Cooler supporting ring structure

Abstract

The utility model discloses a cooler supporting ring structure which comprises an inner supporting ring and an outer supporting ring which are coaxial and arranged inside and outside, and a channel for medium circulation is formed between the inner supporting ring and the outer supporting ring. A first opening is formed in the butt joint position of the two first half rings. A second opening is formed in the butt joint position of the two second half rings. And a medium flows into and out of the channel and an area enclosed by the two first half rings through the second opening and the first opening. The utility model relates to the technical field of cooler parts, and through the arrangement of the inner support ring and the outer support ring, the inner and outer multi-point support of adjacent cooler chips is realized, and the stress generated in the brazing process is effectively dispersed, so that the deformation of the cooler chips is greatly reduced. Due to the design of the upper step and the lower step, the contact area between the inner supporting ring and the surface of the heat exchanger chip and the contact area between the outer supporting ring and the surface of the heat exchanger chip are increased, the compression resistance of the supporting rings is increased, stress concentration is further prevented, and compression resistance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cooler parts, in particular to a cooler support ring structure. Background Art

[0002] In modern industrial production, coolers, as a crucial component of heat exchange systems, are widely used to cool engine lubricating oil. During the cooler manufacturing process, especially during the brazing process at temperatures exceeding 1000°C, cooler chips are prone to deformation. This deformation not only affects the cooler's heat exchange efficiency but can also degrade the performance of the entire system.

[0003] Currently, a common cooler structure features umbilical protrusions on the chip. These protrusions weld the upper and lower chips together during the brazing process, thereby reducing chip deformation to a certain extent. This design improves the cooler's structural stability to a certain extent. However, when the product is large and has many layers, even with the chip protrusions, the cooler still deforms significantly during the high-temperature brazing process. This deformation not only affects the cooler's installation and use, but can also damage the cooler chip due to stress concentration, thereby affecting the reliability and lifespan of the entire cooling system. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a cooler support ring structure, which solves the problem that cooler chips are easily deformed during the manufacturing process of the existing cooler.

[0005] To achieve the above object, the present invention is implemented through the following technical solutions: a cooler support ring structure, the support ring structure includes an inner support ring and an outer support ring that are coaxial and arranged inside and outside, and a channel for medium circulation is formed between the inner support ring and the outer support ring;

[0006] The inner support ring includes two first half rings that are connected to each other, and a first opening is formed at the connection between the two first half rings; the outer support ring includes two second half rings that are connected to each other, and a second opening is formed at the connection between the two second half rings;

[0007] The medium flows into and out of the channel and the area enclosed by the two first semicircles through the second opening and the first opening.

[0008] Preferably, the first opening and the second opening are arranged opposite to each other; the two first openings located at both ends of the two first half circles are arranged opposite to each other, and the two second openings located at both ends of the two second half circles are arranged opposite to each other.

[0009] Preferably, the outer side of the first half circle extends outward to form an upper step, and the inner side of the second half circle extends inward to form a lower step, and the upper step is overlapped on the lower step.

[0010] Preferably, the upper step and the lower step are located in the channel, and when the upper step and the lower step overlap each other, the channel is divided into an upper circulation channel and a lower circulation channel located above and below; the upper circulation channel is formed between the outer wall surface of the upper step and the inner wall surface of the second half circle, and the lower circulation channel is formed between the outer wall surface of the lower step and the wall surface of the first half circle.

[0011] Preferably, an insertion cavity is formed inside the end of the two first half circles and the two second half circles, and an insertion rod is movably connected in the insertion cavity, so that the two first half circles or the two second half circles are enclosed as one.

[0012] Preferably, an end cap is fixed at the port of the insertion cavity, and a limit platform is provided at one end of the insertion rod inserted into the insertion cavity; when the insertion rod is fully extended out of the insertion cavity, the limit platform abuts against the end cap.

[0013] Preferably, the insertion cavity and the insertion rod are both arc-shaped and coaxial with the first half circle and the second half circle.

[0014] Preferably, the first half circle and the second half circle are both made of steel.

