Laser head and laser processing equipment

Abstract

The utility model provides a laser head and laser processing equipment, the laser head comprises a processing laser, a first line positioning illuminator and a second line positioning illuminator, the first line positioning illuminator and the second line positioning illuminator are arranged at the outer side of the processing laser; each of the first line positioning light emitter and the second line positioning light emitter comprises a cavity, a light emitting part and an optical element, the cavities are mounted on the outer side of the processing laser, the light emitting parts and the optical elements are mounted in the cavities, and the optical elements are located in light paths of the light emitting parts and used for modulating light beams emitted by the light emitting parts into line light beams; line beams emitted by the first line positioning illuminator and the second line positioning illuminator intersect on the optical axis of the processing laser, so that a positioning point coincides with a light spot of the processing laser, the processing breadth is not affected by position deviation of the positioning point and the processing light spot, and the processing breadth of the laser processing equipment can be fully utilized.

Description

Technical Field

[0001] The utility model relates to the field of laser processing, in particular to a laser head and laser processing equipment. Background Art

[0002] Lasers are widely used in laser processing scenarios such as laser engraving and laser cutting due to their small divergence angle, high energy density, and high coherence. Before processing, the material being processed needs to be assisted in positioning to determine the target position of the laser processing. Therefore, in related technologies, the laser head includes a module for processing and a line laser for indicating positioning. For example, when laser processing equipment is actually used, it is necessary to first use a line laser for indicating positioning to determine the processing position, and then the laser head moves to the processing position.

[0003] Line lasers use optical devices based on the principle of refraction to generate a structured light field with a specific distribution (amplitude / phase / polarization, etc.) in one or two dimensions, forming lines such as lines or crosshairs. In related technologies, because line lasers cannot share an optical path with processing lasers, the positioning mark emitted by the line laser is at a fixed distance from the processing laser's processing spot. This results in the machine's edge (i.e., the area corresponding to this fixed distance) not being fully utilized, reducing the processing area. Utility Model Content

[0004] One of the purposes of the present invention is to solve the problem that the positioning mark generated by the positioning line laser of the existing laser head cannot be overlapped with the processing spot of the processing laser.

[0005] In order to solve the above technical problems, the utility model provides a laser head, including a processing laser, a first line positioning light emitter and a second line positioning light emitter, the processing laser is used to generate a processing laser beam; the first line positioning light emitter and the second line positioning light emitter are both arranged on the outside of the processing laser; wherein, the first line positioning light emitter and the second line positioning light emitter each include a cavity, a light-emitting part and an optical element, the cavity is installed on the outside of the processing laser, the light-emitting part and the optical element are both installed in the cavity, and the optical element is located in the light path of the light-emitting part, and the optical element is used to modulate the light beam emitted by the light-emitting part into a line beam; the line beams emitted by the first line positioning light emitter and the second line positioning light emitter intersect on the optical axis of the processing laser.

[0006] In some solutions of the present application, the optical element is used to collimate the light beam output by the light-emitting element and modulate the collimated light beam into a line beam.

[0007] In some embodiments of the present application, the light beam emitted by the light-emitting element is a point-shaped light beam.

[0008] In some aspects of the present application, the optical axis of the first line positioning light emitter and the optical axis of the second line positioning light emitter are parallel to the optical axis of the processing laser.

[0009] In some aspects of the present application, the line light beams emitted by the first line positioning light emitter and the line light beams emitted by the second line positioning light emitter intersect vertically.

[0010] In some schemes of the present application, the optical element includes a first optical element and a second optical element, and the first optical element and the second optical element are arranged in sequence along the light emitting direction of the light emitting component. The first optical element is used to collimate the light beam emitted by the light emitting component, and the second optical element is used to modulate the collimated light beam into a line beam.

[0011] In some embodiments of the present application, the first optical element includes a single lens, or a lens group consisting of multiple lenses, or a Fresnel lens or a super lens; and / or the second optical element includes one of a wave mirror, a cylindrical mirror and a Powell prism.

[0012] In some embodiments of the present application, the first optical element and the second optical element are an integrated structure.

[0013] In some embodiments of the present application, the optical element is used to diffract the light beam emitted by the light-emitting element into the line light beam, and the optical element includes one of a diffraction optical element and a metasurface device.

