Laser processing equipment for annealed silicon wafer

Abstract

The utility model discloses an annealed silicon wafer laser processing device which comprises a processing table, a cam divider is installed above the processing table, a rotating rod is fixedly installed on an output shaft of the cam divider, and a rotating disc is fixedly connected to the top of the surface of the rotating rod. According to the utility model, silicon wafers needing back grooving are loaded into the inner cavity of the feeding pipe, the cam divider drives the rotating rod and the rotating disc to rotate, the processing cavity on the rotating disc is aligned with the storage cavity every time, one silicon wafer in the inner cavity of the feeding pipe enters the processing cavity, and laser grooving operation can be carried out after the silicon wafers rotate to the position below a laser head; the grooved silicon wafer rotates to be aligned with the roller bracket, the first air cylinder extends, the roller bracket ejects the machined silicon wafer out of an inner cavity of the machining cavity, then the machined silicon wafer is separated from the top of the machining table through flow guiding of the roller bracket, and the purposes of automatically feeding and discharging the silicon wafer and improving the machining efficiency of the silicon wafer can be achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of photovoltaic solar cell manufacturing technology, in particular to a laser processing device for annealed silicon wafers. Background Art

[0002] With the development of high-efficiency crystalline silicon cell technology, market demands for cell conversion efficiency continue to rise, and continuous process innovation has led to the emergence of N-type cell technology. N-type cells offer advantages such as high conversion efficiency, robustness to degradation, low temperature coefficient, and high bifaciality, which contribute to increasing photovoltaic power generation gain and reducing power generation costs.

[0003] After annealing, the silicon wafer is laser grooved on the back to reduce parasitic absorption of light, thereby increasing current and improving cell efficiency. We have designed a laser processing equipment for post-annealing silicon wafers that can automatically load and unload silicon wafers, improving silicon wafer processing efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a laser processing device for annealed silicon wafers, which has the advantages of being able to automatically load and unload silicon wafers and improve silicon wafer processing efficiency, so as to solve the above-mentioned background technical problems.

[0005] The technical solution of the utility model for solving the above technical problems is as follows: a laser processing equipment for silicon wafers after annealing, which includes a processing table, a cam divider is installed above the processing table, the output shaft of the cam divider is fixedly installed with a rotating rod, the top of the rotating rod surface is fixedly connected to a rotating disk, and a circular array on the top of the rotating disk is provided with a plurality of processing cavities adapted to the silicon wafers, the top of the processing table is provided with a loading assembly, the loading assembly includes a loading tube, a storage cavity adapted to the silicon wafers is opened on the loading tube, the bottom of the loading tube contacts the top of the rotating disk, a laser head is installed on the processing table, and a material stripping assembly is provided between the front side of the processing table and the rotating disk, the material stripping assembly includes a mounting seat fixedly installed on the front side of the processing table, a cylinder 1 is fixedly installed on the inner side of the mounting seat, the output end of the cylinder 1 is fixedly connected to a lifting plate, a rotatable roller bracket is provided on the top of the lifting plate, and the bottom of the inner cavity of the processing cavity is provided with a through opening for the roller bracket to pass through.

[0006] Preferably, a connecting plate is fixedly connected to one side of the feeding tube, the bottom of the connecting plate is fixedly connected to the processing table, and an observation port is opened on one side of the feeding tube, and the observation port is connected to the storage chamber.

[0007] Preferably, the top of the lifting plate is fixedly connected to a fixing seat, the inner cavity of the fixing seat is rotatably connected to a rotating block via a rotating shaft, and the top of the rotating block is fixedly connected to the roller bracket.

[0008] Preferably, the rear side of the top of the lifting plate is rotatably connected to cylinder 2 via a rotating shaft, and the output end of cylinder 2 is rotatably connected to the roller bracket via a rotating shaft.

[0009] Preferably, the four corners of the bottom of the lifting plate are fixedly connected with guide rods, and the bottoms of the guide rods pass through the bottom of the mounting seat and are slidably connected to the mounting seat.

[0010] The beneficial effects of the utility model are:

[0011] 1. The utility model loads the silicon wafer that needs back-grooving into the inner cavity of the feeding tube, and the cam divider drives the rotating rod and the rotating disk to rotate. Each time the processing cavity on the rotating disk is aligned with the storage cavity, a silicon wafer in the inner cavity of the feeding tube will enter the processing cavity. When the silicon wafer rotates to the bottom of the laser head, the laser grooving operation can be carried out. The grooved silicon wafer rotates to align with the roller bracket. When the cylinder extends, the roller bracket pushes the processed silicon wafer out of the inner cavity of the processing cavity. Then, it is separated from the top of the processing table through the guide of the roller bracket, so that the silicon wafer can be automatically loaded and unloaded, thereby improving the efficiency of silicon wafer processing.

