Ceramic chip warping degree and thickness detection all-in-one machine

Abstract

The utility model relates to a ceramic chip warping degree and thickness detection all-in-one machine which comprises a feeding streamline, a stepping type carrying unit, a warping degree detection unit, a thickness detection unit, a centering unit, a discharging unit, a discharging bin and a plurality of NG bins. The stepping type carrying unit conveys ceramic chips in a stepping mode along a first horizontal shaft and enables the ceramic chips to sequentially pass through the feeding streamline, the warping degree detection unit, the thickness detection unit and the centering unit. The discharging unit moves ceramic chips from the centering unit into the discharging bin or any one of the NG bins, the discharging bin and all the NG bins are arranged around the centering unit, and the discharging unit comprises a mechanical arm support straddling the centering unit and a multi-axis mechanical arm arranged on the upper portion of the mechanical arm support in a hanging mode. The ceramic chip warping degree and thickness detection all-in-one machine is compact in structure, and can rapidly detect the warping degree and the thickness of the ceramic chip and complete sorting.

Description

Technical Field

[0001] The utility model relates to the technical field of sorting equipment, in particular to an all-in-one machine for detecting the warpage and thickness of ceramic pieces. Background Art

[0002] Ceramic wafers, a crucial component of new energy power semiconductor packaging materials, are subject to extremely complex manufacturing processes and low yield rates. This process can easily lead to product defects, significantly impacting performance. In practical applications, both the warpage and thickness of ceramic wafers must be inspected.

[0003] Chinese patent CN110125026A discloses a thickness measurement device that uses a stepping robot to transport products to a thickness detection device for testing, and then places them on a conveyor belt. This device only measures thickness and marks products, and cannot detect warpage simultaneously or immediately sort products. Therefore, separate warpage measurement and sorting equipment are required to complete these operations, increasing equipment costs and occupying additional factory space.

[0004] Chinese patent CN219804995U discloses a line-scanning warpage detection device, which only has the functions of warpage detection and unqualified product output. The unqualified product output can only be completed based on the distinction of one parameter, warpage, and has a single function.

[0005] Therefore, it is necessary to provide a new detection device to solve the above problems. Utility Model Content

[0006] The main purpose of the utility model is to provide an all-in-one machine for detecting the warpage and thickness of ceramic sheets, which has a compact structure and can quickly detect the warpage and thickness of ceramic sheets and perform sorting.

[0007] The present invention achieves the above-mentioned purpose through the following technical solutions: a ceramic sheet warping and thickness detection integrated machine, comprising a feeding streamline, a step-by-step transport unit, a warping detection unit, a thickness detection unit, a centering unit, a unloading unit, an unloading bin and several NG bins, wherein the step-by-step transport unit conveys the ceramic sheet in steps along the first horizontal axis and passes the ceramic sheet through the feeding streamline, the warping detection unit, the thickness detection unit and the centering unit in sequence; the unloading unit moves the ceramic sheet from the centering unit to the unloading bin or any NG bin, the unloading bin and all NG bins are arranged around the centering unit, and the unloading unit comprises a manipulator bracket straddling the centering unit and a multi-axis manipulator suspended on the upper part of the manipulator bracket.

[0008] Specifically, it also includes a loading bin and a loading unit, and the loading unit moves the ceramic pieces from the loading bin to the feeding flow line along the second horizontal axis, and the first horizontal axis and the second horizontal axis are perpendicular to each other.

[0009] Furthermore, the loading bin includes a blocking portion and a lifting cylinder for driving the blocking portion to rise and fall.

[0010] Furthermore, the loading unit includes a gantry straddling the feeding flow line and the loading bin, a loading translation module arranged on the upper part of the gantry, a loading lifting module driven by the loading translation module to move along the second horizontal axis, and a loading suction head driven to rise and fall by the loading lifting module, and the loading suction head moves between above the loading bin and above the feeding flow line.

[0011] Specifically, the unloading bin includes an enclosure portion and a lifting cylinder for driving the enclosure portion to rise and fall.

[0012] Specifically, the centering unit includes a centering adsorption platform and a centering clamp, and the centering clamp centers the ceramic piece on the centering adsorption platform from four sides.

