Heat dissipation mainboard box

Abstract

The utility model belongs to the technical field of electric control devices, and particularly relates to a heat dissipation mainboard box which comprises a main box body assembly and an auxiliary box body assembly. The main box body assembly comprises main side plates, a main bottom plate and a heat insulation plate, the main side plates are connected to the main bottom plate, the heat insulation plate is arranged between the two main side plates and connected with the two main side plates, and the side face of each main side plate is provided with a main heat dissipation groove. The auxiliary box body assembly comprises a heat dissipation box, a supporting frame and a heat dissipation frame, the heat dissipation box is connected to the heat insulation plate, the supporting frame is arranged between the heat insulation plate and the heat dissipation frame and connected with the heat insulation plate and the heat dissipation frame, and a plurality of auxiliary heat dissipation grooves are formed in the side face of the heat dissipation box. According to the heat dissipation mainboard box, heat transfer is blocked through the heat insulation plate, heat dissipation is accelerated through the main heat dissipation grooves and the auxiliary heat dissipation grooves, the heat dissipation efficiency is improved, the temperature is reduced, continuous rising of the temperature in the mainboard box is effectively avoided, safety is improved, and aging of circuit elements in the mainboard box is slowed down.

Description

Technical Field

[0001] The utility model belongs to the technical field of electric control devices, and in particular relates to a heat dissipation mainboard box. Background Art

[0002] The electronic control mainboard box typically houses control or information processing components such as circuit boards, chips, and sensors. Wires connected to these components extend outside the box and connect to electrical devices, enabling the box to perform its electronic control functions. During operation, the circuit components within the mainboard box generate heat over time. If this heat is not dissipated promptly, the temperature inside the mainboard box can continue to rise, posing a safety hazard and accelerating the aging of the circuit components within. Utility Model Content

[0003] The purpose of the utility model is to provide a heat dissipation motherboard box, aiming to solve the technical problems in the prior art that the temperature inside the electronic control motherboard box is easily caused to continue to rise, which poses a safety hazard and easily accelerates the aging of circuit components inside the electronic control motherboard box.

[0004] To achieve the above-mentioned purpose, the heat dissipation motherboard box provided by the embodiment of the present utility model includes a main box body component and a sub-box body component, wherein the main box body component and the sub-box body component are arranged and connected in parallel;

[0005] The main box assembly includes a main side plate, a main bottom plate and a heat insulation plate. The main side plates are provided with two and are arranged parallel to each other. The main side plates are connected to the main bottom plate. The heat insulation plate is arranged between the two main side plates and is respectively connected to the two main side plates. Each side of the main side plate is provided with a main heat dissipation slot.

[0006] The auxiliary box assembly includes a heat dissipation box, a support frame and a heat dissipation frame. The heat dissipation box is connected to the heat insulation board. The support frame is arranged between the heat insulation board and the heat dissipation frame and is respectively connected to the heat insulation board and the heat dissipation frame. A plurality of auxiliary heat dissipation slots are provided on the side of the heat dissipation box.

[0007] As an optional solution of the present invention, there are multiple main heat dissipation slots, which are evenly arranged on the main side panels.

[0008] As an optional solution of the present invention, a fixing plate is provided at the bottom of the main side plate, two fixing plates are provided and are fixedly connected to the main side plate, and fixing holes are provided on the fixing plates.

[0009] As an optional solution of the present invention, a dust cover is provided on the top of the main side panel, and four dust covers are provided and arranged in parallel, and the four dust covers are all buckled and connected to the main side panel.

[0010] As an optional solution of the present invention, the main bottom plate is provided with a heat dissipation bottom hole, and there are two heat dissipation bottom holes, which are arranged in parallel and at intervals, and the heat dissipation bottom holes are arranged in a trapezoidal shape.

[0011] As an optional solution of the present invention, a circuit main board and a relay are fixedly connected to the inner side of the main base plate. The circuit main board is fixedly connected to the main base plate. The relay is electrically connected to the circuit main board. There are four relays, which are arranged in parallel and at intervals.

[0012] As an optional solution of the present invention, there are multiple auxiliary heat dissipation slots, which are evenly arranged on the heat dissipation box.

[0013] As an optional solution of the present invention, a top cover is provided on the top of the heat dissipation box, and the top cover is arranged on one side of the dust cover and is clamped with the heat dissipation box.