[0015] Beneficial effects of the present invention: By using a cooler support ring structure provided by the present invention, compared with the prior art, by setting an inner support ring and an outer support ring, the present invention realizes internal and external multi-point support for adjacent cooler chips, effectively dispersing the stress generated during the brazing process, thereby greatly reducing the deformation of the cooler chips. The design of the upper and lower steps increases the contact area between the inner and outer support rings and the surface of the heat exchanger chip, thereby increasing the pressure-resistant surface of the support ring, further preventing stress concentration, and improving the pressure resistance. The two first half rings or the two second half rings that constitute the inner and outer support rings are connected by an arc-shaped plug rod. This connection method can adjust the diameter of the inner support ring and / or the outer support ring to avoid the welding points on the surface of the heat exchanger chip, thereby improving the applicability and flexibility of the support ring. The relative arrangement of the first opening and the second opening allows the medium to flow smoothly into and out of the interior of the support ring, avoiding the formation of a sealed area in the support ring, thereby ensuring the uniformity of the heat exchange rate. At the same time, the support ring is not only suitable for cooler chips of various sizes, but also can significantly improve the overall performance and reliability of the cooler without increasing excessive costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the position of the support ring of the utility model arranged on the cooler chip;

[0017] Figure 2 This is a top view of the support ring of the utility model;

[0018] Figure 3 For this utility model Figure 2 AA cross-section of the middle support ring.

[0019] Description of reference numerals in the figures

[0020] 100, cooler chip, 200, support ring;

[0021] 1. First half circle, 2. Second half circle, 3. First opening, 4. Second opening, 5. Channel, 51. Upper circulation channel, 52. Lower circulation channel, 6. Insertion cavity, 7. Insertion rod, 8. Upper step, 9. Lower step. DETAILED DESCRIPTION

[0022] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. As long as the effects of the present invention can be exerted, various changes can be made to the embodiments.

[0023] By those skilled in the art, the components in this case are connected in sequence. The specific connection and operation sequence should refer to the following working principle. The detailed connection means are well-known technologies in this field. The following mainly introduces the working principle and process.

[0024] Reference Figure 1-3 A cooler support ring structure according to this embodiment will be described.

[0025] like Figure 1 As shown, the support ring structure is arranged between two adjacent cooler chips to support the cooler chip to prevent it from deforming during use and ensure the stability and service life of the cooler chip.

[0026] like Figure 2 As shown, it mainly includes an inner support ring and an outer support ring that are coaxial and arranged inside and outside. A channel 5 for medium circulation is formed between the inner and outer support rings. Effective circulation of the medium between the inner and outer support rings is achieved, improving heat exchange efficiency. The inner and outer support rings form an inner and outer double-point support, improving the support effect of the two adjacent cooler chips, reducing stress concentration on the cooler chips and avoiding damage. It should be noted that the support ring structure is made of steel, specifically Q235 steel.

[0027] like Figure 2As shown, the inner support ring includes two first half rings 1 that are butted together, with a first opening 3 formed at the butt joint of the two first half rings 1; the outer support ring includes two second half rings 2 that are butted together, with a second opening 4 formed at the butt joint of the two second half rings 2. The medium flows into and out of the channel 5 and the area enclosed by the two first half rings 1 through the second opening 4 and the first opening 3. With the design of the first opening 3 and the second opening 4, during actual operation, the medium flowing within the cooler will flow through the second opening 4 and the first opening 3 into the interior of the inner and outer support rings, allowing the medium to flow in and out of the support rings. This prevents the support rings from forming a sealed area after being clamped by the upper and lower cooler chips, resulting in a lack of medium flow within the support rings. This improves heat exchange efficiency and avoids a decrease in local heat exchange rate.

[0028] like Figure 2 As shown, the first openings 3 and second openings 4 are arranged opposite each other; the two first openings 3 at the ends of the two first half-circles 1 are arranged opposite each other, and the two second openings 4 at the ends of the two second half-circles 2 are arranged opposite each other. The relative arrangement of all openings allows the medium to flow in from one end, enter the area enclosed by the channel 5 and the two first half-circles 1, and then quickly flow out, reducing the flow path.

[0029] like Figure 3 As shown, the outer side of the first half circle 1 extends outward to form an upper step 8, and the inner side of the second half circle 2 extends inward to form a lower step 9, with the upper step 8 overlapping the lower step 9. During use, the upper step 8 is welded to the top surface of the heat exchanger chip, and the lower step 9 is welded to the bottom surface of the heat exchanger chip.