[0013] Specifically, the warpage detection unit includes a detection adsorption platform, a line scanning mechanism and a flipping mechanism;

[0014] The line scanning mechanism includes a bracket located on one side of the detection adsorption platform, a scanning translation module provided on the upper part of the bracket, and a line laser sensor driven by the scanning translation module to move along the second horizontal axis, wherein the line laser sensor detects the relative height of the reflective surface downward;

[0015] The flipping mechanism is located on the second horizontal axis side of the detection adsorption platform, and includes a lifting drive member, a telescopic drive member driven to lift and lower by the lifting drive member, a flipping motor driven to extend and retract along the second horizontal axis by the telescopic drive member, and a fine-motion clamp driven to rotate around the second horizontal axis by the flipping motor. The detection adsorption platform is provided with a notch on the side close to the fine-motion clamp.

[0016] Furthermore, the warpage detection unit also includes a first in-position sensor. A through hole is provided in the middle of the detection adsorption platform. The first in-position sensor is located below the detection adsorption platform and detects whether the ceramic sheet is placed on the detection adsorption platform through the through hole.

[0017] Specifically, the thickness detection unit includes a thickness measuring adsorption platform, a surface scanning thickness measuring mechanism and a second in-position sensor; a hollow hole corresponding to the thickness measuring range is provided in the middle of the thickness measuring adsorption platform, and the surface scanning thickness measuring mechanism includes a first horizontal module, a second horizontal module and a thickness measuring sensor. The first horizontal module and the second horizontal module control the thickness measuring sensor to translate in the horizontal plane, and the thickness measuring sensor measures the thickness of the ceramic sheet in the hollow hole by upward and downward shooting.

[0018] Furthermore, the thickness detection unit further includes a second in-position sensor, which is located below the thickness measuring adsorption platform and detects whether the ceramic sheet is placed on the thickness measuring adsorption platform through the hollow hole.

[0019] The beneficial effects of the technical solution of this utility model are:

[0020] The ceramic sheet warpage and thickness detection integrated machine has a compact structure and can quickly detect the warpage and thickness of ceramic sheets and complete sorting. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional diagram of the core components of the ceramic wafer warpage and thickness detection integrated machine according to the embodiment;

[0022] Figure 2 This is a diagram showing the relative positions of the step-by-step transport unit, the feed flow line, and each adsorption station;

[0023] Figure 3 This is a diagram showing the relative positions of the loading bin, feeding flow line and loading unit;

[0024] Figure 4 is a three-dimensional diagram of the warpage detection unit;

[0025] Figure 5 is a three-dimensional diagram of a thickness detection unit;

[0026] Figure 6 This is a positional relationship diagram of the multi-axis robot, centering unit, unloading bin, and all NG bins.

[0027] The numbers in the figure represent:

[0028] 100-ceramic sheet warpage thickness detection machine,

[0029] 1a-upper silo, 1b-lower silo, 11-enclosure, 12-lifting cylinder;

[0030] 2-feeding line, 21-belt conveyor line, 22-blocking block;

[0031] 3- loading unit, 31- gantry, 32- loading translation module, 33- loading lifting module, 34- loading suction head;

[0032] 4-stepping transport unit, 41-transport lifting module, 42-transport translation module, 43-strip fixing plate, 44-suction cup rack;

[0033] 5-warpage detection unit, 51-detection adsorption platform, 511-notch, 512-perforation, 52-line scanning mechanism, 521-bracket, 522-scanning translation module, 523-line laser sensor, 53-flipping mechanism, 531-lifting drive element, 532-telescopic drive element, 533-flipping motor, 534-micro-gripper, 54-first in-position sensor;

[0034] 6-thickness detection unit, 61-thickness measurement adsorption platform, 611-hollow hole, 62-surface scanning thickness measurement mechanism, 621-first horizontal module, 622-second horizontal module, 623-thickness measurement sensor, 63-second in-position sensor;

[0035] 7-centering unit, 71-centering adsorption platform, 72-centering clamp;

[0036] 8-unloading unit, 81-manipulator bracket, 82-multi-axis manipulator;

[0037] 9-NG warehouse;

[0038] 200-ceramic pieces. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below with reference to specific embodiments.

[0040] Example:

[0041] like Figure 1 As shown, the utility model discloses an integrated machine 100 for detecting warpage and thickness of ceramic sheets, comprising a loading bin 1a, a feeding line 2, a loading unit 3, a step-by-step transport unit 4, a warpage detection unit 5, a thickness detection unit 6, a centering unit 7, a discharge unit 8, a discharge bin 1b, and several NG bins 9. The step-by-step transport unit 4 conveys ceramic sheets 200 in a stepwise manner along a first horizontal axis and sequentially passes through the feeding line 2, the warpage detection unit 5, the thickness detection unit 6, and the centering unit 7. The loading unit 3 moves the ceramic sheets 200 from the loading bin 1a to the feeding line 2 along a second horizontal axis, the first and second horizontal axes being perpendicular to each other. The discharge unit 8 moves the ceramic sheets 200 from the centering unit 7 to the discharge bin 1b or any NG bin 9.

