Electroplating side conduction DIP type hanger

Abstract

The utility model discloses an electroplating side conduction DIP type hanger, which belongs to the technical field of wafer electroplating hangers, and comprises a bottom plate, an electroplating side conduction DIP type hanger, an electroplating side conduction DIP type hanger and an electroplating side conduction DIP type hanger, the placing assembly comprises a placing groove which is arranged on the bottom plate and is used for placing a wafer; the electroplating assembly comprises a conducting strip for electrifying and an adjusting mechanism for adjusting the position of the electroplating assembly; the fixing assembly comprises a fixing plate which slides in the containing grooves and is used for fixing the wafers, two sets of wafers needing to be electroplated can be placed at the same time through the two sets of containing grooves formed in the bottom plate, the wafers can be fixed through the fixing plate by screwing up two sets of nuts, operation is easy and convenient, and the fixing effect is good; and four groups of conducting strips are arranged on the mounting ring, so that the effect is better when the wafer is electroplated, and the electroplating efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer electroplating racks, in particular to an electroplating side conduction DIP type rack. Background Art

[0002] During the electroplating process of wafers, it is often necessary to place the wafer on a wafer electroplating rack. The electrode ring in the wafer electroplating rack contacts the wafer, and the electrode ring then contacts an external power source to form a cathode. During electroplating, the cations in the plating solution are adsorbed onto the wafer to form a coating. When the electrode ring is damaged, it needs to be replaced. However, in existing electroplating racks, the electrode ring is relatively thin and has no fulcrum at the bottom of the electroplating rack, making it difficult to remove the electrode ring.

[0003] In order to solve the above problems, after searching, the existing public technology (application number: CN202220984444.3) wafer electroplating rack is found. The article proposes that "the wafer electroplating rack includes a base plate, an electrode ring, a gasket and a fixed cover, and a wafer slot is provided on the base plate, the bottom of the wafer slot forms a support plate, and a plating hole is opened in the support plate; the electrode ring is arranged in the wafer slot, the electrode ring is annular, and the outer edge of the electrode ring abuts the support plate, and the inner edge of the electrode ring is provided with a platform portion, and the orthographic projection of the platform portion at least partially overlaps with the orthographic projection of the electroplating hole. Through the above design, when disassembling the wafer electroplating rack from the back side in sequence until the electrode ring is taken out, the platform portion provides a fulcrum for the dismantling personnel, and the dismantling personnel can easily take out the entire electrode ring by taking the platform portion."

[0004] Although the above-mentioned wafer electroplating rack can conveniently take out the electrode ring for maintenance, it can only hang and place one wafer for electroplating at a time, and the wafer needs to be electroplated for a long time. When the number of wafers to be electroplated is large, the electroplating speed is slow and the work efficiency is low. Utility Model Content

[0005] The utility model solves the technical problems in the above-mentioned background technology and provides a DIP type rack with electroplating side conduction.

[0006] In order to solve the above technical problems, the technical solution provided by the utility model is:

[0007] A DIP type rack with electroplating side conduction, comprising:

[0008] The base plate is used to place the wafer, fix it and perform electroplating;

[0009] A placement assembly, comprising a placement slot arranged on the base plate for placing the wafer;

[0010] An electroplating assembly, comprising a conductive sheet for conducting electricity and an adjusting mechanism for adjusting the position of the electroplating assembly;

[0011] The fixing component includes a fixing plate that slides in the placement groove and is used to fix the wafer.

[0012] Preferably, a connecting groove for fixing the bottom plate is provided on the top of the bottom plate, and two groups of placement grooves are provided. An empty groove is provided in the middle of the two groups of placement grooves so that both sides of the wafer can be electroplated.

[0013] Preferably, the placement component further includes:

[0014] A limiting ring is arranged inside the placement slot to limit the wafer;

[0015] The circular holes are evenly arranged on the limiting ring and are used for the conductive sheet to penetrate and fit the wafer placed in the placement groove.

[0016] Preferably, the electroplating assembly further comprises:

[0017] A mounting ring is used to mount the conductive sheets, and the conductive sheets are provided in four groups evenly distributed on the mounting ring;

[0018] The connecting rod is fixed to the top of the mounting ring for connection and installation.

[0019] Preferably, the position adjustment mechanism includes:

[0020] A threaded rod is rotatably connected to the base plate;

[0021] A threaded block, threadedly connected to the threaded rod;

[0022] A screw, threadedly connected to the threaded block and the connecting rod, is used to fix the threaded block and the connecting rod;

[0023] The limiting block is fixed in the empty groove provided on the bottom plate and is used for limiting the threaded block.

[0024] Preferably, the threaded rod is provided with two sets of opposite thread structures, the limiting block is in a U-shape, and the threaded block slides inside the limiting block.

[0025] Preferably, the fixing assembly further comprises:

[0026] Extension blocks are fixed to both sides of the fixed plate and are used for being inserted into the bottom plate;

[0027] Card slots are arranged on both sides of the placement slot and the extension blocks slide in the card slots;

[0028] A bolt is fixed in the slot and the extension block slides on the bolt;

[0029] The nut is threadedly connected to the bolt and is attached to the outer side of the extension block and is used to fix the wafer through the fixing plate so that the wafer is attached to the conductive sheet.

