Silicon substrate diamond sheet cutting and fixing device

Abstract

The utility model discloses a silicon substrate diamond sheet cutting and fixing device which comprises two positioning seats which are oppositely installed. The positioning seat comprises a fixed seat, a push rod device and an adsorption disc, the push rod device is mounted on the fixed seat, two ends of a piston rod of the push rod device extend out of the cylinder body, and the adsorption disc is mounted at one end, positioned on the fixed seat, of the piston rod after penetrating through the fixed seat; the piston rod is of a tubular structure, and one end of the piston rod communicates with the adsorption disc. The silicon wafer diamond sheet is clamped and adsorbed through the adsorption discs on the positioning seats on the two sides, and the silicon substrate sheet in the silicon wafer diamond sheet is cut through the cutting equipment, so that the diamond sheets on the two sides of the silicon substrate sheet are separated, the separated diamond sheets are adsorbed on the adsorption discs, and the diamond sheets can be conveniently collected in the next procedure.

Description

Technical Field

[0001] The utility model relates to the technical field of diamond slice production, in particular to a silicon substrate diamond slice cutting and fixing device. Background Art

[0002] Currently, when producing diamond wafers, carbon is deposited on one side of a silicon substrate to form a silicon wafer diamond slice. To obtain diamond wafers from this silicon wafer diamond slice, the silicon substrate is ground away through polishing. This process deposits carbon only on one side of the silicon substrate, resulting in low silicon substrate utilization. Our company has modified the production process to deposit carbon on both sides of the silicon substrate. To separate the diamond wafers on both sides of the silicon substrate, we have designed a device for cutting and fixing silicon substrate diamond wafers. Utility Model Content

[0003] The purpose of this utility model is to provide a device for cutting and fixing a silicon substrate diamond slice. The device clamps and adsorbs the silicon wafer diamond slice using suction discs on two side positioning seats, facilitating the slicing of the silicon substrate slice within the silicon wafer diamond slice by a cutting device. The separated diamond slices are adsorbed on the suction discs, facilitating their collection in the next step. This device facilitates the separation of the diamond slices on both sides of the silicon substrate slice.

[0004] To achieve the above-mentioned purpose, the utility model provides a silicon substrate diamond sheet cutting and fixing device, comprising two positioning seats, which are installed opposite to each other; the positioning seat comprises a fixing seat, a push rod device and an adsorption plate, the push rod device is installed on the fixing seat, both ends of the piston rod of the push rod device extend out of the cylinder body, and the adsorption plate is installed at one end of the piston rod located at the fixing seat after passing through the fixing seat; the piston rod is a tubular structure, and one end of the piston rod is connected to the adsorption plate; in use, the other end of the piston rod is connected to the negative pressure equipment through a flexible pipe.

[0005] The adsorption disc comprises a box body, one end of the box body is provided with an adsorption hole, and the other side of the box body is provided with a connecting sleeve, which is connected to the piston rod.

[0006] The fixing seat is provided with a sinking platform on one side of the adsorption plate.

[0007] The depth of the sink is greater than the thickness of the adsorption disk, so that the sink forms a limiting groove on the outer side of the adsorption disk.

[0008] The two positioning seats are installed on the base.

[0009] The base is provided with a through hole between the two positioning seats.

[0010] Compared with the prior art, the present invention has the following technical effects:

[0011] 1. The fixing base of the utility model is used to install and support the push rod device, and the suction plate is used to absorb the silicon wafer diamond slice and clamp the silicon wafer diamond slice under the action of the push rod device. The silicon wafer diamond slice is clamped and absorbed by the suction plates on the positioning base on both sides. The silicon substrate slice in the silicon wafer diamond slice is cut by the cutting equipment, thereby separating the diamond slices on both sides of the silicon substrate slice. The separated diamond slices are adsorbed on the suction plate, facilitating their collection in the next step.