[0014] In some embodiments of the present application, the cavity of the first line positioning light emitter and the cavity of the second line positioning light emitter are two cavities on an integrated structure; and / or, the first line positioning light emitter and the second line positioning light emitter are both used to project multiple line light beams, and the multiple line light beams projected by the first line positioning light emitter intersect with the multiple line light beams projected by the second line positioning light emitter to form a grid pattern, wherein one grid intersection point is located on the optical axis of the processing laser.

[0015] The present application also provides a laser processing device, comprising a laser head and a mechanical drive mechanism, wherein the mechanical drive mechanism is connected to the laser head, and the mechanical drive mechanism can drive the laser head to move.

[0016] It can be seen from the above technical solution that the beneficial effects of the utility model are as follows: the laser head of the present application includes a processing laser, a first line positioning light emitter and a second line positioning light emitter, the first line positioning light emitter and the second line positioning light emitter are arranged on the outside of the processing laser, the first line positioning light emitter and the second line positioning light emitter both include a cavity, a light-emitting part and an optical element, the light-emitting part and the optical element are both installed on the cavity, and the optical element can modulate the light beam shape emitted by the light-emitting part into a line beam; the line beams emitted by the first line positioning light emitter and the second line positioning light emitter intersect, and the intersection is located on the optical axis of the processing laser, so that the positioning point formed by the first line positioning light emitter and the second line positioning light emitter coincides with the light spot of the processing laser, and there is no deviation between the positioning point and the light spot of the processing laser, so that when the laser processing equipment is positioned, the processing laser can be moved to the position of the positioning point, and the light spot of the processing laser can be moved to the edge of the working platform, so that the processing width is fully utilized. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a laser processing device in one embodiment.

[0018] Figure 2 It is a structural schematic diagram of a laser head in one embodiment.

[0019] Figure 3 It is a schematic diagram of the working principle of a laser head in one embodiment.

[0020] Figure 4 It is a schematic diagram of the working principle of a laser head in another embodiment.

[0021] Figure 5 1 is a schematic structural diagram of a first line positioning light emitting device and a second line positioning light emitting device in one embodiment.

[0022] Figure 6 It is a schematic diagram of the structure of a line beam formed by refraction of a refracting mirror.

[0023] Figure 7 yes Figure 6 Schematic top view of the refractor shown.

[0024] Figure 8 This is a schematic diagram of the change of the light spot after the light beam passes through the refractor.

[0025] Figure 9 It is a structural schematic diagram of a laser processing device in another embodiment.

[0026] The following are the descriptions of the reference numerals:

[0027] 100-laser head; 110-processing laser; 120-first line positioning light emitter; 130-second line positioning light emitter; 1-cavity; 2-light-emitting part; 3-optical element; 31-first optical element; 32-second optical element; 140-control circuit; 150-gas path structure; 160-heat dissipation structure; 170-detector; 200-mechanical drive mechanism; 210-X-axis drive structure; 220-Y-axis drive structure; 300-working platform. DETAILED DESCRIPTION

[0028] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various variations in different embodiments without departing from the scope of the present invention, and that the descriptions and illustrations herein are intended to be illustrative in nature and not to limit the present invention.

[0029] In the description of this application, it should be understood that in the embodiments shown in the drawings, indications of directions or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions will also change accordingly.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0031] See Figure 1 A laser processing device includes a laser head 100, a work platform 300, and a mechanical drive mechanism 200. The mechanical drive mechanism 200 is connected to the work platform 300. The laser head 100 is connected to the mechanical drive mechanism 200 and is located above the work platform 300. The mechanical drive mechanism 200 can drive the laser head 100 to move, thereby locating the processing position of a workpiece placed on the work platform 300 and processing the workpiece. The laser processing device can be a laser cutting device, a laser engraving device, etc.

[0032] The laser processing equipment is also provided with an electric control device, and the laser head 100 and the mechanical drive mechanism 200 are both electrically connected to the electric control device, so that the electric control device can automatically control the operation of the laser head 100 and the mechanical drive mechanism 200.

