Full-automatic film tearing and laminating equipment

Abstract

The utility model discloses full-automatic film tearing and laminating equipment, which comprises a working rack, a stock bin, a carrying manipulator, a laminating mechanism and a printing and labeling mechanism, and further comprises a wafer film tearing mechanism, a film laminating mechanism and a printing and labeling mechanism, the visual edge finder is used for correcting the center position of the wafer, identifying the position of a notch in the edge of the wafer and detecting residual glue on the surface of the wafer after film tearing; the device further comprises a second heating platform; a bearing table for placing a wafer is arranged on the second heating platform, and the bearing table is used for heating the wafer; the second moving module is used for driving the second heating platform to move and enabling the wafer film tearing mechanism to carry out film tearing on the wafer on the bearing platform; according to the utility model, re-film coating and label pasting of the wafer can be efficiently completed, residual glue detection can be carried out on the wafer after film tearing, and the film coating quality of the wafer is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to fully automatic film tearing and laminating equipment. Background Art

[0002] Laminating is an important step in the semiconductor manufacturing process. Sometimes it is necessary to tear off the old film on the wafer and re-laminate it. Wafer laminating can not only improve the performance and reliability of the wafer, but also protect the wafer surface and improve the accuracy and efficiency of subsequent processes. Existing laminating devices mostly use manual methods, which are inefficient and easy to damage the wafer. Although some existing automatic laminating devices can achieve automatic lamination, they lack the function of visually inspecting residual adhesive on the wafer, which makes it inconvenient to ensure the lamination quality of the wafer. Utility Model Content

[0003] The purpose of the present invention is to provide a fully automatic film tearing and laminating device to solve the problems raised in the above background technology.

[0004] In order to solve the above technical problems, the utility model provides the following technical solutions: fully automatic film tearing and laminating equipment, including a workbench, a material silo, a handling robot, a laminating mechanism and a printing and labeling mechanism, and also includes: a wafer tearing mechanism for tearing off the old film on the surface of the wafer; a visual edge finder, the visual edge finder is used to correct the center position of the wafer, detect the position of the wafer edge notch and detect the residual glue on the wafer surface after tearing the film.

[0005] Furthermore, it also includes: a second heating platform; a carrier platform for placing wafers is provided on the second heating platform, and the carrier platform is used to heat the wafers; a movable module 2, and the movable module 2 is used to drive the second heating platform to move and enable the wafer tearing mechanism to tear the film of the wafer on the carrier platform.

[0006] Furthermore, the carrier is provided with an adsorption area for adsorbing wafers.

[0007] Furthermore, the visual edge finder includes: a visual device, which is arranged on the workbench; a correction device, which is arranged on the workbench and is used to correct the position of the wafer.

[0008] Furthermore, the visual device includes a CCD camera and a coaxial light source arranged below the CCD camera.

[0009] Furthermore, the wafer tearing mechanism includes: a first heating platform, which is also provided with a supporting platform for placing the wafer; a movable module 1, which is used to drive the first heating platform to move; a fixed frame, which is movably set on the workbench; a tape unwinding roller, which is set on the workbench; a tape winding roller, which is set on the workbench; a driving device, which is used to drive the fixed frame to move horizontally; wherein, the fixed frame is provided with a plurality of pressure rollers of different sizes, and the workbench is provided with a plurality of guide rollers; the tape roll is placed on the tape unwinding roller, and one end of the tape roll passes around each pressure roller and guide roller and is wound around the tape winding roller.

[0010] Furthermore, the driving device includes: a screw rod, which is rotatably set on the workbench, and the fixing frame is threadedly connected to the outside of the screw rod; a driving motor, the output end of the driving motor is fixedly connected to the screw rod, and the driving motor is installed on the workbench.

[0011] Furthermore, the first movable module and the second movable module are both linear modules.

[0012] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0013] 1. It realizes automatic film tearing and automatic lamination, and efficiently completes wafer re-lamination and labeling. It is also equipped with a visual edge finder to detect residual adhesive on the wafer after film tearing, thereby ensuring that the surface of the re-laminated wafer remains clean, thereby ensuring the lamination quality of the wafer.

[0014] 2. Since the wafer is pre-positioned by the visual edge finder before re-laminating, it is convenient to accurately place the label at the specified position when placing the label later, thereby ensuring the placement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention.

[0016] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the present utility model.

[0017] Figure 2 This is a structural schematic diagram of embodiment 1 of the utility model from another angle.