[0012] 2. The depth of the sinking platform of the utility model is greater than the thickness of the adsorption disk, so that the sinking platform forms a limiting groove on the outside of the adsorption disk. When the silicon wafer and diamond wafer are placed in the limiting groove, they can be accurately placed on the adsorption disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art description:

[0014] Figure 1 This is a schematic diagram of the top structure of the utility model;

[0015] Figure 2 for Figure 1 Schematic diagram of the AA section structure;

[0016] Figure 3 This is a schematic diagram of the cross-sectional structure of the adsorption disk of the present invention;

[0017] Figure 4 A schematic diagram of the state in which a silicon wafer and a diamond wafer are placed on a suction plate on one side when the utility model is used;

[0018] Figure 5 This is a schematic diagram of the state when the silicon wafer and diamond sheet are extended when the utility model is used;

[0019] Figure 6 This is a schematic diagram of the state in which the silicon wafer and diamond wafer are clamped and adsorbed by the adsorption disks on both sides during cutting when the utility model is used;

[0020] Figure 7 This is a schematic diagram of the state of a silicon wafer and a diamond slice after being cut when the utility model is used.

[0021] Reference numerals:

[0022] Base 10, through hole 11;

[0023] Positioning seat 20, fixing seat 21, sinking platform 211, push rod device 22, piston rod 221, adsorption plate 23, box body 231, adsorption hole 232, connecting sleeve 233, limiting groove 24;

[0024] Flexible pipe 30;

[0025] Silicon wafer diamond sheet 40, silicon substrate sheet 41, diamond thin sheet 42;

[0026] Cutting device 50. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0028] Example 1:

[0029] See Figure 1-7 A device for cutting and fixing a silicon substrate diamond sheet comprises two positioning seats 20, which are mounted opposite each other. The positioning seats 20 include a fixing seat 21, a push rod device 22, and a suction plate 23. The push rod device 22 is mounted on the fixing seat 21. Both ends of the piston rod 221 of the push rod device 22 extend out of the cylinder body. The piston rod 221 is located at one end of the fixing seat 21 and is mounted with the suction plate 23 after passing through the fixing seat 21. The piston rod 221 is a tubular structure, one end of which is connected to the suction plate 23. When in use, the other end of the piston rod 221 is connected to a negative pressure device via a flexible pipe. The fixing seat 21 is used to mount and support the push rod device 22. The suction plate 23 is used to adsorb the silicon wafer diamond sheet 40 and clamp the silicon wafer diamond sheet 40 under the action of the push rod device 22. The silicon wafer diamond slice 40 is clamped and adsorbed by the adsorption plates 23 on the positioning seats 20 on both sides, and the silicon substrate slice 41 in the silicon wafer diamond slice 40 is cut by the cutting equipment 50, so as to separate the diamond slices 42 on both sides of the silicon substrate slice 41. The separated diamond slices 42 are adsorbed on the adsorption plates 23, so that the diamond slices 23 can be collected in the next process.

[0030] In this embodiment, the cutting device 50 includes a wire cutting device and a laser cutting device.

[0031] In this embodiment, the push rod device 22 adopts an air cylinder or a hydraulic cylinder, preferably an air cylinder.

[0032] See also Figure 3In this embodiment, the adsorption disk 23 includes a box body 231, one end of which is provided with an adsorption hole 232, and the other side is provided with a connecting sleeve 233, which is connected to the piston rod 221. Specifically, the box body 231 is provided with a hole inside the connecting sleeve 233, so that the piston rod 221 is connected to the interior of the box body 231. The connecting sleeve 233 can be a ring sleeve or an internal threaded sleeve, which is convenient for interference fit connection with the piston rod 221, or threaded connection. In this embodiment, the box body 231 is circular, and the silicon wafer diamond piece 40 is also circular.

[0033] Further, see Figure 2 The fixing seat 21 is provided with a sinking platform 211 on one side of the adsorption plate 23. The sinking platform 211 is provided to accommodate the adsorption plate 23.