[0033] The mechanical drive mechanism 200 includes an X-axis drive structure 210 and a Y-axis drive structure 220, which are used to drive the laser head 100 to move along the X-axis and Y-axis directions respectively, so that the laser head 100 can process the workpiece placed on the working plane of the laser processing equipment. Figure 1 In the illustrated embodiment, the X-axis drive structure 210 is connected to the work platform 300, the Y-axis drive structure 220 is connected to the X-axis drive structure 210, and the laser head 100 is mounted on the Y-axis drive structure 220. In other embodiments, the Y-axis drive structure 220 is connected to the work platform 300, the X-axis drive structure 210 is connected to the Y-axis drive structure 220, and the laser head 100 is mounted on the X-axis drive structure 210.

[0034] In one embodiment, the mechanical drive mechanism 200 further includes a Z-axis drive structure (not shown), which is used to drive the laser head 100 to move along the Z-axis direction, so that the laser head 100 approaches or moves away from the workpiece on the work platform 300. For example, the Z-axis drive structure can be provided on the X-axis drive structure 210 or the Y-axis drive structure 220, and the laser head 100 can be provided on the Z-axis drive structure.

[0035] See Figures 2 to 4 Specifically, the laser head 100 includes a processing laser 110, a first line positioning light emitter 120, and a second line positioning light emitter 130. The processing laser 110 is used to generate a processing laser beam that can be directed onto the processing surface of the workpiece. The processing laser 110 is not limited to a specific laser type and can be a laser of any wavelength and any optical power, and can be a pulsed laser or a continuous laser.

[0036] The laser head 100 also includes a first line positioning light emitter 120 and a second line positioning light emitter 130. The first line positioning light emitter 120 and the second line positioning light emitter 130 are both disposed outside the processing laser 110 and are capable of projecting line beams. The line beams projected by the first and second line positioning light emitters 120, 130 intersect on the optical axis of the processing laser 110. The intersection of the line beams projected by the first and second line positioning light emitters 120, 130 is used for processing positioning. As a result, the positioning point formed by the first and second line positioning light emitters 120, 130 can coincide with the light spot of the processing laser 110.

[0037] When the mechanical drive mechanism 200 drives the laser head 100 to move, the positioning point formed by the first line positioning light emitter 120 and the second line positioning light emitter 130 coincides with the light spot of the processing laser 110. When the first line positioning light emitter 120 and the second line positioning light emitter 130 locate the processing starting point of the workpiece, the processing laser 110 moves together to the position of the processing starting point. The scheme of moving the relative line positioning light emitter and the processing laser 110 in steps shortens the processing time and improves the processing efficiency. Moreover, the positioning point formed by the first line positioning light emitter 120 and the second line positioning light emitter 130 and the light spot of the processing laser 110 can both be moved to the edge of the work platform 300, avoiding the problem in the prior art that the positioning mark emitted by the line laser and the processing light spot of the processing laser are at a fixed distance, resulting in the edge of the work platform 300 not being fully utilized, thereby increasing the processing width of the laser processing equipment.

[0038] For example: In the technical solution of the laser processing equipment of the related technology, the positioning mark generated by the line positioning light emitter is located directly below the line positioning light emitter and is located to the right of the processing laser. When the processing laser head moves to the leftmost side of the working platform (the maximum safe travel distance along the X-axis direction), the positioning mark generated by the line positioning light emitter is still at a fixed distance from the leftmost edge of the working platform. The fixed distance is the fixed distance between the positioning mark emitted by the line laser and the processing spot of the processing laser, resulting in a position on the leftmost side of the working platform that cannot be processed, resulting in the left edge of the working platform cannot be fully utilized, reducing the processing width of the laser processing equipment. Similarly, when the line positioning light emitter is set on the left side of the processing laser, the right edge of the working platform cannot be fully utilized, reducing the processing width of the laser processing equipment.

[0039] In the laser processing equipment of the present application, by aligning the positioning points projected by the first line positioning light emitter 120 and the second line positioning light emitter 130 with the light spot of the processing laser 110, when the center of the processing laser 110 is located at any edge of the working platform, the positioning points formed by the first line positioning light emitter 120 and the second line positioning light emitter 130 are also located at the edge of the working platform, and the processing laser 110 can also reach the edge, thereby making it possible to fully utilize the processing width of the working platform.

[0040] It should be noted that the line light beams projected by the first line positioning light source 120 and the second line positioning light source 130 intersect on the optical axis of the processing laser 110, including the line light beams projected by the first line positioning light source 120 and the second line positioning light source 130 completely intersecting or roughly intersecting on the optical axis of the processing laser 110, and the intersection point of the line light beams projected by the first line positioning light source 120 and the second line positioning light source 130 and the optical axis of the processing laser 110 The deviation is within a preset range (such as 0.5mm, or 1mm, or 1.5mm, or 2mm, etc.).

