Controller assembly accommodating structure and electronic equipment

Abstract

The utility model discloses a controller assembly containing structure and electronic equipment. The controller assembly containing structure comprises a shell and a heat dissipation device. The shell is provided with a containing cavity, and a controller assembly is arranged in the containing cavity; the heat dissipation device is arranged in the containing cavity, the controller assembly is arranged on the heat dissipation device, the heat dissipation device comprises a supporting piece and a heat dissipation assembly, the supporting piece is used for bearing the controller assembly, and a heat exchange space is formed between the inner wall of the shell and the controller assembly. The heat dissipation assembly is arranged in the heat exchange space, and the heat dissipation assembly communicates with the shell.

Description

Technical Field

[0001] The present application relates to the field of controller temperature control technology, and more specifically, to a controller component accommodating structure and electronic equipment. Background Art

[0002] During the operation of electronic devices, the controller components of their control units generate heat due to the high-frequency switching of current, voltage, and other signals, causing the control unit temperature to rise. For electronic devices with lower voltage and power, the heat generated during operation is not significant and is generally dissipated naturally by the controller components.

[0003] However, as users' demand for electronic equipment continues to increase, the power density of battery packs and motors continues to increase, and electronic equipment is also developing towards high voltage and high power. The increasingly complex functions and operating conditions are placing higher and higher requirements on the operating processing capabilities and reliability of controller components. Currently, the heat generated by the operation of controller components can no longer be effectively dissipated through the above methods.

[0004] Therefore, it is necessary to provide a new technical solution to solve the technical problem of heat dissipation of the control unit of the electronic device. Utility Model Content

[0005] One purpose of the present application is to provide a new technical solution for a controller component housing structure.

[0006] According to the first aspect of the present application, a controller component accommodating structure is provided. The controller component accommodating structure includes a housing and a heat dissipation device; the housing has a accommodating cavity, in which a controller component is arranged; the heat dissipation device is arranged in the accommodating cavity, and the controller component is arranged on the heat dissipation device, wherein the heat dissipation device includes a support member and a heat dissipation component, the support member is arranged in the accommodating cavity, the support member is used to support the controller component, a heat exchange space is formed between the inner wall of the housing and the controller component, the heat dissipation component is arranged in the heat exchange space, and the heat dissipation component is connected to the outside

[0007] Optionally, the heat dissipation component includes a protrusion, which is arranged on a side of the accommodating cavity away from the controller component. The protrusion is formed by being recessed from the bottom of the shell toward the side of the accommodating cavity, and a concave cavity is formed at the bottom of the shell. A baffle is arranged in the concave cavity, and the baffle forms a circuitous cooling channel in the concave cavity. A through hole is opened on the protrusion.

[0008] Optionally, the heat dissipation assembly includes a protrusion, which is arranged on a side of the accommodating cavity away from the controller assembly, and the protrusion forms a concave cavity facing the controller assembly on the outer shell. A cooling channel is arranged on the protrusion, and the cooling channel is connected to a liquid inlet and a liquid outlet.

[0009] Optionally, the housing has a vent, which is arranged on a side of the accommodating cavity away from the controller component, and is connected to the heat dissipation component.

[0010] Optionally, a plurality of the support members are distributed in the accommodating cavity in a rectangular array.

[0011] Optionally, the housing includes a shell and a cover, the shell and the cover are detachably connected, and a seal is provided between the cover and the shell.

[0012] Optionally, a cooling channel, a liquid inlet and a liquid outlet are provided in the cover body, the cooling channel is arranged on a side of the cover body close to the controller component, and the liquid inlet and the liquid outlet are respectively connected to the cooling channel.

[0013] Optionally, a temperature monitor is provided in the accommodating cavity, and the temperature monitor is signal-connected to the heat dissipation component.

[0014] According to a second aspect of the present application, an electronic device is provided, which includes the controller component and the controller component accommodating structure as described above.

[0015] In an embodiment of the present application, the controller assembly is supported by a support member to form a heat exchange space in the accommodating cavity, thereby increasing the flow space for hot and cold air. In addition, a heat dissipation assembly is arranged in the heat exchange space to accelerate the air flow speed in the accommodating cavity, thereby reducing the temperature in the accommodating cavity and effectively improving the heat dissipation efficiency.

[0016] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0018] Figure 1 is a three-dimensional diagram of the controller assembly housing structure in an embodiment of the present application;

[0019] Figure 2 is a cross-sectional schematic diagram of the controller component housing structure in an embodiment of the present application;

[0020] Figure 3 yes Figure 2 Front view of the mid-section structure.

