Groove type full-automatic silicon wafer cleaning equipment

Abstract

The utility model provides a groove-type full-automatic silicon wafer cleaning device which comprises a cleaning groove assembly, a silicon wafer cleaning device, a silicon wafer cleaning device, a silicon wafer cleaning device, a silicon wafer cleaning device, a silicon wafer cleaning device and a silicon wafer cleaning device, and is characterized in that the cleaning groove assembly is provided with a cleaning area; the first lifting mechanism and the second lifting mechanism are arranged on the two sides of the cleaning area, and a lifting basket used for containing silicon wafers is placed between the first lifting mechanism and the second lifting mechanism; and the pushing mechanism comprises a connecting rod, pushing blocks and sliding rods, the number of the sliding rods is two, the sliding rods are connected through the connecting rod, the pushing blocks are arranged at the front ends of the sliding rods, and inclined planes arranged on the different pushing blocks are in contact connection with the first lifting mechanism and the second lifting mechanism correspondingly. The first lifting mechanism and the second lifting mechanism serve as lifting assemblies of the lifting basket, the operation that the lifting basket enters a cleaning area to be lifted is reduced, and manual lifting or mechanical arm lifting is facilitated.

Description

Technical Field

[0001] The utility model belongs to the technical field of cleaning, and in particular relates to a trough-type fully automatic silicon wafer cleaning device. Background Art

[0002] Silicon wafer cleaning equipment mainly uses different types of cleaning fluids to clean silicon wafers. Usually, ultrasonic cleaning equipment is used as the main technical means, and an ultrasonic generator is used to generate vibrations to vibrate the cleaning fluid to complete the cleaning of the silicon wafers immersed in the cleaning fluid.

[0003] Most silicon wafer cleaning equipment in the existing technology does not have the function of lifting the basket. Usually, manual or multi-axis robotic arm simulation arms are required to place the basket into the cleaning tank. This process requires additional manpower or equipment workload. Utility Model Content

[0004] The utility model provides a trough-type fully automatic silicon wafer cleaning device, which aims to solve the problem that most current silicon wafer cleaning devices do not have a basket lifting function, and the basket taking and placing process requires additional manpower or equipment workload.

[0005] The utility model is realized as follows: a trough-type fully automatic silicon wafer cleaning device, comprising:

[0006] A cleaning tank assembly, wherein the cleaning tank assembly is provided with a cleaning area, and the cleaning area is provided with an ultrasonic generating device for generating ultrasonic waves;

[0007] a first lifting mechanism and a second lifting mechanism, wherein the first lifting mechanism and the second lifting mechanism are arranged on both sides of the cleaning area, and a basket for placing silicon wafers is placed between the first lifting mechanism and the second lifting mechanism;

[0008] The pushing mechanism includes a connecting rod, a pushing block and a sliding rod. The sliding rods are in two groups and are connected to each other through a connecting rod. The pushing block is provided at the front end of the sliding rod. The inclined surfaces on different pushing blocks are respectively in contact with the first lifting mechanism and the second lifting mechanism.

[0009] Preferably, the first lifting mechanism includes a side hanging plate, a connecting plate and a lifting block;

[0010] The side hanging plate and the lifting block are connected via a connecting plate, and the lifting block extends into the interior of the cleaning tank assembly and is in contact with and connected to the pushing mechanism.

[0011] Preferably, a lifting port is provided on the top of the cleaning tank assembly, and the lifting block extends from the lifting port into the interior of the cleaning tank assembly. The side hanging plate and the lifting block are arranged in parallel, and the side hanging plate extends into the interior of the cleaning area.

[0012] Preferably, the side hanging plate is provided with a support plate for carrying the basket.

[0013] Preferably, the first lifting mechanism and the second lifting mechanism are symmetrical structures and are respectively arranged on both sides of the cleaning area.

[0014] Preferably, the pushing block is provided with an inclined surface structure, the end surface of the lifting block away from the connecting plate is an inclined surface, and the inclined surface structure on the pushing block is in contact and connected with the end surface of the lifting block away from the connecting plate.

[0015] Preferably, a guide rail is provided inside the cleaning tank assembly, and the sliding rod slides on the guide rail.

[0016] Preferably, the pushing block and the guide rail are staggered so that the guide rail does not come into contact during the lifting process of the lifting block.

[0017] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0018] The trough-type fully automatic silicon wafer cleaning equipment provided by the present invention uses the first lifting mechanism and the second lifting mechanism as the lifting components of the basket, ensuring that the basket can completely leave the cleaning area under the lifting action of the first lifting mechanism and the second lifting mechanism, reducing the operation of entering the cleaning area to extract the basket, and facilitating extraction by manual or robotic arms. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The utility model is a structural diagram of a trough-type fully automatic silicon wafer cleaning device provided by the present invention.