[0042] The upper bin 1a is used for feeding ceramic sheets, and the lower bin 1b is used for discharging good products. The structures of the two are basically the same, and both include an enclosure 11 and a lifting cylinder 12 that drives the enclosure 11 to rise and fall. The upper bin 1a and the lower bin 1b are only used to perform progressive raising and progressive lowering actions respectively to comply with the height of the ceramic sheets 200 for taking or placing. The enclosure 11 prevents the stacked ceramic sheets 200 from collapsing, and the lifting cylinder 12 realizes the lifting action. The loading unit 3 is used to move the ceramic sheets 200 from the upper bin 1a to the feeding section of the feeding streamline 2, and the step-by-step transport unit 4 is used to move the ceramic sheets 200 from the discharging section of the feeding streamline 2 and pass through the warping detection unit 5 and the thickness detection unit 6 in sequence, and finally send them to the centering unit 7. The centering unit 7 centers the position of the ceramic sheets 200. The NG bin 9 is used to classify and discharge defective products. The unloading unit 8 is used to move the inspected ceramic pieces 200 from the centering unit 7 to the unloading bin 1 b or each NG bin 9 .

[0043] like Figure 1 and Figure 2 As shown, the loading unit 3 includes a gantry 31 that straddles the feed line 2 and the loading bin 1a, a loading translation module 32 located above the gantry 31, a loading elevating module 33 driven by the loading translation module 32 to move along a second horizontal axis, and a loading suction head 34 driven up and down by the loading elevating module 33. The loading suction head 34 moves between above the loading bin 1a and above the feed line 2. The feed line 2 includes a belt conveyor line 21 that conveys ceramic tiles 200 along a first horizontal axis, and a blocking block 22 located at the outlet of the belt conveyor line 21.

[0044] Although the ceramic sheet 200 can be fed directly from other production lines at the inlet of the feed line 2, the loading unit 3 provides another way of automatic loading through the loading bin 1a. The loading suction head 34 is used to suck a ceramic sheet 200 from the top of the loading bin 1a and then place it in the feeding section of the feed line 2. The loading translation module 32 is used to realize the translation movement of the loading suction head 34 along the second horizontal axis during the suction and release process. The loading lifting module 33 is used to realize the lifting and lowering movement of the loading suction head 34 during the suction and release process. The belt conveyor line 21 is used to horizontally transport the ceramic sheet 200, and the blocking block 22 is used to determine the final stop position of the ceramic sheet 200 on the belt conveyor line 21, so that it can be sucked by the first suction cup rack.

[0045] like Figure 2The step-by-step transport unit 4 includes a transport lifting module 41, a transport translation module 42, a strip-shaped fixed plate 43, and three suction cup racks 44. The length direction of the strip-shaped fixed plate 43 is along the first horizontal axis, and the three suction cup racks 44 are fixed to the strip-shaped fixed plate 43 with the step distance as the center distance. The transport lifting module 41 drives the transport translation module 42 to rise and fall, and the transport translation module 42 drives the strip-shaped fixed plate 43 to translate along the first horizontal axis. The spacing between adjacent adsorption platforms is no less than the width of the suction cup rack 44. The detection adsorption platform 51, the thickness measurement adsorption platform 61, and the centering adsorption platform 71 are distributed equidistantly in the pick-up and placement positions of the step-by-step transport unit 4.

[0046] The transfer of the ceramic wafer 200 between the suction stations is accomplished by the step-by-step transport unit 4. Each time the suction cup holders 44 descend to absorb the ceramic wafer 200, the transport lift module 41 is responsible for synchronously raising and lowering the three suction cup holders 44, while the transport translation module 42 is responsible for synchronously translating the three suction cup holders 44 (along the first horizontal axis). During warpage and thickness testing, the suction cup holders 44 must be staggered relative to the ceramic wafer 200, otherwise the scanning of the line scanning mechanism 52 and the surface scanning thickness measurement mechanism 62 will be affected. Therefore, the suction cup holders 44 must be positioned centrally between adjacent suction stations. Therefore, the width of the suction cup holders 44 cannot be greater than the spacing between the suction stations.