[0021] Description of reference numerals:

[0022] 1-housing; 11-accommodation cavity; 12-heat exchange space; 13-recessed cavity; 14-vent; 15-shell; 16-cover; 17-seal;

[0023] 2-heat dissipation device; 21-support member; 22-heat dissipation assembly; 221-protrusion; 222-baffle; 3-controller assembly. DETAILED DESCRIPTION

[0024] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0025] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0026] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0027] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0028] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0029] According to one embodiment of the present application, a controller component accommodating structure is provided, which includes a shell 1 and a heat dissipation device 2, wherein the shell 1 has a accommodating cavity 11, and a controller component 3 is arranged in the accommodating cavity 11; the heat dissipation device 2 is arranged in the accommodating cavity 11, and the controller component 3 is arranged on the heat dissipation device 2, wherein the heat dissipation device 2 includes a support member 21 and a heat dissipation assembly 22, the support member 21 is arranged in the accommodating cavity 11, and the support member 21 is used to support the controller component 3, a heat exchange space 12 is formed between the inner wall of the shell 1 and the controller component 3, and the heat dissipation assembly 22 is arranged in the heat exchange space 12, and the heat dissipation assembly 22 is connected to the outside.

[0030] like Figures 1 to 3As shown, the housing 1 is in a rectangular block shape and has a rectangular receiving cavity 11 therein. The receiving cavity 11 is used to place the controller assembly 3.

[0031] The heat dissipation device 2 is arranged in the accommodating cavity 11. The heat generated by the controller component 3 during operation is released to the outside of the housing 1 through the heat dissipation device 2 to reduce the temperature in the accommodating cavity 11 and effectively prolong the service life of the controller component 3.

[0032] like Figures 1 to 3 As shown, the heat sink 2 includes a support member 21. The support member 21 is columnar, with the bottom of the support member 21 fixed to the bottom of the accommodating cavity 11. The top of the support member 21 can be connected to the controller assembly 3 by bonding, screwing, or other methods. The provision of multiple support members 21 can enhance the stability of the controller assembly 3 within the accommodating cavity 11, preventing the controller assembly 3 from falling and causing damage during use of the device.

[0033] The controller component 3 is supported by the support member 21 so that the controller component 3 is located in the upper middle part of the accommodating cavity 11, and a heat exchange space 12 is formed in the accommodating cavity 11 and below the controller component 3, providing flow space for the exchange of hot and cold air, accelerating the air flow speed in the accommodating cavity 11, thereby reducing the temperature in the accommodating cavity 11 and effectively improving the heat dissipation efficiency.

[0034] like Figures 1 to 3 As shown, four support members 21 are respectively arranged at the four corners of the rectangular accommodating cavity 11 , and the heat dissipation device 2 is arranged in the accommodating cavity 11 and is located between the four support members 21 .

[0035] The heat dissipation device 2 also includes a heat dissipation assembly 22, which can be a heat sink, heat-absorbing material, heat dissipation holes, cooling structure, etc. By arranging the heat dissipation assembly 22 between the multiple support members 21, the heat dissipation assembly 22 and the controller assembly 3 are arranged vertically or / and horizontally, effectively increasing the contact area between the heat dissipation assembly 22 and the controller assembly 3 and improving heat dissipation efficiency.

[0036] Of course, in the embodiment of the present application, the heat dissipation assembly 22, the support member 21, and the controller assembly 3 are not limited to the above-described structures, and those skilled in the art can configure them according to actual needs. For example, multiple support members 21 are dispersed within the accommodating cavity 11, and the controller assembly 3 is supported by the multiple support members 21, and the heat dissipation assembly 22 can be arranged around the support members 21.

[0037] The heat dissipation component 22 and the controller component 3 are arranged along the axial direction of the support member 21. That is, the support member 21 can be a cylindrical structure such as a cylinder, a prism or an elliptical cylinder. For example, the opposite ends of the support member 21 are respectively connected to the bottom of the accommodating cavity 11 and the controller component 3, and the heat dissipation component 22 is located between the bottom of the accommodating cavity 11 and the controller component 3, that is, Figures 1 to 3 As shown, the heat dissipation component 22 and the controller component 3 are arranged in the accommodating cavity 11 at upper and lower positions.