[0034] Further, see Figure 2 The depth of the sink 211 is greater than the thickness of the adsorption plate 23, so that the sink 211 forms a limiting groove 24 outside the adsorption plate 23. After the limiting groove 24 is provided, the silicon wafer diamond sheet 40 can be placed in the limiting groove 24 and accurately placed on the adsorption plate 23.

[0035] Example 2:

[0036] See also Figure 1 , the two positioning seats 20 are installed on the base 10. It is convenient to position the positioning seat 20 so that the positioning seats 20 on both sides form an integral structure, which is convenient for installing the device as a whole on the workbench of the cutting equipment 50.

[0037] Furthermore, the base 10 is provided with a through hole 11 between the two positioning seats 20 to facilitate dust falling.

[0038] The working principle or action process of the utility model is as follows:

[0039] When using, see Figure 1 The piston rods 221 of the push rod devices 22 on both sides are connected to the negative pressure device through the flexible pipes 30, and the negative pressure device controls the on and off of the negative pressure in the adsorption disk 23. The negative pressure device can be a negative pressure micro negative pressure pump or a vacuum pump.

[0040] First step, see Figure 2 The piston rods 221 of the push rod device 22 are all retracted, and the adsorption plate 23 is located in the sink 211, so that the space between the fixing seats 21 is maximized, which is convenient for placing the silicon wafer and diamond sheet 40.

[0041] Step 2, see Figure 4 , place the silicon wafer diamond piece 40 into the limiting groove 24 on one side. At this time, the adsorption plate 23 on this side is connected to the negative pressure through the negative pressure device, so that the adsorption plate 23 absorbs the silicon wafer diamond piece 40.

[0042] Step 3, see Figure 5 The adsorption plate 23 on one side of the silicon wafer and diamond wafer 40 is extended under the action of the push rod device 22.

[0043] Step 4, see Figure 6 The suction plate 23 on the other side of the positioning seat 20 is also extended by the corresponding push rod device 22 to clamp the silicon wafer diamond sheet 40. Then, the suction plate 23 on this side is also connected to the negative pressure device. After that, the cutting device 50 cuts the silicon substrate sheet 41, thereby separating the diamond sheets 42 on both sides of the silicon substrate sheet 41. Figure 7 Afterwards, disconnect the negative pressure connection of the negative pressure device and take out the diamond slice 42.

Claims

1. A device for cutting and fixing a silicon substrate diamond sheet, characterized in that: The invention comprises two positioning seats (20), which are installed relative to each other; the positioning seat (20) comprises a fixed seat (21), a push rod device (22) and an adsorption plate (23); the push rod device (22) is installed on the fixed seat (21); both ends of the piston rod (221) of the push rod device (22) extend out of the cylinder body; one end of the piston rod (221) located on the fixed seat (21) is installed with the adsorption plate (23) after passing through the fixed seat (21); the piston rod (221) is a tubular structure, and one end of the piston rod (221) is connected to the adsorption plate (23); in the use state, the other end of the piston rod (221) is connected to the negative pressure device through the flexible pipe (30).

2. The device for cutting and fixing a silicon substrate diamond sheet according to claim 1, characterized in that: The adsorption disc (23) comprises a box body (231), one end of the box body (231) is provided with an adsorption hole (232), and the other side is provided with a connecting sleeve (233), and the connecting sleeve (233) is connected to the piston rod (221).

3. The device for cutting and fixing a silicon substrate diamond sheet according to claim 1, characterized in that: The fixing seat (21) is provided with a sink (211) on one side of the adsorption plate (23).

4. The device for cutting and fixing a silicon substrate diamond sheet according to claim 3, characterized in that: The depth of the sink (211) is greater than the thickness of the adsorption disk (23), so that the sink (211) forms a limiting groove (24) outside the adsorption disk (23).

5. A silicon substrate diamond sheet cutting and fixing device according to any one of claims 1 to 4, characterized in that: The two positioning seats (20) are mounted on the base (10).

6. The device for cutting and fixing a silicon substrate diamond sheet according to claim 5, characterized in that: The base (10) is provided with a through hole (11) between the two positioning seats (20).

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