[0014] The above one or more technical solutions in the heat dissipation motherboard box provided by the embodiment of the utility model have at least one of the following technical effects:

[0015] The heat dissipation motherboard box provided in the present application includes a main box body assembly and a sub-box body assembly. The main box body assembly includes a main side panel, a main bottom panel and a heat insulation panel. The sides of the main side panels are provided with main heat dissipation slots. The sub-box body assembly includes a heat dissipation box, a support frame and a heat dissipation frame. The sides of the heat dissipation box are provided with multiple sub-heat dissipation slots. The heat insulation panel blocks the heat transfer, and the main heat dissipation slots and sub-heat dissipation slots are used to accelerate the heat dissipation efficiency, reduce the temperature, effectively avoid the temperature in the motherboard box from continuing to rise, improve safety, and slow down the aging of circuit components in the motherboard box. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 This is a structural schematic diagram of a heat dissipation motherboard box provided by an embodiment of the utility model.

[0018] Figure 2 This is a schematic diagram of the internal structure of the heat dissipation motherboard box provided by an embodiment of the utility model.

[0019] Figure 3 A three-dimensional diagram of the internal structure of the heat dissipation motherboard box provided in an embodiment of the present utility model.

[0020] Among them, the reference numerals in the figures are:

[0021] 1. Main box assembly; 2. Sub-box assembly;

[0022] 11. Main side panel; 12. Main bottom panel; 13. Heat shield; 14. Main heat sink; 15. Fixing plate; 16. Dust cover; 17. Heat dissipation bottom hole; 18. Circuit board; 19. Relay;

[0023] 21. Radiator box; 22. Support frame; 23. Radiator frame; 24. Auxiliary radiator slot; 25. Top cover. DETAILED DESCRIPTION

[0024] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0025] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0027] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0028] In one embodiment of the present invention, Figures 1 to 3As shown, a heat dissipation mainboard box is provided, which includes a main box body component 1 and a sub-box body component 2. The main box body component 1 and the sub-box body component 2 are arranged and connected in parallel.

[0029] The main box body assembly 1 includes a main side panel 11, a main bottom panel 12 and a heat insulation panel 13. Two main side panels 11 are provided and are arranged parallel to each other. The main side panel 11 is fixedly connected to the main bottom panel 12. The heat insulation panel 13 is arranged between the two main side panels 11 and is respectively fixedly connected to the two main side panels 11. A main heat dissipation groove 14 is provided on the side of each main side panel 11.

[0030] The auxiliary box assembly 2 includes a heat dissipation box 21, a support frame 22 and a heat dissipation frame 23. The heat dissipation box 21 is fixedly connected to the heat insulation board 13. The support frame 22 is arranged between the heat insulation board 13 and the heat dissipation frame 23, and is fixedly connected to the heat insulation board 13 and the heat dissipation frame 23 respectively. A plurality of auxiliary heat dissipation slots 24 are provided on the side of the heat dissipation box 21.

[0031] The heat dissipation motherboard box provided in the present application blocks heat transfer through the heat insulation plate 13 and accelerates heat dissipation through the main heat dissipation slot 14 and the auxiliary heat dissipation slot 24, thereby improving heat dissipation efficiency, reducing temperature, effectively avoiding continuous temperature increase in the motherboard box, improving safety, and slowing down the aging of circuit components in the motherboard box.

[0032] In another embodiment of the present invention, the heat dissipation mainboard box is provided with multiple main heat dissipation slots 14, which are evenly arranged on the main side plate 11. The provision of multiple main heat dissipation slots 14 improves the heat dissipation efficiency and reduces the temperature of the circuit components in the mainboard box.

[0033] In another embodiment of the present invention, a fixing plate 15 is provided at the bottom of the main side plate 11 of the heat dissipation mainboard box. Two fixing plates 15 are provided and are fixedly connected to the main side plate 11. Fixing holes are provided on the fixing plates 15. The main side plate 11 is fixed by the fixing plates 15.

[0034] In another embodiment of the present invention, a dust cover 16 is provided on the top of the main side panel 11 of the heat dissipation motherboard box. Four dust covers 16 are provided and arranged in parallel. The four dust covers 16 are all snap-fitted and connected to the main side panel 11, which is convenient for disassembling and inspecting the circuit components in the motherboard box.

