Silicon rod grinding system and silicon rod processing production line

Abstract

The utility model relates to the technical field of silicon rod machining, in particular to a silicon rod grinding system and a silicon rod machining production line, which comprise a first X-axis sliding table, and a grinding mechanism is connected to the first X-axis sliding table; the grinding mechanism comprises a supporting frame, a grinding mechanism and a chamfering mechanism, the grinding mechanism and the chamfering mechanism are both supported on the supporting frame, the supporting frame is supported on the first X-axis sliding table, and the chamfering mechanism is located on one side, in the X direction, of the grinding mechanism. According to the silicon rod chamfering device, the chamfering mechanism is arranged on one side of the polishing mechanism, the window period of machining is not generated, namely, in the polishing process, the chamfering mechanism located on one side of the polishing mechanism can naturally enter the chamfering machining procedure along with the polishing process, independent procedure switching actions are not needed, the chamfering mechanism can complete the chamfering procedure conveniently, and the machining efficiency of the silicon rod is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon rod processing, in particular to a silicon rod grinding system and a silicon rod processing production line. Background Art

[0002] After a silicon ingot is cut into two halves, each section requires grinding and chamfering. Currently, in commercially available grinding and chamfering equipment, the grinding and chamfering spindles are separate. This lacks interoperability when processing silicon ingots of varying heights, requiring independent adjustment of the chamfering spindle position. This reduces processing efficiency, while the independent adjustment mechanism also increases equipment cost. Utility Model Content

[0003] (1) Technical issues to be solved

[0004] In view of the above-mentioned shortcomings and deficiencies of the prior art, the utility model provides a silicon rod grinding system and a silicon rod processing production line, which solve the technical problems of low processing efficiency and high equipment cost of the grinding mechanism in the prior art.

[0005] (2) Technical solution

[0006] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0007] In the first aspect, the utility model provides a silicon rod grinding system, comprising a first X-axis slide, a grinding device and a fixture, wherein the grinding device is connected to the first X-axis slide; a clamping area is formed inside the fixture, and the silicon rod extends along the X-axis direction in the clamping area; the side of the clamping area facing the grinding device is the grinding area of ​​the silicon rod; the grinding device comprises a support frame, and a grinding mechanism and a chamfering mechanism both supported on the support frame, the support frame is supported on the first X-axis slide, and the chamfering mechanism is located on one side of the grinding mechanism along the X direction, so that the grinding mechanism and the grinding part of the chamfering mechanism form an integral grinding part.

[0008] In the second aspect, the utility model provides a silicon rod processing production line, including the silicon rod grinding system in the above technical solution, and also including a silicon rod cutting device and a silicon rod transfer robot. The silicon rod cutting device is suitable for horizontally cutting silicon rods; the silicon rod transfer robot is suitable for moving the cut silicon rods to the clamping area for clamping.

[0009] (3) Beneficial effects

[0010] The beneficial effects of the present invention are as follows: the silicon rod grinding system and silicon rod processing production line of the present invention can reduce the equipment costs of both, because the grinding mechanism and the chamfering mechanism share the first X-axis slide. Moreover, because both are supported on a support frame, when processing the silicon rod, the grinding process and the chamfering process will not be paused due to process switching, and there will be no processing window period. That is, after the grinding process is completed, the chamfering mechanism located on one side of the grinding mechanism will naturally enter the chamfering process as the grinding process proceeds. There is no need to perform an independent process switching action, and the chamfering mechanism can naturally complete the chamfering process, thereby greatly improving the processing efficiency of the silicon rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is one of the structural diagrams of the silicon rod grinding system of the utility model;

[0012] Figure 2 For this utility model Figure 1 Schematic diagram of the local enlarged structure at A in the middle;

[0013] Figure 3 This is a schematic structural diagram of the first X-axis slide and grinding mechanism of the utility model;

[0014] Figure 4 It is a structural schematic diagram of the chamfering mechanism, the second Y-axis slide and the second Z-axis slide of the utility model;

[0015] Figure 5 This is a schematic structural diagram of the clamp and the tightening device of the utility model;

[0016] Figure 6 This is a schematic structural diagram of the wear detection device of the utility model;

[0017] Figure 7 This is a structural diagram of the installation assembly of the utility model.