[0038] In the embodiment of the present application, the controller component 3 is supported by the support member 21, so that a heat exchange space 12 is formed in the accommodating cavity 11, thereby increasing the flow space of hot and cold air. In addition, by arranging a heat dissipation component 22 in the heat exchange space 12, the cold air outside the shell 1 is accelerated to enter the accommodating container 11, so as to speed up the air flow speed in the accommodating cavity 11, improve the heat exchange efficiency, reduce the temperature in the accommodating cavity 11, and effectively improve the heat dissipation efficiency.

[0039] In one example, the heat dissipation component 22 includes a protrusion 221, which is arranged on the side of the accommodating cavity 11 away from the controller component 3, and is recessed from the bottom of the shell 1 to the side of the accommodating cavity 11 to form the protrusion 221, and a concave cavity 13 is formed at the bottom of the shell 1, and a baffle 222 is arranged in the concave cavity 13, and the baffle 222 forms a circuitous cooling channel in the concave cavity 13, and a through hole is opened on the protrusion 221.

[0040] like Figures 1 to 3 As shown, the heat dissipation assembly 22 is a protrusion 221 disposed within the accommodating cavity 11. The protrusion 221 is a projection formed by the bottom of the housing 1 being recessed into the accommodating cavity 11 and formed within the accommodating cavity 11. The protrusion 221 can be integrally formed with the housing 1, or can be realized by machining the housing 1.

[0041] The protrusion 221 located in the accommodating cavity 11 is arranged corresponding to the controller component 3, that is, Figures 1 to 3 As shown, the controller assembly 3 is disposed in the upper middle portion of the accommodating cavity 11 through the support member 21 , and the protrusion 221 is located at the bottom of the accommodating cavity 11 .

[0042] A plurality of through holes are provided on the protrusion 221 . Compared with providing through holes on the bottom of the housing 1 , the addition of the protrusion 221 can effectively increase the number of through holes, thereby increasing the flow speed of hot and cold air and improving the heat exchange efficiency in the accommodating cavity 11 .

[0043] A baffle 222 is provided in the concave cavity 13 formed by the protrusion 221 and communicating with the outside. The baffle 222 is used to prevent external impurities from entering the accommodating cavity 11 through the through hole and causing damage to the controller component 3 .

[0044] Of course, in the embodiment of the present application, the heat dissipation component 22 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, the heat dissipation component 22 can also be a heat dissipation plate, etc.

[0045] In one example, the heat dissipation component 22 includes a protrusion 221, which is arranged on a side of the accommodating cavity 11 away from the controller component 3, and the protrusion 221 forms a concave cavity 13 facing the controller component 3 on the outer shell 1, and a cooling channel is arranged on the protrusion 221, and the cooling channel is connected to a liquid inlet and a liquid outlet.

[0046] In the embodiment of the present application, the heat dissipation assembly 22 is disposed on a protruding portion 221 in the accommodating cavity 11. The protruding portion 221 is a protrusion formed in the accommodating cavity 11 by the housing 1 being recessed into the accommodating cavity 11.

[0047] The protrusion 221 located in the accommodating cavity 11 is arranged corresponding to the controller component 3, that is, Figures 1 to 3 As shown, the controller assembly 3 is disposed in the upper middle portion of the accommodating cavity 11 through the support member 21 , and the protrusion 221 is located at the bottom of the accommodating cavity 11 .

[0048] A cooling channel is arranged on the protrusion 221, and a cooling medium is injected into the cooling channel through the liquid inlet to absorb the heat energy in the accommodating cavity 11. The cooling medium after absorbing the heat energy is discharged from the cooling channel through the liquid outlet for circulation, thereby releasing the heat energy in the accommodating cavity 11. By arranging the protrusion 221 in the accommodating cavity 11 and arranging the cooling channel on the protrusion 221, compared with arranging the cooling channel on the bottom of the shell 1, the protrusion 221 can effectively increase the flow path of the cooling medium. In addition, the protrusion 221 forms multiple surfaces in the accommodating cavity 11. The cooling channel is arranged on the protrusion 221, so that the cooling medium can simultaneously absorb the heat energy in multiple directions in the accommodating cavity 11, accelerate the heat absorption speed, and improve the heat dissipation efficiency.

[0049] In one example, the housing 1 has a vent 14 , which is disposed on a side of the accommodating cavity 11 away from the controller assembly 3 , and the vent 14 is communicated with the heat dissipation assembly 22 .