[0041] In some embodiments of the present application, the optical axes of the first line positioning light emitter 120 and the second line positioning light emitter 130 are parallel to the optical axis of the processing laser 110. If the optical axis of the processing laser 110 is not a straight line, the optical axis of the light beam emitted from the light outlet of the processing laser 110 is parallel to the optical axes of the first line positioning light emitter 120 and the second line positioning light emitter 130.

[0042] In one embodiment, see Figure 3 , the first line positioning light emitting device 120 and the second line positioning light emitting device 130 each project only one line beam, the line beam projected by the first line positioning light emitting device 120 intersects vertically with the line beam projected by the second line positioning light emitting device 130, and the intersection point between the line beam projected by the first line positioning light emitting device 120 and the line beam projected by the second line positioning light emitting device 130 is the center point of positioning, and is also the positioning point, so that the position of the center point of positioning can be known intuitively and accurately. In other embodiments, the line beams projected by the first line positioning light emitting device 120 and the second line positioning light emitting device 130 can also form other angles, such as 30°, 45°, 60° or any other angle. In other words, as long as the line beams projected by the first line positioning light emitting device 120 and the second line positioning light emitting device 130 intersect, and the intersection point is used as the center point of positioning.

[0043] In one embodiment, see Figure 4, the first line positioning light emitter 120 and the second line positioning light emitter 130 both project a plurality of line light beams, the plurality of line light beams projected by the first line positioning light emitter 120 are spaced apart along the Y-axis direction, and the plurality of line light beams projected by the second line positioning light emitter 130 are spaced apart along the X-axis direction. The plurality of line light beams projected by the first line positioning light emitter 120 intersect with the plurality of line light beams projected by the second line positioning light emitter 130 and form a grid pattern, so that they can be adapted to different scenarios. One of the grid intersections is located on the optical axis of the processing laser 110, and the grid intersection that coincides with the optical axis of the processing laser 110 is the positioning point. Among them, the line light beams formed by the first line positioning light emitter 120 and the second line positioning light emitter 130 can intersect vertically, or form other angles, such as 30°, 45°, 60° or any other angle.

[0044] See Figure 5 The first line positioning light emitter 120 and the second line positioning light emitter 130 both include a cavity 1, a light emitting component 2 and an optical element 3. The cavity 1 is installed on the outside of the processing laser 110. The light emitting component 2 and the optical element 3 are both installed in the cavity 1, and the optical element 3 is located in the light path of the light emitting component 2. The optical element 3 can modulate the light beam emitted by the light emitting component 2 into a line beam.

[0045] Specifically, the cross-section of cavity 1 is a closed ring, meaning it can be hollow cylindrical or polygonal prism. Cavity 1 encloses the light-emitting element 2 and optical element 3 within it, connecting them and protecting them from dust. This prevents dust from adhering to the surfaces of the light-emitting element 2 and optical element 3 and affecting the positioning accuracy of the linear positioning light emitter, while also reducing maintenance difficulties.

[0046] Light-emitting element 2 blocks one axial end of cavity 1, while optical element 3 blocks the other axial end of cavity 1, creating a closed structure within cavity 1. External dust cannot enter cavity 1, thereby achieving a dust-proof effect. The light beam projected by light-emitting element 2 is directed toward optical element 3, causing it to be modulated by optical element 3 to form a linear beam.

[0047] The cavity 1 includes but is not limited to a cavity formed by a shell made of metal, plastic, or ceramic. The cavity 1 is preferably made of metal, which has good heat transfer capabilities and can better dissipate the heat generated by the light-emitting element 2.

[0048] In one embodiment, the cavity of the first line positioning light emitter 120 and the cavity of the second line positioning light emitter 130 can be separately provided, so that the structure of the cavity 1 is simple and convenient for production. The cavity of the first line positioning light emitter 120 and the cavity of the second line positioning light emitter 130 are both located outside the processing laser 110.