[0018] Figure 3 This is a schematic structural diagram of the first heating platform of Example 1 of the present utility model.

[0019] Figure 4 This is a schematic diagram of the installation of the visual device of the third embodiment of the present invention.

[0020] In the figure: 1. Workbench; 2. Material silo; 3. Handling robot; 4. Wafer film tearing mechanism; 41. First heating platform; 411. Carrying platform; 412. Mobile module 1; 42. Fixed frame; 43. Adhesive paper unwinding roller; 44. Adhesive paper taking-up roller; 45. Driving device; 451. Driving motor; 452. Screw; 46. Pressing roller; 47. Guide roller; 5. Visual edge finder; 51. Correction device; 52. Visual device; 521. CCD camera; 522. Coaxial light source; 6. Second heating platform; 61. Mobile module 2; 7. Laminating mechanism; 8. Printing and labeling mechanism. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purposes, features and advantages of the present application more clearly understood, the following detailed description of the specific embodiments of the present application is given in conjunction with the accompanying drawings, that is, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example 1

[0023] See also Figure 1-Figure 3 The utility model provides a technical solution: fully automatic film tearing and laminating equipment, including a workbench 1, a material bin 2, a handling robot 3, a laminating mechanism 7 and a printing and labeling mechanism 8, and also includes a wafer film tearing mechanism 4, a visual edge finder 5 and a second heating platform 6 arranged on the workbench 1. The wafer film tearing mechanism 4 is used to tear off the old film on the surface of the wafer, and the visual edge finder 5 is used to correct the center position of the wafer, detect the edge notch position of the wafer, and detect the residual glue on the wafer surface after tearing the film.

[0024] The silo 2 is used to place wafers with old films, and the wafers are neatly stacked in the silo 2, and there is a gap between adjacent wafers; the handling robot 3 is used to transport wafers, and the handling robot 3 is connected to a linear module, so that it can drive the handling robot 3 to move; the laminating mechanism 7 is used to re-laminate the surface of the wafer, and the printing and labeling mechanism 8 is used to print labels and stick the labels on the re-laminated wafers; the silo 2 can be set at a suitable position, and the wafers with old films can be directly transported out of the silo 2 by the handling robot 3; with the cooperation of the linear module connected to the handling robot 3, the handling robot 3 can operate the wafer to cooperate with the visual edge finder 5, the wafer tearing mechanism 4 or the laminating mechanism 7; in addition, the silo 2 is also used to place wafers that have been re-laminated and labeled; the silo 2, the handling robot 3, the laminating mechanism 7 and the printing and labeling mechanism 8 can all adopt existing technologies.

[0025] The visual edge finder 5 includes a visual device 52, which can identify the edge position of the wafer, thereby identifying the position of the notch mark on the edge of the wafer. At the same time, the visual device 52 can also detect whether there is residual glue on the surface of the wafer; the visual edge finder 5 also includes a correction device 51. Based on the recognition of the visual device 52, the correction device 51 can correct the center position of the wafer, and the correction device 51 can adopt a correction platform.

[0026] The wafer tearing mechanism 4 includes a moving module 412, and a first heating platform 41 is provided on the moving module 412. The moving module 412 is arranged on the workbench 1, and the moving module 412 drives the first heating platform 41 to move linearly; a carrier 411 for placing the wafer is provided on the first heating platform 41, and the carrier 411 is used to adsorb and heat the wafer; specifically, the carrier 411 can be heated by arranging a heating device on the second heating platform 6, or the carrier 411 itself adopts a heating plate structure, which can be heated by powering on; an adsorption area is provided on the carrier 411, and specifically, a groove or through-hole structure can be provided on the carrier 411, and a negative pressure device can be used to generate a negative pressure inside the groove or through-hole, so as to adsorb the wafer, and the negative pressure device can adopt a vacuum generator or other air pressure regulating device.