[0012] 2. The utility model is provided with an observation port, through which the number of silicon wafers in the storage cavity can be directly understood, making it convenient to add silicon wafers in time;

[0013] 3. The utility model provides a guide rod, which drives the guide rod to slide on the mounting seat during the lifting process of the lifting plate, providing guidance and limit for the lifting of the lifting plate, thereby improving the stability of the lifting movement of the lifting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or other advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. These drawings are only illustrative and do not limit the present invention, wherein:

[0015] Figure 1 This is a three-dimensional schematic diagram of an embodiment of the utility model;

[0016] Figure 2 This is a three-dimensional schematic diagram of a rotating disk and a cam divider according to an embodiment of the present utility model;

[0017] Figure 3 This is a three-dimensional schematic diagram of a material stripping assembly according to an embodiment of the present invention.

[0018] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0019] 1. Processing table, 2. Cam divider, 3. Rotating rod, 4. Rotating disk, 5. Processing chamber, 6. Loading assembly, 61. Loading tube, 62. Storage chamber, 63. Observation port, 64. Connecting plate, 7. Laser head, 8. Material return assembly, 81. Mounting seat, 82. Cylinder 1, 83. Lifting plate, 84. Fixed seat, 85. Rotating block, 86. Roller bracket, 87. Cylinder 2, 88. Through-mouth, 89. Guide rod. DETAILED DESCRIPTION

[0020] Hereinafter, embodiments of the annealed silicon wafer laser processing apparatus of the present invention will be described with reference to the accompanying drawings.

[0021] Figure 1-3 The present invention shows an embodiment of a post-annealing silicon wafer laser processing device, which includes a processing table 1, a cam divider 2 is installed above the processing table 1, a rotating rod 3 is fixedly installed on the output shaft of the cam divider 2, a rotating disk 4 is fixedly connected to the top of the surface of the rotating rod 3, a plurality of processing cavities 5 adapted to the silicon wafers are opened in a circular array on the top of the rotating disk 4, a loading assembly 6 is provided on the top of the processing table 1, the loading assembly 6 includes a loading tube 61, a storage cavity 62 adapted to the silicon wafer is opened on the loading tube 61, and the loading tube 6 The bottom of 1 contacts the top of the rotating disk 4, one side of the feeding tube 61 is fixedly connected to a connecting plate 64, the bottom of the connecting plate 64 is fixedly connected to the processing table 1, and an observation port 63 is opened on one side of the feeding tube 61, and the observation port 63 is connected to the storage chamber 62. Through the setting of the observation port 63, the number of silicon wafers in the inner cavity of the storage chamber 62 can be directly understood through the observation port 63, which is convenient for timely adding silicon wafers. A laser head 7 is installed on the processing table 1, and a material stripping component 8 is provided between the front side of the processing table 1 and the rotating disk 4. 8 includes a mounting base 81 fixedly mounted on the front side of the processing table 1, a cylinder 82 is fixedly mounted on the inner side of the mounting base 81, the output end of the cylinder 82 is fixedly connected to a lifting plate 83, a rotatable roller bracket 86 is provided on the top of the lifting plate 83, a through-hole 88 is provided at the bottom of the inner cavity of the processing chamber 5 for the roller bracket 86 to pass through, a fixed base 84 is fixedly connected to the top of the lifting plate 83, the inner cavity of the fixed base 84 is rotatably connected to a rotating block 85 through a rotating shaft, the top of the rotating block 85 is fixedly connected to the roller bracket 86, and the lifting plate The rear side of the top of 83 is rotatably connected to cylinder 2 87 via a rotating shaft. The output end of cylinder 2 87 is rotatably connected to roller bracket 86 via a rotating shaft. The four corners of the bottom of the lifting plate 83 are fixedly connected to guide rods 89. The bottom of the guide rod 89 passes through the bottom of the mounting seat 81 and is slidably connected to the mounting seat 81. Through the setting of the guide rod 89, the guide rod 89 is driven to slide on the mounting seat 81 during the lifting and lowering process of the lifting plate 83, providing guidance and limitation for the lifting and lowering of the lifting plate 83, thereby improving the stability of the lifting and lowering movement of the lifting plate 83.