[0047] like Figure 4 As shown, the warpage detection unit 5 includes a detection adsorption platform 51, a line scanning mechanism 52, a flipping mechanism 53, and a first in-position sensor 54. The line scanning mechanism 52 includes a bracket 521 located on one side of the detection adsorption platform 51, a scanning translation module 522 provided on the upper portion of the bracket 521, and a line laser sensor 523 driven by the scanning translation module 522 to move along the second horizontal axis. The line laser sensor 523 detects the relative height of the reflective surface downward. The flipping mechanism 53 is located on the second horizontal axis side of the detection adsorption platform 51 and includes a lifting drive 531, a telescopic drive 532 driven to lift and lower by the lifting drive 531, a flipping motor 533 driven to extend and retract along the second horizontal axis by the telescopic drive 532, and a micro-grip 534 driven to rotate around the second horizontal axis by the flipping motor 533. The detection adsorption platform 51 has a notch 511 on one side near the fine-motion clamping jaw 534 and a through hole 512 in the middle. The first in-position sensor 54 is located below the detection adsorption platform 51 and detects whether the ceramic sheet 200 is placed on the detection adsorption platform 51 through the through hole 512.

[0048] The detection adsorption platform 51 is used to support and adsorb the ceramic sheet 200 during the warpage detection process. The line laser sensor 523 is used to move and scan the ceramic sheet 200 along the second horizontal axis. During this process, the height of the line laser sensor 523 remains unchanged. When a ceramic sheet 200 is placed on the detection adsorption platform 51, the first in-position sensor 54 will send an in-position signal due to light path obstruction, thereby guiding the detection adsorption platform 51 to adsorb the ceramic sheet 200 to prevent the ceramic sheet 200 from moving arbitrarily during the warpage detection process. The flipping mechanism 53 is used to flip the ceramic sheet 200 180° before the reverse side detection, and to make the other side of the ceramic sheet 200 face up. The notch 511 is used to provide a position for the micro-grip 534 to move to the lower surface of the ceramic sheet 200, so that the micro-grip 534 can clamp both sides of the ceramic sheet 200, and then the flipping motor 533 is used to complete the flipping of the ceramic sheet 200. During the warpage test, the telescopic drive 532 is used to retract the fine-motion clamp 534 out of the scanning range; during the flipping, the lifting drive 531 will stagger the height of the detection adsorption platform 51 and the fine-motion clamp 534, so that the ceramic sheet 200 will not be knocked off or tilted by the detection adsorption platform 51 during the flipping process. When the line laser sensor 523 reaches one end of the ceramic sheet 200, it will obtain a height difference H2. If it continues to move, the line laser sensor 523 will detect the height difference H1 between it and the upper surface of the detection adsorption platform 51. If the theoretical length of the ceramic sheet 200 is L0 and the theoretical thickness is H0, the warpage is In this embodiment, the warpage is measured for both the front and back states of the ceramic sheet 200. Because the ceramic sheet 200 may be twisted and deformed during the manufacturing process, the warpage measurement can be used to distinguish the degree of twisting and deformation of the ceramic sheet 200.

[0049] like Figure 5 As shown, the thickness detection unit 6 includes a thickness measurement adsorption platform 61, a surface scanning thickness measurement mechanism 62, and a second in-position sensor 63. A hollow hole 611 corresponding to the thickness measurement range is provided in the center of the thickness measurement adsorption platform 61. The surface scanning thickness measurement mechanism 62 includes a first horizontal module 621, a second horizontal module 622, and a thickness measurement sensor 623. The first and second horizontal modules 621 and 622 control the translation of the thickness measurement sensor 623 within the horizontal plane. The thickness measurement sensor 623 measures the thickness of the ceramic sheet 200 within the hollow hole 611 by means of up and down beaming. The second in-position sensor 63 is located below the thickness measurement adsorption platform 61 and detects whether the ceramic sheet 200 is placed on the thickness measurement adsorption platform 61 through the hollow hole 611.

[0050] The thickness measuring adsorption platform 61 is used to support and adsorb the ceramic sheet 200 during the thickness detection process. The first horizontal module 621 and the second horizontal module 622 are generally arranged to be stacked orthogonally and move the surface scanning thickness measuring mechanism 62 along the first horizontal axis and the second horizontal axis respectively. When a ceramic sheet 200 is placed on the thickness measuring adsorption platform 61, the second in-position sensor 63 will send an in-position signal due to the obstruction of the light path, thereby guiding the thickness measuring adsorption platform 61 to adsorb the ceramic sheet 200 to prevent the ceramic sheet 200 from moving arbitrarily during the thickness detection process. The scanning range of the surface scanning thickness measuring mechanism 62 is within the hollow hole 611. Since the lower surface of the ceramic sheet 200 is not blocked at this time, the actual value of the plate thickness is measured. Since the ceramic sheet 200 may be uneven in thickness during the manufacturing process, the flatness of the ceramic sheet 200 can be known by continuous measurement of the plate thickness.