[0049] In one embodiment, the cavity of the first line positioning light emitter 120 and the cavity of the second line positioning light emitter 130 can also be set as an integrated structure, so that the first line positioning light emitter 120 and the second line positioning light emitter 130 form a whole, which is convenient for their assembly with the outside of the processing laser. At the same time, it can ensure that the relative precision of the first line positioning light emitter 120 and the second line positioning light emitter 130 is relatively high, so that the intersection of the line light beam emitted by the first line positioning light emitter 120 and the line light beam emitted by the second line positioning light emitter 130 is more accurately located on the optical axis of the processing laser 110.

[0050] The light emitting element 2 is preferably a laser. The light beam emitted by the laser is a point-shaped beam that can be easily adjusted by the optical element 3 to form a line beam. The laser can be a semiconductor laser, a solid-state laser, a gas laser, or other different types of lasers. It can also be a laser with different wavelengths such as blue, red, green, or yellow.

[0051] For example, the light emitting element 2 can be a semiconductor laser. Semiconductor lasers include, but are not limited to, edge-emitting laser diodes (EELs) and vertical-cavity surface-emitting semiconductor lasers (VCSELs). More specifically, edge-emitting laser diodes include: FP lasers (Fabry-Perot laser diodes), DFB lasers (Distributed Feedback laser diodes), and DBR lasers (Distributed Bragg Reflector laser diodes). Vertical-cavity surface-emitting semiconductor lasers include: vertical external-cavity surface-emitting semiconductor lasers VECSELs (Vertical External Cavity Surface-Emitting Lasers), photonic crystal lasers PCSELs (Photonic Crystal Surface-emitting Lasers), topological-cavity surface-emitting semiconductor lasers TCSELs (Topological-cavity surface-emitting lasers), and horizontal-cavity surface-emitting lasers HCSELs (Horizontal-cavity surface-emitting lasers).

[0052] Light-emitting element 2 can be a solid-state laser, a gas laser, or a fiber laser. It can also be another light-emitting device. For example, light-emitting element 2 is an LED lamp. When the light beam emitted by light-emitting element 2 passes through optical element 3, optical element 3 can collimate the light beam output by light-emitting element 2 and modulate the collimated light beam into a line beam.

[0053] In some embodiments, the optical element 3 includes a first optical element 31 and a second optical element 32. The first optical element 31 and the second optical element 32 are arranged in sequence along the light-emitting direction of the light-emitting element 2. The first optical element 31 is used to collimate the light beam emitted by the light-emitting element 2, and the second optical element 32 is used to modulate the collimated light beam into a line beam.

[0054] In one embodiment, the second optical element 32 may be a cylindrical mirror, a wave mirror, or a Powell prism.

[0055] The following describes the working principle of optical element 3 using a wave mirror as an example. The curvature of a wave mirror varies periodically in one direction, while the curvature remains constant in directions perpendicular to it. The direction of constant curvature is defined as the "edge" of the wave mirror, while the curvature varies periodically in directions perpendicular to the "edge."

[0056] exist Figure 6 In the equation, A and B are the positions of the extreme points of the slope of the wave mirror tangent. Taking points A and B as examples, when the light is incident on point A with a speed of θ1:

[0057] θ1=α+β

[0058] n1sinθ1=n2sinθ2

[0059] n2sinθ3=n1sinθ4

[0060] Similarly, when the light is incident on point B with θ1:

[0061] θ1=α+β

[0062] n1sinθ1=n2sinθ2

[0063] n2sinθ3=n1sinθ4

[0064] Where: α is half of the divergence angle of the incident light beam, β is the angle between the surface tangent and the horizontal direction, θ1 is the incident angle of the light on the first surface, θ2 is the refraction angle of the first surface, θ3 is the incident angle of the light on the second surface, θ4 is the refraction angle of the light on the second surface, n1 is the refractive index of air, and n2 is the refractive index of the material of the wave mirror.

[0065] Depend on Figure 6 and Figure 7It can be seen that when light is incident on the periodic surface of a wave mirror, the degree of refraction varies at different locations, and the angle of the exiting light is more divergent than the incident angle. Because the curvature of the wave mirror's surface changes only perpendicular to the "edges" and remains constant along the "edges," this one-dimensional periodic structure transforms the incident point light spot into a long strip of light, creating a light field with a large divergence angle in one dimension. This is the principle of generating one-dimensional line lasers based on wave mirrors.

[0066] Figure 8 The figure shows the changes in the light spot before and after the light beam passes through the wave mirror. The divergence angle of the incident light beam is small. After passing through the wave mirror, the divergence angle in one dimension becomes larger, while the divergence angle in the vertical direction remains unchanged, generating a long strip of line laser.