[0018] [Description of Reference Numerals]

[0019] 10. Silicon rod;

[0020] 1. First X-axis slide;

[0021] 2. Grinding mechanism; 21. Support frame; 22. Grinding mechanism; 23. Chamfering mechanism;

[0022] 24. Clamping device; 241. Stopper; 242. Second X-axis slide;

[0023] 25. Second Y-axis slide; 26. Second Z-axis slide;

[0024] 27. Mounting assembly; 271. Base plate; 272. Stopper; 273. Extrusion bolt; 274. Pull bolt; 275. Connecting bolt;

[0025] 3. Clamp; 31. Clamping jaw; 32. Clamp body;

[0026] 4. Wear detection device; 41. Grinding detection unit; 42. Chamfering detection unit. DETAILED DESCRIPTION

[0027] In order to better explain the present invention, and to facilitate understanding, the following Figure 1-Figure 7 , through the specific implementation method, the utility model is described in detail. Among them, the directional nouns such as "upper" and "lower" mentioned in this article are Figure 1 The orientation is referenced.

[0028] Example 1:

[0029] Reference Figure 1-Figure 7 An embodiment of the present utility model provides a silicon rod grinding system, including a first X-axis slide 1, a grinding device 2 and a clamp 3. The first X-axis slide 1 can slide along the X-axis. Specifically, the first X-axis slide 1 can be set as an electric slide, which is driven by a screw to ensure accuracy; the grinding device 2 is connected to the first X-axis slide 1; a clamping area is formed inside the clamp 3, and the silicon rod 10 extends along the X-axis direction in the clamping area; the side of the clamping area facing the grinding device 2 is the grinding area of ​​the silicon rod 10; the grinding device 2 includes a support frame 21, and a grinding mechanism 22 and a chamfering mechanism 23 both supported on the support frame 21. The support frame 21 is supported on the sliding part of the first X-axis slide 1, and the chamfering mechanism 23 is located on one side of the grinding mechanism 22 along the X-direction; and along the grinding direction of the grinding device 2, the chamfering mechanism 23 is located downstream of the grinding mechanism 22. The working ends of the grinding mechanism 22 and the chamfering mechanism 23 are formed into one or more grinding shapes, so that the grinding portions of the grinding mechanism 22 and the chamfering mechanism 23 form an integral grinding portion.

[0030] In this embodiment, the first X-axis slide 1 is the basic mobile platform of the entire grinding device 2. It can slide along the X-axis, allowing the grinding device 2 to flexibly adjust its position to meet the grinding requirements of the silicon rod 10. The movement of the X-axis is used to control the horizontal feed of the grinding process. The first X-axis slide 1 can be configured as a motor-driven screw slide.

[0031] The grinding device 2 is directly responsible for the grinding operation of the silicon rod 10. It is connected to the first X-axis slide 1 and moves with the movement of the slide, ensuring the stability and accuracy of the grinding operation.

[0032] The clamping area formed within the fixture 3 secures the silicon rod 10, preventing it from moving or vibrating during the grinding process. The silicon rod 10 extends along the X-axis within the clamping area. This layout facilitates continuous and uniform grinding by the grinding device 2 along the length of the silicon rod 10. The side of the clamping area facing the grinding device 2 is designated as the grinding zone, which is the area directly affected by the grinding operation.

[0033] The support frame 21 serves as a common supporting structure for the grinding mechanism 22 and the chamfering mechanism 23 , and is firmly connected to the first X-axis slide 1 to ensure smooth operation during the grinding process.

[0034] The grinding mechanism 22 is used to perform the main grinding operation on the silicon rod 10. The grinding mechanism 22 includes a grinding spindle, which can be configured as a nested spindle. The nested spindle can achieve coarse and fine grinding of the silicon rod 10, thereby improving the grinding efficiency and ensuring that the surface of the silicon rod 10 achieves the required dimensional accuracy and surface roughness.

[0035] The chamfering mechanism 23 is located on one side of the grinding mechanism 22 along the X direction, and is mainly used to chamfer the edge of the silicon rod 10 to remove burrs and sharp corners on the edge of the silicon rod 10 .