[0051] like Figure 6 As shown, the centering unit 7 includes a centering adsorption platform 71 and a centering clamp 72 . The centering clamp 72 centers the ceramic sheet 200 on the centering adsorption platform 71 from four sides.

[0052] The angle of the ceramic sheet 200 may change after the previous detection. In order to ensure that the unloading unit 8 can correctly absorb the ceramic sheet 200 and put it into the unloading bin 1b or an NG bin 9, it is necessary to return to the center in advance.

[0053] like Figure 1 and Figure 6 As shown, the unloading bin 1b and all NG bins 9 are arranged around the centering unit 7. The unloading unit 8 includes a robot bracket 81 standing above the centering unit 7 and a multi-axis robot 82 suspended on the upper part of the robot bracket 81.

[0054] In order to make the equipment structure compact, the unloading bin 1b and all NG bins 9 should be installed nearby the centering unit 7 (except for one side occupied by the thickness detection unit 6, the other three sides can be set). Because the centering unit 7, the unloading bin 1b and the NG bin 9 have occupied the space below the equipment, the multi-axis robot 82 should be set above it so as not to conflict with the positions of other parts.

[0055] The working process of the ceramic wafer warpage thickness detection integrated machine 100 is as follows:

[0056] 1. A worker stacks the ceramic sheets 200 to be inspected on the loading bin 1a, which supplies the sheets upward. The loading suction head 34 removes a ceramic sheet 200 from the top of the loading bin 1a and then moves it to the feeding section of the feeding flow line 2. The loading bin 1a allows the remaining ceramic sheets 200 to rise a distance equal to the thickness of the ceramic sheet 200. The feeding flow line 2 moves the ceramic sheet 200 until it is blocked by the blocking block 22. At this point, the ceramic sheet 200 is located at the picking position of the first suction cup rack, which moves it to the inspection adsorption platform 51.

[0057] 2. When the first in-position sensor 54 senses that the ceramic sheet 200 has arrived on the detection adsorption platform 51, the detection adsorption platform 51 absorbs the ceramic sheet 200, and then the line laser sensor 523 performs the first scan. The detection information is uploaded to the control system to obtain the warpage of the front detection;

[0058] 3. The lifting drive 531 moves the fine-motion clamp 534 to the clamping height. Driven by the telescopic drive 532, the opened fine-motion clamp 534 extends to the notch 511 and then clamps the upper and lower surfaces of the ceramic sheet 200. The lifting drive 531 appropriately raises the height of the fine-motion clamp 534 so that the ceramic sheet 200 does not touch the detection adsorption platform 51 during the flipping. Then, the flip motor 533 flips the fine-motion clamp 534 holding the ceramic sheet 200 180°, and the ceramic sheet 200 is placed back on the detection adsorption platform 51 and withdrawn. The detection adsorption platform 51 then adsorbs the ceramic sheet 200. The line laser sensor 523 performs a second scan first, and the detection information is then uploaded to the control system to obtain the warpage of the reverse side detection.

[0059] 4. The second suction cup holder takes the ceramic sheet 200 from the detection adsorption platform 51 and places it on the thickness measurement adsorption platform 61. It is then sensed by the second in-position sensor 63 and the ceramic sheet 200 is then sucked by the thickness measurement adsorption platform 61.

[0060] 5. The first horizontal module 621 and the second horizontal module 622 drive the thickness measuring sensor 623 to move within the range of the hollow hole 611 (which can take a rectangular path), continuously scanning to obtain the thickness change value of the ceramic sheet 200. The detection information is then uploaded to the control system to obtain a sorting command;

[0061] 6. The third suction cup holder transfers the ceramic sheet 200 from the thickness measurement adsorption platform 61 to the centering adsorption platform 71. When the third suction cup holder places the ceramic sheet 200 on the centering adsorption platform 71, the centering jaws 72 are opened, and then the centering jaws 72 center the ceramic sheet 200 and then release.

[0062] 7. The multi-axis manipulator 82 places the ceramic sheets 200 into the unloading bin 1b or a NG bin 9 according to the sorting command. Every time a ceramic sheet 200 is placed into the unloading bin 1b, all the ceramic sheets 200 therein are lowered by the thickness of one ceramic sheet 200.