[0067] The generation principle of "cross line" laser: According to the generation principle of one-dimensional line laser, the direction with a larger divergence angle is perpendicular to the "edge" of the wave mirror, so when there are two one-dimensional periodic structures with mutually perpendicular "edges" on the same lens, the incident light beam will diverge in two orthogonal directions, forming a "cross line" laser. The centers of the first line positioning light emitter 120 and the second line positioning light emitter 130 are respectively aligned with the center of the laser head 100 used for processing. The first line positioning light emitter 120 generates a one-dimensional line laser in the horizontal direction, and the second line positioning light emitter 130 generates a one-dimensional line laser in the vertical direction. The two mutually perpendicular line lasers intersect at the center of the laser head 100, that is, the intersection of the cross line lasers coincides with the light spot of the laser head 100.

[0068] See Figure 5 In one embodiment, the first optical element 31 is a lens, which is disposed between the light-emitting element 2 and the second optical element 32 and is located in the optical path of the light-emitting element 2. The lens can collimate the light beam emitted by the light-emitting element 2 into parallel light, which is then modulated by the second optical element 32 to form a linear beam. The lens can reduce the width of the linear beam, thereby improving positioning accuracy.

[0069] The lens includes but is not limited to a single lens, a lens group consisting of multiple lenses, a Fresnel lens, or a super lens with a focusing function.

[0070] In one embodiment, the light emitting element 2 , the first optical element 31 and the second optical element 32 are spaced apart from each other along the axial direction of the cavity 1 .

[0071] In one embodiment, the first optical element 31 and the second optical element 32 are integrated into one, for example, a micro-nano optical element having both collimation and refraction or diffraction functions. This optical element can not only collimate the laser, but also realize one-dimensional line laser through refraction.

[0072] In one embodiment, the light emitting element 2, the first optical element 31 and the second optical element 32 are integrated into one body. For example, a special micro-nano structure can be provided on the surface of the laser through semiconductor technology, so that the laser directly emits a one-dimensional line laser.

[0073] In one embodiment, the light emitting element 2 is integrated with the first optical element 31. For example, a structure with a collimating function is provided on the surface of the laser through semiconductor technology.

[0074] In an alternative embodiment, the first line-positioning light source 120 and the second line-positioning light source 130 form a line beam by diffraction. For example, the optical element 3 can diffract the light emitted by the light-emitting element 2 into a line beam. The optical element 3 is one of a diffuser, a light homogenizer, a diffractive optical element (DOE), and a metasurface device.

[0075] In one embodiment, the optical element 3 is a light diffuser with a micro-facet structure. The light beam emitted by the light emitting element 2 passes through the micro-facet structure on the light diffuser to form a line beam. The light diffuser can also be used in conjunction with a diverging lens. The diverging lens can diverge the line beam after passing through the light diffuser and change the length of the line beam, thus forming a DOE+LENS structure.

[0076] In the above embodiment, “the first line positioning light emitting device 120 and the second line positioning light emitting device 130 both project multiple line light beams”, this can be achieved by:

[0077] Method 1: Each first line positioning light source 120 and each second line positioning light source 130 is configured with multiple light-emitting elements 2, and the multiple light-emitting elements 2 respectively illuminate different positions of the optical element 3, and the optical element 3 is used to modulate the light beams of the multiple light-emitting elements 2 into multiple line beams.

[0078] Method 2: Each first line positioning light emitter 120 and each second line positioning light emitter 130 is configured with a light-emitting component 2, and the optical element 3 includes a first optical element 31, a second optical element 32 and a shading plate with multiple through holes. The shading plate is arranged between the first optical element 31 and the second optical element 32, and the shading plate splits the light beam collimated by the first optical element 31 into multiple light beams, and the multiple light beams are modulated by the second optical element 32 to form multiple line light beams.

[0079] Method 3: Multiple first line positioning light emitters 120 and multiple second line positioning light emitters 130 are provided. The multiple first line positioning light emitters 120 are spaced apart along the Y-axis, and the multiple second line positioning light emitters 130 are spaced apart along the X-axis. The multiple first line positioning light emitters 120 and the multiple second line positioning light emitters 130 operate simultaneously, so that the line beams projected by the multiple first line positioning light emitters 120 and the line beams projected by the multiple second line positioning light emitters 130 intersect and form a grid pattern.