[0036] Compared with the prior art, the grinding device 2 of the present invention can reduce the equipment cost of both the grinding mechanism 22 and the chamfering mechanism 23 because they share the first X-axis slide 1. And because both are supported on the support frame 21, when the silicon rod 10 is processed, the grinding process and the chamfering process will not be paused due to process switching, and there will be no processing window period. That is, after the grinding process is completed, the chamfering mechanism 23 located on one side of the grinding mechanism 22 will naturally enter the chamfering process as the grinding process proceeds. There is no need to perform an independent process switching action, and the chamfering mechanism 23 can naturally complete the chamfering process, which greatly improves the processing efficiency of the silicon rod 10.

[0037] Specifically, the grinding mechanism 22 includes a grinding spindle and a grinding head. The grinding spindle can also slide vertically along the Z-axis direction to adjust the grinding feed amount.

[0038] Example 2:

[0039] Reference Figure 1-Figure 7 In addition to all the technical solutions of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0040] The device further comprises a wear detection device 4 , which comprises a grinding detection portion 41 and a chamfering detection portion 42 . The grinding detection portion 41 and the chamfering detection portion 42 form a detection area that matches the grinding shape.

[0041] In this embodiment, the wear detection device 4 is used to detect the wear of the grinding mechanism 22 and the chamfering mechanism 23, so that the grinding mechanism 22 and the chamfering mechanism 23 can adaptively adjust the feed rate, thereby ensuring the processing accuracy of the grinding mechanism 22 and the chamfering mechanism 23 and improving the processing quality of the silicon rod 10.

[0042] Specifically, the grinding detection unit 41 and the chamfering detection unit 42 work together to accurately measure the wear of the grinding mechanism 22 and the chamfering mechanism 23 during long-term use. Through real-time or periodic detection, the system can obtain wear data to ensure the processing accuracy of the silicon rod 10.

[0043] More specifically, the grinding detection unit 41 and the chamfering detection unit 42 may use high-precision contact sensors to more directly and accurately measure the wear of the grinding mechanism 22 and the chamfering mechanism 23 .

[0044] The contact sensor is a displacement sensor. The grinding parts with different grinding amounts will cause different displacements of the contact sensor after being released from the contact sensor. Combined with the displacement of the contact sensor under standard conditions, the loss of the grinding part can be obtained.

[0045] The grinding detection part 41 and the chamfering detection part 42 closely match their respective grinding shapes. When detecting the wear amount of the grinding mechanism 22 and the chamfering mechanism 23, the grinding mechanism 22 and the chamfering mechanism 23 only need to be moved to the wear detection device 4 according to the processing status, thereby ensuring the efficiency of wear detection.

[0046] By real-time monitoring and adjusting the feed rates of the grinding mechanism 22 and the chamfering mechanism 23, the problem of reduced machining accuracy due to wear can be effectively avoided, thereby improving the overall machining quality of the silicon ingot 10. Promptly identifying and replacing severely worn tools can prevent sudden failure due to overuse, thereby extending the tool life and reducing production costs. The application of the wear detection device 4 provides the hardware foundation for intelligent management of the silicon ingot 10 machining process, making the entire production process more efficient and controllable.

[0047] The grinding mechanism 22 and the chamfering mechanism 23 are regularly tested for wear, so as to ensure that they are accurately processed to the required size, and to achieve closed-loop feedback of wear detection, probe feedback, and grinding processing to ensure grinding accuracy.

[0048] The wear detection device 4 further includes a protective cover capable of shielding the detection area, so as to protect the grinding detection portion 41 and the chamfering detection portion 42 under non-detection conditions.

[0049] Example 3:

[0050] Reference Figure 1-Figure 7In addition to all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0051] The wear detection device 4 is supported on one side of the fixture 3 along the X-axis direction, so that the grinding device 2 can be moved and switched between the grinding area and the detection area along the X-axis direction.

[0052] In this embodiment, the wear detection device 4 is arranged on one side of the fixture 3, and the first X-axis slide 1 can be used to move the grinding device 2 to the wear detection device 4, thereby fully utilizing the first X-axis slide 1, saving hardware costs, and making the entire processing process more compact.

[0053] The grinding device 2 can move directly between the grinding area and the inspection area along the X-axis, reducing adjustment time and complexity and improving work efficiency. Furthermore, when moving along the X-axis, the grinding device 2 can maintain its original processing state to the greatest extent possible, thereby ensuring the detection accuracy of the wear detection device 4.