[0050] In the embodiment of the present application, the heat dissipation component 22 can be a heat dissipation device such as a heat dissipation fan.

[0051] like Figures 1 to 3 As shown, the controller assembly 3 is supported by the support member 21 and is located in the upper middle portion of the accommodating cavity 11 , with a heat exchange space 12 formed below the controller assembly 3 and between the multiple support members 21 .

[0052] A vent 14 is provided at the bottom of the accommodating chamber 11, and a cooling fan is provided in the heat exchange space 12 and communicated with the vent 14. When the cooling fan is started, the hot air in the accommodating chamber 11 is exchanged with the cold air outside through the vent 14, thereby achieving heat dissipation.

[0053] In one example, the plurality of support members 21 are distributed in the accommodating cavity 11 in a rectangular array.

[0054] like Figures 1 to 3 As shown, the housing 1 is rectangular and has a rectangular housing 11 therein. Support members 21 are columnar structures. Four support members 21 are disposed at the four corners of the housing 11, supporting the controller assembly 3 so that the controller assembly 3 is located in the upper middle portion of the housing 11, thereby forming a heat exchange space 12 within the housing 11.

[0055] By distributing multiple support members 21 in a rectangular array in the accommodating cavity 11, not only can the stability of the controller component 3 during the suspension process be effectively enhanced, but also the internal space of the accommodating cavity 11 can be fully utilized, reducing the impact of the support members 21 on the layout of the heat dissipation component 22 in the accommodating cavity 11.

[0056] For example, the heat dissipation component 22 is a heat sink. By arranging multiple support members 21 at the four corners of the rectangular accommodating cavity 11, the heat sink can be concentrated under the controller component 3 to increase the contact area between the heat sink and the controller component 3 and improve the heat dissipation efficiency.

[0057] By distributing multiple support members 21 in the accommodating cavity 11 to support the controller assembly 3, it is avoided that the controller assembly 3 is locally overheated and the heat dissipation effect is poor due to the centralized support of the controller assembly 3, which affects the use effect of the controller assembly 3.

[0058] Of course, in the embodiment of the present application, the support member 21 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, a plurality of the support members 21 are distributed in the accommodating cavity 11 in a circular array.

[0059] In one example, the housing 1 includes a shell 15 and a cover 16 . The shell 15 and the cover 16 are detachably connected, and a seal 17 is provided between the cover 16 and the shell 15 .

[0060] like Figures 1 to 3 As shown, the housing 1 is in the shape of a rectangular block and has a rectangular receiving cavity 11 therein. Of course, in the embodiment of the present application, the housing 1 and the receiving cavity 11 are not limited to the above structures, and those skilled in the art can configure them according to actual needs. For example, the housing 1 can be in the shape of a column, and the receiving cavity 11 can also be in the shape of a column.

[0061] Housing 1 includes a shell 15 with an opening at the top and a cover 16. Receiving chamber 11 is disposed within shell 15. Cover 16 is disposed on top of shell 15 and is detachably connected to shell 15. A seal 17 is disposed between cover 16 and shell 15 to seal receiving chamber 11 when cover 16 is connected to shell 15, thereby preventing impurities, liquids, and other contaminants from entering and potentially damaging controller assembly 3.

[0062] The cover body 16 and the shell 15 can be detachably connected by means of screws, snap connections, interference fits, etc. By setting the cover body 16 and the shell 15 to be detachably connected, it is convenient to inspect, maintain or replace parts of the components in the accommodating cavity 11, which not only reduces the difficulty of maintenance operations but also effectively reduces the equipment maintenance costs.

[0063] In one example, a cooling channel, a liquid inlet and a liquid outlet are provided in the cover body 16. The cooling channel is arranged on a side of the cover body 16 close to the controller component 3. The liquid inlet and the liquid outlet are respectively connected to the cooling channel.

[0064] like Figures 1 to 3 As shown, a cooling channel is arranged in the cover body 16, and a cooling medium is injected into the cooling channel through the liquid inlet, and the cooling medium that absorbs heat energy is discharged through the liquid outlet for circulation.

[0065] Support member 21 supports controller assembly 3, positioning it on the side of accommodating chamber 11 near cover 16. Heat energy from below controller assembly 3 is dissipated via heat dissipation assembly 22. Heat energy from the top of controller assembly 3 is dissipated via cooling channels within cover 16. Cooling channels within cover 16 and heat dissipation assembly 22 within accommodating chamber 11 dissipate heat from opposing sides of controller assembly 3, effectively improving heat dissipation efficiency.