[0080] In the above description, the first line positioning light emitter 120 and the second line positioning light emitter 130 may be of the same model and structure. In other embodiments, the first line positioning light emitter 120 and the second line positioning light emitter 130 may use different types of lasers or different types of optical elements 3, or the first line positioning light emitter 120 and the second line positioning light emitter 130 may use different types of lasers and different types of optical elements 3, respectively.

[0081] In one embodiment, the center lines of the first line positioning light emitter 120 and the second line positioning light emitter 130 are parallel to the center line of the processing laser 110. Figure 3 In other embodiments, the first line positioning light emitter 120 and the second line positioning light emitter 130 are arranged at an angle, and the center lines of the first line positioning light emitter 120 and the second line positioning light emitter 130 are both at an angle to the center line of the processing laser 110. Alternatively, the center line of one of the first line positioning light emitter 120 and the second line positioning light emitter 130 is parallel to the center line of the processing laser 110, while the other is at an angle to the center line of the processing laser 110.

[0082] See Figure 9 The laser head 100 also includes a control circuit 140. The first line positioning light emitter 120, the second line positioning light emitter 130 and the processing laser 110 are all electrically connected to the control circuit 140, so that the control circuit 140 controls the first line positioning light emitter 120, the second line positioning light emitter 130 and the processing laser 110 to operate.

[0083] The laser head 100 also includes an air path structure 150, which is connected to the processing laser 110, and the air path structure 150 can provide auxiliary gas for the processing laser 110. For example, the air path structure 150 includes a sleeve, which is sleeved on the light-emitting end of the processing laser 110. The sleeve is connected to the gas supply device, so that the auxiliary gas provided by the gas supply device can pass through the sleeve and be ejected from the light-emitting end of the processing laser 110. Among them, the auxiliary gas can blow away the slag generated when cutting the workpiece, improve the cutting effect, and also protect the optical elements of the processing laser 110 to prevent the slag from adhering to the lens and affecting the cutting quality. In some embodiments, the auxiliary gas can also react with the workpiece to increase the cutting speed.

[0084] In one embodiment, the gas path structure 150 is further connected to the first and second line positioning light emitters 120, 130, and the processing laser 110 in the same manner. Auxiliary gas can be ejected from the light-emitting ends of the first and second line positioning light emitters 120, 130 to prevent slag from adhering to the optical element 3 and affecting positioning accuracy.

[0085] The laser head 100 also includes a heat dissipation structure 160, which is connected to the processing laser 110 and is used to dissipate heat from the processing laser 110. For example, a coolant channel is provided within the housing of the processing laser 110, and the coolant channel is connected to a coolant supply device, forming the heat dissipation structure 160. When the processing laser 110 is operating, the coolant supply device provides coolant, and the coolant flows through the coolant channel, thereby cooling the processing laser 110.

[0086] In one embodiment, the heat dissipation structure 160 is also connected to the first and second line positioning light emitters 120, 130. The heat dissipation structure 160 is connected to the first and second line positioning light emitters 120, 130, and the processing laser 110 in the same manner. That is, the cavities of the first and second line positioning light emitters 120, 130 are also provided with cooling liquid channels. When the cooling liquid flows through the cooling liquid channels within the first and second line positioning light emitters 120, 130, the first and second line positioning light emitters 120, 130 are cooled.

[0087] The laser head 100 also includes a detector 170, which is used to detect the distance between the laser head 100 and the workpiece or to detect the position of the workpiece on the work platform. For example, the detector 170 is a distance sensor that can detect the distance between the laser head 100 and the workpiece. The control circuit controls the mechanical drive mechanism 200 based on the signal from the distance sensor to prevent collision between the laser head 100 and the workpiece. For example, the detector 170 is an industrial camera that detects the position of the workpiece on the work platform 300. The detector 170 can be located at the front end of the processing laser 110.