[0054] Example 4:

[0055] Reference Figure 1-Figure 7 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0056] The grinding device 2 also includes a tightening device 24, which includes a stopper 241 parallel to the end face of the silicon rod 10, and the stopper 241 is supported on one side of the clamping area along the X-axis direction; the tightening device 24 also includes a second X-axis slide 242, and the stopper 241 is supported on the second X-axis slide 242.

[0057] In this embodiment, the stopper 241 is arranged in a direction parallel to the end face of the silicon rod 10 to prevent the silicon rod 10 from moving along its axial direction during the processing. The stopper 241 provides a stable support surface for the silicon rod 10 through its physical blocking effect, ensuring the position accuracy of the silicon rod 10 during the processing. The stopper 241 is supported on the second X-axis slide 242, and the second X-axis slide 242 provides a movable base for the stopper 241. The second X-axis slide 242 allows the stopper 241 to be precisely adjusted in the X-axis direction to accommodate silicon rods 10 of different lengths or processing requirements. Through the stable support of the second X-axis slide 242, the stopper 241 can more firmly fix the silicon rod 10 and reduce vibration and deviation during the processing.

[0058] Example 5:

[0059] Reference Figure 1-Figure 7 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0060] Two chamfering mechanisms 23 are provided, and the working ends of the two chamfering mechanisms 23 form an angle that matches the chamfer of the silicon rod 10 to be processed.

[0061] In the silicon rod 10 processing system, the working ends of the two chamfering mechanisms 23 are designed to form an angle that completely matches the chamfer of the silicon rod 10 to be processed, for example, 45°, to ensure that excess material on the edge of the silicon rod 10 can be accurately removed during the processing process to form the desired chamfer shape.

[0062] The two chamfering mechanisms 23 form matching angles at their working ends, ensuring the chamfered shape and dimensional accuracy of the silicon ingot 10 edge. The parallel operation of the chamfering mechanisms 23 can shorten the processing cycle and improve production efficiency. By adjusting the operating parameters and position of the chamfering mechanisms 23, the processing requirements of silicon ingots 10 of different specifications can be met.

[0063] Example 6:

[0064] Reference Figure 1-Figure 7 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0065] It also includes a first Z-axis slide, a second Y-axis slide 25 and a second Z-axis slide 26. The grinding mechanism 22 is supported on the first Z-axis slide. Two second Y-axis slides 25 are provided and both are supported on the second Z-axis slide 26. Two chamfering mechanisms 23 are supported on the corresponding second Y-axis slides 25. In this way, it can be ensured that each chamfering mechanism 23 can obtain the freedom of movement in the Z-axis direction and the freedom of movement in the Y-axis direction, so that the chamfering mechanism 23 can better match the size model of the silicon rod 10, thereby improving the flexibility of use of the chamfering mechanism 23.

[0066] Example 7:

[0067] Reference Figure 1-Figure 7 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0068] The grinding device 2 also includes a mounting assembly 27, which includes a base plate 271, a limit block 272, an extrusion bolt 273 and a pull bolt 274. The base plate 271 is supported on the corresponding second Y-axis slide 25, and the limit block 272 is fixed on the base plate 271. The base plate 271 and the limit block 272 both extend along the YOZ plane; a connecting ear extends from the chamfering mechanism 23, and a connecting hole is provided on the connecting ear; the mounting assembly 27 also includes a connecting bolt 275, which is threadedly connected to the base plate 271 after passing through the connecting hole, and the connecting hole is connected to the connecting The bolt 275 is clearance-fitted to reserve an offset adjustment margin for the chamfering mechanism 23; the limit block 272 is located on one side of the chamfering mechanism 23; the extrusion bolt 273 and the pulling bolt 274 are arranged as two groups connected to the limit block 272, and are respectively connected to both sides of the length direction of the limit block 272; the pulling bolt 274 is slidingly connected to the limit block 272 and is threadedly connected to the chamfering mechanism 23 to pull the chamfering mechanism 23 close to the limit block 272; the extrusion bolt 273 is threadedly connected to the limit block 272 and is away from the extrusion chamfering mechanism 23 away from the limit block 272.