[0027] The wafer film tearing mechanism 4 also includes a fixed frame 42, which is movably arranged on the workbench 1; specifically, a linear guide rail is connected between the fixed frame 42 and the workbench 1, so that the fixed frame 42 can move horizontally; a tape unwinding roller 43 and a tape rewinding roller 44 are rotatably arranged on the workbench 1, and the tape unwinding roller 43 is used to place the tape roll; a plurality of pressure rollers 46 are arranged on the fixed frame 42, and the diameters of the plurality of pressure rollers 46 can be set to different, and each pressure roller 46 is rotatably arranged on the fixed frame 42; the wafer film tearing mechanism 4 It also includes a plurality of guide rollers 47 arranged on the workbench 1. One end of the adhesive paper roll peels off the entire roll and passes through each pressure roller 46 and each guide roller 47, and is wound on the adhesive paper winding roller 44. The adhesive paper winding roller 44 is driven to rotate by a motor; wherein, at least one guide roller 47 can be movably arranged on the workbench 1, and the guide roller 47 is driven to move by a driving structure (such as a cylinder or other device), so as to adjust the tightness of the adhesive paper between the adhesive paper unwinding roller 43 and the adhesive paper winding roller 44.

[0028] The wafer tearing mechanism 4 also includes a driving device 45, which is used to drive the fixed frame 42 to move horizontally and linearly; the driving device 45 includes a screw rod 452, which is movably arranged on the workbench 1 through a bearing, and the fixed frame 42 is sleeved on the outside of the screw rod 452, and the fixed frame 42 and the screw rod 452 are connected by threaded cooperation; the driving device 45 also includes a driving motor 451, and the output shaft of the driving motor 451 is fixedly connected to the screw rod 452, and the screw rod 452 is driven to rotate by the driving motor 451. Since the fixed frame 42 is movably arranged on the workbench 1 through a linear guide rail, it can drive the fixed frame 42 to move horizontally and linearly, and then drive the pressure roller 46 to move.

[0029] The wafer film tearing mechanism 4 is used to tear off the old film on the wafer. The specific working process is as follows: first, the wafer in the hopper 2 is taken out by the transport robot 3, and the wafer is placed on the correction device 51. The visual edge finder 5 corrects the position of the wafer to ensure that the subsequent transport robot 3 can place the wafer at the center of the carrier 411; after the wafer correction is completed, the transport robot 3 can place the wafer at the center of the carrier 411 of the first heating platform 41. The carrier 411 absorbs the wafer and heats the wafer. The heating helps to soften the film on the wafer; then, the moving module 1 412 drives the first heating platform 41 to move, and drives the wafer to move to the center of the carrier 411. The position of the adhesive tape between the adhesive tape unwinding roller 43 and the adhesive tape winding roller 44 is aligned; the driving motor 451 drives the screw rod 452 to rotate, so as to drive the fixed frame 42 to move and approach the wafer. When the adhesive tape corresponding to the pressure roller 46 contacts and presses on the surface of the film, the adhesive tape can stick to the film; the adhesive tape is wound by the adhesive tape winding roller 44 and cooperates with the fixed frame 42 to drive the pressure roller 46 to move, so as to realize the peeling of the film on the wafer, and the film is taken away along with the adhesive tape; after the film is torn off, the moving module 412 drives the first heating platform 41 to reset, and the handling robot 3 cooperates with the linear module connected to it to place the wafer after the film is torn off on the visual edge finder 5 for residual glue detection.

[0030] At the same time, if the visual edge finder 5 detects residual glue, the handling robot 3 moves the wafer away from the visual edge finder 5 and places the wafer back in the silo 2, or cooperates with an external robot to load the wafer out for subsequent processing; if no residual glue is detected, the visual edge finder 5 corrects the position of the wafer.

[0031] A carrier platform 411 is also provided on the second heating platform 6, and the carrier platform 411 is also used to adsorb and heat the wafer. An adsorption area is also provided on the carrier platform 411. The carrier platform 411 and the carrier platform 411 in the first heating platform 41 adopt the same method to achieve adsorption and heating of the wafer; the wafer is heated here to increase the surface temperature of the wafer, which is convenient for the subsequent coating mechanism 7 to coat the wafer surface.

[0032] The second heating platform 6 is disposed on the second moving module 61 , and the second moving module 61 is used to drive the second heating platform 6 to move, so that the laminating mechanism 7 can re-attach a layer of DAF film on the surface of the wafer.

[0033] After the visual edge finder 5 has corrected the wafer to find that there is no residual glue, the handling robot 3 can place the wafer at the center position of the supporting platform 411 of the second heating platform 6, so as to improve the lamination quality of the wafer by the laminating mechanism 7; after the wafer is re-laminated, the moving module 2 61 drives the second heating platform 6 to reset, and the handling robot 3 is equipped to transport the re-laminated wafer again. The linear module connected to the handling robot 3 drives the handling robot 3 to move, so that the wafer moves to the appropriate position. At this time, the printing and labeling mechanism 8 can print out the label and attach the label to the specified position on the wafer; after the attachment is completed, the handling robot 3 cooperates with the linear module connected to it to place the re-laminated and labeled wafer back in the silo 2.