[0063] In summary, the ceramic sheet warpage and thickness detection integrated machine 100 has a compact structure and can quickly detect the warpage and thickness of ceramic sheets and complete sorting.

[0064] The above descriptions are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A ceramic sheet warpage thickness detection integrated machine, characterized by: It includes a feeding streamline, a step-by-step transport unit, a warping detection unit, a thickness detection unit, a centering unit, a unloading unit, a unloading bin and several NG bins. The step-by-step transport unit transports ceramic sheets along a first horizontal axis and makes the ceramic sheets pass through the feeding streamline, the warping detection unit, the thickness detection unit and the centering unit in sequence; the unloading unit moves the ceramic sheets from the centering unit to the unloading bin or any NG bin. The unloading bin and all NG bins are arranged around the centering unit. The unloading unit includes a manipulator bracket standing astride the centering unit and a multi-axis manipulator suspended on the upper part of the manipulator bracket.

2. The ceramic wafer warpage thickness detection integrated machine according to claim 1, characterized in that: The invention also includes a loading bin and a loading unit, wherein the loading unit moves the ceramic pieces from the loading bin to the feeding flow line along the second horizontal axis, and the first horizontal axis and the second horizontal axis are perpendicular to each other.

3. The ceramic wafer warpage thickness detection integrated machine according to claim 2, characterized in that: The loading bin includes a blocking portion and a lifting cylinder for driving the blocking portion to move up and down.

4. The ceramic wafer warpage thickness detection integrated machine according to claim 2, characterized in that: The loading unit includes a gantry that straddles the feeding flow line and the loading bin, a loading translation module arranged on the upper part of the gantry, a loading lifting module driven by the loading translation module to move along a second horizontal axis, and a loading suction head driven to rise and fall by the loading lifting module, and the loading suction head moves between above the loading bin and above the feeding flow line.

5. The ceramic wafer warpage thickness detection integrated machine according to claim 1, characterized in that: The unloading bin includes an enclosure portion and a lifting cylinder for driving the enclosure portion to rise and fall.

6. The ceramic wafer warpage thickness detection integrated machine according to claim 1, characterized in that: The centering unit includes a centering adsorption platform and a centering clamp. The centering clamp is used to center the ceramic sheet on the centering adsorption platform from four sides.

7. The ceramic wafer warpage thickness detection integrated machine according to claim 1, characterized in that: The warpage detection unit includes a detection adsorption platform, a line scanning mechanism and a flipping mechanism; The line scanning mechanism includes a bracket located on one side of the detection adsorption platform, a scanning translation module provided on the upper part of the bracket, and a line laser sensor driven by the scanning translation module to move along the second horizontal axis, wherein the line laser sensor detects the relative height of the reflective surface downward; The flipping mechanism is located on the second horizontal axis side of the detection adsorption platform, and includes a lifting drive member, a telescopic drive member driven to lift and lower by the lifting drive member, a flipping motor driven to extend and retract along the second horizontal axis by the telescopic drive member, and a fine-motion clamp driven to rotate around the second horizontal axis by the flipping motor. The detection adsorption platform is provided with a notch on the side close to the fine-motion clamp.

8. The ceramic wafer warpage thickness detection integrated machine according to claim 7, characterized in that: The warpage detection unit further includes a first in-position sensor. A through-hole is provided in the middle of the detection adsorption platform. The first in-position sensor is located below the detection adsorption platform and detects whether the ceramic sheet is placed on the detection adsorption platform through the through-hole.

9. The ceramic wafer warpage thickness detection integrated machine according to claim 1, characterized in that: The thickness detection unit includes a thickness measurement adsorption platform, a surface scanning thickness measurement mechanism and a second in-position sensor; a hollow hole corresponding to the thickness measurement range is provided in the middle of the thickness measurement adsorption platform, and the surface scanning thickness measurement mechanism includes a first horizontal module, a second horizontal module and a thickness measurement sensor. The first horizontal module and the second horizontal module control the thickness measurement sensor to translate in the horizontal plane, and the thickness measurement sensor measures the thickness of the ceramic sheet in the hollow hole by upward and downward shooting.

10. The ceramic wafer warpage thickness detection integrated machine according to claim 9, characterized in that: The thickness detection unit further includes a second in-position sensor, which is located below the thickness measurement adsorption platform and detects whether the ceramic sheet is placed on the thickness measurement adsorption platform through the hollow hole.

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