[0020] Figure 2 The utility model provides a schematic diagram of the internal structure of a cleaning tank component of a tank-type fully automatic silicon wafer cleaning device.

[0021] Figure 3 The utility model provides a schematic diagram of the structure of a lifting component and a pushing mechanism of a trough-type fully automatic silicon wafer cleaning device.

[0022] Figure 4 The utility model provides a structural diagram of a driving mechanism in a trough-type fully automatic silicon wafer cleaning device.

[0023] Figure 5 The utility model provides a schematic diagram of the driving mechanism structure of a trough-type fully automatic silicon wafer cleaning device.

[0024] Figure 6 The utility model provides a schematic diagram of the structure of a lifting component of a trough-type fully automatic silicon wafer cleaning device.

[0025] Description of reference numerals:

[0026] 100, cleaning tank assembly; 101, cleaning area; 110, water inlet pipe; 120, water outlet pipe; 200, basket;

[0027] 300, lifting assembly; 310, first lifting mechanism; 311, side hanging plate; 312, connecting plate; 313, lifting block; 314, limit stopper; 320, second lifting mechanism;

[0028] 400, pushing mechanism; 410, guide rail; 420, connecting rod; 430, pushing block; 440, sliding rod. DETAILED DESCRIPTION

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0030] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] The present invention provides a fully automatic silicon wafer cleaning device. Figures 1-6 As shown, the tank-type fully automatic silicon wafer cleaning equipment includes:

[0032] A cleaning tank assembly 100 is provided with a trough-shaped cleaning area 101. An ultrasonic generator for generating ultrasonic waves is provided at the bottom of the cleaning area 101. The ultrasonic generator uses existing technology to vibrate the liquid in the cleaning tank provided in the cleaning area 101 by ultrasonic vibration.

[0033] A first lifting mechanism 310 and a second lifting mechanism 320 are disposed on either side of the cleaning area 101. A basket 200 for placing silicon wafers is placed between the first lifting mechanism 310 and the second lifting mechanism 320. It should be noted that the first lifting mechanism 310 and the second lifting mechanism 320 do not directly contact the cleaning tank in the cleaning area 101. The first lifting mechanism 310 and the second lifting mechanism 320 are disposed on the cleaning tank assembly 100 to assemble the side walls of the cleaning tank.

[0034] The pushing mechanism 400 includes a connecting rod 420, a pushing block 430, and a sliding rod 440. The sliding rods 440 are in two groups and are connected to each other by the connecting rod 420. The pushing block 430 is provided at the front end of the sliding rod 440. The inclined surfaces provided on the different pushing blocks 430 are respectively in contact with the first lifting mechanism 310 and the second lifting mechanism 320. The pushing mechanism 400 drives the first lifting mechanism 310 and the second lifting mechanism 320 to move synchronously, ensuring the stability of the basket 200 during the lifting process and reducing the shaking that may cause the basket 200 to slip;

[0035] In the present application, the cleaning tank assembly 100 further includes multiple sets of water inlet pipes 110 and a set of water outlet pipes 120. The water inlet pipes 110 and the water outlet pipes 120 are connected to the cleaning tank through pipes. During the cleaning process, a specified liquid is fed into the cleaning tank through the water inlet pipes 110 to complete the cleaning task of silicon wafers under different environments. Here, the piping arrangement adopts existing technical means, and the water inlet and outlet pipes 110 and 120 are completed by external drainage pumps and water inlet pumps. The basket 200 also adopts existing technology and is provided with multiple sets of slots for inserting and fixing silicon wafers.

[0036] The first lifting mechanism 310 and the second lifting mechanism 320 serve as lifting components for the basket 200, ensuring that the basket 200 can completely leave the cleaning area 101 under the lifting action of the first lifting mechanism 310 and the second lifting mechanism 320, thereby reducing the need to enter the cleaning area 101 to extract the basket 200, facilitating manual or robotic extraction and reducing manual and robotic operation.

[0037] As a preferred embodiment of this embodiment, a lifting port is provided on the top of the cleaning tank assembly 100, and the lifting block 313 extends from the lifting port into the interior of the cleaning tank assembly 100. The side hanging plate 311 and the lifting block 313 are arranged in parallel, and the side hanging plate 311 extends into the interior of the cleaning area 101; a support plate for the basket 200 is provided on the side hanging plate 311, and the support plate supports the basket 200. During the lifting process, the support plate lifts or lowers the basket 200 to a designated position.

