board substrate. Background Art

[0002] Ultra-long flexible circuit boards (FPCs) use polymer materials such as polyimide (PI) and polyester (PET) as substrates, combining conductive circuits, insulation layers, and components to form electronic connectors with specific functions. Their length can be customized to meet specific needs, often far exceeding that of standard FPCs.

[0003] With the continuous advancement of technology and the increasing demand for portability and aesthetics in electronic products, the market prospects for ultra-long flexible circuit boards are promising. Driven by emerging technologies such as 5G, the Internet of Things, and artificial intelligence, demand for flexible circuit boards in various electronic devices will continue to grow. Furthermore, market demand for ultra-long flexible circuit boards will continue to grow in high-end sectors such as new energy vehicles and aerospace.

[0004] While the market for ultra-long flexible circuit boards (FPCBs) holds great promise, they also face challenges. For example, FPCB substrates are typically manufactured using a batch process, which is limited by the size of production equipment. Consequently, when manufacturing ultra-long FPCBs, production equipment may not meet the required requirements, limiting the length and width of the boards. Existing FPCB substrates on the market generally feature wide line widths (typically exceeding 0.5mm) and relatively simple design patterns (primarily limited to straight lines). Utility Model Content

[0005] The purpose of the utility model is to provide an ultra-long flexible circuit board substrate, on which the circuits have no gaps and the line width can be about 0.1mm, and can be cut into any length for use as needed.

[0006] To achieve the above objectives, the present application proposes an ultra-long flexible circuit board substrate, comprising:

[0007] Reference holes, used for positioning and drilling identification, are symmetrically arranged on both sides of the head end of the coil substrate;

[0008] The first exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the reference hole and is symmetrically arranged on both sides of the coil substrate;

[0009] The second exposure punch-shaped positioning hole is used for positioning and drilling identification, and is located behind the first exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate;

[0010] The third exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the second exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate.

[0011] …

[0012] The Nth exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the N-1th exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate;

[0013] The circuit is formed by pressing a dry film and exposing a film, and is etched onto a coil substrate; wherein the film is provided with a non-exposed area and an exposed area, and the pattern of the exposed area matches the desired circuit shape.

[0014] In one embodiment, the circuit includes several sections, each section has the same shape and is formed by the same film.

[0015] In one embodiment, a film exposure overlap area is formed between adjacent lines.

[0016] In one embodiment, exposure identification holes are symmetrically provided on both sides of the film and are concentrically aligned with each exposure punch-shaped positioning hole.

[0017] In one embodiment, the reference hole includes a punching positioning hole and a reference exposure punching positioning hole, wherein the punching positioning hole is located at the head end of the coil substrate, and the reference exposure punching positioning hole is located between the punching positioning hole and the first exposure punching positioning hole.

[0018] In one embodiment, the distances between adjacent exposure punch-shaped positioning holes are the same.

[0019] In one embodiment, the reference exposure punch-shaped positioning hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, and the third exposure punch-shaped positioning hole are respectively located on both sides of each circuit segment.

[0020] In one embodiment, the circuit surface is tin-plated.

[0021] The above technical solution adopted by the present invention has the following advantages compared with the prior art:

[0022] 1) The coiled substrate of the present application can be made into circuits of any length according to the specific needs of the customer. This flexibility makes it easy to match with automatic processing machines, thereby improving the convenience and efficiency of production.

[0023] 2) The circuit design is gapless, ensuring that users can cut it into any required length for use without affecting the integrity and performance of the circuit.

[0024] 3) The line width and spacing of the circuit can be designed according to actual needs, and the width can even reach a level of precision of about 0.1 mm, allowing the product to meet diverse application scenarios and performance requirements.

[0025] 4) It can correspond to any complex routing shape, further broadening the application range of coil substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the coil substrate structure;

[0027] Figure 2 Schematic diagram of film structure;

[0028] Figure 3 Schematic diagram of the coil substrate after exposure;

[0029] Figure 4 This is a schematic diagram of an ultra-long flexible circuit board;

[0030] Among them: 1. Reference hole, 2. First exposure punch-shaped positioning hole, 3. Second exposure punch-shaped positioning hole, 4. Exposure identification hole, 5. Non-exposure area, 6. Exposure area, 7. Film exposure overlapping area. DETAILED DESCRIPTION

[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0032] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0034] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0036] Example 1

[0037] See also Figure 1 This embodiment provides an ultra-long flexible circuit board substrate, including:

[0038] Reference holes are used for positioning and drilling identification and are symmetrically arranged on both sides of the head end of the coil substrate. The reference holes include a punching positioning hole and a reference exposure punching positioning hole. The punching positioning hole is located at the head end of the coil substrate, and the reference exposure punching positioning hole is located between the punching positioning hole and the first exposure punching positioning hole.

[0039] The first exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the reference hole and is symmetrically arranged on both sides of the coil substrate;

[0040] The second exposure punch-shaped positioning hole is used for positioning and drilling identification, and is located behind the first exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate;

[0041] The third exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the second exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate.