[0030] like Figure 3 As shown, the upper step 8 is formed on the outside of the first half circle 1, and the lower step 9 is formed on the inside of the second half circle 2, and the upper step 8 and the lower step 9 are located in the channel 5. When the upper step 8 and the lower step 9 overlap each other, the channel 5 is divided into an upper circulation channel 51 and a lower circulation channel 52 located above and below; the upper circulation channel 51 is formed between the outer wall surface of the upper step 8 and the inner wall surface of the second half circle 2, and the lower circulation channel 52 is formed between the outer wall surface of the lower step 9 and the wall surface of the first half circle 1.

[0031] like Figure 2 As shown, an insertion cavity 6 is formed inside the end of the two first half circles 1 and the second half circles 2, and an insertion rod 7 is movably connected in the insertion cavity 6, so that the two first half circles 1 or the two second half circles 2 are enclosed as one.

[0032] Furthermore, the insertion cavity 6 and the insertion rod 7 are both arc-shaped and coaxial with the first half circle 1 and the second half circle 2 .

[0033] Furthermore, an end cap is fixed at the end of the insertion cavity 6, and a limit platform is provided at one end of the insertion rod 7 inserted into the insertion cavity 6; when the insertion rod 7 is fully extended out of the insertion cavity 6, the limit platform abuts against the end cap.

[0034] The ends of the two first half rings 1 and the second half ring 2 are connected by an insert rod 7, so that the diameter of the inner support ring and / or the outer support ring can be adjusted to avoid welding points on the surface of the heat exchanger chip.

[0035] Before brazing, the support ring structure is placed between two adjacent cooler chips. The diameters of the two first half rings 1 constituting the inner support ring and / or the two second half rings 2 constituting the outer support ring are adjusted, with the upper step 8 overlapping the lower step 9. During use, the upper step 8 is welded to the top surface of the heat exchanger chip, and the lower step 9 is welded to the bottom surface of the heat exchanger chip. The upper and lower steps 8 and 9 increase the contact area between the inner and outer support rings and the heat exchanger chip surfaces, thereby increasing the support ring's compressive surface, preventing stress concentration, and improving compressive resistance.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooler support ring structure, characterized in that: The support ring structure comprises an inner support ring and an outer support ring which are coaxial and arranged inside and outside, and a channel (5) for medium circulation is formed between the inner support ring and the outer support ring; The inner support ring comprises two first half rings (1) butted against each other, and a first opening (3) is formed at the butt joint of the two first half rings (1); the outer support ring comprises two second half rings (2) butt jointed against each other, and a second opening (4) is formed at the butt joint of the two second half rings (2); The medium flows into and out of the channel (5) and the area enclosed by the two first half circles (1) through the second opening (4) and the first opening (3).

2. The cooler support ring structure according to claim 1, characterized in that: The first opening (3) and the second opening (4) are arranged opposite to each other; the two first openings (3) located at the two ends of the first half circles (1) are arranged opposite to each other, and the two second openings (4) located at the two ends of the second half circles (2) are arranged opposite to each other.

3. The cooler support ring structure according to claim 1, characterized in that: The outer side of the first half circle (1) extends outward to form an upper step (8), and the inner side of the second half circle (2) extends inward to form a lower step (9), and the upper step (8) is overlapped on the lower step (9).

4. The cooler support ring structure according to claim 3, characterized in that: The upper step (8) and the lower step (9) are located in the channel (5), and when the upper step (8) and the lower step (9) overlap each other, the channel (5) is divided into an upper circulation channel (51) and a lower circulation channel (52) located above and below; the upper circulation channel (51) is formed between the outer wall surface of the upper step (8) and the inner wall surface of the second half circle (2), and the lower circulation channel (52) is formed between the outer wall surface of the lower step (9) and the wall surface of the first half circle (1).

5. The cooler support ring structure according to claim 1, characterized in that: An insertion cavity (6) is formed inside the ends of the two first half circles (1) and the second half circles (2), and an insertion rod (7) is movably connected in the insertion cavity (6), so that the two first half circles (1) or the two second half circles (2) are enclosed as one body.

6. The cooler support ring structure according to claim 5, characterized in that: An end cap is fixed at the port of the insertion cavity (6), and a limit platform is provided at one end of the insertion rod (7) inserted into the insertion cavity (6); when the insertion rod (7) is fully extended out of the insertion cavity (6), the limit platform abuts against the end cap.

7. The cooler support ring structure according to claim 5, characterized in that: The insertion cavity (6) and the insertion rod (7) are both arc-shaped and coaxial with the first half circle (1) and the second half circle (2).

8. The cooler support ring structure according to claim 1, characterized in that: The first half ring (1) and the second half ring (2) are both made of steel.

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