[0069] In this embodiment, the base plate 271 is the foundation of the entire mounting assembly 27. It is supported on the corresponding second Y-axis slide 25 to ensure the stability of the entire mounting assembly 27. The base plate 271 extends along the YOZ plane to match the movement direction of the second Y-axis slide 25 and processing requirements.

[0070] The limit block 272 is fixed to the bottom plate 271, providing precise positioning and restraint for the chamfering mechanism 23. The limit block 272 also extends along the YOZ plane and remains parallel to the bottom plate 271 to ensure the stability of the chamfering mechanism 23 in the vertical and horizontal directions.

[0071] The squeeze bolts 273 and pull bolts 274 connect the stop block 272 and the chamfering mechanism 23, enabling precise adjustment of the chamfering mechanism 23 within the installation area. The squeeze bolts 273 and pull bolts 274 are connected to either side of the length of the stop block 272. This arrangement allows the chamfering mechanism 23 to be subjected to forces in two directions, making it easier to achieve precise position adjustment.

[0072] The pulling bolt 274 is slidably connected to the limit block 272, but is threadedly connected to the chamfering mechanism 23. When the pulling bolt 274 is rotated, due to its sliding connection with the limit block 272, the bolt itself does not move, but the chamfering mechanism 23 is pulled closer to the limit block 272 through the threaded connection.

[0073] The extrusion bolt 273 is threadedly connected to the limit block 272, but contacts and applies an extrusion force to the chamfering mechanism 23. When the extrusion bolt 273 is rotated, it moves along the thread direction and extrudes the chamfering mechanism 23, moving it away from the limit block 272.

[0074] By adjusting the pulling bolt 274 and the squeezing bolt 273 , the angle of the chamfering device can be fine-tuned to better match the processing needs and ensure the accuracy of the chamfering processing.

[0075] A connecting ear extends from the chamfering mechanism 23, and a connecting hole is provided on the connecting ear; the mounting assembly 27 also includes a connecting bolt 275, which passes through the connecting hole and is threadedly connected to the base plate 271. The connecting hole and the connecting bolt 275 are clearance-matched to reserve an offset adjustment margin for the chamfering mechanism 23.

[0076] The connecting lugs can be rectangular and have connecting holes formed in them for connecting bolts 275 to pass through. The location and size of the holes should match the connecting bolts 275 to ensure smooth passage of the bolts. Connecting bolts 275 are used to secure chamfering mechanism 23 to base plate 271 via the connecting lugs. The length and diameter of connecting bolts 275 should be selected based on actual needs to ensure a strong and stable connection.

[0077] A threaded hole is provided on the base plate 271 at a position corresponding to the connecting bolt 275. Importantly, a clearance fit is established between the connecting hole and the connecting bolt 275, meaning the diameter of the connecting hole is slightly larger than the diameter of the connecting bolt 275. This design allows for offset adjustment of the chamfering mechanism 23, allowing for fine-tuning of the chamfering mechanism 23 when needed to accommodate different processing requirements or compensate for minor errors during the processing, thus satisfying the need to adjust the chamfering mechanism 23's inclination angle by pulling the bolt 274 and squeezing the bolt 273.

[0078] Example 8:

[0079] Reference Figure 1-Figure 7 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0080] The silicon ingot grinding system is configured with two groups, forming two grinding zones capable of simultaneously grinding silicon ingots 10 to ensure efficient processing. Specifically, by configuring two identical grinding mechanisms, the silicon ingot grinding system achieves dual-station simultaneous processing of silicon ingots 10. This parallel processing approach reduces processing wait time and improves overall equipment utilization and processing efficiency.

[0081] The two silicon rod grinding systems share the first X-axis slide 1 to reduce costs and improve structural compactness.

[0082] Example 9:

[0083] Reference Figure 1-Figure 7 In addition to all the technical solutions of any of the above embodiments, the embodiments of the present invention further have the following technical solutions:

[0084] The fixture 3 is configured as a centering fixture 3 , so that manual width adjustment is not required for silicon rods 10 of different width specifications, thereby ensuring the accuracy of the chamfering position and the grinding position.