[0030] With the above structure, the utility model has the following advantages:

[0031] 1. Two sets of placement slots are provided on the bottom plate, which can simultaneously place two sets of wafers that need to be electroplated. By tightening the two sets of nuts, the fixing plate can fix the wafers. The operation is simple and convenient, and the fixing effect is good. In addition, the four sets of conductive sheets on the mounting ring can make the wafers more effective during electroplating, thereby improving the efficiency of electroplating.

[0032] 2. By rotating the threaded rod to make the two sets of threaded blocks drive the mounting ring to move toward the middle, the conductive sheet can be separated from the round hole. Then, the screws can be removed to remove the mounting ring for replacement and maintenance. The operation is simple and convenient, which improves the speed of subsequent maintenance, thereby improving the efficiency of electroplating and the practicality of the device.

[0033] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 This is a schematic diagram of the mechanism of a DIP type rack with electroplating side conduction in the utility model;

[0036] Figure 2 This is a cross-sectional view of a DIP type rack with electroplating side conduction in the utility model;

[0037] Figure 3 This is a structural exploded diagram of a DIP type rack with electroplating side conduction in the utility model;

[0038] Figure 4 yes Figure 3 A magnified view of point A in the figure;

[0039] Figure 5 yes Figure 3 Enlarged view of point B in .

[0040] As shown in the figure: 1. Base plate; 101. Placement slot; 102. Limiting ring; 103. Round hole; 201. Mounting ring; 202. Conductive sheet; 203. Connecting rod; 301. Threaded rod; 302. Threaded block; 303. Screw; 304. Limiting block; 401. Fixing plate; 402. Extension block; 403. Slot; 404. Bolt; 405. Nut. DETAILED DESCRIPTION

[0041] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0043] The following is a further detailed description of the present invention in conjunction with the full text:

[0044] Example 1:

[0045] Combined with attachment Figures 1 to 5 This embodiment provides a DIP-type rack with electroplating side conduction, including a base plate 1 for placing a wafer to fix it and perform electroplating. The top of the base plate 1 is provided with a connecting groove for fixing the base plate 1. There are two groups of placement grooves 101. An empty groove is provided in the middle of the two groups of placement grooves 101 so that both sides of the wafer can be electroplated.

[0046] In order to facilitate the placement of wafers, a placement component is arranged on the base plate 1, and the placement component includes a placement groove 101 arranged on the base plate 1 for placing wafers.

[0047] As a preferred embodiment, the placement component also includes: a limiting ring 102, arranged inside the placement groove 101 for limiting the wafer; circular holes 103, evenly arranged on the limiting ring 102 for the conductive sheet 202 to pass through and fit the wafer placed in the placement groove 101.

[0048] It should be noted that the two groups of placement grooves 101 are symmetrically arranged, and the shape of the placement grooves 101 is circular. The diameter of the wafer to be electroplated is larger than the inner diameter of the limiting ring 102 and also smaller than the diameter of the placement groove 101. The inner diameter of the limiting ring 102 is smaller than the diameter of the placement groove 101.

[0049] Example 2:

[0050] On the basis of Example 1, a fixing assembly is arranged to facilitate fixing of the wafer. The fixing assembly includes a fixing plate 401 that slides in the placement groove 101 to fix the wafer.

[0051] As a preferred embodiment, the fixing assembly also includes: an extension block 402, fixed on both sides of the fixing plate 401 for inserting into the base plate 1; a slot 403, arranged on both sides of the placement slot 101 and the extension block 402 slides in the slot 403; a bolt 404, fixed in the slot 403 and the extension block 402 slides on the bolt 404; a nut 405, threadedly connected to the bolt 404 and attached to the outer side of the extension block 402, for fixing the wafer through the fixing plate 401 so that the wafer is attached to the conductive sheet 202.

[0052] It should be noted that the size of the fixing plate 401 is consistent with the size of the limiting ring 102, and thus cooperate with each other to fix the wafer to enhance stability. There are two sets of extension blocks 402 and bolts 404, which are fixed from both sides to further enhance stability during electroplating.

[0053] Example 3:

[0054] On the basis of Example 1 and Example 2, an electroplating assembly is arranged to facilitate electroplating. The electroplating assembly includes a conductive sheet 202 for energizing. At the same time, an adjustment mechanism is arranged to facilitate replacement and maintenance of the electroplating assembly.

[0055] As a preferred embodiment, the plating assembly also includes: a mounting ring 201 for mounting the conductive sheet 202, and the conductive sheet 202 is provided with four groups evenly distributed on the mounting ring 201; a connecting rod 203, fixed to the top of the mounting ring 201 for connection and installation.

[0056] It should be noted that the positions of the conductive sheets 202 on the mounting ring 201 correspond to the positions of the circular holes 103 on the limiting ring 102 . The two groups of mounting rings 201 are symmetrically arranged, and the four groups of conductive sheets 202 are electrically connected.