[0022] Working principle: When the present invention is used, the user loads the silicon wafer that needs to be grooved on the back into the inner cavity of the feeding tube 61, and the cam divider 2 drives the rotating rod 3 and the rotating disk 4 to rotate. The processing cavity 5 on the rotating disk 4 is aligned with the storage cavity 62 each time. Since the top of the rotating disk 4 is in contact with the feeding tube 61, a silicon wafer in the inner cavity of the feeding tube 61 will enter the processing cavity 5. When the silicon wafer in the inner cavity of the processing cavity 5 rotates to the bottom of the laser head 7, the laser groove operation can be performed by the laser head 7. The silicon wafer with the grooved surface rotates to align with the roller bracket 86, the cylinder 82 extends, and the lifting plate The cooperation between 83 and the fixed seat 84, the rotating block 85 and the cylinder 2 87 enables the roller bracket 86 to push the processed silicon wafer out of the inner cavity of the processing chamber 5 until the lifting plate 83 enters the inner cavity of the through-opening 88. The cylinder 2 87 extends, and the roller bracket 86 drives the rotating block 85 to rotate with the rotating axis of the inner cavity of the fixed seat 84 as the axis, so that the roller bracket 86 tilts forward. The slotted silicon wafer then passes through the guide of the roller bracket 86 and rolls to the front side of the processing table 1, and detaches from the top of the processing table 1. Then the cylinder 2 87 and the cylinder 1 82 are reset, so that the roller bracket 86 is located at the bottom of the rotating disk 4.

[0023] In summary: the annealed silicon wafer laser processing equipment loads the silicon wafer that needs to be grooved on the back into the inner cavity of the feeding tube 61, and the cam divider 2 drives the rotating rod 3 and the rotating disk 4 to rotate. The processing cavity 5 on the rotating disk 4 is aligned with the storage cavity 62 each time, and a silicon wafer in the inner cavity of the feeding tube 61 will enter the processing cavity 5. After the silicon wafer rotates to the bottom of the laser head 7, the laser grooving operation can be performed. The grooved silicon wafer is rotated to be aligned with the roller bracket 86, and the cylinder 82 is extended, so that the roller bracket 86 pushes the processed silicon wafer out of the inner cavity of the processing cavity 5, and then detaches from the top of the processing table 1 through the guide of the roller bracket 86, so as to achieve the purpose of automatically loading and unloading silicon wafers and improving the silicon wafer processing efficiency.

Claims

1. A laser processing device for annealed silicon wafers, characterized in that: The invention comprises a processing table (1), a cam divider (2) is installed above the processing table (1), a rotating rod (3) is fixedly installed on the output shaft of the cam divider (2), a rotating disk (4) is fixedly connected to the top of the surface of the rotating rod (3), a plurality of processing cavities (5) adapted to silicon wafers are provided in a circular array on the top of the rotating disk (4), a feeding assembly (6) is provided on the top of the processing table (1), the feeding assembly (6) comprises a feeding tube (61), a storage cavity (62) adapted to silicon wafers is provided on the feeding tube (61), and the bottom of the feeding tube (61) is connected to the rotating disk (4). ), a laser head (7) is mounted on the processing table (1), a material stripping assembly (8) is provided between the front side of the processing table (1) and the rotating disk (4), the material stripping assembly (8) comprises a mounting seat (81) fixedly mounted on the front side of the processing table (1), a cylinder 1 (82) is fixedly mounted on the inner side of the mounting seat (81), an output end of the cylinder 1 (82) is fixedly connected to a lifting plate (83), a rotatable roller bracket (86) is provided on the top of the lifting plate (83), and a through opening (88) for the roller bracket (86) to pass through is provided at the bottom of the inner cavity of the processing chamber (5).

2. The laser processing equipment for annealed silicon wafers according to claim 1, characterized in that: A connecting plate (64) is fixedly connected to one side of the feeding tube (61), and the bottom of the connecting plate (64) is fixedly connected to the processing table (1). An observation port (63) is opened on one side of the feeding tube (61), and the observation port (63) is communicated with the storage chamber (62).

3. The laser processing equipment for annealed silicon wafers according to claim 2, characterized in that: The top of the lifting plate (83) is fixedly connected to a fixed seat (84), the inner cavity of the fixed seat (84) is rotatably connected to a rotating block (85) via a rotating shaft, and the top of the rotating block (85) is fixedly connected to a roller bracket (86).

4. The laser processing equipment for annealed silicon wafers according to claim 3, characterized in that: The rear side of the top of the lifting plate (83) is rotatably connected to a second cylinder (87) via a rotating shaft, and the output end of the second cylinder (87) is rotatably connected to a roller bracket (86) via a rotating shaft.

5. The laser processing equipment for annealed silicon wafers according to claim 4, characterized in that: The four corners of the bottom of the lifting plate (83) are fixedly connected to guide rods (89), and the bottom of the guide rods (89) penetrates the bottom of the mounting seat (81) and is slidably connected to the mounting seat (81).

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