[0085] The clamp 3 includes a clamp jaw 31, a clamp body 32 and a synchronous drive assembly. The clamp jaw 31 is set to two, and the synchronous drive assembly includes a telescopic drive member, a gear, two racks and two clamp jaw rails; the telescopic drive member is connected to a rack drive; the gear is rotatably connected to the clamp body 32; the two racks are both meshed with the two sides of the gear in the radial direction, and the two racks are correspondingly connected to the two clamp jaws 31, the two clamp jaw rails are fixedly connected to the corresponding clamp body 32, and the two clamp jaws 31 are slidably connected to the corresponding clamp jaw rails.

[0086] In this embodiment, the centering fixture 3 primarily comprises three parts: a clamping jaw 31, a fixture body 32, and a synchronous drive assembly. The clamping jaws 31 are symmetrically positioned on either side of the fixture body 32. They are used to directly clamp the silicon ingot 10, ensuring it maintains a stable position during processing. The fixture body 32 serves as a support platform for the clamping jaws 31 and the synchronous drive assembly, providing a stable mounting foundation.

[0087] The synchronous drive assembly includes a telescopic drive member, a gear, two racks and two clamping claw tracks. The telescopic drive member serves as a power source and drives a rack to perform linear motion. The gear is rotatably connected to the clamp body 32 and meshes with the two racks to achieve power transmission and conversion. The two racks mesh with the two sides of the gear respectively. When the telescopic drive member drives one rack to move, the transmission action of the gear causes the other rack to move in the opposite direction. The clamping claw track is fixedly connected to the clamp body 32, providing a sliding guide for the clamping claw 31, ensuring the stability and accuracy of the clamping claw 31 during the clamping process.

[0088] Because the two jaws 31 are driven synchronously and maintain the same movement speed and direction through a rack-and-pinion transmission mechanism, the silicon ingot 10 is automatically centered during the clamping process. By controlling the telescopic drive element, the clamping force of the jaws 31 can be adjusted to accommodate silicon ingots 10 of different sizes and materials.

[0089] The precise clamping and centering adjustment capabilities of the centering fixture 3 ensure that the silicon ingot 10 maintains a stable position and posture during processing, thereby improving processing accuracy. The fixture 3 offers a flexible design, allowing adjustments to the spacing and clamping force of the jaws 31 to accommodate processing of silicon ingots 10 of varying sizes and materials. The automated centering and clamping process reduces manual intervention and waiting time, thereby improving production efficiency.

[0090] Example 9:

[0091] Figure 1-Figure 7In addition to providing a silicon rod processing production line, the embodiments of the present invention include the silicon rod grinding system in any of the above embodiments, and also include a silicon rod cutting device and a silicon rod transfer robot. The silicon rod cutting device is suitable for horizontally cutting the silicon rod 10; the silicon rod transfer robot is suitable for moving the cut silicon rod 10 to the clamping area for clamping. Therefore, the silicon rod processing production line can realize automatic processing of the silicon rod 10 and further improve the processing efficiency of the silicon rod 10. The production line includes the silicon rod grinding system in any of the above embodiments, and therefore also includes all the beneficial effects of any of the above embodiments. To avoid repetition, they are not described in detail here.

[0092] It can be understood that, except for any conflicting parts, the above-mentioned embodiments 1-9 can be freely combined to form other implementation methods of the present invention.

[0093] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0094] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0095] In the present invention, unless otherwise expressly specified or limited, when a first feature is “above” or “below” a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, when a first feature is “above,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0096] The term "comprise" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed or inherent to such process, article, or apparatus / device.

[0097] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A silicon rod grinding system, characterized by: The invention comprises a first X-axis slide (1), a grinding device (2) and a clamp (3), wherein the grinding device (2) is connected to the first X-axis slide (1); a clamping area is formed inside the clamp (3), and the silicon rod (10) can extend along the X-axis direction in the clamping area; and an area on one side of the clamping area facing the grinding device (2) is a grinding area for the silicon rod (10); The grinding device (2) includes a support frame (21), and a grinding mechanism (22) and a chamfering mechanism (23) both supported on the support frame (21); the support frame (21) is supported on the first X-axis slide (1); the chamfering mechanism (23) is located on one side of the grinding mechanism (22) along the X direction, and along the grinding direction of the grinding device (2), the chamfering mechanism (23) is located downstream of the grinding mechanism (22), so that the grinding parts of the grinding mechanism (22) and the chamfering mechanism (23) form an integrated grinding part.