[0038] The first lifting mechanism 310 and the second lifting mechanism 320 are symmetrical structures and are respectively arranged on both sides of the cleaning area 101;

[0039] As a preferred implementation in this embodiment, a guide rail 410 is provided inside the cleaning tank assembly 100, and the sliding rod 440 slides on the guide rail 410 through the technical principle of the slide rail slider; the guide rail 410 and the sliding rod 440 are both in two groups, and the sliding rods 440 are connected by a connecting rod 420. A power device is also provided inside the cleaning tank assembly 100, which can adopt a pneumatic push rod or an electric push rod. The power device is connected to the connecting rod 420, and the connecting rod 420 performs linear motion along the guide rail 410 along with the power device;

[0040] The pushing block 430 is staggered with the guide rail 410. The guide rail 410 does not contact the lifting block 313 during its lifting process. Due to the staggered arrangement, the lifting block 313 moves along the edge of the guide rail 410 during its lifting process, thus preventing the guide rail 410 from affecting the lifting movement of the lifting block 313.

[0041] As a preferred implementation manner in this embodiment, the pushing block 430 is provided with an inclined surface structure, and the end surface of the lifting block 313 away from the connecting plate 312 is an inclined surface. The inclined surface structure on the pushing block 430 is in contact with and connected to the end surface of the lifting block 313 away from the connecting plate 312. A limit stopper 314 is further provided inside the cleaning tank assembly 100, and the card slot provided on the limit stopper 314 is engaged with the lifting block 313. Due to the force transmitted by the inclined surface structure, only the vertical force can enable the lifting block 313 to complete the lifting operation, and the horizontal force is offset by the action of the limit stopper 314. A limit guide groove is provided in the limit stopper 314, and the lifting block 313 is provided with a guide slider. Under the action of the limit guide groove, the lifting block 313 can only move along the limit guide groove in the limit stopper 314.

[0042] It should be noted that for the aforementioned embodiments, for simplicity of description, they are all expressed as a series of action combinations. However, those skilled in the art should be aware that the present invention is not limited by the order of the actions described, because according to the present invention, certain steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0043] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope to be protected by the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making any creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope to be protected by the present invention.

Claims

1. A trough-type fully automatic silicon wafer cleaning equipment, characterized in that: include: A cleaning tank assembly, wherein the cleaning tank assembly is provided with a cleaning area, and the cleaning area is provided with an ultrasonic generating device; a first lifting mechanism and a second lifting mechanism, wherein the first lifting mechanism and the second lifting mechanism are arranged on both sides of the cleaning area, and a basket for placing silicon wafers is placed between the first lifting mechanism and the second lifting mechanism; The pushing mechanism includes a connecting rod, a pushing block and a sliding rod. The sliding rods are in two groups and are connected to each other through a connecting rod. The pushing block is provided at the front end of the sliding rod. The inclined surfaces on different pushing blocks are respectively in contact with the first lifting mechanism and the second lifting mechanism.

2. The tank-type fully automatic silicon wafer cleaning equipment according to claim 1, characterized in that: The first lifting mechanism includes a side hanging plate, a connecting plate and a lifting block; The side hanging plate and the lifting block are connected via a connecting plate, and the lifting block extends into the interior of the cleaning tank assembly and is in contact with and connected to the pushing mechanism.

3. The tank-type fully automatic silicon wafer cleaning equipment according to claim 2, characterized in that: A lifting port is provided on the top of the cleaning tank assembly, and the lifting block extends from the lifting port into the interior of the cleaning tank assembly. The side hanging plate and the lifting block are arranged in parallel, and the side hanging plate extends into the interior of the cleaning area.

4. The tank-type fully automatic silicon wafer cleaning equipment according to claim 3, characterized in that: The side hanging plates are provided with support plates for carrying the basket.

5. The tank-type fully automatic silicon wafer cleaning equipment according to claim 4, characterized in that: The first lifting mechanism and the second lifting mechanism are symmetrical structures and are respectively arranged on both sides of the cleaning area.

6. The tank-type fully automatic silicon wafer cleaning equipment according to claim 5, characterized in that: The pushing block is provided with an inclined surface structure, the end surface of the lifting block away from the connecting plate is an inclined surface, and the inclined surface structure on the pushing block is in contact and connected with the end surface of the lifting block away from the connecting plate.

7. The tank-type fully automatic silicon wafer cleaning equipment according to claim 6, characterized in that: A guide rail is provided inside the cleaning tank assembly, and the sliding rod slides on the guide rail.

8. The tank-type fully automatic silicon wafer cleaning equipment according to claim 7, characterized in that: The pushing block and the guide rail are staggered and arranged, and the guide rail does not come into contact during the lifting process of the lifting block.

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