[0088] The laser head 100 of the present application includes a processing laser 110, a first line positioning light emitter 120, and a second line positioning light emitter 130. The first line positioning light emitter 120 and the second line positioning light emitter 130 are arranged outside the processing laser 110. The first line positioning light emitter 120 and the second line positioning light emitter 130 both include a cavity 1, a light-emitting element 2, and an optical element 3. The cavity 1 is installed outside the processing laser 110, and the light-emitting element 2 and the optical element 3 are both installed on the cavity 1. The optical element 3 can modulate the light beam emitted by the light-emitting element 2 into a line beam. The line beams emitted by the first line positioning light emitter 120 and the second line positioning light emitter 130 intersect, and the intersection is located on the optical axis of the processing laser 110, so that the positioning points formed by the first line positioning light emitter 120 and the second line positioning light emitter 130 coincide with the light spot of the processing laser 110. Moreover, the cavity 1 can connect the light emitting element 2 and the optical element 3 and prevent dust from adhering to the surfaces of the light emitting element 2 and the optical element 3 and affecting the positioning accuracy of the line positioning light emitter.

[0089] When the laser head 100 of the present application is applied to laser processing equipment, since the positioning point formed by the first line positioning light emitter 120 and the second line positioning light emitter 130 coincides with the light spot of the processing laser 110, when the laser processing equipment locates the processing starting point, the processing laser 110 is simultaneously moved to the position of the processing starting point, thereby shortening the processing time and improving the processing effect. Moreover, the positioning point formed by the first line positioning light emitter 120 and the second line positioning light emitter 130 and the light spot of the processing laser 110 can both be moved to the edge of the work platform 300, avoiding the problem in the prior art that the positioning mark emitted by the line laser and the processing light spot of the processing laser are at a fixed distance, resulting in the edge of the work platform 300 not being fully utilized, thereby increasing the processing width of the laser processing equipment.

[0090] While the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope of the appended claims. Therefore, all changes and modifications that fall within the scope of the claims or their equivalents are intended to be covered by the appended claims.

Claims

1. A laser head, characterized in that: include: a processing laser for generating a processing laser beam; a first line positioning light emitter and a second line positioning light emitter, disposed outside the processing laser; The first line positioning light emitter and the second line positioning light emitter each comprise a cavity, a light emitting element, and an optical element. The cavity is located outside the processing laser. The light emitting element and the optical element are both installed in the cavity, and the optical element is located in the optical path of the light emitting element. The optical element is used to modulate the light beam emitted by the light emitting element into a line beam. The line light beams emitted by the first line positioning light emitter and the second line positioning light emitter intersect on the optical axis of the processing laser.

2. The laser head according to claim 1, wherein: The optical element is used to collimate the light beam output by the light emitting element and modulate the collimated light beam into a line light beam.

3. The laser head according to claim 1 or 2, characterized in that: The light beam emitted by the light emitting element is a point-shaped light beam; and / or, The optical axis of the first line positioning light emitter and the optical axis of the second line positioning light emitter are parallel to the optical axis of the machining laser.

4. The laser head according to claim 1 or 2, characterized in that: The line light beams emitted by the first line positioning light emitter and the line light beams emitted by the second line positioning light emitter intersect vertically.

5. The laser head according to claim 2, characterized in that: The optical element includes a first optical element and a second optical element. The first optical element and the second optical element are arranged in sequence along the light emitting direction of the light emitting component. The first optical element is used to collimate the light beam emitted by the light emitting component, and the second optical element is used to modulate the collimated light beam into a line beam.

6. The laser head according to claim 5, characterized in that: The first optical element includes a single lens, a lens group consisting of multiple lenses, a Fresnel lens, or a super lens; and / or The second optical element includes one of a wave mirror, a cylindrical mirror, and a Powell prism.

7. The laser head according to claim 5, characterized in that: The first optical element and the second optical element are an integrated structure.

8. The laser head according to claim 2, wherein: The optical element is used to diffract the light beam emitted by the light emitting element into the line light beam, and the optical element includes one of a diffractive optical element and a metasurface device.

9. The laser head according to claim 1 or 2, characterized in that: The cavity of the first line positioning light emitter and the cavity of the second line positioning light emitter are two cavities in an integrated structure; and / or, The first line positioning light emitter and the second line positioning light emitter are both used to project multiple line light beams, and the multiple line light beams projected by the first line positioning light emitter intersect with the multiple line light beams projected by the second line positioning light emitter to form a grid pattern, one of which is located on the optical axis of the processing laser.

10. A laser processing device, characterized in that: include: The laser head according to any one of claims 1 to 9; The mechanical driving mechanism is connected to the laser head, and the mechanical driving mechanism is used to drive the laser head to move.

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