2. The silicon rod grinding system according to claim 1, wherein: It also includes a wear detection device (4), the wear detection device (4) including a grinding detection portion (41) and a chamfering detection portion (42), the grinding detection portion (41) and the chamfering detection portion (42) forming a detection area that matches the grinding shape; The wear detection device (4) further comprises a protective cover capable of shielding the detection area.

3. The silicon rod grinding system according to claim 2, wherein: The wear detection device (4) is supported on one side of the fixture (3) along the X-axis direction, so that the grinding device (2) can be moved and switched between the grinding area and the detection area along the X-axis direction.

4. The silicon rod grinding system according to claim 1, wherein: The grinding device (2) further includes a tightening device (24), the tightening device (24) including a stopper (241) parallel to the end face of the silicon rod (10), so that the stopper (241) can selectively tighten the end face of the silicon rod (10), and the stopper (241) is supported on one side of the clamping area along the X-axis direction; The tightening device (24) further includes a second X-axis slide (242), and the stopper (241) is supported on the second X-axis slide (242).

5. The silicon rod grinding system according to claim 1, wherein: The chamfering mechanisms (23) are provided in two numbers, and the working ends of the two chamfering mechanisms (23) form an angle that matches the chamfer to be processed on the silicon rod (10).

6. The silicon rod grinding system according to claim 1, wherein: The grinding device (2) further comprises a first Z-axis slide, a second Y-axis slide (25) and a second Z-axis slide (26); The grinding mechanism (22) is supported on the first Z-axis slide; The second Y-axis slides (25) are provided in two pieces and are both supported on the second Z-axis slide (26), and the two chamfering mechanisms (23) are supported on the corresponding second Y-axis slides (25).

7. The silicon rod grinding system according to claim 6, wherein: The grinding device (2) further includes a mounting assembly (27), the mounting assembly (27) including a base plate (271), a limit block (272), an extrusion bolt (273), and a pull bolt (274), the base plate (271) being supported on the corresponding second Y-axis slide (25), the limit block (272) being fixed on the base plate (271), and the base plate (271) and the limit block (272) both extending along the YOZ plane; A connecting ear extends from the chamfering mechanism (23), and a connecting hole is provided on the connecting ear; the mounting assembly (27) further comprises a connecting bolt (275), the connecting bolt (275) passing through the connecting hole and then being threadedly connected to the base plate (271), the connecting hole and the connecting bolt (275) being clearance-matched to reserve a margin for offset adjustment of the chamfering mechanism (23); The limit block (272) is located on one side of the chamfering mechanism (23); the extrusion bolt (273) and the pulling bolt (274) are provided as two groups connected to the limit block (272), and are respectively connected to two sides of the limit block (272) in the length direction; The pulling bolt (274) is slidably connected to the limit block (272) and is threadedly connected to the chamfering mechanism (23) to pull the chamfering mechanism (23) closer to the limit block (272); the squeezing bolt (273) is threadedly connected to the limit block (272) to squeeze the chamfering mechanism (23) away from the limit block (272).

8. The silicon rod grinding system according to claim 1, wherein: The clamp (3) is configured as a centering clamp (3); The clamp (3) includes a clamp (31), a clamp body (32) and a synchronous drive assembly, wherein the clamp (31) is provided in two pieces, and the synchronous drive assembly includes a telescopic drive member, a gear, two racks and two clamp rails; the telescopic drive member is connected to a rack drive; the gear is rotatably connected to the clamp body (32); the two racks are both meshed with the two sides of the gear in the radial direction, and the two racks are connected to the two clamps (31) respectively, the two clamp rails are fixedly connected to the corresponding clamp body (32), and the two clamps (31) are slidably connected to the corresponding clamp rails.

9. The silicon rod grinding system according to any one of claims 1 to 8, characterized in that: The silicon rod grinding system is provided in two groups, and the two groups of silicon rod grinding systems share the first X-axis slide (1) to form two grinding areas capable of simultaneously grinding the silicon rods (10).

10. A silicon rod processing production line, characterized by: The silicon rod grinding system according to any one of claims 1 to 9, further comprising: A silicon rod cutting device, adapted to horizontally cut the silicon rod (10); The silicon rod transfer robot is suitable for moving the cut silicon rod (10) to the clamping area for clamping.

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