[0057] As a preferred embodiment, the position adjustment mechanism includes: a threaded rod 301, which is rotatably connected to the base plate 1; a threaded block 302, which is threadedly connected to the threaded rod 301; a screw 303, which is threadedly connected to the threaded block 302 and the connecting rod 203 for fixing the threaded block 302 and the connecting rod 203; and a limit block 304, which is fixed in an empty groove provided on the base plate 1 for limiting the threaded block 302.

[0058] As a preferred embodiment, two sets of opposite thread structures are provided on the threaded rod 301 , the limiting block 304 is U-shaped, and the threaded block 302 slides inside the limiting block 304 .

[0059] It should be noted that the distance between the empty slots in the middle of the base plate 1 is greater than the sum of the thicknesses of the two sets of mounting rings 201 and the conductive sheet 202. The threaded rod 301 is located in the middle of the connecting slot and the placement slot 101 on the base plate 1 and passes through the empty slot provided on the base plate 1. The limit block 304 is located in the empty slot and above the placement slot 101.

[0060] The operation steps are as follows: the operator places the two groups in the placement groove 101 in turn until they fit into the limit ring 102, and then inserts the extension blocks 402 on both sides of the fixing plate 401 into the bolts 404 on the card slot 403, and then fixes the wafer by tightening the nut 405. Then, the bottom plate 1 drives the wafer into the electroplating solution and supplies power to the conductive sheet 202, so that the cations in the plating solution are adsorbed to both sides of the wafer, and both sides of the wafer are plated. When the resistor component needs to be replaced and repaired, the threaded rod 301 is manually rotated to make the two sets of threaded blocks 302 move toward the middle at the same time. At this time, the mounting ring 201 is driven toward the middle by the connecting rod 203 until the conductive sheet 202 is completely out of the round hole 103, and then the screws 303 fixing the connecting rod 203 and the threaded blocks 302 are removed, and the mounting ring 201 and the conductive sheet 202 can be removed for repair and replacement.

[0061] The above description of the present invention and its embodiments is non-limiting. What is shown in the full text is only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs a structure and embodiment similar to the technical solution without creatively designing, they shall fall within the scope of protection of the present invention.

Claims

1. A DIP type rack with electroplating side conduction, characterized by: include: A bottom plate (1) is used to place the wafer, fix it and perform electroplating; A placement component, comprising a placement groove (101) arranged on a base plate (1) for placing a wafer; An electroplating assembly comprises a conductive sheet (202) for energizing and an adjusting mechanism for adjusting the position of the electroplating assembly; The fixing assembly comprises a fixing plate (401) which slides in the placement groove (101) and is used to fix the wafer.

2. The electroplating side conductive DIP type rack according to claim 1, characterized in that: The top of the base plate (1) is provided with a connection groove for fixing the base plate (1), and two groups of placement grooves (101) are provided. An empty groove is provided in the middle of the two groups of placement grooves (101) so that both sides of the wafer can be electroplated.

3. The electroplating side conductive DIP type rack according to claim 2, characterized in that: The placement component also includes: A limiting ring (102) is arranged inside the placement groove (101) and is used to limit the wafer; The circular holes (103) are evenly arranged on the limiting ring (102) and are used for the conductive sheet (202) to penetrate and fit the wafer placed in the placement groove (101).

4. The electroplating side conductive DIP type rack according to claim 3, characterized in that: The electroplating assembly further comprises: A mounting ring (201) is used for mounting the conductive sheets (202), and the conductive sheets (202) are provided in four groups evenly distributed on the mounting ring (201); The connecting rod (203) is fixed to the top of the mounting ring (201) for connection and installation.

5. The electroplating side conductive DIP type rack according to claim 4, characterized in that: The position adjustment mechanism comprises: A threaded rod (301) is rotatably connected to the base plate (1); A threaded block (302) is threadedly connected to the threaded rod (301); A screw (303) is threadedly connected to the threaded block (302) and the connecting rod (203) for fixing the threaded block (302) and the connecting rod (203); The limiting block (304) is fixedly connected to a hollow groove provided on the bottom plate (1) and is used to limit the threaded block (302).

6. The electroplating side conductive DIP type rack according to claim 5, characterized in that: The threaded rod (301) is provided with two sets of opposite thread structures, the limiting block (304) is in a U-shape, and the threaded block (302) slides inside the limiting block (304).

7. The electroplating side conductive DIP type rack according to claim 6, characterized in that: The fixing assembly further comprises: Extension blocks (402) are fixed to both sides of the fixing plate (401) and are used for being inserted into the bottom plate (1); The card slots (403) are arranged on both sides of the placement slot (101) and the extension block (402) slides in the card slots (403); A bolt (404) is fixed in the slot (403) and the extension block (402) slides on the bolt (404); The nut (405) is threadedly connected to the bolt (404) and affixed to the outer side of the extension block (402) for fixing the wafer through the fixing plate (401) so that the wafer is affixed to the conductive sheet (202).

Images