[0066] Of course, in the embodiment of the present application, the cover 16 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, a heat sink, a heat absorbing material, or other heat dissipation component 22 can also be set in the cover 16.

[0067] In one example, a temperature monitor is provided in the accommodating cavity 11 , and the temperature monitor is signal-connected to the heat dissipation component 22 .

[0068] like Figures 1 to 3As shown, a temperature monitor is provided within the accommodating chamber 11 to monitor the temperature within the accommodating chamber 11. When the monitoring result is greater than or equal to a set value, the heat dissipation assembly 22 is activated to dissipate heat. When the monitoring result is less than the set value, the heat dissipation assembly 22 does not need to be activated. By providing a temperature monitor to activate the heat dissipation assembly 22 based on the temperature value within the accommodating chamber 11, not only is resource waste effectively reduced, but the heat dissipation assembly 22 can also be stopped when it is necessary to maintain the temperature within the accommodating chamber 11, thereby maintaining the normal operation of the controller assembly 3.

[0069] According to another embodiment of the present application, an electronic device is provided. The electronic device includes the controller component 3 and the controller component accommodating structure as described above.

[0070] like Figures 1 to 3 As shown, the above-mentioned small-volume controller component 3 accommodating mechanism is suitable for electronic equipment with the controller component 3, and the heat dissipation efficiency of the controller component 3 is effectively improved through the above-mentioned accommodating mechanism.

[0071] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A controller component accommodating structure, characterized in that: include: The housing (1) has a receiving cavity (11), wherein a controller component (3) is arranged in the receiving cavity (11); A heat dissipation device (2) is arranged in the accommodating cavity (11), and the controller component (3) is arranged on the heat dissipation device (2). The heat dissipation device (2) comprises a support member (21) and a heat dissipation assembly (22); the support member (21) is arranged in the accommodating cavity (11); the support member (21) is used to support the controller assembly (3); a heat exchange space (12) is formed between the inner wall of the housing (1) and the controller assembly (3); the heat dissipation assembly (22) is arranged in the heat exchange space (12), and the heat dissipation assembly (22) is connected to the outside.

2. The controller assembly accommodating structure according to claim 1, characterized in that: The heat dissipation component (22) includes a protrusion (221), which is arranged on a side of the accommodating cavity (11) away from the controller component (3), and is recessed from the bottom of the housing (1) toward one side of the accommodating cavity (11) to form the protrusion (221), and a concave cavity (13) is formed at the bottom of the housing (1), a baffle (222) is arranged in the concave cavity (13), and the baffle (222) forms a circuitous cooling channel in the concave cavity (13), and a through hole is opened on the protrusion (221).

3. The controller assembly accommodating structure according to claim 1, characterized in that: The heat dissipation assembly (22) comprises a protrusion (221), the protrusion (221) being arranged on a side of the accommodating cavity (11) away from the controller assembly (3), the protrusion (221) forming a concave cavity (13) facing the controller assembly (3) on the housing (1), and a cooling channel being arranged on the protrusion (221), the cooling channel being connected to a liquid inlet and a liquid outlet.

4. The controller assembly accommodating structure according to claim 1, characterized in that: The housing (1) has a vent (14), the vent (14) being arranged on a side of the accommodating cavity (11) away from the controller assembly (3), and the vent (14) being in communication with the heat dissipation assembly (22).

5. The controller assembly accommodating structure according to claim 1, characterized in that: The plurality of support members (21) are distributed in the accommodating cavity (11) in a rectangular array.

6. The controller assembly accommodating structure according to claim 1, characterized in that: The housing (1) comprises a shell (15) and a cover (16); the shell (15) and the cover (16) are detachably connected; a sealing member (17) is provided between the cover (16) and the shell (15).

7. The controller assembly accommodating structure according to claim 6, characterized in that: A cooling channel, a liquid inlet and a liquid outlet are provided in the cover body (16); the cooling channel is arranged on a side of the cover body (16) close to the controller component (3); the liquid inlet and the liquid outlet are respectively communicated with the cooling channel.

8. The controller assembly accommodating structure according to claim 1, characterized in that: A temperature monitor is provided in the accommodating cavity (11), and the temperature monitor is signal-connected to the heat dissipation component (22).

9. An electronic device, characterized in that: It comprises the controller component (3) and the controller component accommodating structure according to any one of claims 1 to 8.

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