[0042] …

[0043] The Nth exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the N-1th exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate;

[0044] The distances between the adjacent exposure punch-shaped positioning holes are the same;

[0045] The circuit is formed by pressing the dry film and exposing the film, and is etched on the coil substrate; the circuit includes several sections, each section has the same shape and is formed by the same film, such as Figure 2 As shown, the film is provided with a non-exposed area and an exposed area, the pattern of the exposed area matches the required circuit shape, and the pattern of the exposed area is not restricted by line width and line shape.

[0046] As a preferred implementation provided in this embodiment, Figure 3 As shown, a film exposure overlap area is formed between adjacent circuits, and the overlap size may be about 0.1 mm to ensure the continuity of the circuit.

[0047] As a preferred implementation provided by this embodiment, exposure identification holes are symmetrically provided on both sides of the film. When the coil substrate is exposed, the exposure identification holes are concentrically aligned with each exposure punch-shaped positioning hole.

[0048] As a preferred implementation provided by this embodiment, the reference exposure punch-shaped positioning hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, and the third exposure punch-shaped positioning hole are respectively located on both sides of each line segment.

[0049] Example 2

[0050] This embodiment provides a process for manufacturing a flexible circuit board of any length, based on the substrate described in Example 1 to achieve the following:

[0051] First, a roll-to-roll laser machine is used to punch holes in the roll substrate to obtain reference holes, which include punching positioning holes and reference exposure punching positioning holes.

[0052] Punch two first exposure punching holes backward based on the reference exposure punching hole and the set distance, and then pull the coiled substrate forward;

[0053] Punch two second exposure punch-shaped positioning holes backward based on the first exposure punch-shaped positioning hole and the set distance, and then pull the coil substrate forward;

[0054] Punch two third exposure punch-shaped positioning holes backward based on the second exposure punch-shaped positioning holes and the set distance, and then pull the coil substrate forward;

[0055] …

[0056] Punch two Nth exposure punching holes backward based on the N-1th exposure punching hole and the set distance, and then pull the coil substrate forward;

[0057] The perforated coil substrate is exposed by pressing the dry film. The exposure identification hole and the exposure punch positioning hole of the film are used for registration exposure. The overlap between two adjacent exposures of the film is 0.1mm to ensure the continuity of the final circuit.

[0058] The exposed coil substrate is developed to remove the unexposed dry film, and then etched to remove the copper foil without dry film protection. The exposed dry film is then removed through stripping to form the desired circuit.

[0059] After the etched circuit is treated with chemical tin plating, it is positioned using punching holes and punched out in sequence through the mold to obtain an ultra-long flexible circuit board FPC of the required width, such as Figure 4 shown.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An ultra-long flexible circuit board substrate, characterized in that: include: Reference holes, used for positioning and drilling identification, are symmetrically arranged on both sides of the head end of the coil substrate; The first exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the reference hole and is symmetrically arranged on both sides of the coil substrate; The second exposure punch-shaped positioning hole is used for positioning and drilling identification, and is located behind the first exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate; The third exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the second exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate. …… The Nth exposure punch-shaped positioning hole is used for positioning and drilling identification. It is located behind the N-1th exposure punch-shaped positioning hole and is symmetrically arranged on both sides of the coil substrate; The circuit is formed by pressing a dry film and exposing a film, and is etched onto a coil substrate; wherein the film is provided with a non-exposed area and an exposed area, and the pattern of the exposed area matches the desired circuit shape.

2. The ultra-long flexible circuit board substrate according to claim 1, characterized in that: The circuit includes several sections, each section has the same shape and is formed by the same film.

3. The ultra-long flexible circuit board substrate according to claim 2, characterized in that: A film exposure overlapping area is formed between adjacent lines.

4. The ultra-long flexible circuit board substrate according to claim 1, characterized in that: Exposure identification holes are symmetrically arranged on both sides of the film, and are concentrically aligned with each exposure punch-shaped positioning hole.

5. The ultra-long flexible circuit board substrate according to claim 1, characterized in that: The reference holes include a punching positioning hole and a reference exposure punching positioning hole. The punching positioning hole is located at the head end of the coiled substrate, and the reference exposure punching positioning hole is located between the punching positioning hole and the first exposure punching positioning hole.

6. The ultra-long flexible circuit board substrate according to claim 1, characterized in that: The distances between adjacent exposure punch-shaped positioning holes are the same.

7. The ultra-long flexible circuit board substrate according to claim 5, characterized in that: The reference exposure punch-shaped positioning hole, the first exposure punch-shaped positioning hole, the second exposure punch-shaped positioning hole, and the third exposure punch-shaped positioning hole are respectively located on both sides of each section of the circuit.

8. The ultra-long flexible circuit board substrate according to claim 1, characterized in that: The surface of the circuit is tin-plated.

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