[0035] In another embodiment of the present invention, the main bottom plate 12 of the heat dissipating motherboard box is provided with two heat dissipating bottom holes 17, which are arranged in parallel and spaced apart, and are arranged in a trapezoidal shape. The provision of heat dissipating bottom holes 17 improves heat dissipation efficiency and reduces the temperature of circuit components within the motherboard box.

[0036] In another embodiment of the present invention, a circuit board 18 and relays 19 are fixedly connected to the inner side of the main base plate 12 of the heat dissipation mainboard box. The circuit board 18 is fixedly connected to the main base plate 12, and the relays 19 are electrically connected to the circuit board 18. Four relays 19 are arranged in parallel and spaced apart. The four relays 19 are independently arranged and do not interfere with each other, and can independently control the circuit.

[0037] In another embodiment of the present invention, the heat dissipation mainboard box is provided with multiple auxiliary heat dissipation slots 24, which are evenly arranged on the heat dissipation box 21. The provision of multiple auxiliary heat dissipation slots 24 improves the heat dissipation efficiency and reduces the temperature of the circuit components in the mainboard box.

[0038] In another embodiment of the present invention, a top cover 25 is provided on the top of the heat dissipation box 21 of the heat dissipation motherboard box. The top cover 25 is arranged on one side of the dust cover 16 and is snap-connected with the heat dissipation box 21 to facilitate disassembly and maintenance of circuit components in the motherboard box.

[0039] The heat dissipation motherboard box provided in the present application blocks heat transfer through the heat insulation plate 13 and accelerates heat dissipation through the main heat dissipation slot 14 and the auxiliary heat dissipation slot 24, thereby improving heat dissipation efficiency, reducing temperature, effectively avoiding continuous temperature increase in the motherboard box, improving safety, and slowing down the aging of circuit components in the motherboard box.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation motherboard box, characterized in that: It includes a main box body component and a sub-box body component, wherein the main box body component and the sub-box body component are arranged and connected in parallel; The main box assembly includes a main side plate, a main bottom plate and a heat insulation plate. The main side plates are provided with two and are arranged parallel to each other. The main side plates are connected to the main bottom plate. The heat insulation plate is arranged between the two main side plates and is respectively connected to the two main side plates. Each side of the main side plate is provided with a main heat dissipation slot. The auxiliary box assembly includes a heat dissipation box, a support frame and a heat dissipation frame. The heat dissipation box is connected to the heat insulation board. The support frame is arranged between the heat insulation board and the heat dissipation frame and is respectively connected to the heat insulation board and the heat dissipation frame. A plurality of auxiliary heat dissipation slots are provided on the side of the heat dissipation box.

2. A heat dissipation motherboard box according to claim 1, characterized in that: There are multiple main heat dissipation slots, which are evenly arranged on the main side plate.

3. The heat dissipation motherboard box according to claim 1, characterized in that: A fixing piece is provided at the bottom of the main side plate. Two fixing pieces are provided and are both fixedly connected to the main side plate. Fixing holes are provided on the fixing pieces.

4. The heat dissipation motherboard box according to claim 1, characterized in that: A dust cover is provided on the top of the main side plate. Four dust covers are provided and arranged in parallel. The four dust covers are all buckled and connected to the main side plate.

5. The heat dissipation motherboard box according to claim 1, characterized in that: The main bottom plate is provided with heat dissipation bottom holes, two of the heat dissipation bottom holes are provided, and are arranged in parallel and at intervals, and the heat dissipation bottom holes are arranged in a trapezoidal shape.

6. The heat dissipation motherboard box according to claim 1, characterized in that: A circuit main board and a relay are fixedly connected to the inner side of the main base plate. The circuit main board is fixedly connected to the main base plate. The relay is electrically connected to the circuit main board. Four relays are provided and are arranged in parallel and at intervals.

7. The heat dissipation motherboard box according to claim 1, characterized in that: There are multiple auxiliary heat dissipation slots, which are evenly arranged on the heat dissipation box.

8. The heat dissipation motherboard box according to claim 4, characterized in that: A top cover is provided on the top of the heat dissipation box. The top cover is arranged on one side of the dust cover and is clamped with the heat dissipation box.

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