[0034] In this embodiment, automatic film tearing, automatic laminating, automatic labeling and automatic loading and unloading are realized, and the wafer re-laminating and labeling are completed efficiently; and a visual edge finder 5 is provided, which can identify the notch position, correct the position and detect residual glue on the wafer, so as to ensure that the surface of the re-laminated wafer remains clean, thereby ensuring the lamination quality of the wafer; because the wafer is pre-position-corrected by the visual edge finder 5 before re-laminating, it is convenient to improve the lamination quality, and the label can be accurately attached to the specified position when attaching the note, thereby ensuring the attachment accuracy.

[0035] Example 2

[0036] See also Figure 4 In this embodiment, based on the first embodiment, the visual device 52 specifically includes a CCD camera 521 and a coaxial light source 522 arranged below the CCD camera 521; the CCD camera 521 is combined with the coaxial light source 522 to realize the recognition and detection of the wafer surface.

[0037] Example 3

[0038] This embodiment is based on the first embodiment, and both the first moving module 412 and the second moving module 61 adopt existing linear modules; the first heating platform 41 and the second heating platform 6 can be driven to move horizontally and linearly by the two linear modules.

[0039] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. Fully automatic film tearing and laminating equipment, comprising a workbench (1), a silo (2), a handling manipulator (3), a laminating mechanism (7) and a printing and labeling mechanism (8), characterized in that: Also includes: A wafer film tearing mechanism (4) is used to tear off the old film on the surface of the wafer; A visual edge finder (5) is used to calibrate the center position of a wafer, detect the position of a notch on the edge of the wafer, and detect residual adhesive on the surface of the wafer after film removal.

2. The fully automatic film tearing and laminating equipment according to claim 1 is characterized in that: Also includes: A second heating platform (6); a carrier platform (411) for placing wafers is provided on the second heating platform (6), and the carrier platform (411) is used to heat the wafers; The second movable module (61) is used to drive the second heating platform (6) to move and enable the wafer tearing mechanism (4) to tear the film of the wafer on the carrier (411).

3. The fully automatic film tearing and laminating equipment according to claim 2 is characterized in that: The carrier platform (411) is provided with an adsorption area for adsorbing wafers.

4. The fully automatic film tearing and laminating equipment according to claim 1 is characterized in that: The visual edge finder (5) comprises: A visual device (52), wherein the visual device (52) is arranged on the workbench (1); A correction device (51) is provided on the workbench (1), and the correction device (51) is used to correct the position of the wafer.

5. The fully automatic film tearing and laminating equipment according to claim 4 is characterized in that: The visual device (52) includes a CCD camera (521) and a coaxial light source (522) arranged below the CCD camera (521).

6. The fully automatic film tearing and laminating equipment according to claim 2, characterized in that: The wafer film tearing mechanism (4) comprises: A first heating platform (41), wherein the first heating platform (41) is also provided with a carrier platform (411) for placing wafers; A movable module (412), wherein the movable module (412) is used to drive the first heating platform (41) to move; A fixed frame (42), wherein the fixed frame (42) is movably arranged on the workbench (1); An adhesive tape unwinding roller (43), the adhesive tape unwinding roller (43) being arranged on the workbench (1); A tape rewinding roller (44), the tape rewinding roller (44) being arranged on the workbench (1); A driving device (45), wherein the driving device (45) is used to drive the fixing frame (42) to move horizontally; Wherein, the fixed frame (42) is provided with a plurality of pressure rollers (46) of different sizes, and the workbench (1) is provided with a plurality of guide rollers (47); the adhesive paper roll is placed on the adhesive paper unwinding roller (43), and one end of the adhesive paper roll passes around each pressure roller (46) and guide roller (47) and is wound around the adhesive paper winding roller (44).

7. The fully automatic film tearing and laminating equipment according to claim 6, characterized in that: The driving device (45) comprises: A screw rod (452), the screw rod (452) is rotatably arranged on the workbench (1), and the fixing frame (42) is threadedly connected to the outside of the screw rod (452); A driving motor (451), the output end of the driving motor (451) is fixedly connected to the screw rod (452), and the driving motor (451) is installed on the workbench (1).

8. The fully automatic film tearing and laminating equipment according to claim 6, characterized in that: The movable module 1 (412) and the movable module 2 (61) are both linear modules.

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